Philips pcf50732 DATASHEETS

INTEGRATED CIRCUITS

DATA SH EET

PCF50732

Baseband and audio interface for GSM

Objective speciﬁcation File under Integrated Circuits, IC17

1999 May 03

Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 ORDERING INFORMATION 5 QUICK REFERENCE DATA 6 BLOCK DIAGRAM 7 PINNING 8 FUNCTIONAL DESCRIPTION

8.1 General

8.2 Baseband and voice band reference voltages 9 BASEBAND CODEC

9.1 Baseband transmit path

9.2 Baseband receive path

9.3 Baseband Serial Interface (BSI) 10 VOICE BAND CODEC

10.1 Voice band receive path

10.2 Voice band transmit path

10.3 Voice band digital circuitry 11 AUXILIARY FUNCTIONS

11.1 Automatic Gain Control (AGC): AUXDAC1

11.2 Automatic Frequency Control (AFC): AUXDAC2

11.3 Power ramping: AUXDAC3

11.4 Auxiliary analog-to-digital converter (AUXADC)

12 CONTROL SERIAL INTERFACE (CSI)

12.1 The serial interface

12.2 Control Serial Interface (CSI) timing characteristics

12.3 Control register block

13 VOICE BAND SIGNAL PROCESSOR (VSP)

13.1 Hardware description

13.2 VSP assembler language

13.3 Descriptions of the VSP instruction set

13.4 The assembler/emulator

14 LIMITING VALUES 15 THERMAL CHARACTERISTICS 16 DC CHARACTERISTICS 17 AC CHARACTERISTICS 18 FUNCTIONAL CHARACTERISTICS

18.1 Baseband transmit (BSI to TXI/Q)

18.2 Baseband receive (RXI/Q to BSI)

18.3 Voice band transmit (microphone to ASI)

18.4 Voice band receive (ASI to earphone)

18.5 Auxiliary digital-to-analog converters

18.6 Auxiliary analog-to-digital converters: AUXADC1, AUXADC2, AUXADC3 and AUXADC4

18.7 Typical total current consumption

18.8 Typical output loads

19 APPLICATION INFORMATION

19.1 Wake-up procedure from Sleep mode

19.2 Microphone input connection and test set-up

20 PACKAGE OUTLINES 21 SOLDERING

21.1 Introduction to soldering surface mount packages

21.2 Reflow soldering

21.3 Wave soldering

21.4 Manual soldering

21.5 Suitability of surface mount IC packages for wave and reflow soldering methods

22 DEFINITIONS 23 LIFE SUPPORT APPLICATIONS

1999 May 03 2

Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

1 FEATURES

• Low power and low voltage device in 0.25 micron CMOS technology; supply voltage: analog 2.7 V (typical) and digital 1.5 V (typical)

• Compatible with GSM phase 2 and DCS1800 recommendations

• Complete in-phase and quadrature component interface paths between the Digital Signal Processor (DSP) and RF circuitry

• Complete linear PCM CODEC for audio signal conversion between earphone/microphone and DSP

• Four auxiliary analog inputs for measurement purposes (e.g. battery monitoring)

• Three auxiliary analog outputs for control purposes (i.e. AFC, AGC and power ramping control)

• Separate baseband, audio and control serial interfaces

• Voice band Signal Processor (VSP) for flexible audio

data processing.

2 APPLICATIONS

The CMOS integrated circuit PCF50732, Baseband and audio interface for GSM, is dedicated to wireless telephone handsets conforming to the GSM recommendations phases 1 and 2, DCS1800 and PCS1900.

• The digital Baseband Serial Interface (BSI), which exchanges baseband data between the PCF50732 and the digital signal processor. The interface also includes signals to power-up and power-down the baseband transmit (TX) and receive (RX) paths.

The voice band CODEC is a complete analog front-end circuit. It consists of four parts:

• The receive path, which converts a digital signal to an analog signal for an earpiece, an external loudspeaker or a buzzer

• The transmit path, which receives the analog external signal from a microphone and converts it into a digital signal

• The Voice band Signal Processor (VSP), which filters the voice band data

• The digital Audio Serial Interface (ASI), which connects the digital linear PCM signals of the receive and transmit paths to an external DSP. The voice band data is coded in 16-bit linear PCM twos complement words.

The auxiliary Analog-to-Digital Converter (ADC) section consists of four input channels specified for battery management applications.

The auxiliary Digital-to-Analog Converter (DAC) section consists of three DACs for Automatic Gain Control (AGC), for Automatic Frequency Control (AFC) and for power ramping.

3 GENERAL DESCRIPTION

The baseband CODEC is a complete interface circuit between the RF part in a mobile communication handset and the Digital Signal Processor (DSP). It consists of three parts:

• The receive path, which transforms the quadrature signals from the RF (I/Q) to digital signals

• The transmit path, which transforms a bitstream to analog quadrature signals for the RF devices

4 ORDERING INFORMATION

TYPE NUMBER

NAME DESCRIPTION VERSION

PCF50732H LQFP48 plastic low proﬁle quad ﬂat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2

1999 May 03 3

The Control Serial Interface (CSI) is used to program a set of control registers, to store the power amplifier ramping characteristics into the dedicated RAM and to transmit auxiliary ADC values to the DSP. It also controls switches, modes and power status of the different parts of the IC.

