Philips ne1619 DATASHEETS

INTEGRATED CIRCUITS
NE1619
HECETA 4 Temperature and voltage monitor
Product specification 2000 Jul 13
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Philips Semiconductors Product specification

GENERAL DESCRIPTION

The NE1619 is designed for monitoring the temperatures and supply voltages of microprocessor-based systems by measuring those parameters and comparing the readings with programmable limits. The device provides five possible analog inputs, a remote temperature sensor input and on-board local temperature sensor. The device also monitors its own power supply and provides digital inputs for the Pentium/PRO power supply ID code.
The device communicates with the system controller via an SMBus (System Management bus) by which it can be programmed for operation and data collection. Readings come from conversions of the on-board A-to-D converter which cycles through all measurements in sequence in approximately one second when the conversion is started. The device includes a number of registers to store data of the device configuration, status, readings and limits. Except for the temperature-related data which are in 8-bit digital
2’s complement format, all the data are in 8-bit digital straight format.

FEA TURES

Monitor local and remote temperatures
Temperature accuracy of ±2 °C for local, and ±3 °C for remote
channel
Temperature resolution of 1 °C
2.8 V to 5.5 V supply range
Monitor different power supplies: 12 V, 5 V, 3.3 V, 2.5 V, V
V
accuracy of ±2% of full scale
IN
CCP, VDD
Differential non-linearity of ±1LSB
No calibration required
Programmable temperature and voltage limits for alarms
Programmable Reset low state pulse output
SMBus 2-wire serial interface
Small 16-lead QSOP package
Compatible with Intel “Heceta 4” specification and reference
designs utilizing it

APPLICATIONS

System thermal and hardware monitor
Desktop computers
Notebook computers
Industrial controllers
T elecom equipment

ORDERING INFORMATION

PART NUMBER PACKAGE DRAWING NUMBER
NE1619 16-lead QSOP package SOT519-1
2000 Jul 13 853-2202 24122
2
Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor
PINNING Pin Configuration
16SDA 15 14 13 12 11 10
SL01228
A0/RESET
/NTEST_OUT
V
CCPVIN
2.5V
IN
3.3V
IN
5V
IN
12VIN/VID4 D+ D–/NTEST_IN
V
DD
1 2
SCL
3
GND
4
/3.3VSB
5
VID0
6
VID1
7
VID2
89
VID3

Pin Description

PIN # SYMBOL FUNCTION DESCRIPTION
1 SDA Digital I/O. SMBus serial bi-directional data. Open-drain output. 2 SCL Digital Input. SMBus serial clock input. 3 GND Ground. To be connected to system ground. 4 VDD/3.3VSB Power supply. Can be connected to +3.3 V standby power if monitoring in low power states is
5 VID0 Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status
6 VID1 Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register. 7 VID2 Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register. 8 VID3 Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register. 9 D–/NTEST_IN Analog/Digital Input. This pin is connected to the negative terminal of the remote temperature sensor for
10 D+ Analog Input. This pin is connected to the positive terminal of the remote temperature sensor. 11 12VIN/VID4 Analog/Digital Input. Defaults at power-up to analog input for monitoring the +12 V supply. This pin is
12 5V 13 3.3V 14 2.5V 15 V
IN
IN IN
CCPVIN
16 A0/RESET/NTEST_IN Digital I/O. At power-up, the logic input of this pin defines the LSB bit of the device slave address.
required. This pin also serves as the analog input to monitor the VDD voltage level.
register (LSB bit).
analog input. If this pin is held high at power-up, for digital input, it enables the NAND-TREE test mode.
programmable to be a digital input for voltage ID readouts from the processor. Its state is read into the
VID4 status register. Analog Input. For monitoring the +5 V supply. Analog Input. For monitoring the +3.3 V supply. Analog Input. For monitoring the +2.5 V supply. Analog Input. For monitoring the processor voltage supply (0 to 3.0 V)
This pin can be configured to give a low pulse reset output of 20ms minimum. This pin also functions as the output in the NAND–TREE test mode.
2000 Jul 13
3
Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor

