Philips ISP1103 User Manual

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ISP1103

Universal Serial Bus transceiver

Rev. 01 — 4 October 1999 Preliminary specification

1. General description

The ISP1103 is a single-chip generic Universal Serial Bus (USB) transceiver that is
fully compliant with the
USB Application Specific ICs (ASICs) and Programmable Logic Devices (PLDs) to
interface with the physical layer of the Universal Serial Bus. It supports transmitting
and receiving serial data at both full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s)
data rates. It also supports the low-power single-ended input receiver interface in
‘suspend’ mode operation. The ISP1103 operates on a 3.3 V supply voltage.

Universal Serial Bus Specification Rev. 1.1

. It allows 3.3 V

2. Features

The pin configuration conforms to the ‘Serial Interface Engine’ from the Universal
Serial Bus Implementers Forum (USB-IF). The ISP1103 allows for both the ‘USB-IF
Standard Data Interface’ and the ‘Philips Encoded Data Interface’. The ISP1103 is
fully pin compatible with the industry-standard Philips Semiconductors USB
transceiver PDIUSBP11A.

■ Complies with

c

c

■ Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) serial data rates

■ Slew-rate controlled differential data driver

■ Differential inputreceiver with wide common-mode range and very high data input

sensitivity

■ Stable RCV output during SE0 condition

■ Two single-ended receivers with hysteresis

■ Supports ‘Philips Encoded Data Interface’ and ‘USB-IF Standard Data Interface’

■ Low-power operation in ‘suspend’ mode

■ Operates on a 3.3 V supply voltage

■ Fully backward compatible with PDIUSBP11A

■ Compatible with VHDL ‘Serial Interface Engine’ from USB Implementers Forum

■ Higher than 8 kV ESD protection

■ Full industrial operating temperature range −40 to +85 °C

■ Available in SO14, SSOP14 and TSSOP14 packages.

Universal Serial Bus Specification Rev. 1.1

Philips Semiconductors

ISP1103

USB transceiver

3. Ordering information

Table 1: Ordering information

Type number Package

Name Description Version

ISP1103D SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
ISP1103DB SSOP14 plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1
ISP1103DH TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1

4. Functional diagram

Fig 1. Functional diagram.

handbook, halfpage

n.c.

MODE

OE

SPEED

VMO/FSE0

VPO/VO

SUSPND

RCV

VP

VM

8

1
2
9
13
12

6
3

4

5

ISP1103x

14

10

11

MBL094

V

CC(3.3)

D−

D+

7

GND

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© Philips Electronics N.V. 1999. All rights reserved.

Preliminary specification Rev. 01 — 4 October 1999 2 of 17

Philips Semiconductors

5. Pinning information

5.1 Pinning

ISP1103

USB transceiver

page

SUSPND

MODE

OE

RCV

VP

VM

GND

1
2
3
4
5
6
7

ISP1103D

MBL091

V

14
13

VMO/FSE0

12

VPO/VO

11

D+

10

D−

9

SPEED
n.c.

8

CC(3.3)

page

SUSPND

MODE

OE

RCV

VP

VM

GND

1
2
3
4

ISP1103DB

5
6
7

MBL092

V

14
13

VMO/FSE0

12

VPO/VO

11

D+

10

D−

9

SPEED
n.c.

8

CC(3.3)

page

SUSPND

MODE

OE

RCV

VP

VM

GND

1
2
3
4

ISP1103DH

5
6
7

MBL093

V

14
13

VMO/FSE0

12

VPO/VO

11

D+

10

D−

9

SPEED
n.c.

8

CC(3.3)

Fig 2. Pinning diagram SO14. Fig 3. Pinning diagram SSOP14. Fig 4. Pinning diagram TSSOP14.