PACKAGE

Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

5 QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

DDD

DDA

stb(tot)

clk

amb

Note

1. Without load on audio outputs EARP, EARN, AUXSP and BUZ.

digital supply voltage 1.0 1.5 2.75 V analog supply voltage V analog supply current V

DDA DDD

≥ V

DDD

= 1.5 V; V

DDA

= 2.7 V;

2.5 2.7 2.75 V

− 3.5 − mA

RXON active

average power consumption V

DDD

= 1.5 V; V

= 2.7 V; note 1 − 15 − mW

DDA

total standby current − 10 −µA master clock frequency − 13.0 − MHz operating ambient temperature −40 +27 +85 °C

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Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

6 BLOCK DIAGRAM

handbook, full pagewidth

TXON

BIEN

BIOCLK

BDIO

RXON

BOEN

AUXST

CCLK

CEN

CDI

CDO

AMPCTRL

ACLK

AFS

ADI

ADO

DDD

DDA(bb)

DDA(vb)

DDA(vbo)

PCF50732

19 16

15 17

20 18

13 9 10 11 12 14

BSI

CSI

4 3 2

ASI

GMSK

MODULATOR

DIGITAL

FILTER

DAC3

CTL

VOICE BAND

SIGNAL

PROCESSOR

IRAM

64 × 10-BIT

SRAM

10-BIT

DECIMATION

FILTER

NOISE

SHAPER

DAC

ADC

DDA(ref)

AUXDAC3

10-BIT

AUXDAC2

12-BIT

AUXDAC1

8-BIT

MICADC

EARDAC

1 MHz

REFERENCE

VOLTAGES AND

CURRENTS

M U X

U X

OUTPUT

AMPLIFIER

ref

AUXADC1

AUXADC2

AUXADC3

AUXADC4

AUXDAC3

AUXDAC2

AUXDAC1

MICP

MICN

AUXMICP

AUXMICN

EARP

EARN

MCLK

RESET

CLOCK

GENERATOR

82642

SSDVSSA(bb)VSSA(vb)VSSA(vbo)VSSA(ref)

Fig.1 Block diagram.

1999 May 03 5

OUTPUT

AMPLIFIER

OUTPUT

AMPLIFIER

MGR988

AUXSP

BUZ

Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

7 PINNING

SYMBOL

NR. TYPE

(1)

ACTIVE

LEVEL

ACTIVE

EDGE

ADO 1 O/TS −−1.5 mA audio digital interface PCM data output to DSP ADI 2 I −−−audio digital interface PCM data input from DSP AFS 3 I − rising − audio digital interface PCM frame synchronization signal

from DSP ACLK 4 I − rising − audio digital interface PCM clock signal from DSP RESET 5 I LOW −−asynchronous reset input MCLK 6 I − rising − low-swing master clock input; f

capacitive coupling V V

DDD SSD

7P −−−digital power supply

8G −−−digital ground CCLK 9 I − falling − control bus clock input from DSP CEN 10 I LOW −−control bus data enable from DSP CDI 11 I −−−control bus data input from DSP CDO 12 O/TS −−1.5 mA control bus data output to DSP AUXST 13 I HIGH −−status control signal for activation of AUXDAC1,

AUXDAC2 and MCLK input AMPCTRL 14 O −−1.5 mA general purpose output pin BIOCLK 15 O/TS −−3 mA baseband interface data clock BIEN 16 O LOW − 1.5 mA baseband transmit interface data enable signal BDIO 17 I/O −−1.5 mA baseband interface data I/O from/to DSP BOEN 18 O LOW − 1.5 mA baseband receive interface data enable signal TXON 19 I HIGH −−baseband transmit path activation signal RXON 20 I HIGH −−baseband receive path activation signal IP 21 I/O −−−(I) baseband differential positive input/output to IF circuit IN 22 I/O −−−(I) baseband differential negative input/output to

IF circuit QP 23 I/O −−−(Q) baseband differential positive input/output to

IF circuit QN 24 I/O −−−(Q) baseband differential negative input/output to

IF circuit V

DDA(bb)

SSA(bb)

25 P −−−baseband power supply (analog)

26 G −−−baseband ground (analog) AUXADC1 27 I −−−auxiliary ADC input 1 for battery voltage measurement AUXADC2 28 I −−−auxiliary ADC input 2 AUXADC3 29 I −−−auxiliary ADC input 3 AUXADC4 30 I −−−auxiliary ADC input 4 AUXDAC1 31 O −−−auxiliary DAC output for AGC; max. load 50 pF // 2 kΩ AUXDAC2 32 O −−−auxiliary DAC output for AFC; max. load 50 pF // 10 kΩ

DESCRIPTION

= 13 MHz; integrated

clk

1999 May 03 6

Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

SYMBOL

NR. TYPE

(1)

ACTIVE

LEVEL

ACTIVE

EDGE

AUXDAC3 33 O −−−auxiliary DAC output for power ramping; maximum load

50 pF, ±600 µA

DDA(ref)

