Philips PCF2110CU-10-F1, PCF2100CT-F1, PCF2100CU-10-F1, PCF2100CU-F1, PCF2100CP-F1 Datasheet

DATA SH EET

Product specification
Supersedes data of 1995 May 03
File under Integrated Circuits, IC12

1997 Mar 28

INTEGRATED CIRCUITS

PCF21xxC family

LCD drivers

1997 Mar 28 2

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

CONTENTS

1 FEATURES
2 GENERAL DESCRIPTION
3 QUICK REFERENCE DATA
4 ORDERING INFORMATION
5 BLOCK DIAGRAMS
6 PINNING

6.1 PCF2100C

6.2 PCF2111C

6.3 PCF2112C
7 FUNCTIONAL DESCRIPTION

7.1 PCF2100C

7.2 PCF2111C

7.3 PCF2112C

7.4 Bus control logic

7.5 Timing

7.6 Input circuitry

7.7 Expansion
8 LIMITING VALUES
9 HANDLING
10 DC CHARACTERISTICS
11 AC CHARACTERISTICS
12 PACKAGE OUTLINES
13 SOLDERING

13.1 Plastic dual in-line packages

13.1.1 By dip or wave

13.1.2 Repairing soldered joints

13.2 Plastic small outline packages

13.2.1 By wave

13.2.2 By solder paste reflow

13.2.3 Repairing soldered joints (by hand-held
soldering iron or pulse-heated solder tool)

14 DEFINITIONS
15 LIFE SUPPORT APPLICATIONS

1997 Mar 28 3

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

1 FEATURES

• Supply voltage 2.25 to 6.0 V

• Low current consumption

• Serial data input

• CBUS control

• One-point built-in oscillator

• Stand-alone or expanded system

• Power-on reset clear

• LCD segments

– 40 (PCF2100C)
– 64 (PCF2111C)
– 32 (PCF2112C)

• Multiplex rate

– 1 : 2 (PCF2100C)
– 1 : 2 (PCF2111C)
– 1 : 1 (PCF2112C)

• Word length

– 22 bits (PCF2100C)
– 34 bits (PCF2111C)
– 34 bits (PCF2112C).

2 GENERAL DESCRIPTION

The PCF21xxC family are single-chip, silicon gate CMOS
LCD driver circuits. A 3-line bus (CBUS) structure enables
serial data transfer with microcontrollers. All inputs are
CMOS/NMOS compatible.

The devices have the same function and performance as
those of the PCF21xx family, which they supersede.
The maximum operating voltage required is reduced from

6.5 to 6.0 V.

3 QUICK REFERENCE DATA

4 ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DD

supply voltage 2.25 − 6.0 V

I

DD1

supply current 1 outputs open; CBUS inactive − 20 50 µA

I

DD2

supply current 2 outputs open; CBUS inactive;

T

amb

=25°C

− 20 30 µA

P

O

power dissipation per output −−100 mW

T

amb

operating ambient temperature −40 − +85 °C

T

stg

storage temperature −65 − +150 °C

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

PCF2100CP DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1
PCF2100CT SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1
PCF2111CP DIP40 plastic dual in-line package; 40 leads (600 mil) SOT129-1
PCF2111CT VSO40 plastic very small outline package; 40 leads SOT158-1
PCF2112CP DIP40 plastic dual in-line package; 40 leads (600 mil) SOT129-1
PCF2112CT VSO40 plastic very small outline package; 40 leads SOT158-1

1997 Mar 28 4

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

5 BLOCK DIAGRAMS

Fig.1 Block diagram; PCF2100C.

handbook, full pagewidth

BACKPLANE AND SEGMENT DRIVERS

ANALOG

VOLTAGE

BUS

CONTROL

SHIFT

REGISTER

LATCHES

AND

DRIVER CONTROL

OSCILLATOR

AND

DIVIDER

40-SEGMENT LCD

BP2BP1
2526

S1 to S20

24 to 5

2

3

4

DLEN

CLB

DATA

V

SS

V

DD

OSC

680

pF

1 MΩ

R

O

C

O

A

B

28

1

27

MLD286

PCF2100C

Fig.2 Block diagram; PCF2111C.

