The ISP1521 is a stand-alone Universal Serial Bus (USB) hub controller IC that
complies with
high-speed (480 Mbit/s), full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s).
The upstream facing port can be connected to a Hi-Speed USB host or hub or to an
Original USB hostor hub. If the upstream facingport is connected to a Hi-Speed USB
host or hub, then the ISP1521 will operate as a Hi-Speed USB hub. That is, it will
support high-speed, full-speed and low-speed devices connected to its downstream
facing ports. If the upstream facing port is connected to an Original USB host or hub,
then the ISP1521 will operate as an Original USB hub. That is, high-speed devices
that are connected to its downstream facing ports will operate in full-speed mode
instead.
The ISP1521 is a full hardware USB hub controller. All Original USB devices
connected to the downstream facing ports are handled using a single Transaction
Translator (TT), when operating in a cross-version environment. This allows the
whole 480 Mbit/s upstream bandwidth to be shared by all the Original USB devices
on its downstream facing ports.
Universal Serial Bus Specification Rev. 2.0
. It supports data transfer at
The ISP1521 has seven downstream facing ports. If not used, ports 3 to 7 can be
disabled. The vendor ID, product ID and string descriptors on the hub are supplied by
the internal ROM; they can also be supplied by an external I2C-bus™ EEPROM or a
microcontroller.
The ISP1521 is suitable for self-powered hub designs.
An analog overcurrent detection circuitry is built into the ISP1521, which can also
accept digital overcurrent signals from external circuits; for example, Micrel MOSFET
switch MIC2026. The circuitry can be configured to trip on a global or an individual
overcurrent condition.
Each port comes with two status indicator LEDs.
Target applications of the ISP1521 are monitor hubs, docking stations for notebooks,
internal USB hub for motherboards, hub for extending Intel® Easy PCs, hub boxes,
and so on.
Philips Semiconductors
2.Features
■ Complies with:
■ Supports data transfer at high-speed (480 Mbit/s), full-speed (12 Mbit/s) and
■ Self-powered capability
■ USB suspend mode support
■ Configurable number of ports
■ Internal power-on reset and low voltage reset circuit
■ Port status indicators
■ Integrates high performance USB interface device with hub handler, Philips Serial
■ Built-in overcurrent detection circuit
■ Individual or ganged power switching, individual or global overcurrent protection,
■ Simple I2C-bus (master/slave) interface to read device descriptor parameters,
■ Visual USB traffic monitoring (GoodLink™) for the upstream facing port
■ Uses 12 MHz crystal oscillator with on-chip Phase-Locked Loop (PLL) for low
■ Supports temperature range from −40 °C to +70 °C
■ Available in LQFP80 package.
ISP1521
Hi-Speed USB hub controller
◆
Universal Serial Bus Specification Rev. 2.0
◆ Advanced Configuration and Power Interface (ACPI™), OnNow™ and USB
power management requirements
low-speed (1.5 Mbit/s)
Interface Engine (SIE) and transceivers
and non-removable port support by I/O pins configuration
language ID, manufacturer ID, product ID, serial number ID and string descriptors
from a dedicated external EEPROM, or to allow the microcontroller to set up hub
descriptors
DP04AI/Oupstream facing port 0 D+ connection (analog)
RPU5AIpull-up resistor connection;connect this pin through a resistor of
GND6-ground supply
RREF7AIreferenceresistor connection; connect thispin through a resistor
GND8-ground supply
DM59AI/Odownstream facing port 5 D− connection (analog)
DP510AI/Odownstream facing port 5 D+ connection (analog)
V
CC1
GND12-ground supply
V
CC4
GND14-ground supply
DM615AI/Odownstream facing port 6 D− connection (analog)
DP616AI/Odownstream facing port 6 D+ connection (analog)
V
CC2
GND18-ground supply
DM119AI/Odownstream facing port 1 D− connection (analog)
DP120AI/Odownstream facing port 1 D+ connection (analog)
TEST_LOW21-connect to GND
TEST_HIGH22-connect to 5.0 V through a 10 kΩ resistor
OC1_N23AI/Iovercurrent sense input for downstream facing port 1
PSW1_N24I/Ooutput — power switch control output (open-drain) with an
OC6_N25AI/Iovercurrent sense input for downstream facing port 6
PSW6_N26I/Ooutput — power switch control output (open-drain) with an
OC5_N27AI/Iovercurrent sense input for downstream facing port 5
PSW5_N28I/Ooutput — power switch control output (open-drain) with an
GND29-ground supply
V
CC3
V
REF(5V0)
Hi-Speed USB hub controller
[1]
…continued
[2]
Pin Type Description
1.5 kΩ±5 % to 3.3 V
of 12 kΩ±1 % to an analog band gap ground reference
11-analog supply voltage 1 (3.3 V)
13-crystal and PLL supply voltage 4 (3.3 V)
17-transceiver supply voltage 2 (3.3 V)
(analog/digital)
internal pull-up resistor for downstream facing port 1
input — function of the pin when used as an input is given in
Table 5
(analog/digital)