SSA(ref)

ref

DDA(vb)

34 P −−−reference voltage power supply (analog)

35 G −−−reference voltage ground (analog)

36 I/O −−−band gap reference voltage noise decoupling

37 P −−−voice band voltage power supply AUXMICP 38 I −−−auxiliary microphone differential positive input AUXMICN 39 I −−−auxiliary microphone differential negative input MICP 40 I −−−microphone differential positive input MICN 41 I −−−microphone differential negative input V

SSA(vb)

42 G −−−voice band ground BUZ 43 O −−−buzzer output AUXSP 44 O −−−auxiliary speaker output EARN 45 O −−−earphone differential negative output EARP 46 O −−−earphone differential positive output V

DDA(vbo)

SSA(vbo)

47 P −−−voice band output buffer voltage power supply (analog)

48 G −−−voice band output buffer ground (analog)

Note

1. O/TS = 3-state output.

DESCRIPTION

1999 May 03 7

Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

handbook, full pagewidth

ADO

ADI

AFS

ACLK

RESET

MCLK V

DDD

SSD

CCLK

CEN

CDI

CDO

SSA(vbo)

DDA(vbo)

EARP

BIOCLK

AMPCTRL

EARN

AUXSP

PCF50732

BIEN

BDIO

1 2 3 4 5 6 7 8

9 10 11 12

AUXST

BUZ 43

BOEN

SSA(vb)

MICN

V 42

TXON

RXON

MICP 40

AUXMICN

22 IN

DDA(vb)

AUXMICP

24 37

23 QP

34 33

AUXDAC3

AUXDAC2

AUXDAC1 AUXADC4

30 29

AUXADC3 AUXADC2

28 27

AUXADC1 V

MGR989

ref SSA(ref) DDA(ref)

SSA(bb) DDA(bb)

Fig.2 Pin configuration.

1999 May 03 8

Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

8 FUNCTIONAL DESCRIPTION

This chapter gives a brief overview of the device. The detailed functional description can be found in the following chapters:

Chapter 9 “Baseband CODEC” Chapter 10 “Voice band CODEC” Chapter 11 “Auxiliary functions” Chapter 12 “Control Serial Interface (CSI)” Chapter 13 “Voice band Signal Processor (VSP)”.

8.1 General

As low power consumption in mobile telephones is a very important issue, all the circuit parts in the PCF50732 can be powered-on/off either by means of the external signals AUXST, TXON or RXON, or by programming the respective register bits in the Control Serial Interface (CSI).

The most important signal for the digital and analog circuit functions in the PCF50732 is the DAC enable signal AUXST, which allows to activate AUXDAC1 (AGC) and AUXDAC2 (AFC), as well as the low-swing master clock input MCLK. AUXST must be active (HIGH) and V

DDA

must be stable (see also Section 18.1) to allow the

master clock to access different circuit parts after a reset (RESET active). AUXDAC1 and AUXDAC2 are only activated if their related power-on bit is set. AUXDAC1 is default off, AUXDAC2 is default on.

RESET must be active during at least 3 MCLK cycles, with AUXST active, to ensure a correct initialisation of all the digital circuitry of the PCF50732. Since RESET is asynchronous even small spikes of a few nanoseconds can cause partial resets.

For power supply noise interference reduction, a pair of power supply and ground pins are provided for the:

• Baseband analog: V

• Voice band analog: V

• Voice band output drivers: V

• DC reference voltages and currents: V

• Digital circuitry: V

All VSS pins are connected internally. V supply. V

DDA(bb)

analog supplies, and are referred to as V

, V

DDA(vb)

DDD/VSSD

DDA(bb)/VSSA(bb)

DDA(vb)/VSSA(vb)

DDA(vbo)/VSSA(vbo)

, V

DDA(vbo)

, and V

DDA(ref)/VSSA(ref)

is the digital

DDD

are

DDA(ref)

throughout

DDA

this document. These analog supplies must be connected externally.

8.2 Baseband and voice band reference voltages

The reference voltage V gap voltage reference circuit and is available at pin V

As V

is used as reference for most of the internal analog

ref

is generated on-chip by a band

ref

circuitry, noise must be kept as low as possible by connecting an external decoupling capacitor at this pin.

The voltage at V and voice band reference voltage V

is buffered to generate the baseband

ref

as well as internal

ref

references for the different functions, such as the auxiliary and the transmit DACs.

9 BASEBAND CODEC

The baseband CODEC is a complete interface circuit between the RF part in a mobile communication handset and the digital signal processor. It consists of three parts:

• The transmit path, which converts a bitstream to analog quadrature signals for the RF devices

• The receive path, which transforms the quadrature signals of the IF chip (I/Q) to digital signals

• The digital baseband serial interface, which exchanges baseband data between the PCF50732 and the DSP. The interface also includes signals to power-up and power-down the baseband transmit (TX) and receive (RX) paths.