handbook, full pagewidth

BACKPLANE AND SEGMENT DRIVERS

ANALOG

VOLTAGE

BUS

CONTROL

SHIFT

REGISTER

LATCHES

AND

DRIVER CONTROL

OSCILLATOR

AND

DIVIDER

64-SEGMENT LCD

BP2BP1
3738

2

3

4

DLEN

CLB

DATA

V

SS

V

DD

OSC

680

pF

1 MΩ

R

O

C

O

A

B

40

1

39

MLD285

PCF2111C

S1 to S32

36 to 5

1997 Mar 28 5

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

Fig.3 Block diagram; PCF2112C.

handbook, full pagewidth

BACKPLANE AND SEGMENT DRIVERS

ANALOG

VOLTAGE

BUS

CONTROL

SHIFT

REGISTER

LATCHES

AND

DRIVER CONTROL

OSCILLATOR

AND

DIVIDER

32-SEGMENT LCD

BP
38

2

3

4

DLEN

CLB

DATA

V

SS

V

DD

OSC

1.5
nF

1 MΩ

R

O

C

O

40

1

39

MLD287

PCF2112C

S1 to S32

36 to 5

1997 Mar 28 6

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

6 PINNING

6.1 PCF2100C
SYMBOL PIN DESCRIPTION

CLB 1 clock burst input (CBUS)
V

DD

2 supply voltage
OSC 3 oscillator input
V

SS

4 supply voltage ground
S20 5 LCD driver output 20
S19 6 LCD driver output 19
S18 7 LCD driver output 18
S17 8 LCD driver output 17
S16 9 LCD driver output 16
S15 10 LCD driver output 15
S14 11 LCD driver output 14
S13 12 LCD driver output 13
S12 13 LCD driver output 12
S11 14 LCD driver output 11
S10 15 LCD driver output 10
S9 16 LCD driver output 9
S8 17 LCD driver output 8
S7 18 LCD driver output 7
S6 19 LCD driver output 6
S5 20 LCD driver output 5
S4 21 LCD driver output 4
S3 22 LCD driver output 3
S2 23 LCD driver output 2
S1 24 LCD driver output 1
BP2 25 backplane driver output 2
BP1 26 backplane driver output 1
DATA 27 data input line (CBUS)
DLEN 28 data input line enable (CBUS)

Fig.4 Pin configuration; SOT117-1 and SOT136-1.

handbook, halfpage

PCF2100C

MLD295

1
2
3
4
5
6
7
8

9
10
11
12
13
14

28
27
26
25
24
23
22
21
20
19
18
17
16
15

CLB
V
OSC

S20
S19
S18
S17
S16
S15
S14
S13
S12
S11

DD

V

SS

DLEN
DATA
BP1
BP2
S1
S2
S3
S4
S5
S6
S7
S8
S9
S10

1997 Mar 28 7

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

6.2 PCF2111C
SYMBOL PIN DESCRIPTION

CLB 1 clock burst input (CBUS)
V

DD

2 supply voltage
OSC 3 oscillator input
V

SS

4 supply voltage ground
S32 5 LCD driver output 32
S31 6 LCD driver output 31
S30 7 LCD driver output 30
S29 8 LCD driver output 29
S28 9 LCD driver output 28
S27 10 LCD driver output 27
S26 11 LCD driver output 26
S25 12 LCD driver output 25
S24 13 LCD driver output 24
S23 14 LCD driver output 23
S22 15 LCD driver output 22
S21 16 LCD driver output 21
S20 17 LCD driver output 20
S19 18 LCD driver output 19
S18 19 LCD driver output 18
S17 20 LCD driver output 17
S16 21 LCD driver output 16
S15 22 LCD driver output 15
S14 23 LCD driver output 14
S13 24 LCD driver output 13
S12 25 LCD driver output 12
S11 26 LCD driver output 11
S10 27 LCD driver output 10
S9 28 LCD driver output 9
S8 29 LCD driver output 8
S7 30 LCD driver output 7
S6 31 LCD driver output 6
S5 32 LCD driver output 5
S4 33 LCD driver output 4
S3 34 LCD driver output 3
S2 35 LCD driver output 2
S1 36 LCD driver output 1
BP2 37 backplane driver output 2
BP1 38 backplane driver output 1
DATA 39 data input line (CBUS)
DLEN 40 data input line enable (CBUS)

Fig.5 Pin configuration; SOT129-1 and SOT158-1.