internal pull-up resistor for downstream facing port 6
input — function of the pin when used as an input is given in
Table 5
(analog/digital)
internal pull-up resistor for downstream facing port 5
input — function of the pin when used as an input is given in
Table 5
30-digital supply voltage 3 (3.3 V)
31-reference voltage (5 V ± 5 %); used to power internal pull-up
resistors of PSWn_N pins and also for the analog overcurrent
detection
GND71-ground supply
GRN1_N72I/Ooutput — green LED port indicator (open-drain) for downstream
AMB1_N73I/Ooutput — amber LED port indicator (open-drain) for
GRN6_N74I/Ooutput — green LED port indicator (open-drain) for downstream
AMB6_N75I/Ooutput — amber LED port indicator (open-drain) for
GRN5_N76I/Ooutput — green LED port indicator (open-drain) for downstream
AMB5_N77I/Ooutput — amber LED port indicator (open-drain) for
HUBGL_N78Ohub GoodLink LED indicator output; the LED is off until the hub
SCL79I/OI
SDA80I/OI
[2]
Pin Type Description
ISP1521
Hi-Speed USB hub controller
[1]
…continued
facing port 1
input — function of the pin when used as an input is given in
Table 9
downstream facing port 1
input — function of the pin when used as an input is given in
Table 8
facing port 6
input — function of the pin when used as an input is given in
Table 9
downstream facing port 6
input — function of the pin when used as an input is given in
Table 8
facing port 5
input — function of the pin when used as an input is given in
Table 9
downstream facing port 5
input — function of the pin when used as an input is given in
Table 8
is configured; a transaction between the host and the hub will
blink the LED offfor100 ms; this LED isoff in thesuspend mode
(open-drain)
2
C-bus clock (open-drain); see Table 11
2
C-bus data (open-drain); see Table 11
[1] The maximum current the ISP1521 can sink on a pin is 8 mA.
[2] Symbol names ending with underscore N (for example, NAME_N) represent active LOW signals.
[3] To disable a downstream port n, connect both pins DPn and DMn to VCC (3.3 V); unused ports must
be disabled in reverse order starting from port 7.
The integrated transceivers directly interface to USB lines. They can transmit and
receive serial data at high-speed (480 Mbit/s), full-speed (12 Mbit/s) and low-speed
(1.5 Mbit/s).
8.2 Hub controller core
The main components of the hub core are:
• Philips Serial Interface Engine (SIE)
• Routing logic
• Transaction Translator (TT)
• Mini-host controller
• Hub repeater
• Hub controller
• Port controller
• Bit clock recovery.
ISP1521
Hi-Speed USB hub controller
8.2.1 Philips serial interface engine
The Philips SIE implements the full USB protocol layer. It is completely hardwired for
speed and needs no firmware intervention. The functions of this block include:
synchronization, pattern recognition, parallel or serial conversion, bit (de-)stuffing,
CRC checking and generation, Packet IDentifier verification and generation, address
recognition, and handshake evaluation and generation.
8.2.2 Routing logic
The routing logic directs signaling to the appropriate modules (mini-host controller,
Original USB repeater and Hi-Speed USB repeater) according to the topology in
which the hub is placed.
8.2.3 Transaction translator
The TT acts as a go-between mechanism that links devices operating in the Original
USB mode and the Hi-Speed USB upstream mode. For the ‘IN’ direction, data is
concatenated in TT buffers till the proper length is reached, before the host takes the
transaction. In the reverse direction (OUT), the mini-host dispenses the data
contained in TT buffers over a period that fits into the Original USB bandwidth. This
continues until all outgoing data is emptied. TT buffers are used only on split
transactions.
8.2.4 Mini-host controller
The internal mini-host generates all the Original USB IN, OUT or SETUP tokens for
the downstream facing ports, while the upstream facing port is in the high-speed
mode. The responses from the Original USB devicesare collected in TT buffers, until
the end of the complete split transaction clears the TT buffers.
A hub repeater is responsible for managing connectivity on a per packet basis. It
implements packet signaling connectivity and resume connectivity. There are two
repeaters in the ISP1521: a Hi-Speed USB repeater and an Original USB repeater.
The only major difference between these two repeaters is the speed at which they
operate. When the hub is connected to an Original USB system, it automatically
switches itself to function as a pure Original USB hub.
8.2.6 Hub and port controllers
The hub controller provides status report. The port controller provides control for
individual downstream facing port; it controls the port routing module. Any port status
change will be reported to the host via the hub status change (interrupt) endpoint.
8.2.7 Bit clock recovery
The bit clock recovery circuit extracts the clock from the incoming USB data stream.
