Philips MX0912B100Y, MZ0912B100Y Datasheet

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DISCRETE SEMICONDUCTORS

DATA SHEET

MX0912B100Y; MZ0912B100Y

NPN microwave power transistors

Product specification

 

1997 Feb 20

Supersedes data of June 1992

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Philips MX0912B100Y, MZ0912B100Y Datasheet

Philips Semiconductors

Product specification

 

 

 

NPN microwave power transistors

MX0912B100Y; MZ0912B100Y

 

 

 

 

 

 

FEATURES

Interdigitated structure provides high emitter efficiency

Diffused emitter ballasting resistors providing excellent current sharing and withstanding a high VSWR

Gold metallization realizes very stable characteristics and excellent lifetime

Multicell geometry improves power sharing and low thermal resistance

Input and output matching cell allows an easier design of circuits.

APPLICATIONS

Common base class-C broadband pulse power amplifiers operating at 960 to 1215 MHz for TACAN application.

DESCRIPTION

NPN silicon planar epitaxial microwave power transistors.

The MX0912B100Y has a SOT439A metal ceramic flange package and improved output prematching cells. It is recommended for new designs.

The MZ0912B100Y has a SOT443A metal ceramic flange package with the base connected to the flange. It is mounted in common base configuration and specified in class C.

PINNING

 

 

PIN

 

 

 

DESCRIPTION

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

 

 

 

 

collector

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

 

 

 

 

 

emitter

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3

 

 

 

 

 

base connected to flange

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

lumns

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

b

 

c

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3

 

 

 

 

 

 

 

 

3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

 

 

 

 

e

 

 

 

 

 

 

 

 

MAM045

 

Top view

 

 

 

 

 

 

 

 

 

Fig.1 Simplified outline and symbol (SOT439A).

handbook, halfpage

1

c

b

3

e

2

Top view

MAM314

Fig.2 Simplified outline and symbol (SOT443A).

QUICK REFERENCE DATA

Microwave performance at Tmb 25 °C in a common base class-C broadband amplifier.

MODE OF OPERATION

f

VCC

PL

GP

ηC

Zi; ZL

(GHz)

(V)

(W)

(dB)

(%)

(Ω)

 

 

 

 

 

 

 

 

Class-C; tp = 10 μs; δ = 10 %

0.960 to 1.215

50

>100

>7

>42

see Figs 8 and 9

WARNING

Product and environmental safety - toxic materials

This product contains beryllium oxide. The product is entirely safe provided that the BeO slab is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety

precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.

1997 Feb 20

2

Philips Semiconductors

 

 

 

Product specification

 

 

 

 

 

 

 

NPN microwave power transistors

MX0912B100Y; MZ0912B100Y

 

 

 

 

 

 

 

LIMITING VALUES

 

 

 

 

 

In accordance with the Absolute Maximum Rating System (IEC 134).

 

 

 

 

 

 

 

 

 

 

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

 

 

 

 

 

 

 

VCBO

collector-base voltage

open emitter

 

65

V

VCES

collector-emitter voltage

RBE = 0 Ω

 

60

V

VCEO

collector-emitter voltage

open base

 

20

V

VEBO

emitter-base voltage

open collector

 

3

V

IC

collector current (DC)

tp 10 μs; δ ≤ 10 %

6

A

Ptot

total power dissipation

tp 10 μs; δ ≤ 10 %;

290

W

 

(peak power)

Tmb = 75 °C

 

 

 

 

Tstg

storage temperature

 

 

65

+200

°C

Tj

operating junction temperature

 

 

200

°C

Tsld

soldering temperature

up to 0.2 mm from ceramic;

235

°C

 

 

t 10 s

 

 

 

 

 

 

 

 

 

 

 

300

 

 

MGL046

 

 

 

 

handbook, halfpage

 

 

 

 

Ptot

 

 

 

 

(W)

 

 

 

 

200

 

 

 

 

100

 

 

 

 

0

 

 

 

 

50

0

100

Tmb (°C)

200

 

 

 

 

tp = 10 μs; δ = 10 %; Ptot max = 290 W.

 

 

Fig.3 Maximum power dissipation derating as a function of mounting-base temperature.

1997 Feb 20

3

Philips Semiconductors

 

 

Product specification

 

 

 

 

 

NPN microwave power transistors

MX0912B100Y; MZ0912B100Y

 

 

 

 

 

 

THERMAL CHARACTERISTICS

 

 

 

 

 

 

 

 

 

SYMBOL

PARAMETER

CONDITIONS

MAX.

UNIT

 

 

 

 

 

 

Rth j-mb

thermal resistance from junction to mounting-base

Tj = 125

°C

3.2

K/W

Rth mb-h

thermal resistance from mounting-base to heatsink

Tj = 125

°C; note 1

0.2

K/W

Zth jh

thermal impedance from junction to heatsink

tp = 10 ms; d = 10 %;

0.43

K/W

 

 

Tj = 125

°C; notes 1 and 2

 

 

Notes

1.See “Mounting recommendations in the General part of handbook SC19a”.

2.Equivalent thermal impedance under pulsed microwave operating conditions.

CHARACTERISTICS

Tmb = 25 °C unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MAX.

UNIT

 

 

 

 

 

 

ICBO

collector cut-off current

VCB = 65

V; IE = 0

40

mA

 

 

VCB = 50 V; IE = 0

4

mA

ICES

collector cut-off current

VCB = 60

V; RBE = 0

40

mA

IEBO

emitter cut-off current

VEB = 1.5 V; IC = 0

400

mA

APPLICATION INFORMATION

Microwave performance up to Tmb = 25 °C measured in the test jig as shown in Fig.7 and working in class C broadband in pulse mode; note 1.

MODE OF OPERATION

f

VCC

PL

Gp

hC

Zi/ZL

(GHz)

(V)(2)

(W)

(dB)

(%)

(W)

 

Class C;

0.960 to 1.215

50

³100

³7

³42

see Figs 8 and 9

tp = 10 ms; d = 10%

 

 

typ. 115

typ. 7.6

typ. 44

 

tp = 300 ms; d = 10%;

1.03 to 1.09

50

typ. 125

typ. 8

typ. 50

 

see Fig.6

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes

1.Operating conditions and performance for other pulse formats can be made available on request.

2.VCC during pulse.

1997 Feb 20

4

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