handbook, halfpage

PCF2111C

MLD291

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18
19
20

40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21

CLB

V

OSC

S32

S31
S30
S29
S28
S27
S26
S25
S24
S23
S22
S21
S20
S19
S18
S17

DD

V

SS

DLEN

BP1

S1

S2
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
S13
S14
S15
S16

DATA

BP2

1997 Mar 28 8

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

6.3 PCF2112C
SYMBOL PIN DESCRIPTION

CLB 1 clock burst input (CBUS)
V

DD

2 supply voltage
OSC 3 oscillator input
V

SS

4 supply voltage ground
S32 5 LCD driver output 32
S31 6 LCD driver output 31
S30 7 LCD driver output 30
S29 8 LCD driver output 29
S28 9 LCD driver output 28
S27 10 LCD driver output 27
S26 11 LCD driver output 26
S25 12 LCD driver output 25
S24 13 LCD driver output 24
S23 14 LCD driver output 23
S22 15 LCD driver output 22
S21 16 LCD driver output 21
S20 17 LCD driver output 20
S19 18 LCD driver output 19
S18 19 LCD driver output 18
S17 20 LCD driver output 17
S16 21 LCD driver output 16
S15 22 LCD driver output 15
S14 23 LCD driver output 14
S13 24 LCD driver output 13
S12 25 LCD driver output 12
S11 26 LCD driver output 11
S10 27 LCD driver output 10
S9 28 LCD driver output 9
S8 29 LCD driver output 8
S7 30 LCD driver output 7
S6 31 LCD driver output 6
S5 32 LCD driver output 5
S4 33 LCD driver output 4
S3 34 LCD driver output 3
S2 35 LCD driver output 2
S1 36 LCD driver output 1
n.c. 37 not connected
BP 38 backplane driver output
DATA 39 data input line (CBUS)
DLEN 40 data input line enable (CBUS)

Fig.6 Pin configuration; SOT129-1 and SOT158-1.

handbook, halfpage

PCF2112C

MLD292

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18
19
20

40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21

CLB

V

OSC

S32

S31
S30
S29
S28
S27
S26
S25
S24
S23
S22
S21
S20
S19
S18
S17

DD

V

SS

DLEN

BP

S1

S2
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
S13
S14
S15
S16

DATA

n.c.

1997 Mar 28 9

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

7 FUNCTIONAL DESCRIPTION

An LCD segment or LED output is activated when the
corresponding DATA bit is HIGH.

7.1 PCF2100C

When DATA bit 21 is HIGH, the A-latches (BP1) are
loaded. With DATA bit 21 LOW, the B-latches (BP2) are
loaded. CLB pulse 23 transfers data from the shift register
to the selected latches.

7.2 PCF2111C

When DATA bit 33 is HIGH, the A-latches (BP1) are
loaded. With DATA bit 33 LOW, the B-latches (BP2) are
loaded. CLB pulse 35 transfers data from the shift register
to the selected latches.

7.3 PCF2112C

When DATA bit 33 is HIGH, the latches are loaded.
CLB pulse 35 transfers data from the shift register to the
selected latches.

7.4 Bus control logic

The following tests are carried out by the bus control logic:

1. Test on leading zero

2. Test on number of DATA bits

3. Test of disturbed DLEN and DATA signals during
transmission.

If one of the test conditions is not fulfilled, no action follows
the load condition (load pulse with DLEN LOW) and the
driver is ready to receive new data.

Fig.7 CBUS data format.

handbook, full pagewidth

DLEN

CLB

DATA

1

01

S1



1

S1

2

S2



2

S2

3

S3



3

S3

4

S4



4

S4

5

S5



5

S5

6

S6



6

S6

7

S7



7

S7

31

S31



19

S19

2345 678 3220332134

22

35
23

PCF2111C and PCF2112C
PCF2100C


PCF2111C and PCF2112C


load bit

load pulse

leading zero

test leading zero

32

S32



20

S20

33

21

PCF2100C

bit number
output

MLD296

1997 Mar 28 10

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

7.5 Timing

Fig.8 Timing diagram for PCF2100C and PCF2111C.

