The NE1619 is designed for monitoring the temperatures and supply
voltages of microprocessor-based systems by measuring those
parameters and comparing the readings with programmable limits.
The device provides five possible analog inputs, a remote
temperature sensor input and on-board local temperature sensor.
The device also monitors its own power supply and provides digital
inputs for the Pentium/PRO power supply ID code.
The device communicates with the system controller via an SMBus
(System Management bus) by which it can be programmed for
operation and data collection. Readings come from conversions of
the on-board A-to-D converter which cycles through all
measurements in sequence in approximately one second when the
conversion is started. The device includes a number of registers to
store data of the device configuration, status, readings and limits.
Except for the temperature-related data which are in 8-bit digital
2’s complement format, all the data are in 8-bit digital straight format.
FEA TURES
•Monitor local and remote temperatures
•Temperature accuracy of ±2 °C for local, and ±3 °C for remote
channel
•Temperature resolution of 1 °C
•2.8 V to 5.5 V supply range
•Monitor different power supplies: 12 V, 5 V, 3.3 V, 2.5 V, V
•V
accuracy of ±2% of full scale
IN
CCP, VDD
•Differential non-linearity of ±1LSB
•No calibration required
•Programmable temperature and voltage limits for alarms
•Programmable Reset low state pulse output
•SMBus 2-wire serial interface
•Small 16-lead QSOP package
•Compatible with Intel “Heceta 4” specification and reference
designs utilizing it
APPLICATIONS
•System thermal and hardware monitor
•Desktop computers
•Notebook computers
•Industrial controllers
•T elecom equipment
ORDERING INFORMATION
PART NUMBERPACKAGEDRAWING NUMBER
NE161916-lead QSOP packageSOT519-1
2000 Jul 13853-2202 24122
2
Philips SemiconductorsProduct specification
NE1619HECETA4 Temperature and voltage monitor
PINNING
Pin Configuration
16SDA
15
14
13
12
11
10
SL01228
A0/RESET
/NTEST_OUT
V
CCPVIN
2.5V
IN
3.3V
IN
5V
IN
12VIN/VID4
D+
D–/NTEST_IN
V
DD
1
2
SCL
3
GND
4
/3.3VSB
5
VID0
6
VID1
7
VID2
89
VID3
Pin Description
PIN #SYMBOLFUNCTION DESCRIPTION
1SDADigital I/O. SMBus serial bi-directional data. Open-drain output.
2SCLDigital Input. SMBus serial clock input.
3GNDGround. To be connected to system ground.
4VDD/3.3VSBPower supply. Can be connected to +3.3 V standby power if monitoring in low power states is
5VID0Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status
6VID1Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register.
7VID2Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register.
8VID3Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register.
9D–/NTEST_INAnalog/Digital Input. This pin is connected to the negative terminal of the remote temperature sensor for
10D+Analog Input. This pin is connected to the positive terminal of the remote temperature sensor.
1112VIN/VID4Analog/Digital Input. Defaults at power-up to analog input for monitoring the +12 V supply. This pin is
125V
133.3V
142.5V
15V
IN
IN
IN
CCPVIN
16A0/RESET/NTEST_INDigital I/O. At power-up, the logic input of this pin defines the LSB bit of the device slave address.
required. This pin also serves as the analog input to monitor the VDD voltage level.
register (LSB bit).
analog input. If this pin is held high at power-up, for digital input, it enables the NAND-TREE test mode.
programmable to be a digital input for voltage ID readouts from the processor. Its state is read into the
VID4 status register.
Analog Input. For monitoring the +5 V supply.
Analog Input. For monitoring the +3.3 V supply.
Analog Input. For monitoring the +2.5 V supply.
Analog Input. For monitoring the processor voltage supply (0 to 3.0 V)
This pin can be configured to give a low pulse reset output of 20ms minimum. This pin also functions
as the output in the NAND–TREE test mode.