9.1 Baseband transmit path

The baseband transmit path consists of three parts:

• GMSK modulator: generation of a Gaussian Minimum Shift Keying (GMSK) signal

• 10-bit DACs: digital-to-analog converters for the I and Q components of the GMSK signal

• Low-pass filters: analog reconstruction low-pass filters for the output of the DACs.

The requirements of the transmit path of a GSM terminal are given by

“GSM recommendation 05.05”

• Phase RMS error <5°

• Phase peak error <20°

• Amplitude error < ±1 dB.

Nevertheless the performance of the PCF50732 is far better than these figures indicate; see Section 18.1.

1999 May 03 9

Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

9.1.1 GMSK MODULATOR The input signal of the GMSK modulator is a bitstream

coming from the baseband serial interface, with a sampling frequency of 270.833 kHz. Typically 148 bits are modulated during a normal burst, and 88 bits during an access burst. Using this bitstream, the GMSK modulator generates digital I and Q components as described in

“GSM recommendation 05.04”

This is done in three steps:

1. First the incoming bitstream is differentially encoded by an EXOR operation on the actual bit and the previous bit

2. The instantaneous phase (ϕ) is calculated using a gaussian filter with an impulse response of 4 taps

3. A look-up table provides the cosine (I component) and the sine values (Q component) of the phase (ϕ).

The look-up table also interpolates the signal to a 16 times higher frequency (4.333 MHz).

9.1.2 10-

BIT DACS

The two 10-bit DACs are working at a sampling rate of

4.3333 MHz. They convert the digital I and Q components

of the GMSK modulator to differential analog I and Q signals.

9.1.3 L

OW-PASS FILTER

The analog output signals of the DACs are filtered by analog reconstruction low-pass filters.

These filters remove high frequency components of the DAC output signals and attenuate components around the

4.3333 MHz sampling frequency. The low-pass filters

have a cut-off frequency of approximately 300 kHz, with very linear phase behaviour in the pass band.

The baseband receive section can be switched between two modes of operation:

• ZIF (zero IF) mode for radio sections, which convert the receive signal down to baseband. In this mode the ADC is sampled at 6.5 MHz, the decimation filter samples down by a factor of 24 with a pass band as specified in Fig.3. The serial interface output BDIO delivers 2 × 12-bit values for I and Q components at

270.833 kHz.

• NZIF (near zero IF) mode for radio sections, which converts the receive signal down to a centre frequency of 100 kHz. In this mode the ADC is sampled at 13 MHz, the decimation filter samples down by a factor of 24 with a pass band as specified in Fig.3. The serial interface output BDIO delivers 2 × 12-bit values for I and Q components at 541.667 kHz.

9.2.1 R

ECEIVE ADC

The receive ADCs are Σ∆ analog-to-digital converters that convert differential input signals into1-bit data streams with a sampling frequency of 6.5 or 13 MHz.

9.2.2 D

IGITAL DECIMATION FILTER

Digital filtering is required for:

• Suppression of out-of-band noise produced by the Σ∆ ADC

• Decimation of the sampling rate (6.5 or 13 MHz) by 24

• System level filtering.

The digital filtering is performed by a digital FIR filter with a group delay for this running average filter of approximately 23 or 11.5 µs respectively. The filter uses twos complement arithmetic.

9.2 Baseband receive path

The baseband receive path consists of two parts:

• Receive ADC: Σ∆ analog-to-digital converters

• Decimation filter: digital decimation filters for I and Q.

1999 May 03 10

Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

handbook, full pagewidth

gain (dB)

−20

−40

−60

−80

−100

ZIF

100 200 300 400

NZIF

Fig.3 Transfer functions for the baseband receive filter.

f (kHz)

MBL025

600500

9.3 Baseband Serial Interface (BSI)

9.3.1 O

VERVIEW

The digital part of the baseband consists of a receive section and a transmit section. The receive section is a FIR filter that reduces the 6.5 MHz (13 MHz for NZIF mode) bitstream from the sigma-delta converters into 2 × 12-bit values at 270.833 kHz (541.667 kHz for NZIF mode).

The transmit section converts the 270.833 kHz data stream from the DSP into a GMSK signal sampled at

4.333 MHz. The 10-bit I and Q signals are then fed into two 10-bit DACs. The power ramping signal is also generated by the transmit section with the 10-bit AUXDAC3 block.

9.3.2 T

RANSMIT PATH BLOCK DESCRIPTION

9.3.2.1 Transmit serial interface

The power-up of the BSI transmit path is controlled via the TXON pin. When TXON is pulled HIGH, the transmit path recovers from power-down. The MCLK/48 = 270.833 kHz output signal BIOCLK is activated. When the BIEN0 period has elapsed the output signal BIEN goes LOW and the bits to be transmitted are clocked out of the DSP.

BIEN0 must be at least 10 quarterbits long to allow settling of the analog filters. Bits are clocked out of the DSP by the falling edge and clocked into the PCF50732 by the rising edge of BIOCLK. After the BIEN1 period has elapsed, BIEN is set HIGH again and transmission from the DSP ends. Logic 1s are modulated whenever BIEN is HIGH and the baseband transmit (BBTX) block is active. Values for BIEN0 and BIEN1 can be set in the Burst control register.