MLD294

V

DD

V

SS

SSDD

0.5 (V V )

SSDD

0.5 (V V )

V

DD

V

SS

SSDD

0.5 (V V )

V

DD

V

SS

SSDD

V V

0

SSDD

0.5 (V V )
SSDD

(V V )

SSDD

0.5 (V V )

SSDD

V V

0

SSDD

0.5 (V V )
SSDD

(V V )

BP2 SX

BP1 SX

BP1

BP2

SX

1

f

LCD

OFF / OFF ON / OFF OFF / ON ON / ON

Fig.9 Timing diagram for PCF2112C.

handbook, halfpage

MLD299

V

DD

V

SS

V

DD

V

SS
SSDD

V V

0

SSDD

(V V )

BP SX

Segment X

(SX)

BP

1

f

LCD

OFF ON

1997 Mar 28 11

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

7.6 Input circuitry

7.7 Expansion

Fig.10 Input circuitry.

VSS line is common. In systems where it is expected that V

DD2>VDD1

+ 0.5V, a resistor should be inserted to reduce the current flowing through the

input protection. Maximum input current ≤40µA.

handbook, halfpage

BUS DRIVER PCF21XXC

R

100 kΩ

V

SS

V

DD2VDD

V

SS

MLD284

Fig.11 Expansion possibility (using PCF2111C).

By connecting OSC to VSS the BP pins become inputs and generate signals synchronized to the single oscillator frequency, thus allowing expansion of
several members of the PCF21xxC family up to the BP drive capability of the master. The PCF2112C can only function as a master for other PCF2112Cs.

handbook, full pagewidth

DLEN

OSC

CLB
DATA

BP2 S1 to S32BP1

V

SS

PCF2111C

SLAVE1

DLEN

OSC

CLB
DATA

BP2 S1 to S32BP1

V

SS

PCF2111C

SLAVE1

DLEN

OSC

CLB
DATA

BP2 S1 to S32BP1

V

SS

V

DD

PCF2111C

MASTER

LCD

MLD293

DATA

CLB
DLEN1
DLEN2
DLEN3

1997 Mar 28 12

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

8 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note

1. Derate by 7.7 mW/K when T

amb

>60°C.

9 HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices. See

“Handling MOS devices”

.

ESD in accordance with

“MIL STD 883C, Method 3015”

.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DD

supply voltage −0.5 +8.0 V

V

I

input voltage DLEN, CLB, DATA and OSC VSS− 0.5 VDD+ 0.5 V

V

O

output voltage BP1, BP2 and S1 to S32 VSS− 0.5 VDD+ 0.5 V

I

DD

, I

SS

supply current −50 +50 mA

I

I

DC input current −20 +20 mA

I

O

DC output current −25 +25 mA

P

tot

total power dissipation per package note 1 − 500 mW

P

O

power dissipation per output − 100 mW

T

stg

storage temperature −65 +150 °C

1997 Mar 28 13

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

10 DC CHARACTERISTICS

V

DD

= 2.25 to 6.0 V; VSS=0V; T

amb

= −40 to +80 °C; RO=1MΩ; CO= 680 pF; unless otherwise specified.

Notes

1. Outputs open; CBUS inactive.

2. Resets all logic, when V

DD<VPOR

.

3. Periodically sampled (not 100% tested).

4. Outputs measured one at a time.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

DD

supply voltage 2.25 − 6.0 V

I

DD

supply current note 1; see Fig.13 − 20 50 µA

note 1; T

amb

=25°C;

see Fig.13

− 20 30 µA

V

POR

power-on reset voltage level note 2 − 1.0 1.6 V

Inputs CLB, DATA and DLEN

V

IL

LOW level input voltage −−0.8 V

V

IH

HIGH level input voltage 2.0 −−V

I

LI

input leakage current VI=VSSor V

DD

−−±1µA

C

i

input capacitance note 3 −−10 pF

Input OSC

I

osc

oscillator start-up current VI=V

SS

0.5 1.2 5.0 µA

LCD outputs

V

BP

DC voltage of backplane drivers −±20 − mV

Z

O(BP)

backplane driver output impedance note 4; VDD=5V − 0.5 5.0 kΩ

Z

O(S)

segment driver output impedance note 4; VDD=5V − 17kΩ

1997 Mar 28 14

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

11 AC CHARACTERISTICS

V

DD

= 2.25 to 6.0 V; VSS=0V; T

amb

= −40 to +80 °C; RO=1MΩ; CO= 680 pF; all timing values are referenced to V

IH

and VIL levels with an input voltage swing of VSSto VDD; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Inputs CLB, DATA and DLEN (see Fig.12)