FUNCTIONAL BLOCK DIAGRAM

D+ D-/
NTEST_IN
GND
VDD
V
CCVIN
2.5 VIN
3.3 VIN 5 VIN
12 VIN/
VID4
Local Temp
Sensor
Temp
Mux
A-to-D
Converter
Voltage
Mux
Vin
Attenuators
Switch
Vid4
Register
Control
Logic
Local Temp
RDG Register
Remote Temp RDG Register
VDD Reading
Register
VCCP Reading
Register
2.5 V Reading Register
3.3 V Reading Register
5 V Reading
Register
12 V Reading
Register
SMBus Interface
Configuration
Register
Local Temp
HL Register
Remote Temp
HL Register
VDD HL Register
VCCP HL
Register
2.5 V HL Register
3.3 V HL Register
5 V HL
Register
12 V HL Register
Command
Pointer Register
Local Temp LL Register
Remote Temp
LL Register
VDD LL
Register
VCCP LL
Register
2.5 V LL Register
3.3 V LL Register
5 V LL
Register
12 V LL
Register
Address Decoder
and Register
Status
Register 1
Status
Register 2
Company #
Register
Step Version
Register
Test
Register
Reset Pulse
Circuit
VID 0-3
Register
NTEST
Circuit
A0/
Reset #/
NTEST_OUT
VID3 VID2 VID1
VID0
2000 Jul 13
SCL
SDA
SL01229
4
Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor

TYPICAL OPERATING CIRCUIT

Remote Sensor:
V
DD
SMBus
:
CLOCK DATA
Selectable A0/RESET/NTEST_OUT
Ground
µP On-Board PNP Transistor
See Note 1
or Discrete NPN Transistor
0.1 uF
10
10 k 10 k 100 k
4
2 1
9
16
System Power
Supplies
V
CCP
2.5 V
3.3 V
5.0 V
12.0 V
1. May be required in noisy environment, about 1 nF
15 14 13 12
11
NE1619
5 6 7 8
3
Ground
Processor Voltage
ID Code: VID0 VID1 VID2 VID3 VID4
SL01230

ABSOLUTE MAXIMUM RATINGS

PARAMETER MIN. MAX. UNIT
VDD to GND –0.3 6 V 12VIN to GND –0.3 18 V 5VIN, 3.3VIN, 2.5VIN, V Other pins to GND –0.3 VDD+0.3 V Input current at any pin –5 5 mA Package input current –20 20 mA Operating temperature range 0 +120 °C Maximum junction temperature +150 °C Storage temperature range –65 +150 °C
to GND –0.3 6 V
CCP
2000 Jul 13
5
Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor
Temp Error vs PC Board Track Resistance
20 15 10
–5 –10 –15 –20 –25
Remote Temp Error(deg. C)
–30
FROM D+ PIN TO GND
5 0
FROM D+ PIN TO VDD
1 10 100
Leakage Resistance (Mohm)
Figure 1. Temp Error vs PC Board Track Resistance
Temp Error vs D+D– Capacitance
0 –1 –2 –3 –4 –5 –6 –7 –8 –9
Temperature Error (deg. C)
–10
1 2.2 3.3 4.7 6.8 10 22 33 47
D+ to D– Capacitance (nF)
SL01245
SL01244
Standby Current vs Supply Voltage
100
80
60
40
20
Stdby Supply Current (uA)
0
0123456
Supply Voltage (V)
Figure 3. Standby Current vs Supply Voltage
Standby Current vs Temperature
50
40
30
20
10
Stdby Supply Current (uA)
0
–50 –25 0 25 50 75 100 125
VDD = 5.0V
VDD= 3.8V
VDD= 3.3V VDD= 2.8V
Temperatures (deg. C)
SL01243
SL01242
2000 Jul 13
Figure 2. Temp Error vs D+D– Capacitance
Figure 4. Standby Current vs Temperature
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