8.3 Phase-locked loop clock multiplier
A 12 MHz to 480 MHz clock multiplier PLL is integrated on-chip. This allows the use
of low-cost 12 MHz crystals. The low crystal frequency also minimizes
ElectroMagnetic Interference (EMI). No external components are required for the
operation of the PLL.
ISP1521
Hi-Speed USB hub controller
8.4 I2C-bus controller
A simple serial I2C-bus interface is provided to transfer vendor ID, product ID and
string descriptor from an external I2C-busEEPROM (for example,Philips PCF8582 or
equivalent) or microcontroller. A master/slave I2C-bus protocol is implemented
according to the timing requirements as mentioned in the I2C-bus standard
specifications. The maximum data count during I2C-bus transfers for the ISP1521 is
256 bytes.
8.5 Overcurrent detection circuit
An overcurrent detection circuit is integrated on-chip. The main features of this circuit
are: self reporting, automatic resetting, low-trip time and low cost. This circuit offers
an easy solution at no extra hardware cost on the board.
8.6 GoodLink
Indication of a good USB connection is provided through GoodLink technology. An
LED can be directly connected to pin HUBGL_N via an external 330 Ω resistor.
During enumeration, the LED blinks on momentarily. After successful configuration,
the LED blinks off for 100 ms upon each transaction.
This featureprovides a user-friendly indication of the status of the hub, the connected
downstream devices and the USB traffic. It is a useful diagnostics tool to isolate faulty
USB equipment and helps to reduce field support and hotline costs.
8.7 Power-on reset
The ISP1521 has an internal Power-On Reset (POR) circuit.
The triggering voltage of the POR circuit is 2.03 V nominal. A POR is automatically
generated when VCC goes below the trigger voltage for a duration longer than 1 µs.
ISP1521
Hi-Speed USB hub controller
POR
V
CC
2.03 V
0 V
≤ 683 µs
004aaa388
At t1: clock is running and available.
Fig 3. Power-on reset timing.
POR
EXTERNAL CLOCK
A
Stable external clock is to be available at A.
Fig 4. External clock with respect to power-on reset.
The ISP1521 is configured through I/O pins and, optionally, through an external
I2C-bus,in which case the hub can updateits configuration descriptors as amaster or
as a slave.
Table 3 shows the configuration parameters.
Table 3:Configuration parameters
Mode and selectionOptionConfiguration method
Pin controlSoftware control
Control pinReferenceAffected fieldReference
Numberof downstream
facing ports
Power switching modenone
Overcurrent protection
mode
Non-removable portsany port can be
Port indicator supportno
2 ports
3 ports
4 ports
5 ports
6 ports
7 ports
ganged
multiple ganged
individual
none
[2]
global
multiple ganged
individual
non-removable
yes
DM1/DP1 to
DM7/DP7
PSW1_N to
PSW7_N
[1]
NOOC and
OC1_N to
OC7_N
AMBn_Nsee Section 9.1.4wHubCharacteristics:
all GRNn_Nsee Section 9.1.5 wHubCharacteristics:
see Section 9.1.1bNbrPorts0see Table 22
see Section 9.1.2wHubCharacteristics:
see Section 9.1.3wHubCharacteristics:
ISP1521
Hi-Speed USB hub controller
see Table 22
bits D1 and D0
bPwrOn2PwrGood:
time interval
see Table 22
bits D4 and D3
see Table 22
bit D2 (compound hub)
DeviceRemovable:
bit map
see Table 22
bit D7
[1] Multiple ganged power mode is reported as individual power mode; refer to the USB 2.0 specification.
[2] When the hub uses the global overcurrent protection mode,the overcurrentindication is throughthe wHubStatus field bit 1(overcurrent)
and the corresponding change bit (overcurrent change).
To discount a physical downstream facing port, connect pins DP and DM of that
downstream facing port to VCC (3.3 V) starting from the highest port number (7); see
Table 4.
The sum of physical ports configured is reflected in the bNbrPorts field.
Table 4:Downstream facing port number pin configuration
Number of physical
downstream facing port
715kΩ
615kΩ
515kΩ
415kΩ
315kΩ
215kΩ
DM1/DP1DM2/DP2DM3/DP3DM4/DP4DM5/DP5DM6/DP6DM7/DP7
pull-down
pull-down
pull-down
pull-down
pull-down
pull-down
15 kΩ
pull-down
15 kΩ
pull-down
15 kΩ
pull-down
15 kΩ
pull-down
15 kΩ
pull-down
15 kΩ
pull-down
15 kΩ
pull-down
15 kΩ
pull-down
15 kΩ
pull-down
15 kΩ
pull-down
15 kΩ
pull-down
V
CC
15 kΩ
pull-down
15 kΩ
pull-down
15 kΩ
pull-down
15 kΩ
pull-down
V
CC
V
CC
ISP1521
Hi-Speed USB hub controller
15 kΩ
pull-down
15 kΩ
pull-down
15 kΩ
pull-down
V
CC
V
CC
V
CC
15 kΩ
pull-down
15 kΩ
pull-down
V
CC
V
CC
V
CC
V
CC
15 kΩ
pull-down
V
V
V
V
V
CC
CC
CC
CC
CC
9.1.2 Power switching
Power switching of downstream ports can be done individually or ganged, where all
ports are simultaneously switchedwith onepower switch. TheISP1521 supports both
modes, which can be selected using input PSWn_N; see Table 5.