5.2 Pin description

Table 2: Pin description

Symbol Pin Type Description

MODE 1 I driver interface selection input (Schmitt trigger):

LOW: Philips Encoded Data Interface (pins VO, FSE0)
HIGH: USB-IF Standard Data Interface (pins VPO, VMO);

pulled HIGH by an internal pull-up transistor, if left floating

OE 2 I output enable input (Schmitt trigger, active LOW); enables the

transceiver to transmit data on the bus

RCV 3 O differential data receiver output (CMOS level); driven HIGH

when input SUSPND is HIGH; the output state of RCV is
preserved and stable during an SE0 condition

VP 4 O single-ended D+ receiver output (CMOS level); used for

external detection of single-ended zero (SE0), error
conditions, speed of connected device

VM 5 O single-ended D− receiver output (CMOS level); used for

external detection of single-ended zero (SE0), error
conditions, speed of connected device

SUSPND 6 I suspend input (Schmitt trigger); a HIGH level enables

low-power state while the USB bus is inactive and drives

output RCV to a HIGH level
GND 7 - ground supply
n.c. 8 - not connected
SPEED 9 I speed selection input (Schmitt trigger); adjusts the slew rate

of differential data outputs D+ and D− according to the

transmission speed:

LOW: low-speed (1.5 Mbit/s)
HIGH: full-speed (12 Mbit/s)

9397 750 06329

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Preliminary specification Rev. 01 — 4 October 1999 3 of 17

Philips Semiconductors

ISP1103

USB transceiver

Table 2: Pin description

Symbol Pin Type Description

D− 10 AI/O negative USB data bus connection (analog, differential); for

D+ 11 AI/O positive USB data bus connection (analog, differential); for

VPO/VO 12 I differential driver data input (Schmitt trigger); see Table 4
VMO/FSE0 13 I differential driver data input (Schmitt trigger); see Table 4
V

CC(3.3)

6. Functional description

6.1 Function selection

Table 3: Function table

SUSPND OE D+/D− RCV VP/VM Function

L L driving active active normal driving

L H receiving

H L driving inactive

H H high-Z

…continued

low-speed mode connect to pin V

full-speed mode connect to pin V

14 - supply voltage (3.0 to 3.6 V)

[1]

active active receiving

[2]

active driving during ‘suspend’

[1]

inactive

[2]

active low-power state

via a 1.5 kΩ resistor

CC(3.3)

via a 1.5 kΩ resistor

CC(3.3)

(differential receiver active)

(differential receiver inactive)

[1] Signal levels on D+/D− are determined by other USB devices and external pull-up/down resistors.
[2] In ‘suspend’ mode (SUSPND = H) the differential receiver is inactive and output RCV is always HIGH.

Out-of-suspend (‘K’) signalling is detected via the single-ended receivers VP and VM.

6.2 Operating functions

Table 4: Driving function (OE = L)

MODE Interface type VPO/VO VMO/FSE0 Data

L L differential logic 0

L

H

Philips Encoded

Data Interface

USB-IF Standard

Data Interface

Table 5: Receiving function (

D+/D− RCV VP VM

differential logic 0 L L H
differential logic 1 H H L

SE0 RCV* L L

OE=H)

L H SE0
H L differential logic 1
H H SE0

L L SE0

L H differential logic 0
H L differential logic 1
H H illegal data

[1] RCV* denotes the signal level on output RCV just before SE0 state occurs. This level is kept stable

during the SE0 period.

9397 750 06329

Preliminary specification Rev. 01 — 4 October 1999 4 of 17

© Philips Electronics N.V. 1999. All rights reserved.

Philips Semiconductors

ISP1103

USB transceiver

7. Limiting values

Table 6: Absolute maximum ratings

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

CC(3.3)

V

I

I

latchup

V

esd

T

stg

P

tot

[1] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).

Table 7: Recommended operating conditions

Symbol Parameter Conditions Min Max Unit

V

CC(3.3)

V

I

V

I(AI/O)

T

amb

supply voltage −0.5 +6.0 V
input voltage −0.5 VCC+ 0.5 V
latchup current VI< 0 or VI>V
electrostatic discharge voltage ILI<1µA

CC

- 200 mA

[1]

- ±8000 V
storage temperature −60 +150 °C
total power dissipation - <tbf> W

supply voltage 3.0 3.6 V
input voltage 0 5.5 V
input voltage on analog I/O pins

0 3.6 V

(D+/D−)
operating ambient temperature −40 +85 °C

8. Static characteristics

Table 8: Static characteristics: supply pins

VCC=V

Symbol Parameter Conditions Min Typ Max Unit

I

CC

I

CC(susp

; V

CC(3.3)

GND

=0V; T

=−40 to+85°C; unless otherwise specified.

amb

operating supply current - <tbf> - mA

) suspend supply current - - 10 µA

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Preliminary specification Rev. 01 — 4 October 1999 5 of 17

© Philips Electronics N.V. 1999. All rights reserved.

