Philips ne1617a DATASHEETS
INTEGRATED CIRCUITS
NE1617A
Temperature monitor for
microprocessor systems
Product specification 2000 Jul 13
Philips Semiconductors Product specification
NE1617ATemperature monitor for microprocessor systems
FEA TURES
•Replacement for Maxim MAX1617 and Analog Devices ADM1021
•Monitors local and remote temperature
•Accuracy
– ± 2°C local (on-chip) sensor
– ± 3°C remote sensor
•No calibration required
•Programmable over/under temperature alarm
•SMBus 2-wire serial interface
•3V to 5.5V supply range
•70µa supply current in operating mode
•3µa (typical) supply current in standby mode
•Small 16–lead QSOP package
APPLICATIONS
•Desktop computers
•Notebook computers
•Smart battery packs
•Industrial controllers
•T elecom equipment
DESCRIPTION
The NE1617A is an accurate two-channel temperature monitor. It
measures the temperature of itself and the temperature of a remote
sensor. The remote sensor is a diode connected transistor. This can
be in the form of either a discrete NPN/PNP, such as the
2N3904/2N3906, or a diode connected PNP built into another die,
such as is done on some INTEL microprocessors.
The temperature of both the remote and local sensors is stored in a
register that can be read via a 2-wire SMBus. The temperatures are
updated at a rate that is programmable via the SMBus (the average
supply current is dependent upon the update rate—the faster the
rate, the higher the current).
In addition to the normal operation, which is to update the
temperature at the programmed rate, there is a one shot mode that
will force a temperature update.
There is also an alarm that senses either an over or under
temperature condition. The trip points for this alarm are also
programmable.
The device can have 1 of 9 addresses (determined by 2 address
pins), so there can be up to 9 of the NE1617A on the SMBus.
It can also be put in a standby mode (in order to save power). This
can be done either with software (over the SMBus) or with hardware
(using the STANDBY pin).
PIN CONFIGURATION
TEST
V
2
DD
3
D+
4
D–
5
TEST
6
ADD1
7
GND
8
GND
Figure 1. Pin configuration
161
15
14
13
12
11
10
SL01202
9
TEST
STBY
SCLK
TEST
SDATA
ALERT
ADD0
TEST
PIN FUNCTION DESCRIPTION
PIN # FUNCTION DESCRIPTION/COMMENTS
1 TEST Factory use only
2 V
DD
Positive supply
3 D+ Positive side of remote sensor
4 D– Negative side of remote sensor
5 TEST Factory use only
6 ADD1 Device address pin (3-State)
7 GND Ground
8 GND Ground
9 TEST Factory use only
10 ADD0 Device address pin (3-State)
11 ALERT Open drain output used as
interrupt or SMBus alert
12 SDATA SMBus serial data input/output
open drain
13 TEST Factory use only
14 SCLK SMBus clock input
15 STBY Hardware standby input pin
HIGH = normal operating mode
LOW = standby mode
16 TEST Factory use only
NOTES:
1. These pins should either float or be tied to ground.
pin should be decoupled by a 0.1µF capacitor.
2. V
DD
1
2
1
1
1
1
ORDERING INFORMATION
PART NUMBER PACKAGE DRAWING NUMBER
NE1617ADS 16-lead QSOP package SOT519–1
2000 Jul 13 853–2203 24123
2
Philips Semiconductors Product specification
NE1617ATemperature monitor for microprocessor systems
FUNCTIONAL BLOCK DIAGRAM
STDBY
ADD1
ADD0
ALERT
ONE-SHOT
REGISTER
LOCAL TEMP
SENSOR
D+
D–
ANALOG
MUX
DD
CONTROL
LOGIC
A-TO-D
CONVERTER
CONVERSION RATE
REGISTER
LOCAL TEMP
DATA REGISTER
REMOTE TEMP
DATA REGISTER
ADDRESS
DECODER
INTERRUPT
MASKING
CONFIGURATION
REGISTER
LOCAL TEMP HIGH
THRESHOLD
LOCAL LOW TEMP
THRESHOLD
REMOTE HIGH TEMP
THRESHOLD
REMOTE LOW TEMP
THRESHOLD
STATUS REGISTER
SMBUS INTERFACE
SCLK SDAT ATEST16TEST13TEST9TEST5TEST1GNDGNDV
COMMAND POINTER
REGISTER
LOCAL TEMP HIGH
LIMIT REGISTER
LOCAL TEMP LOW
LIMIT REGISTER
REMOTE TEMP HIGH
LIMIT REGISTER
REMOTE TEMP LOW
LIMIT REGISTER
2000 Jul 13
SL01210
3
Philips Semiconductors Product specification
NE1617ATemperature monitor for microprocessor systems
TYPICAL OPERATING CIRCUIT
0.1µF
V
DD
215
10K10K10K
NE1617A
REMOTE SENSOR
SHIELDED
TWISTED PAIR
(NOTE 1)
C
1
(NOTE 2)
3
4
10 6 7 8
14
12
11
CLOCK
DATA
MICROCONTROLLER
INTERRUPT
SL01248
NOTES:
1. May be required if remote diode is in a noisy environment and/or several feet from the NE1617A.
2. May be required in noisy environment. Up to 2200pF may be used.
Figure 2. Typical operating circuit
ABSOLUTE MAXIMUM RATINGS
PARAMETER MIN. MAX. UNIT
VDD to GND –0.3 +6 V
D+, ADD0, ADD1 –0.3 VDD+0.3 V
D– to GND –0.3 +0.8 V
SCLK, SDATA, ALERT, STBY –0.3 +6 V
Input current SDATA –1 +50 mA
D– current ±1 mA
Operating temperature range 0 +120 °C
Maximum junction temperature +150 °C
Storage temperature range –65 +150 °C
2000 Jul 13
4
Philips Semiconductors Product specification
PARAMETER
CONDITIONS
UNIT
Local temperature error
Remote temperature error
Power supply current (average)
Remote sensor source current
NE1617ATemperature monitor for microprocessor systems
ELECTRICAL CHARACTERISTICS
VDD = 3.3V; T
T emperature resolution 1 °C
Under voltage lockout VDD supply (Note 1) 2.0 2.95 V
Power-on reset threshold VDD supply (falling edge) (Note 2) 1.0 2.5 V
Power supply current (standby) SMBus inactive 3 10 µA
Conversion time
Conversion rate error Percentage error in programmed rate –30 +30 %
Address pin bias current
NOTES:
1. V
(rising edge) voltage below which the ADC is disabled.
DD
(falling edge) voltage below which the logic is reset.
2. V
DD
3. Address is read a power up and at start of conversion for all conversions except the fastest rate.
4. Due to the bias current, any pull-up/down resistors should be ≤ 2kΩ.
= 0°C to +125°C unless otherwise noted.
amb
p
p
pp
LIMITS
MIN. TYP. MAX.
T
= +60°C to +100°C < ±1 ±2 °C
amb
T
= 0°C to +125°C < ±2 ±3 °C
amb
T
= +60°C to +100°C ±3 °C
remote
T
= 0°C to +125°C ±5 °C
remote
Conversion rate = 0.25/sec 70 µA
Conversion rate = 2/sec 180 µA
From stop bit to conversion complete,
both channels
170 ms
HIGH level 100 µA
LOW level 10 µA
Momentary as the address is being read
(Notes 3 and 4)
160 µA
2000 Jul 13
5
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