Figure 5 shows the timing for the BSI data transmission. In power-down the de-asserted value of BIOCLK is high-Z and BIEN is HIGH. Typical connection to the system DSP is defined in Table 1.

Table 1 Connection of BSI transmit signals to

PCF5087X

PCF50732 PCF5087X

PIN I/O PIN I/O

TXON I RFSIG[y] O

BDIO I/O SIOXD I/O BIEN O SOXEN_N I

BIOCLK O SIOXCLK I

1999 May 03 11

Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

9.3.2.2 Power ramping controller

The PCF50732 fully supports all multislot modes which do not require full duplex operation or more than two consecutive transmit bursts. In this specification double burst mode is used for all supported multislot modes while single burst mode supports the normal GSM modes.

The power ramping controller drives the power amplifier output envelope.

In each transmit (TX) burst one ramp-up and one ramp-down will be carried out. In multislot mode one intermediate ramp will be carried out in addition to ramp-up and ramp-down. Each ramp consists of 16 discrete step values that are sent to the DAC3. Each step’s duration is 2 quarterbits which translates into 8-bit long ramps. The DAC3 output is in 3-state whenever it is powered down. The ramping step values are stored in a 64 × 10-bit RAM as shown in Table 2.

In order to initialize AUXDAC3 it is necessary to write into the RAM all 32 (or 48 in multislot mode) DAC3 output values. Filling the RAM is normally done by writing a logic 0 to the address sub-register of the Burst control register, after which 32 or 48 values, depending on multislot mode, can be written into the data sub-register of the Burst control register. Writing to the DAC3 RAM is only possible when the DAC3 is powered off.

Total number of CSI-accesses is therefore 33 for a normal burst and 49 for a double burst.

An autoincrement feature will store these data into the correct RAM positions.

The value after power-up of DAC3 will always be equal to the value of RAM location 47.

AUXDAC3 timing is controlled by the Burst control register. This contains the following sub-registers:

• The RU register containing the delay in number of quarterbit cycles from the assertion of TXON to the start of the power-up ramping; default value is 0

• The RM register containing the delay in number of quarterbit cycles from the assertion of TXON to the start of the intermediate power ramp; default value is 0. RM is only used in case of multislot mode

• The RD register containing the delay in number of quarterbit cycles from the assertion of TXON to the start of the power-down ramping; default value is 0

• DAC3 burst RAM address register

• DAC3 burst RAM data register

• Single/double burst mode register: normal mode or

multislot mode selection flag.

After TXON goes HIGH and a time equal to RU quarterbit periods has elapsed, power ramp-up is done.

After a time period equal to RD quarterbits has elapsed power ramp-down is initiated.

The AUXDAC3 output is also shown in Fig.4. Values for RU (ramp-up) and RD (ramp-down) can be set

in the Burst control register of the control serial interface. RD must be greater than RU + 32. RU and RD range from 0 to 4000 QB (quarterbit). The register offers the possibility to enter codes up to 4095.

The GMSK modulator is active for a period of 2 clock cycles after the ramp-down or for the length of the TXON burst, whichever is longer.

Multislot (high speed switched data mode) can be selected by setting the appropriate bit in the Burst control register. In multislot mode an intermediate ramping step is done. This intermediate step is started after a time period equal to RM quarterbits has elapsed. A value for RM (intermediate ramp) is also set using the Burst control register. The following conditions must be true:

RU + 32 < RM and RM + 32 < RD.

Table 2 AUXDAC3 RAM contents

RAM ADDRESS DATA

0 to 15 ramp-up data 16 to 31 intermediate ramp data 32 to 47 ramp-down data 48 to 64 not used

Table 3 Power ramping timing characteristics

SYMBOL VALUE COMMENTS

t t t t t

0 ru im rd rup

, t

rim

12t

one quarterbit (QB) RU register 0 to 4000 QB RM register RU + 32 to 4000 QB RD register RM + 32 to 4000 QB

rdo

32t

8 bits; 32 QB

(1)

Note

1. QB: Quarterbit, usually referred to the time needed for one quarter of a GSM baseband bit, i.e. a frequency of

⁄12× 13 MHz.

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Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

andbook, full pagewidth

TXON

AUXDAC3

ADDRESS

AUXDAC3

RAM

(1)

APE_DAC3

(1) APE_DAC3: Analog Power Enable signal for the AUXDAC3.

15 15 31

rup

RU RM RD

Fig.4 Power ramping timing characteristics (multislot mode).

9.3.3 RECEIVER PATH BLOCK DESCRIPTION

9.3.3.1 Receive serial interface

The baseband serial interface sends the digital signal of the receive path to a digital signal processor. It also takes the digital bitstream from the digital signal processor and transmits it via the baseband CODEC.

The baseband reception and transmission are active in bursts. A normal burst has a length of 548 µs. The frame rate of bursts is 4.615 ms. Using a normal traffic channel, one burst for each frame is transmitted and two bursts are received. To save as much power as possible, the transmit path and the receive path of the PCF50732 are in power-up mode only during the transmission or reception bursts respectively.