Philips Semiconductors

ISP1103

USB transceiver

Table 9: Static characteristics: digital pins

VCC=V

Symbol Parameter Conditions Min Typ Max Unit

Schmitt trigger input levels

V

th(LH)

V

th(HL)

V

hys

Output levels

V

OL

V

OH

Leakage current

I

LI

; V

CC(3.3)

GND

=0V; T

positive-going threshold

=−40 to+85°C; unless otherwise specified.

amb

1.4 - 1.9 V

voltage
negative-going threshold

0.9 - 1.5 V

voltage
hysteresis voltage 0.4 - 0.7 V

LOW-level output voltage IOL= 3 mA - - 0.4 V

=20µA - - 0.1 V

I

OL

HIGH-level output voltage IOL= 3 mA 2.4 - - V

=20µAV

I

OL

CC(3.3)

−

--V

0.1

input leakage current - - ±1 µA

Table 10: Static characteristics: analog I/O pins (D+, D−)

VCC=V

CC(3.3)

; V

GND

=0V; T

=−40 to+85°C; unless otherwise specified.

amb

[1]

Symbol Parameter Conditions Min Typ Max Unit

Input levels

V

DI

V

CM

differential input sensitivity |V
differential common mode

− V

I(D+)

| 0.2 - - V

I(D−)

includes VDI range 0.8 - 2.5 V

voltage

V

IL

V

IH

V

hys

LOW-level input voltage - - 0.8 V
HIGH-level input voltage 2.0 - - V
hysteresis voltage 0.4 - 0.7 V

Output levels

V

OL

V

OH

LOW-level output voltage RL= 1.5 kΩ to V

CC(3.3)

HIGH-level output voltage RL=15kΩ to GND 2.8 - V

- - 0.3 V

CC(3.3)

V

Leakage current

I

LZ

OFF-state leakage current - - ±10 µA

Capacitance

C

IN

transceiver capacitance pin to GND - - 20 pF

Resistance

Z

DRV

Z

INP

driver output impedance
input impedance 10 - - MΩ

[2]

steady-state drive 28 - 44 Ω

Termination

V

TERM

termination voltage

[3]

for

upstream port pull-up (R

PU

)

3.0

[4]

- 3.6 V

[1] D+ is the USB positive data pin; D− is the USB negative data pin.
[2] Includes external resistors of 22 Ω±1% or 24Ω±1% on both D+ and D−.
[3] This voltage is available at pin V
[4] In ‘suspend’ mode the minimum voltage is 2.9 V.

9397 750 06329

Preliminary specification Rev. 01 — 4 October 1999 6 of 17

CC(3.3)

.

© Philips Electronics N.V. 1999. All rights reserved.

Philips Semiconductors

9. Dynamic characteristics

ISP1103

USB transceiver

Table 11: Dynamic characteristics: analog I/O pins (D+, D−); full-speed mode

VCC=V

CC(3.3)

; V

GND

=0V; T

=−40 to+85°C; CL= 50 pF; RPU= 1.5 kΩ on D+ to V

amb

[1]

.; unless otherwise specified.