Voltage drop requirements: Self-powered hubs are required to provide a minimum
of 4.75 V to its output port connectors at all legal load conditions. To comply with
Underwriters Laboratory Inc. (UL) safety requirements, the power from any port must
be limited to 25 W (5 A at 5 V). Overcurrent protection may be implemented on a
global or individual basis.
Assuming a 5 V ± 3 % power supply, the worst-case supply voltage is 4.85 V. This
only allows a voltage drop of 100 mV across the hub Printed-Circuit Board (PCB) to
each downstream connector. This includes a voltage drop across the:
• Power supply connector
• Hub PCB (power and ground traces, ferrite beads)
• Power switch (FET on-resistance)
• Overcurrent sense device.
The PCB resistance and power supply connector resistance may cause a drop of
25 mV, leaving only 75 mV as the voltage drop allowed across the power switch and
overcurrent sense device. The individual voltage drop components are shown in
For global overcurrent detection, an increased voltage drop is needed for the
overcurrent sense device (in this case, a low-ohmic resistor). This can be realized by
using a special power supply of 5.1 V ± 3 %, as shown in Figure 6.
The PCB resistance may cause a drop of 25 mV, which leaves 75 mV for the power
switch and overcurrent sense device.
ISP1521
Hi-Speed USB hub controller
voltage drop
25 mV
hub board
resistance
4.75 V (min)
(1)
V
BUS
D+
D−
GND
SHIELD
004aaa264
downstream
port
connector
5 V
POWER SUPPLY
± 3 % regulated
4.85 V (min)
+
−
voltage drop
75 mV
ISP1521
power switch
(PSWn_N)
low-ohmic
PMOS switch
(1) Includes PCB traces, ferrite beads, and so on.
Fig 5. Typical voltage drop components in the self-powered mode using individual overcurrent detection.
voltage drop
5.1 V KICK-UP
POWER SUPPLY
± 3 % regulated
4.95 V(min)
+
−
100 mV
low-ohmic
sense resistor
for overcurrent
detection
(1) Includes PCB traces, ferrite beads, and so on.
voltage drop
75 mV
ISP1521 power
switch
(PSWn_N)
low-ohmic
PMOS switch
voltage drop
25 mV
hub board
resistance
4.75 V(min)
(1)
V
BUS
D+
D−
GND
SHIELD
004aaa265
downstream
port
connector
Fig 6. Typical voltage drop components in the self-powered mode using global overcurrent detection.
PSWn_N pins have integrated weak pull-up resistors inside the chip.
Table 5:Power switching mode: pin configuration
Power switching modePSW1_NPSW2_NPSW3_NPSW4_NPSW5_NPSW6_NPSW7_N
The ISP1521 supports all overcurrent protection modes: none, global and individual.
No overcurrent protection mode reporting is selected when pin NOOC = HIGH.
Global and individual overcurrent protectionmodes areselected usingpins PSWn_N,
following the power switching modes selection scheme; seeTable 6.
For the global overcurrent protection mode, only PSW1_N and OC1_N are active;
that is, in this mode, the remaining overcurrent indicator pins are disabled. To inhibit
9397 750 13702
the analog overcurrent detection, the OC_N pins must be connected to V
Both analog and digital overcurrent modes are supported; see Table 7.
For digital overcurrent detection, the normal digital TTL level is accepted on the
overcurrent input pins. For analog overcurrent detection, the threshold is given in the
DC characteristics. In this mode, to filter out false overcurrent conditions because of
in rush and spikes, a dead time of 15 ms is built into the IC, that is, overcurrent must
persist for 15 ms before it is reported to the host.
3.3 Vor 5.0 Vanalogthreshold ∆V
Grounddigitalnormal digital TTL level
trip
9.1.4 Non-removable port
A non-removable port, by definition, is a port that is embedded inside the hub
application box and is not externally accessible. The LED port indicators
(pins AMBn_N) of such a port are not used. Therefore, the corresponding amber LED
port indicators are disabled to signify that the port is non-removable; see Table 8.
More than one non-removable port can be specified by appropriately connecting the
corresponding amber LED indicators. At least one port should, however, be left as a
removable port.
The detection of any non-removable port sets the hub descriptor into a compound
hub.