t

SUDA

data set-up time 3 −−µs

t

HDDA

data hold time 3 −−µs

t

SUEN

enable set-up time 1 −−µs

t

SUDI

disable set-up time 2 −−µs

t

SULD

load pulse set-up time 2.5 −−µs

t

BUSY

busy time 3 −−µs

t

WH

CLB HIGH time 1 −−µs

t

WL

CLB LOW time 5 −−µs

t

CLB

CLB cycle time 10 −−µs

t

r

rise time −−10 µs

t

f

fall time −−10 µs
LCD timing (see Figs. 12, 14, 15, 16 and 17)
f

LCD

LCD frame frequency

PCF2100C, PCF2111C 60 75 100 Hz
PCF2112C C

O

= 1.5 nF 30 35 50 Hz

t

BS

transfer time with test loads VDD=5V − 20 100 µs
t

PLCD

driver delay time with test loads VDD=5V − 20 100 µs

1997 Mar 28 15

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

handbook, full pagewidth

MLD297

BP1, BP2

(except PCF 2112C)

(V = 5 V)

DD

0.5 V

BS

t

CLB

t

SX

V

DD

2

0.5 V

(V = 5 V)

DD

0.5 V

0.5 V

0.5 V

0.5 V

(V = 5 V)

DD

enable disable

V

IL max

V

IL max

V

IL max

V

IL max

V

IH min

V

IH min

V

IH min

V

IH min

V

IH min

V

IL max

DLEN

t

r

t

r

t

f

t

f

t

HDDA

t

SUDA

t

SUEN

t

SUDA

t

SUDI

t

SULD

t

BUSY

t

PCLD

t

HDDA

t

WH

t

WL

t

WL

leading zero data S1 load bit

load pulse

12

22

34

23 (1)

35 (2)

BP (PCF2112C)

CLB

DATA

Fig.12 CBUS timing.

(1) Load pulse 23 for PCF2100C (see Fig.7).

(2) Load pulse 35 for PCF2111C and PCF2112C (see Fig.7).

1997 Mar 28 16

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

Fig.13 Supply current as a function of supply

voltage.

(1) T

amb

= −40°c.

(2) T

amb

= +85°c.

(3) T

amb

= +25°c.

handbook, halfpage

024 8

20

8

12

16

MLD283

6

I

DD

(µA)

(1)
(2)

(3)

typ

DD

V (V)

Fig.14 Display frequency as a function of supply

voltage; CO= 680 pF (except PCF2112C).

(1) T

amb

= −40°c.

(2) T

amb

= +25°c.

(3) T

amb

= +85°c.

handbook, halfpage

024 8

80

70

78

MLD282

6

76

74

72

V (V)

DD

f

LCD

(Hz)

typ

(1)
(2)
(3)

Fig.15 Display frequency as a function of supply

voltage; CO= 1.5 nF (only PCF2112C).

(1) T

amb

= −40°c.

(2) T

amb

= +25°c.

(3) T

amb

= +85°c.

handbook, halfpage

024 8

37

36

34

33

35

MLD289

6

f

LCD

(Hz)

typ

(1)

(2)

(3)

DD

V (V)

Fig.16 Display frequency as a function of RO and

CO; T

amb

=25°C; VDD=5V.

(1) RO=1MΩ.
(2) RO= 100kΩ.

handbook, halfpage

10

MLD281

110

1

10

10

3

10

2

C (nF)

O

f

LCD

(Hz)

typ

(1)

(2)

1997 Mar 28 17

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

Fig.17 Test loads.

handbook, halfpage

MLD298

S1 to S32

BP (PCF2112C), BP1, BP2

I = 15 µA

L

I = 25 µA

L

Fig.18 Output resistance of backplane and

segments.

(1) T

amb

= +85°c.

(2) T

amb

= +25°c.

(3) T

amb

= −40°c.

handbook, halfpage

024 8

2

1.5

0.5

0

1

MLD288

6

R

O

(kΩ)

DD

V (V)

typ

(1)
(2)

(3)
(1)

(2)
(3)

R

S

R

BP

Fig.19 LOW level output current as a function of

supply voltage (only PCF2112C).