TERM

Symbol Parameter Conditions Min Typ Max Unit

Driver characteristics

t

FR

rise time CL=50pF;

10 to 90% of |V

OH

− VOL|;

4 - 20 ns

see Figure 5

t

FF

fall time CL=50pF;

90 to 10% of |V

OH

− VOL|;

4 - 20 ns

see Figure 5

FRFM differential rise/fall time

V

CRS

matching (t
output signal crossover voltage

FR/tFF

)

[2]

90 - 111.1 %

[2] [3]

1.3 - 2.0 V

Driver timing

t

PLH

t

PHL

t

PHZ

t

PLZ

t

PZH

t

PZL

propagation delay
(VPO,VMO/FSE0 to D+,D−)

3-state output disable time

OE to D+,D−)

(
3-state output enable time

OE to D+,D−)

(

LOW-to-HIGH; seeFigure 8 --14ns
HIGH-to-LOW; see Figure 8 --14ns
HIGH-to-OFF; see Figure 6 --6ns
LOW-to-OFF; seeFigure 6 --5ns
OFF-to-HIGH; see Figure 6 --14ns
OFF-to-LOW; see Figure 6 --15ns

Receiver timing

Differential receiver

t

PLH

t

PHL

propagation delay
(D+,D− to RCV)

LOW-to-HIGH; seeFigure 7 --8ns

HIGH-to-LOW; see Figure 7 --8ns

Single-ended receiver

t

PLH

t

PHL

propagation delay
(D+,D− to VP,VM)

LOW-to-HIGH; seeFigure 7 --5ns

HIGH-to-LOW; see Figure 7 --8ns

[1] Test circuit: see Figure 11.
[2] Excluding the first transition from Idle state.
[3] Characterized only, not tested. Limits guaranteed by design.

Table 12: Dynamic characteristics: analog I/O pins (D+, D−); low-speed mode

VCC=V

CC(3.3)

; V

GND

=0V; T

=−40 to+85°C; CL= 50 pF; RPU= 1.5 kΩ on D− to V

amb

[1]

.; unless otherwise specified.

TERM

Symbol Parameter Conditions Min Typ Max Unit

Driver characteristics

t

LR

rise time CL= 200 to 600 pF;

10 to 90% of |V

OH

− VOL|;

75 - 300 ns

see Figure 5
t

LF

fall time CL= 200 to 600 pF;

90 to 10% of |V

OH

− VOL|;

75 - 300 ns

see Figure 5
LRFM differential rise/fall time

matching (t

V

CRS

9397 750 06329

Preliminary specification Rev. 01 — 4 October 1999 7 of 17

output signal crossover voltage

LR/tLF

)

[2]

85 - 118 %

[2] [3]

1.3 - 2.0 V

© Philips Electronics N.V. 1999. All rights reserved.

Philips Semiconductors

ISP1103

USB transceiver

Table 12: Dynamic characteristics: analog I/O pins (D+, D−); low-speed mode

VCC=V

CC(3.3)

; V

GND

=0V; T

=−40 to+85°C; CL= 50 pF; RPU= 1.5 kΩ on D− to V

amb

[1]

…continued

TERM

.; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Driver timing

t

PLH

t

PHL

t

PHZ

t

PLZ

t

PZH

t

PZL

propagation delay (VPO/VO,
VMO/FSE0 to D+,D−)

3-state output disable time

OE to D+,D−)

(
3-state output enable time

OE to D+,D−)

(

LOW-to-HIGH; seeFigure 8 - - 165 ns

HIGH-to-LOW; see Figure 8 - - 145 ns

HIGH-to-OFF; see Figure 6 --6ns

LOW-to-OFF; seeFigure 6 --5ns

OFF-to-HIGH; see Figure 6 - - 100 ns

OFF-to-LOW; see Figure 6 - - 100 ns

Receiver timing

Differential receiver

t

PLH

t

PHL

propagation delay
(D+,D− to RCV)

LOW-to-HIGH; seeFigure 7 --9ns

HIGH-to-LOW; see Figure 7 --10ns

Single-ended receiver

t

PLH

t

PHL

propagation delay
(D+,D− to VP,VM)

[1] Test circuit: see Figure 11.
[2] Excluding the first transition from Idle state.
[3] Characterized only, not tested. Limits guaranteed by design.

LOW-to-HIGH; seeFigure 7 --5ns

HIGH-to-LOW; see Figure 7 --8ns

+3.0 to +5.5 V

t
t

PHZ
PLZ

1/2V

V

OH

V

OL

logic input

t

FR, tLR

V

OH

V

OL

90% 90%

10% 10%

t

FF, tLF

MGS255

0 V

+3.3 V

differential
data lines

0 V

V

t

PZH

t

PZL

CRS

Fig 5. Rise and fall times. Fig 6. Timing of OE to D+, D-.