The power-up of the receive section is controlled via the RXON pin or RXON bit. When RXON is driven HIGH, the receive section recovers from power-down and the output clock BIOCLK is activated. After a settling delay of 52 µs (ZIF mode, analog circuitry + decimation filter settling time), BOEN goes LOW to transfer the first 12-bit I and Q words. The settling time is only 26 µs in NZIF mode.

31 47154747

rim

rdo

MGR995

Bits are clocked out of the PCF50732 by the falling edge, and clocked into the DSP by the rising edge of BIOCLK. In normal bursts 148 I/Q pairs are read from the PCF50732.

When RXON goes LOW, the last pair of I and Q values will be sampled and transferred to the baseband processor (both I and Q components). BIOCLK stops after additional 16 BIOCLK cycles. The receive path is powered down again. In power-down the BIOCLK output is put in 3-state and the BOEN output is HIGH.

The output format is 2 × 12-bit I/Q (twos complement). Transmission occurs MSB first, I followed by Q. The serial clock signal BIOCLK will run at 6.5 MHz, or 13 MHz in the NZIF mode. Figure 6 shows the timing of the BSI data reception.

An automatic offset compensation mechanism is provided in order to achieve the required performance. This mechanism will short the receive (RX) inputs internally and measure the resulting offset value. This offset value will be subtracted from all subsequent I/Q output words. The offset inherent to the device can thereby be reduced to a few millivolts. Default value for both I- and Q-offset is zero.

1999 May 03 13

Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

Offset compensation measurement can be done on three

Table 4 Connection of BSI receive signals to the channels separately: baseband receive I channel, baseband receive Q channel and AUXADC channel. All AUXADC channels use the same offset compensation value. Starting an offset measurement is done by writing a logic 1 into the offset trigger register for each channel that needs calibration. If the value ‘7’ (decimal) is written into the offset trigger register offsets will be measured for I, Q and AUXADC channels.

Offsets can also be read or written directly. Each offset

RXON I RFSIG[z] O

BDIO I/O SIOXD I/O

BOEN O SIXEN_N I

BIOCLK O SIOXCLK I

measurement is implemented internally as an AUXADC measurement and takes approximately 100 µs. Offsets from −256 up to 255 can be compensated.

9.3.4 BASEBAND SERIAL INTERFACE (BSI) TIMING CHARACTERISTICS

handbook, full pagewidth

(1)

TXI/Q

data

ramp-up

32 QB

data

logic 1s

intermediate ramp

32 QB

data

PCF5087X

PCF50732 PCF5087X

PIN I/O PIN I/O

data

ramp-down

32 QB

logic 1s

trail

2 BIOCLK

clocks

AUXDAC3

BIOCLK

BDIO

BIEN

TXON

(1) TXI/Q = transmit I or Q. (2) d.c. = don’t care; will be overwritten with logic 1.

(2)

d.c.

d.c. d.c. B(0) B(n)B(1)

Fig.5 Timing of the baseband serial interface transmit path; for the timing values see Table 5

high-Zhigh-Z

MGR990

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handbook, full pagewidth

BIOCLK

BDIO

BOEN

RXON

I11 I0 Q11 Q0

548 µs

16t

high-Zhigh-Z

MGR991

Fig.6 Timing of the baseband serial interface receive path; for the timing values see Table 5.

Table 5 BSI timing characteristics

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

Master clock

MCLK cycle time − 76.9 − ns MCLK LOW time 30 MCLK HIGH time 30

RESET LOW time 3t Baseband Serial Interface (BSI) transmit path (see Fig.5) t

BIEN0 value 10 − 511 QB

BIEN1 value t

BIOCLK cycle time − 48t

data set-up time 20 −−ns

data hold time 20 −−ns

BIOCLK active after TXON rising edge −−t

analog TX and GMSK power-up time −−17.4 QB

ramp-up value 0 − 3940 QB

intermediate ramp value 32 + t

ramp-down value

normal mode 32 + t double burst mode 32 + t

⁄2t

−−ns

− 4000 QB

− 3980 QB

− 4020 QB

− ns

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Philips Semiconductors Objective speciﬁcation

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SYMBOL PARAMETER MIN. TYP. MAX. UNIT

Baseband Serial Interface (BSI) receive path (see Fig.6)

analog power-up and ﬁlter settling time

ZIF mode − 52 −µs NZIF mode − 26 −µs

BIOCLK cycle time

ZIF mode − 2t NZIF mode − t

− ns

BOEN LOW after falling clock edge −−15 ns

BIOCLK falling edge to data valid −−15 ns

BOEN HIGH after falling clock edge −−15 ns

10 VOICE BAND CODEC

The voice band CODEC is a complete analog front-end circuit. It consists of three parts:

• The receive path, which converts a digital linear PCM signal to an analog signal for an earpiece, an external loudspeaker or a buzzer

• The transmit path, which receives an analog signal from a microphone or an auxiliary input and converts it into a digital linear PCM signal

• The digital Audio Serial Interface (ASI), which connects the digital linear PCM signals of the receive and transmit paths to a digital signal processor.

Various functions and characteristics of the voice band CODEC can be selected by programming the corresponding control registers in the Control register block (see also Tables 11, 22, 23, 24 and 25).

