Philips NE1617 Datasheet

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NE1617

Temperature monitor for microprocessor systems

Product specification 1999 Mar 19

INTEGRATED CIRCUITS

Philips Semiconductors Product specification

NE1617Temperature monitor for microprocessor systems

1999 Mar 19 853–2144 21065

FEA TURES

•Replacement for Maxim MAX1617 and Analog Devices ADM1021

•Monitors local and remote temperature

•Accuracy

– ± 2°C local (on-chip) sensor – ± 3°C remote sensor

•No calibration required

•Programmable over/under temperature alarm

•SMBus 2-wire serial interface

•3V to 5.5V supply range

•70µa supply current in operating mode

•3µa (typical) supply current in standby mode

•Small 16–lead QSOP package

APPLICATIONS

•Desktop computers

•Notebook computers

•Smart battery packs

•Industrial controllers

•T elecom equipment

DESCRIPTION

The NE1617 is an accurate two-channel temperature monitor. It measures the temperature of itself and the temperature of a remote sensor. The remote sensor is a diode connected transistor. This can be in the form of either a discrete NPN/PNP, such as the 2N3904/2N3906, or a diode connected PNP built into another die, such as is done on some INTEL microprocessors.

The temperature of both the remote and local sensors is stored in a register that can be read via a 2-wire SMBus. The temperatures are updated at a rate that is programmable via the SMBus (the average supply current is dependent upon the update rate—the faster the rate, the higher the current).

In addition to the normal operation, which is to update the temperature at the programmed rate, there is a one shot mode that will force a temperature update.

There is also an alarm that senses either an over or under temperature condition. The trip points for this alarm are also programmable.

The device can have 1 of 9 addresses (determined by 2 address pins), so there can be up to 9 of the NE1617 on the SMBus.

It can also be put in a standby mode (in order to save power). This can be done either with software (over the SMBus) or with hardware (using the STANDBY pin).

PIN CONFIGURATION

161 2 3 4 5 6 7 8

TEST

D+ D–

TEST

ADD1

GND GND

TEST STBY SCLK TEST SDATA ALERT ADD0 TEST

SL01202

Figure 1. Pin configuration

PIN FUNCTION DESCRIPTION

PIN # FUNCTION DESCRIPTION/COMMENTS

1 TEST Factory use only

2 V

Positive supply

3 D+ Positive side of remote sensor 4 D– Negative side of remote sensor 5 TEST Factory use only

6 ADD1 Device address pin (3-State) 7 GND Ground 8 GND Ground 9 TEST Factory use only

10 ADD0 Device address pin (3-State) 11 ALERT Open drain output used as

interrupt or SMBus alert

12 SDATA SMBus serial data input/output

open drain

13 TEST Factory use only

14 SCLK SMBus clock input 15 STBY Hardware standby input pin

HIGH = normal operating mode LOW = standby mode

16 TEST Factory use only

NOTES:

1. These pins should either float or be tied to ground.

2. VDD pin should be decoupled by a 0.1µF capacitor.

ORDERING INFORMATION

PART NUMBER PACKAGE DRAWING NUMBER

NE1617DS 16-lead QSOP package SOT519–1

Philips Semiconductors Product specification

NE1617Temperature monitor for microprocessor systems

1999 Mar 19

FUNCTIONAL BLOCK DIAGRAM

COMMAND POINTER

LOCAL TEMP HIGH

LIMIT REGISTER

LOCAL TEMP LOW

LIMIT REGISTER

REMOTE TEMP HIGH

LIMIT REGISTER

REMOTE TEMP LOW

LIMIT REGISTER

CONFIGURATION

LOCAL TEMP HIGH

THRESHOLD

LOCAL LOW TEMP

THRESHOLD

REMOTE HIGH TEMP

THRESHOLD

REMOTE LOW TEMP

THRESHOLD

STATUS REGISTER

SMBUS INTERFACE

ONE-SHOT REGISTER

CONVERSION RATE

LOCAL TEMP

DATA REGISTER

REMOTE TEMP

DATA REGISTER

ADDRESS DECODER

INTERRUPT

MASKING

A-TO-D

CONVERTER

CONTROL

LOGIC

LOCAL TEMP

SENSOR

ANALOG

MUX

ALERT

ADD0

ADD1

D–

D+

STDBY

SCLK SDAT ATEST16TEST13TEST9TEST5TEST1GNDGNDV

SL01210

Philips Semiconductors Product specification

NE1617Temperature monitor for microprocessor systems

1999 Mar 19

TYPICAL OPERATING CIRCUIT

215

10 6 7 8

SHIELDED

TWISTED PAIR

(NOTE 1)

REMOTE SENSOR

(NOTE 2)

0.1µF V

CLOCK

DATA MICROCONTROLLER

INTERRUPT

10K10K10K

SL01203

NE1617

NOTES:

1. May be required if remote diode is in a noisy environment and/or several feet from the NE1617.

2. May be required in noisy environment. Up to 2200pF may be used.

Figure 2. Typical operating circuit

ABSOLUTE MAXIMUM RATINGS

PARAMETER MIN. MAX. UNIT

VDD to GND –0.3 +6 V D+, ADD0, ADD1 –0.3 VDD+0.3 V D– to GND –0.3 +0.8 V SCLK, SDATA, ALERT, STBY –0.3 +6 V Input current SDATA –1 +50 mA D– current ±1 mA Operating temperature range 0 +120 °C Maximum junction temperature +150 °C Storage temperature range –65 +150 °C

Philips Semiconductors Product specification

NE1617Temperature monitor for microprocessor systems

1999 Mar 19

ELECTRICAL CHARACTERISTICS

VDD = 3.3V; T

amb

= 0°C to +125°C unless otherwise noted.

LIMITS

PARAMETER

CONDITIONS

MIN. TYP. MAX.

UNIT

T emperature resolution 1 °C

amb

= +60°C to +100°C < ±1 ±2 °C

Local temperature error

amb

= 0°C to +125°C < ±2 ±3 °C

remote

= +60°C to +100°C ±3 °C

Remote temperature error

remote

= 0°C to +125°C ±5 °C Under voltage lockout VDD supply (Note 1) 2.0 2.95 V Power-on reset threshold VDD supply (falling edge) (Note 2) 1.0 2.5 V

Conversion rate = 0.25/sec 70 µA

Power supply current (average)

Conversion rate = 2/sec 180 µA

Power supply current (standby) SMBus inactive 3 10 µA Conversion time

From stop bit to conversion complete, both channels

170 ms

Conversion rate error Percentage error in programmed rate –30 +30 %

HIGH level 100 µA

Remote sensor source current

LOW level 10 µA

Address pin bias current

Momentary as the address is being read (Notes 3 and 4)

160 µA

NOTES:

1. V

(rising edge) voltage below which the ADC is disabled.

2. V

(falling edge) voltage below which the logic is reset.

3. Address is read a power up and at start of conversion for all conversions except the fastest rate.

4. Due to the bias current, any pull-up/down resistors should be ≤ 2kΩ.

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