Table 8:Non-removable port pin configuration
AMBn_N (n=1to7)Non-removable port
Groundnon-removable
Pull-up with amber LEDremovable
9.1.5 Port indicator support
The port indicator support can be disabled by grounding all green port indicators (all
pins GRNn_N); see Table 9. This is a global feature. It is not possible to disable port
indicators for only one port.
Table 9:Port indicator support: pin configuration
GRN1_N to GRN7_NPort indicator support
Groundnot supported
LED pull-up green LED for at least one portsupported
9.2 Device descriptors and string descriptors settings using I2C-bus
9.2.1 Background information on I2C-bus
The I2C-bus is suitable for bi-directional communication between ICs or modules. It
consists of two bi-directional lines: SDA for data signals and SCL for clock signals.
Both these lines must be connected to a positive supply voltage through a pull-up
resistor.
The basic I2C-bus protocol is defined as:
• Data transfer is initiated only when the bus is not busy.
• Changes in the data line occur when the clock is LOW and must be stable when
Different conditions on I2C-bus: The I2C-bus protocol defines the following
conditions:
Not busy — both SDA and SCL remain HIGH
START — a HIGH-to-LOW transition on SDA, while SCL is HIGH
STOP — a LOW-to-HIGH transition on SDA, while SCL is HIGH
Data valid — after a STARTcondition, dataon SDAmust be stable for the duration of
the HIGH period of SCL.
ISP1521
Hi-Speed USB hub controller
the clock is HIGH. Any changes in data lines when the clock is HIGH will be
interpreted as control signals.
Data transfer: The master initiates each data transfer using a START condition and
terminates it bygenerating a STOP condition. To facilitate the next byte transfer, each
byte of data must be acknowledged bythe receiver. Theacknowledgement is done by
pulling the SDA line LOW on the ninth bit of the data. An extra clock pulse needs to
be generated by the master to accommodate this bit.
For more detailed information on the operation of the bus, refer to
specification
I2C-bus address: The address of the ISP1521 is given in Table 10.
The I2C-bus cannot be shared between the EEPROM and the external microcontroller.
Fig 7. Configurable hub descriptors.
The configurable hub descriptors can be masked in the internal ROM memory; see
Figure 7. These descriptors can also be supplied from an external EEPROM or a
microcontroller. The ISP1521 implements both the master and slave I2C-bus
controllers. The information from the external EEPROM or the microcontroller is
transferredinto the internal RAM during the power-on reset. A signature word is used
to identify correct descriptors. If the signature matches, the content of the RAM is
chosen instead of the ROM.
When the external microcontroller mode is selected and while the external
microcontroller is writing to the internal RAM, any request to configurable descriptors
will be responded to with a Not AcKnowledge (NAK). There is no specified time-out
period for the NAK signal. This data is then passed to the host during the
enumeration process.
The three configuration methods are selectedby connecting pins SCLand SDAin the
manner given in Table 11.
Table 11: Configuration method
Configuration methodSCLSDA
Internal ROMgroundground
External EEPROM2.2 kΩ to 4.7 kΩ pull-up2.2 kΩ to 4.7 kΩ pull-up
External microcontrollerdriven LOW by the
Remark: A 128-byte EEPROM supports one language ID only, and a 256-byte
EEPROM supports two language IDs.
9.2.4 ROM or EEPROM detailed map
Table 12: ROM or EEPROM detailed map
Address
(hex)
Signature descriptor
00signature (low)55-signature to signify valid data comment
01signature (high)AA-
Device descriptor
02idVendor (low)CC-Philips Semiconductors vendor ID
03idVendor (high)0404idProduct (low)21-ISP1521 product ID
05idProduct (high)1506bcdDevice (low)00-device release; silicon revision
07bcdDevice (high)0208RSV, iSN, iP, iM-00if all the three strings are supported, the
09reserved-FF-
String descriptor Index 0 (language ID)
0AbLength
0BbDescriptorType-03
0CwLANGID[0]-09LANGID code zero (first language ID)
0D-04
0EwLANGID[1]-09LANGID code one (second language ID)
0F-08
EA EB-FF FF
EC ED-FF FF
EE EF-FF FF
F0 F1-FF FF
F2 F3-FF FF
F4 F5-FF FF
F6 F7-FF FF
F8 F9-FF FF
FA FB-FF FF
FC FD-FF FF
FE-FF
FF-FFupper boundary of all string descriptors
[1] If this string descriptor is not supported, this bLength field must be programmed with the value 02H.
[2] If this string descriptor is not supported, this bDescriptorType field must be used (programmed with
[3] String descriptor index (iManufacturer)starts from the address 0EH for one language ID support and
Each USB device is composed of several independent logic endpoints. An endpoint
acts as a terminus of communication flow between the host and the device. At design
time, each endpoint is assigned a unique number (endpoint identifier; see Table 13).
The combination of the device address (given by the host during enumeration), the
endpoint number and the transfer direction allows each endpoint to be uniquely
referenced.