(1) T

amb

= −40°c.

(2) T

amb

= +25°c.

(3) T

amb

= +85°c.

handbook, halfpage

024 8

18

8

16

MLD290

6

14

12

10

V (V)

DD

I

OL

(mA)

typ

(1)

(2)

(3)

1997 Mar 28 18

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

12 PACKAGE OUTLINES

UNIT

A

max.

1 2

b

1

(1)

(1) (1)

cD E weM

H

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT117-1

92-11-17
95-01-14

A

min.

A

max.

b

Z

max.

M

E

e

1

1.7

1.3

0.53

0.38

0.32

0.23

36.0

35.0

14.1

13.7

3.9

3.4

0.252.54 15.24

15.80

15.24

17.15

15.90

1.75.1 0.51 4.0

0.066

0.051

0.020

0.014

0.013

0.009

1.41

1.34

0.56

0.54

0.15

0.13

0.010.10 0.60

0.62

0.60

0.68

0.63

0.0670.20 0.020 0.16

051G05 MO-015AH

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

28

1

15

14

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

handbook, full pagewidth

DIP28: plastic dual in-line package; 28 leads (600 mil)

SOT117-1

1997 Mar 28 19

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

UNIT

A

max.

1 2

b

1

cD E e M

H

L

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT129-1

92-11-17
95-01-14

A

min.

A

max.

b

Z

max.

w

M

E

e

1

1.70

1.14

0.53

0.38

0.36

0.23

52.50

51.50

14.1

13.7

3.60

3.05

0.2542.54 15.24

15.80

15.24

17.42

15.90

2.254.7 0.51 4.0

0.067

0.045

0.021

0.015

0.014

0.009

2.067

2.028

0.56

0.54

0.14

0.12

0.010.10 0.60

0.62

0.60

0.69

0.63

0.089 0.19 0.020 0.16

051G08 MO-015AJ

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

40

1

21

20

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1)

(1)(1)

DIP40: plastic dual in-line package; 40 leads (600 mil)

SOT129-1

1997 Mar 28 20

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

UNIT

A

max.

A

1

A

2

A3b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

18.1

17.7

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT136-1

91-08-13

95-01-24

X

14

28

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

c

L

v M

A

e

15

1

(A )

3

A

y

0.25

075E06 MS-013AE

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.71

0.69

0.30

0.29

0.050

1.4

0.055

0.42

0.39

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0 5 10 mm

scale

SO28: plastic small outline package; 28 leads; body width 7.5 mm

SOT136-1

1997 Mar 28 21

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

UNIT A1A

2

A3b

p

cD

(1)E(2)

Z

(1)

eHELLpQywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

0.3

0.1

2.45

2.25

0.25

0.42

0.30

0.22

0.14

15.6

15.2

7.6

7.5

0.762 2.25

12.3

11.8

1.15

1.05

0.6

0.3

7
0

o
o

0.1 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

1.7

1.5

SOT158-1

92-11-17
95-01-24

X

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v M

A

(A )

3

A

y

40

20

21

1

pin 1 index

0.012

0.004

0.096

0.089

0.017

0.012

0.0087

0.0055

0.61

0.60

0.30

0.29

0.03 0.089

0.48

0.46

0.045

0.041

0.024

0.012

0.004

0.2

0.008 0.004

0.067

0.059

0.010

0 5 10 mm

scale

VSO40: plastic very small outline package; 40 leads

SOT158-1

A

max.

2.70

0.11

1997 Mar 28 22

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

13 SOLDERING

13.1 Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

13.2 DIP

13.2.1 S

OLDERING BY DIPPING OR BY WA VE

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

13.2.2 R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

13.3 SO and VSO

13.3.1 REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO and

VSO packages.
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

13.3.2 W

AVE SOLDERING

Wave soldering techniques can be used for all SO and
VSO packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

13.3.3 R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1997 Mar 28 23

Philips Semiconductors Product specification

LCD drivers PCF21xxC family

14 DEFINITIONS

15 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Short-form specification The data in this specification is extracted from a full data sheet with the same type

number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1997 SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

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Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

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Middle East: see Italy

Printed in The Netherlands 417067/1200/02/pp24 Date of release: 1997 Mar 28 Document order number: 9397 750 01649