2000 Jul 13
3
Philips SemiconductorsProduct specification
NE1619HECETA4 Temperature and voltage monitor
FUNCTIONAL BLOCK DIAGRAM
D+
D-/
NTEST_IN
GND
VDD
V
CCVIN
2.5 VIN
3.3 VIN
5 VIN
12 VIN/
VID4
Local Temp
Sensor
Temp
Mux
A-to-D
Converter
Voltage
Mux
Vin
Attenuators
Switch
Vid4
Register
Control
Logic
Local Temp
RDG Register
Remote Temp
RDG Register
VDD Reading
Register
VCCP Reading
Register
2.5 V Reading
Register
3.3 V Reading
Register
5 V Reading
Register
12 V Reading
Register
SMBus Interface
Configuration
Register
Local Temp
HL Register
Remote Temp
HL Register
VDD HL
Register
VCCP HL
Register
2.5 V HL
Register
3.3 V HL
Register
5 V HL
Register
12 V HL
Register
Command
Pointer Register
Local Temp
LL Register
Remote Temp
LL Register
VDD LL
Register
VCCP LL
Register
2.5 V LL
Register
3.3 V LL
Register
5 V LL
Register
12 V LL
Register
Address Decoder
and Register
Status
Register 1
Status
Register 2
Company #
Register
Step Version
Register
Test
Register
Reset Pulse
Circuit
VID 0-3
Register
NTEST
Circuit
A0/
Reset #/
NTEST_OUT
VID3
VID2
VID1
VID0
2000 Jul 13
SCL
SDA
SL01229
4
Philips SemiconductorsProduct specification
NE1619HECETA4 Temperature and voltage monitor
TYPICAL OPERATING CIRCUIT
Remote Sensor:
V
DD
SMBus
:
CLOCK
DATA
Selectable
A0/RESET/NTEST_OUT
Ground
µP On-Board PNP Transistor
See
Note 1
or Discrete NPN Transistor
0.1 uF
10
10 k10 k100 k
4
2
1
9
16
System Power
Supplies
V
CCP
2.5 V
3.3 V
5.0 V
12.0 V
1. May be required in noisy environment, about 1 nF
15
14
13
12
11
NE1619
5
6
7
8
3
Ground
Processor Voltage
ID Code:
VID0
VID1
VID2
VID3
VID4
SL01230
ABSOLUTE MAXIMUM RATINGS
PARAMETERMIN.MAX.UNIT
VDD to GND–0.36V
12VIN to GND–0.318V
5VIN, 3.3VIN, 2.5VIN, V
Other pins to GND–0.3VDD+0.3V
Input current at any pin–55mA
Package input current–2020mA
Operating temperature range0+120°C
Maximum junction temperature+150°C
Storage temperature range–65+150°C
to GND–0.36V
CCP
2000 Jul 13
5
Philips SemiconductorsProduct specification
NE1619HECETA4 Temperature and voltage monitor
Temp Error vs PC Board Track Resistance
20
15
10
–5
–10
–15
–20
–25
Remote Temp Error(deg. C)
–30
FROM D+ PIN TO GND
5
0
FROM D+ PIN TO VDD
110100
Leakage Resistance (Mohm)
Figure 1. Temp Error vs PC Board Track Resistance
Temp Error vs D+D– Capacitance
0
–1
–2
–3
–4
–5
–6
–7
–8
–9
Temperature Error (deg. C)
–10
12.23.34.76.810223347
D+ to D– Capacitance (nF)
SL01245
SL01244
Standby Current vs Supply Voltage
100
80
60
40
20
Stdby Supply Current (uA)
0
0123456
Supply Voltage (V)
Figure 3. Standby Current vs Supply Voltage
Standby Current vs Temperature
50
40
30
20
10
Stdby Supply Current (uA)
0
–50–250255075100125
VDD = 5.0V
VDD= 3.8V
VDD= 3.3V
VDD= 2.8V
Temperatures (deg. C)
SL01243
SL01242
2000 Jul 13
Figure 2. Temp Error vs D+D– Capacitance
Figure 4. Standby Current vs Temperature
6
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