The ISP1521 has two endpoints: endpoint 0 (control) and endpoint 1 (interrupt).
Table 13: Hub endpoints
FunctionEndpoint
Hub ports 0 to 70controlOUT64
[1] IN: input for the USB host; OUT: output from the USB host.
Hi-Speed USB hub controller
Transfer typeDirection
identifier
IN64
1interruptIN1
[1]
ISP1521
Maximum packet
size (bytes)
10.1 Endpoint 0
According to the USB specification, all devices must implement a default control
endpoint. This endpoint is used by the host to configure the USB device. It provides
access to the device configuration and allows generic USB status and control access.
The ISP1521 supports the following descriptor information through its control
endpoint 0:
• Device descriptor
• Device_qualifier descriptor
• Configuration descriptor
• Interface descriptor
• Endpoint descriptor
• Hub descriptor
• Other_speed_configuration descriptor.
The maximum packet size of this endpoint is 64 bytes.
10.2 Endpoint 1
Endpoint 1 can be accessed only after the hub has been configured by the host (by
sending the Set Configuration command). It is used by the ISP1521 to send the
status change information to the host.
Endpoint 1 is an interrupt endpoint. The host polls this endpoint once every 255 ms.
After the hub is configured, an IN token is sent by the host to request the port change
status. If the hub detects no change in the port status, it returns a NAK to this
request, otherwise the Status Change byte is sent. Table 14 shows the content of the
change byte.
1 to 7 Port n Status Change0no change in the status of port n (n=1to7)
11. Descriptors
The ISP1521 hub controller supports the following standard USB descriptors:
• Device
• Device_qualifier
• Other_speed_configuration
• Configuration
• Interface
• Endpoint
• Hub.
ISP1521
Hi-Speed USB hub controller
1change in the hub status detected
1change in the status of port n (n = 1 to 7)
The hub returns different descriptors based on the mode of operation: full-speed or
high-speed.
Table 15: Device descriptor
Offset
(bytes)
0bLength1212descriptor length = 18 bytes
1bDescriptorType0101type = DEVICE
2bcdUSB0000see USB specification Rev. 2.0
30202
4bDeviceClass0909HUB_CLASSCODE
5bDeviceSubClass0000HubSubClassCode
6bDeviceProtocol0001HubProtocolHSpeedOneTT
7bMaxPacketSize04040packet size = 64 bytes
8idVendorCCCCPhilips Semiconductors vendor ID (04CC); can be
90404
10idProduct2121the ISP1521 product ID; can be customized
111515
12bcdDevice0000device ID; can be customized
130202
14iManufacturer0101can be customized
15iProduct0202can be customized
16iSerialNumber0303can be customized; this value must be unique
17bNumConfigurations 0101one configuration
The hub must react to a variety of requests initiated by the host. Some requests are
standard and are implemented by any USB device whereas others are hub-class
specific requests.
12.1 Standard USB requests
Table 23 shows the supported standard USB requests.
Table 23: Standard USB requests
bmRequestType
Request
Address
Set Address0000 000005device
Configuration
Get Configuration1000 00000800, 0000, 0001, 00configuration value
Set Configuration (0)0000 00000900, 0000, 0000, 00none
Set Configuration (1)0000 00000901, 0000, 0000, 00none
Descriptors
Get Configuration
Descriptor
Get Device Descriptor1000 00000600, 0100, 00length
Get String Descriptor (0) 1000 00000603, 0000, 00length
Get String Descriptor (1) 1000 00000603, 0100, 00length
Get String Descriptor (2) 1000 00000603, 0200, 00length
Get String Descriptor (3) 1000 00000603, 0300, 00length
[1] Returns vendor-specific data.
[2] Returned value in bytes.
[3] Feature selector value; see Table 25.
[4] Downstream port identifier: 1 to N with N is number of enabled ports (2 to 7).
17overcurrent indicator change 0no change in overcurrent
18 to 31reserved0-
12.3.6 Get port status
This request returns four bytes of data. The first word contains the port status bits
(wPortStatus), and the next word contains the port status change bits
(wPortChange). The contents of wPortStatus is given in Table 31, and the contents of
wPortChange is given in Table 32.
In accordance with the Absolute Maximum Rating System (IEC 60134).
SymbolParameterConditionsMinMaxUnit
V
CC
V
REF(5V0)
V
I(5V0)
V
I(3V3)
V
O(3V3)
I
lu
V
esd
T
stg
supply voltage 3.3 V−0.5+4.6V
input reference voltage 5.0 V−0.5+6.0V
input voltage on 5 V buffers3.0 V < VCC< 3.6 V
[1]
−0.5+6.0V
input voltage on 3.3 V buffers3.0 V < VCC< 3.6 V−0.5+4.6V
output voltage on 3.3 V buffers−0.5+4.6V
latch-up currentVI< 0 or VI>V
CC
electrostatic discharge voltageon pins DM1 to DM7, DP1 to DP7,
-100mA
[2][3]
−4000+4000V
OC1_N to OC7_N, and all
V
on all other pins; I
and GND pins; ILI<1µA
REF(5V0)
<1µA
LI
[2][3]
−2000+2000V
storage temperature−40+125°C
[1] Valid only when supply voltage is present.
