Philips pck2001 DATASHEETS

INTEGRATED CIRCUITS

PCK2001

14.318-150 MHz I

Product specification Supersedes data of 1998 Oct 27

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2

C 1:18 Clock Buffer

1999 Jul 06

Philips Semiconductors Product specification

2

14.318–150 MHz I

C 1:18 Clock Buffer

PCK2001

FEA TURES

•HIGH speed, LOW noise non-inverting 1–18 buffer

•Typically used to support four SDRAM DIMMs

•Multiple V

, VSS pins for noise reduction

DD

•3.3V operation

•Separate 3-State pin for testing

•ESD protection exceeds 2000V per Standard 801.2

•Optimized for 66MHz, 100MHz and 133MHz operation

•175 ps skew outputs

•Available in 48-pin SSOP package

•Individual clock output enable/disable via I

DESCRIPTION

The PCK2001 is a 1–18 fanout buffer used for 133/100 MHz CPU, 66/33 MHz PCI, 14.318 MHz REF, or 133/100/66 MHz SDRAM clock distribution. 18 outputs are typically used to support up to 4 SDRAM DIMMS commonly found in desktop, workstation or server applications.

All clock outputs meet Intel’s drive, rise/fall time, accuracy , and skew requirements. An I enabled/disabled individually. An output disabled via the I interface will be held in the LOW state. In addition, there is an OE input which 3-States all outputs.

2

C interface is included to allow each output to be

2

C

•See PCK2001M for mobile (reduced pincount) 28-pin 1-10 buffer

version

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS TYPICAL UNIT

t

PLH

t

PHL

t

r

t

f

I

CC

ORDERING INFORMATION

48-Pin Plastic SSOP 0°C to +70°C PCK2001 DL SOT370-1

Propagation delay BUF_IN to BUF_OUT

n

VCC = 3.3V, CL = 30pF

2.5

2.5 Rise time VCC = 3.3V, CL = 30pF 1.0 ns Fall time VCC = 3.3V, CL = 20pF 700 ps Total supply current VCC = 3.465V 50 µA

PACKAGES TEMPERATURE RANGE ORDER CODE DRAWING NUMBER

2

C

ns

PIN CONFIGURATION

V RESERVED RESERVED

BUF_OUT0 BUF_OUT1

BUF_OUT2 BUF_OUT3

BUF_OUT4 BUF_OUT5

BUF_OUT6

BUF_OUT7

BUF_OUT16

V

SS0

V

DD1

V

SS1

BUF_IN

V

DD2

V

SS2

V

DD3

V

SS3

V

DD4

V

SS4

V

DDI2C

SDA

2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19

20 21 22 23 24

1

DD0

I2C is a trademark of Philips Semiconductors Corporation.

48

RESERVED

47

RESERVED V

46

DD9

45

BUF_OUT15

44

BUF_OUT14 V

43

SS9

V

42

DD8

41

BUF_OUT13

40

BUF_OUT12 V

39

SS8

OE

38

V

37

DD7

36

BUF_OUT11

35

BUF_OUT10 V

34

SS7

PCK2001

V

33

DD6

32

BUF_OUT9 BUF_OUT8

31

V

30

SS6

V

29

DD5

BUF_OUT17

28

V

27

SS5

V

SSI2C

26 25

SCL

SW00248

PIN DESCRIPTION

NUMBER

4, 5, 8, 9 Output BUF_OUT (0–3) Buffered clock outputs

13, 14, 17,

18

31, 32, 35,

36

40, 41, 44,

45

21, 28 Output

11 Input BUF_IN Buffered clock input 38 Input OE 24 I/O SDA I2C serial data

25 Input SCL I2C serial clock

3, 7, 12, 16,

20, 29, 33,

37, 42, 46

6, 10, 15,

19, 22,

27, 30, 34,

39, 43

23 Input V 26 Input V

I/O

TYPE

SYMBOL FUNCTION

Output BUF_OUT (4–7) Buffered clock outputs

Output

BUF_OUT

(8–11)

BUF_OUT

(12–15)

BUF_OUT

(16–17)

Buffered clock outputs

Active high output enable

Input V

DD (0–9)

SS (0–9)

DDI2C

SSI2C

3.3V Power supply

Ground

3.3V I2C Power supply

I2C Ground

1999 Jul 06 853-2072 21924

2

Philips Semiconductors Product specification

SYMBOL

PARAMETER

CONDITION

UNIT

SYMBOL

PARAMETER

CONDITIONS

UNIT

14.318–150 MHz I

2

C 1:18 Clock Buffer

PCK2001

FUNCTION TABLE

OE BUF_IN I2CEN BUF_OUTn

L X X Z H L X L H H H H H H L L

ABSOLUTE MAXIMUM RA TINGS

In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to V

V

DD

I

IK

V

I

OK

V

O

I

O

T

STG

P

TOT

NOTES:

1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability .

2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

DC 3.3V supply voltage –0.5 +4.6 V

DC input diode current VI < 0 –50 mA

DC output diode current VO > VDD or VO < 0 ±50 mA

DC output source or sink current VO >= 0 to V

Storage temperature range –65 +150 °C

Power dissipation per package

plastic medium-shrink SO (SSOP)

(VSS = 0V)

SS

DC input voltage Note 2 –0.5 5.5 V

DC output voltage Note 2 –0.5 VCC + 0.5 V

1, 2

DD

For temperature range: 0 to +70°C

above +55°C derate linearly with 11.3mW/K

LIMITS

MIN MAX

±50 mA

850 mW

RECOMMENDED OPERATING CONDITIONS

V

T

C

V

amb

DD

L

I

O

Operating ambient temperature range in free air 0 +70 °C

DC 3.3V supply voltage 3.135 3.465 V

Capacitive load 20 30 pF

DC input voltage range 0 V

DC output voltage range 0 V

LIMITS

MIN MAX

DD DD

V V

1999 Jul 06

3

Philips Semiconductors Product specification

TEST CONDITIONS

IOHOutput HIGH current

mA

IOLOutput LOW current

mA

14.318–150 MHz I

DC CHARACTERISTICS

SYMBOL PARAMETER

V

IH

V

IL

V

OH

V

OL

±I

I

±I

OZ

I

CC

∆I

CC

HIGH level input voltage 3.135 to 3.465 2.0 VDD + 0.3 V

LOW level input voltage 3.135 to 3.465 VSS – 0.3 0.8 V

3.3V output HIGH voltage 3.135 to 3.465 IOH = –1mA 2.4 – V

3.3V output LOW voltage 3.135 to 3.465 IOL= 1mA – 0.4 V

p

Input leakage current 3.465 – 5 µA

3-State output OFF-State

current

Quiescent supply current 3.465 VI = VDD or GND IO = 0 – 100 µA

Additional quiescent supply

current given per control pin

2

C 1:18 Clock Buffer

VDD(V) OTHER MIN MAX

3.135 to 3.465 V

3.465 V

3.135 to 3.465 V

PCK2001

LIMITS

T

= 0°C to +70°C UNIT

amb

= 2.0V –54 –

OUT

= 3.135V – –46

OUT

= 1.0V 54 –

OUT

= 0.4V – 53

OUT

= VDDor GND IO = 0 – 10 µA

OUT

= VDD– 0.6V IO = 0 – 500 µA

I

1999 Jul 06

4