Philips LTE21025R Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
LTE21025R
NPN microwave power transistor
Product specification Supersedes data of June 1992
1997 Feb 21
NPN microwave power transistor LTE21025R

FEATURES

Diffused emitter ballasting resistors provide excellent current sharing and withstanding a high VSWR
Self-aligned process entirely ion implanted
Gold metallization realizes very stable characteristics
and excellent lifetime
Input matching cell improves input impedance and allows an easier design of wideband circuits.

APPLICATIONS

Common emitter class-A linear power amplifiers up to 4.2 GHz.

DESCRIPTION

NPN silicon planar epitaxial microwave power transistor in a SOT440A metal ceramic flange package with the emitter connected to the flange.

PINNING - SOT440A

PIN DESCRIPTION
1 collector 2 base 3 emitter connected to flange
lumns
Top view
Marking code: 439
Fig.1 Simplified outline and symbol.
1
c
b
3
2
MAM131
e

QUICK REFERENCE DATA

RF performance up to T
MODE OF OPERATION
=25°C in a common emitter class-A test circuit.
mb
f
(GHz)
V
(V)
CE
I
C
(mA)
P
L1
(W)
G
po
(dB)
Class-A (CW) 2.1 16 400 typ. 2.8 typ. 7.8
WARNING
Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO slab is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
1997 Feb 21 2
NPN microwave power transistor LTE21025R

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CER
V
CEO
V
EBO
I
C
P
tot
T
stg
T
j
T
sld
collector-base voltage open emitter 40 V collector-emitter voltage RBE=70Ω−20 V collector-emitter voltage open base 16 V emitter-base voltage open collector 3V collector current (DC) 800 mA total power dissipation Tmb≤ 75 °C 8W storage temperature 65 +200 °C operating junction temperature 200 °C soldering temperature at 0.3 mm from ceramic;
235 °C
t 10 s
handbook, halfpage
1
I
C
(A)
1
10
2
10
1101610
Tmb≤ 75°C. (1) Region of permissible DC operation. (2) Permissible extension provided RBE≤ 70 Ω.
(1) (2)
Fig.2 DC SOAR.
VCE (V)
MGL006
10
handbook,
P
tot
(W)
8
6
4
2
2
0
0 50 100 200
MGD973
150
Tmb (°C)
Fig.3 Power dissipation derating as a function of
mounting-base temperature.
1997 Feb 21 3
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