[2] Test method available on request.
[3] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).
14. Recommended operating conditions
Table 35: Recommended operating ranges
SymbolParameterMinTypMaxUnit
V
CC
V
REF(5V0)
V
I(3V3)
V
I(5V0)
T
amb
[1] All internal pull-up resistors are connected to this voltage.
supply voltage 3.3 V3.03.33.6V
input reference voltage 5.0 V
input voltage on 3.3 V pins0-V
input voltage on 5 V tolerant pins0-V
supply current 5 V-0.5-mA
total supply current 3.3 VI
High-speed
I
CC(tot)
total supply current 3.3 Vsuspend mode; internal clock stopped
=−40°Cto+70°C; unless otherwise specified.
amb
CC(tot)=ICC1+ICC2+ICC3+ICC4
no device connected-183-mA
1 active device connected-231-mA
2 active devices connected-276-mA
3 active devices connected-318-mA
4 active devices connected-362-mA
5 active devices connected-400-mA
6 active devices connected-446-mA
7 active devices connected-492-mA
[1]
-91-mA
[2]
-0.5-mA
[1] Irrespective of the number of devices connected, the value of ICC is always 91 mA in full-speed.
[2] Including Rpu drop current.
Table 37: Static characteristics: digital input and outputs
[1] All pins are 5 V tolerant.
[2] The bus capacitance (Cb) is specified in pF. To meet the specification for VOL and the maximum rise time (300 ns), use an external
LOW-level input voltage--0.9V
HIGH-level input voltage2.1--V
hysteresis voltage0.15--V
LOW-level output voltage--0.4V
output fall time VIH to V
pull-up resistor with R
Table 39: Static characteristics: USB interface block (DP0 to DP7 and DM0 to DM7)
VCC= 3.0 V to 3.6 V; T
SymbolParameterConditionsMinTypMaxUnit
Input levels for high-speed
V
HSSQ
squelch detection threshold
(differential signal amplitude)
V
HSCM
data signaling common-mode
voltage range
Output levels for high-speed
V
HSOI
V
HSOH
V
HSOL
V
CHIRPJ
V
CHIRPK
idle state−10-+10mV
data signaling HIGH360-440mV
data signaling LOW−10-+10mV
chirp J level (differential voltage)
chirp K level (differential voltage)
Input levels for full-speed and low-speed
V
IL
V
IH
V
IHZ
V
DI
V
CM
LOW-level input voltage--0.8V
HIGH-level input voltage (drive)2.0--V
HIGH-level input voltage (floating)2.7-3.6V
differential input sensitivity|DP − DM|0.2--V
differential common-mode range0.8-2.5V
Output levels for full-speed and low-speed
V
V
V
OL
OH
CRS
LOW-level output voltage0-0.3V
HIGH-level output voltage2.8-3.6V
output signal crossover point
voltage
Leakage current
I
LZ
OFF-state leakage current−1- +1µA
Capacitance
C
IN
transceiver capacitancepin to GND--20pF
=−40°Cto+70°C; unless otherwise specified.
amb
[1]
IL
= 850/CbkΩ and R
max
=−40°Cto+70°C; unless otherwise specified.
amb
10<Cb=10pFto400pF
=(VCC− 0.4)/3 kΩ.
min
squelch detected--100mV
no squelch detected150--mV
Table 39: Static characteristics: USB interface block (DP0 to DP7 and DM0 to DM7)
VCC= 3.0 V to 3.6 V; T
=−40°Cto+70°C; unless otherwise specified.
amb
…continued
SymbolParameterConditionsMinTypMaxUnit
Resistance
Z
INP
input impedance10--MΩ
Termination
V
TERM
termination voltage for pull-up
[3]
3.0-3.6V
resistor on pin RPU
[1] For minimum value, the HS termination resistor is disabled and the pull-up resistor is connected. Only during reset, when both the hub
and the device are capable of high-speed operation.
[2] Characterized only, not tested. Limits guaranteed by design.
[3] In the suspend mode, the minimum voltage is 2.7 V.
Table 40: Dynamic characteristics: system clock timing
SymbolParameterConditionsMinTypMaxUnit
Reset
t
W(POR)
internal power-on reset pulse
width
t
W(RESET_N)
pulse width on pin RESET_N0.2--µs
Crystal oscillator
f
clk
clock frequencycrystal
External clock input
δclock duty cycle-50-%
[1] Recommended accuracy of the clock frequency is 500 ppm for the crystal.