10.1 Voice band receive path

The voice band receive path consists of the following parts:

• The receive part of the voice band signal processor

• NOISE SHAPER: 3rd order digital Σ∆ modulator,

generates a bit stream at 1 MHz to drive the EARDAC

• EARDAC: digital-to-analog converter including low-pass filter for high frequency noise content of noise shaper

• EARAMP: amplifier for an earpiece

• AUXAMP: amplifier for an auxiliary loudspeaker

• BUZAMP: amplifier for a buzzer output.

Linearity of receiver equipment (to earpiece) at EARPGA = 0 dB and a volume control (VOLPGA and EARAMP or AUXAMP) of−12 dB, signal-to-total harmonic distortion ratio according to

II.11.10 V.4.16.1”

“GSM recommendation

10.1.1 RXVOL RXVOL controls the volume of the voice band receive

path. In conjunction with EARAMP, AUXAMP and BUZAMP it allows a gain variation from +6 to −30 dB in 64 steps; see Table 25. RXVOL also provides a mute selection of the three outputs EARP/EARN, AUXSP and BUZ respectively. At

RESET the volume is automatically

set to −12 dB.

10.1.2 RXPGA RXPGA controls the gain of the voice band receive path

within a range of −24 to +12 dB in 64 steps for calibration purposes.

10.1.3 RXFILTER RXFILTER is a digital band-pass filter with a pass band

from 300 to 3400 Hz. It is realized by a programmable structure (voice band signal processor).

10.1.4 EARDAC EARDAC is a DAC operating at a sampling frequency of

1 MHz. It converts the bitstream input to a sampled differential analog signal and low-pass filters the output signal at the same time.

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Philips Semiconductors Objective speciﬁcation

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10.1.5 EARAMP

EARAMP is an amplifier, capable of driving a standard earpiece with a minimum impedance of 8 Ω in single-ended mode or 16 Ω in differential mode.

10.1.6 AUXAMP

AUXAMP is an amplifier for connection to an external loudspeaker amplifier of minimum 8 Ω (hands-free car kit).

An‘auxiliary speaker external amplifier control’ output pin (AMPCTRL) can be used to switch on/off an external amplifier (hands-free car kit). The status of AMPCTRL is programmable via the Control Serial Interface; its default value is on.

10.1.7 BUZAMP

BUZAMP is an amplifier for connection to an external buzzer of minimum 8 Ω. It has the same output characteristics as the AUXAMP and can hence be used as a second auxiliary output amplifier. It is switched on/off by a dedicated control bit in the Control register block.

10.2 Voice band transmit path

The voice band transmit path consists of the following parts:

• MICMUX: microphone input multiplexer

• MICADC: Σ∆ analog-to-digital converter

• DECIMATOR: decimates the incoming bit stream from

1 MHz to 40 kHz

• TXFILTER: band-pass filter for the digital transmit signal and down-sampling

• TXPGA/LIM: fine-programmable gain for calibration, limiter

• SidePGA: voice band sidetone programmable gain amplifier.

Linearity of transmitter equipment, signal-to-total harmonic distortion ratio according to

II.11.10 V.4.16.1”

10.2.1 MICMUX

MICMUX is used to select between a differential signal at pins MICP/MICN and a differential signal at pins AUXMICP/AUXMICN.

“GSM recommendation

Values are specified for a standard electret microphone with a sensitivity of −64 ±3 dB for high gain or for an external microphone with an amplifier sensitivity of

−26 ±3 dB (0 dB ≡ 1 V/0.1 Pa = 1 V/µbar; at 1 kHz).

10.2.2 MICADC MICADC is a Σ∆ A/D converter which generates a 1 MHz

bitstream.

10.2.3 DECIMATOR The DECIMATOR is a digital filter, which performs a signal

processing to a lower sampling rate at the output compared to the input.

The bitstream with a sampling frequency of 1 MHz is low-pass filtered and down-sampled to 40 kHz by a FIR filter.

A digital high-pass filter and a digital low-pass filter (both IIR filters) process the 14-bit input samples to achieve a band-pass with a pass band from 300 to 3400 Hz. These filters run on the on-chip voice band signal processor (see Fig.7). It’s program is down-loaded into the instruction memory (IRAM) via the CSI (see Table 26).

The output of the TXFILTER is down-sampled to a sampling frequency of 8 kHz with a word length of 16 bits.

10.2.4 TXPGA TXPGA adapts the analog signals coming from MICMUX

within a range of−30 to +6 dB. It is designed for calibration purposes.

10.2.5 SIDEPGA SidePGA loops part of the voice band transmit signal back

into the receive path. There are 64 gain steps from mute to +6 dB.

10.3 Voice band digital circuitry

The voice band digital circuitry is responsible for converting a 16-bit PCM signal at 8 kHz sample rate to and from a 1-bit 1 MHz signal. It also contains a band-pass filter for 300 to 3400 Hz and a sidetone engine. Various volume settings are calculated inside this block. Figure 7 shows the block diagram of the voice band signal processor.