[2] Suggested values for external capacitors when using a crystal are 22 pF to 27 pF.
Table 41: Dynamic characteristics: overcurrent sense timing
VCC= 3.0 V to 3.6 V; T
=−40°Cto+70°C; unless otherwise specified.
amb
SymbolParameterConditionsMinTypMaxUnit
Overcurrent sense pins OC1_N to OC7_N
t
trip
overcurrent trip response time from
see Figure 9
OCn_N LOW to PSWn_N HIGH
0.2-1µs
[1][2]
-12-MHz
--15ms
V
CC
∆V
overcurrent
input
0 V
V
CC
power switch
output
0 V
Overcurrent input: pins OCn_N; power switch output: pins PSWn_N.
The I2C-bus cannot be shared between the EEPROM and the external microcontroller; see Table 11.
(1) The function on port 7, which is a non-removable port, is optional.
For an overcurrent limit of 500 mA per port, a PMOS with R
100 mΩ is required. If a PMOS with a lower R
detection can be adjusted by using a series resistor; see Figure 18.
DSON
EEPROM
004aaa302
of approximately
DSON
is used, analog overcurrent
∆V
= ∆V
PMOS
∆V
I
OC(nom)
= voltage drop on PMOS
PMOS
= 0.6 µA.
(1) Rtd is optional.
trip
= ∆V
trip(intrinsic)
5 V
− (I
V
OC(nom)
REF(5V0)
ISP1521
× Rtd), where:
OCn_NPSWn_N
004aaa260
I
OC
(1)
R
td
Fig 18. Adjusting analog overcurrent detection limit (optional).
20.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Packages
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended. In these situations
reflow soldering is recommended.
20.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
ISP1521
Hi-Speed USB hub controller
Data Handbook IC26; Integrated Circuit
(document order number 9398 652 90011).
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270 °C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
• below 225 °C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called
thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
20.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
• Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
• For packages with leads on four sides, the footprint must be placed at a 45° angle
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or
265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in
most applications.
ISP1521
Hi-Speed USB hub controller
– larger than or equal to 1.27 mm, the footprint longitudinal axis ispreferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
20.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.
20.5 Package related soldering information
Table 47: Suitability of surface mount IC packages for wave and reflow soldering
[1] For more detailed information on the BGA packages refer to the
(AN01026); order a copy from your Philips Semiconductors sales office.
[2] All surfacemount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body sizeof the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
[8] Image sensor packagesin principle should not be soldered. Theyare mounted in sockets or delivered
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
21. Revision history
ISP1521
Hi-Speed USB hub controller
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm.
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Table 48: Revision history
Rev DateCPCNDescription
03 20041124 200411024Product data (9397 750 13702)
Modifications:
• Globally changed the temperature range from “0 °C to +70 °C” to “−40 °Cto+70°C”
• Globally changed the ADOC pin connection from “3.3 V” to “3.3 V or 5.0 V”
• Table 34 “Absolute maximum ratings”: changed the max value of V
5.25 V to 6.0 V
• Table 35 “Recommended operating ranges”: changed the max value of V
5.25 V to 5.5 V
• Figure 19 “Self-powered hub; individual port power switching; individual overcurrent
detection.”: changed pin SP/BP_N to TEST_HIGH and pin HP to TEST_LOW
• Figure 20 “Self-powered hub; ganged port power switching; global overcurrent
detection.”: changed pin SP/BP_N to TEST_HIGH and pin HP to TEST_LOW.
02 20040212 -Product data (9397 750 11691)
01 20030625 -Preliminary data (9397 750 10691)
IObjective dataDevelopmentThis data sheet contains data from the objective specification for product development. Philips
IIPreliminary dataQualificationThis data sheet contains data from the preliminary specification. Supplementary data will be published
IIIProduct dataProductionThis data sheet contains data from the product specification. Philips Semiconductors reserves the
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
[1]
Product status
23. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
[2][3]
Definition
Semiconductors reserves the right to change the specification in any manner without notice.
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
right to make changes at any time in order to improvethe design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
25. Licenses
Purchase of Philips I2C components
2
Purchase of Philips I
under the Philips’ I
2
I
C system provided the system conforms to the I2C
specification defined by Philips. This specification can be
ordered using the code 9398 393 40011.
C components conveys a license
2
C patent to use the components in the
24. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
26. Trademarks
ACPI — is an open industry specification for PC power management,
co-developed by Intel Corp., Microsoft Corp. and Toshiba.
GoodLink — is a trademark of Koninklijke Philips Electronics N.V.
2
I
C-bus — is a trademark of Koninklijke Philips Electronics N.V.
OnNow — is a trademark of Microsoft Corporation.
Intel — is a registered trademark of Intel Corporation.
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.Fax: +31 40 27 24825
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 24 November 2004Document order number: 9397 750 13702
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