AND TXFILTER

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VOICE BAND SIGNAL PROCESSOR

ADI

ACLK

AFS

ADO

16-bit, 8 kHz

ASI

SidePGA

RXVOL

TXPGA/LIM

RXPGA/LIM

RRAM IRAM

Fig.7 Block diagram of the voice band signal processor.

10.3.1 VOLUME CONTROL BLOCK

The volume control block contains the RXPGA, SidePGA, TXPGA and both limiter blocks. The possible settings can be found in the description of the CSI block. All digital volume control blocks, i.e. RXPGA, SidePGA, and TXPGA, will allow settings from +6 to −30 dB and mute in 64 steps. However, not all combinations of settings for these blocks will be meaningful. The limiter will always clip signals with overflow to the maximum or minimum allowable value.

10.3.2 A

UDIO SERIAL INTERFACE (ASI) BLOCK

The ASI is the voice band serial interface which provides the connection for the exchange of PCM data in both receive and transmit directions, between the baseband digital signal processor and the PCF50732. The data is coded in 16-bit linear PCM twos complement words.

DECIMATOR

RX/TX

FILTER

NOISE

SHAPER

MGR992

TX_BS (transmit bitstream)

1-bit, 1 MHz

RX_BS (receive bitstream)

Pin ADO is put in 3-state after the LSB of the transmit word, independent of the length of the AFS pulse. If the channel position 0 (see Section 10.3.2.1) is selected, then the MSB must be output directly after AFS becomes a logic 1, even if no rising edge on ACLK has been given yet.

The following modes of operation are programmable: channel position and ACLK clock mode.

10.3.2.1 Channel position mode

Depending on a programmable register value n (n = 0 to 15) one of 16 channels can be selected (see Table 22). The ASI can add a delay of 16 × n-bit clocks between the assertion of AFS and the start of the MSB of the PCM values. This delay is independently programmable for transmit and receive mode.

10.3.2.2 ACLK clock mode

A frame start is defined by the first falling edge of ACLK after a rising AFS. This first falling edge is used to clock in the first data bit on both the baseband and the DSP device.

Data on pin ADI is clocked in (MSB first) on the falling edge of the ACLK clock. Data is clocked out (MSB first) on pin ADO on the rising edge of the ACLK clock.

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Single or double clock mode can be selected. Double clock mode implies two clock pulses per data bit and is used for communication with IOM2 compatible devices. In double clock mode data must be output on the first rising edge and be read on the last falling edge.

Philips Semiconductors Objective speciﬁcation

Baseband and audio interface for GSM PCF50732

Table 6 Pin connection of the audio serial interface to the PCF5087X

PCF50732 PCF5087X

PIN I/O PIN I/O

ADI I DD O

ADO O DU I

ACLK I DCL O

AFS I FSC O

handbook, full pagewidth

t t

AFS

ADI

ADO

: receive path data channel delay.

rpdc

: transmit path data channel delay.

tpdc

word

rpdc

word

tpdc

Fig.8 Frame structure of the Audio Serial Interface (ASI).

MGR993

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10.3.2.3 Audio Serial Interface (ASI) timing characteristics

handbook, full pagewidth

AFS

ACLK

ADO

single

clock

mode

ADI

ADO

double

clock

mode

ADI

last slot

last bit

last slot

last bit

last slot

last bit

MSB

first slot

first bit

MSB LSB

first slot

first bit

first slot

second bit

first slot

second bit

MSB LSB

first slot

first bit

MSB

first slot

first bit

LSB

last slot

last bit

last slot

last bit

slot 1

bit 2

slot 1

bit 2

last slot

last bit

LSB

last slot

last bit

high-Z

MGR994

Fig.9 Timing of the Audio Serial Interface (ASI).

Table 7 ASI timing characteristics

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

frame sync (AFS) set-up time to falling edge of ACLK 70 −−ns frame sync (AFS) hold time from falling edge of ACLK 40 −−ns ACLK rising edge to data (ADO) valid −30 − +30 ns data (ADI) set-up time to falling edge of ACLK 50 −−ns data (ADI) hold time from falling edge of ACLK 80 −−ns ﬁrst data valid (ADO) after AFS rising edge 0 − 60 ns ACLK period

single clock mode 0.5 − 7.8 µs double clock mode 0.5 − 3.9 µs

AFS period − 125 −µs ACLK LOW before AFS rising edge 40 −−ns

1999 May 03 20

+ 44 hidden pages

Philips pcf50732 DATASHEETS

Specifications and Main Features

Frequently Asked Questions

User Manual

CONTENTS

1 FEATURES

2 APPLICATIONS

3 GENERAL DESCRIPTION

4 ORDERING INFORMATION

5 QUICK REFERENCE DATA

6 BLOCK DIAGRAM

7 PINNING

8 FUNCTIONAL DESCRIPTION

8.1 General

8.2 Baseband and voice band reference voltages

9 BASEBAND CODEC

9.1 Baseband transmit path

9.2 Baseband receive path

9.3 Baseband Serial Interface (BSI)

10 VOICE BAND CODEC

10.1 Voice band receive path

10.2 Voice band transmit path

10.3 Voice band digital circuitry