+3.3 V

differential
data lines

0 V

V

OH

logic output

0 V

t

PLH

t

PHL

V

CRS

1/2V

CC(3.3)

MGS256

+3.0 to +5.5 V

logic input

0 V

+3.3 V

differential
data lines

0 V

t

PLH

t

1/2V

PHL

CC(3.3)

Fig 7. Timing of D+, D- to RCV, VP, VM. Fig 8. Timing of VPO/VO, VMO/FSE0 to D+, D-.

CC(3.3)

− 0.3 V

+ 0.3 V

MGS257

V

CRS

MGS254

9397 750 06329

© Philips Electronics N.V. 1999. All rights reserved.

Preliminary specification Rev. 01 — 4 October 1999 8 of 17

Philips Semiconductors

10. Test information

ISP1103

USB transceiver

handbook, halfpage

22 or 24 Ω

D.U.T.

V = 0 V for t
V=V

CC(3.3)

PZH

for t

, t

PZL

PHZ

, t

PLZ

Fig 9. Load for enable and disable times.

handbook, halfpage

D.U.T.

test point

Fig 10. Load for VM, VP and RCV.

test point

500 Ω

50 pF

V

MGS258

25 pF

MGS259

handbook, halfpage

D.U.T.

22 or 24 Ω

test point

15 kΩ

S1

C

L

Load capacitance:

CL= 50 pF or 125 pF (full-speed mode, minimum or maximum timing)
CL= 200 pF or 600 pF (low-speed mode, minimum or maximum timing).

Speed selection:

full-speed mode (FS): 1.5 kΩ pull-up resistor on D+
low-speed mode (LS): 1.5 kΩ pull-up resistor on D−.

Fig 11. Load for D+, D-.

R

1.5 kΩ

test

D−/LS
D+/LS
D−/FS
D+/FS

V

CC(3.3)

PU

S1

closed

open
open

closed

MGS260

9397 750 06329

© Philips Electronics N.V. 1999. All rights reserved.

Preliminary specification Rev. 01 — 4 October 1999 9 of 17

Philips Semiconductors

11. Package outline

ISP1103

USB transceiver

SO14: plastic small outline package; 14 leads; body width 3.9 mm

D

c

y

Z

14

pin 1 index

1

e

8

A

2

7

w M

b

p

SOT108-1

E

H

E

A

1

detail X

A

X

v M

A

Q

(A )

L

p

L

A

3

θ

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT108-1

A

max.

1.75

0.069

A2A3b

A

1

0.25

1.45

0.10

0.010

0.004

0.25

1.25

0.057

0.01

0.049

IEC JEDEC EIAJ

076E06S MS-012AB

0.49

0.36

0.019

0.014

p

0.25

0.19

0.0100

0.0075

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1)

cD

8.75

8.55

0.35

0.34

REFERENCES

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

6.2

5.8

0.244

0.228

1.05

0.041

1.0

0.4

0.039

0.016

0.7

0.25

0.6

0.028

0.01 0.004

0.024

EUROPEAN

PROJECTION

0.25 0.1

0.01

(1)

0.7

0.3

0.028

0.012

ISSUE DATE

95-01-23
97-05-22

o

8

o

0

Fig 12. SO14 package outline.

9397 750 06329

Preliminary specification Rev. 01 — 4 October 1999 10 of 17

© Philips Electronics N.V. 1999. All rights reserved.

Philips Semiconductors

ISP1103

USB transceiver

SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm

D

c

y

Z
14

pin 1 index

8

A

2

A

E

H

E

1

SOT337-1

A

X

v M

A

Q

(A )

L

p

L

A

3

θ

b

p

0.20

0.09

MO-150AB

7

w M

p

0 2.5 5 mm

(1)E(1)

cD

6.4

6.0

REFERENCES

1

e

DIMENSIONS (mm are the original dimensions)

mm

OUTLINE
VERSION

SOT337-1

A

max.

2.0

0.21

0.05

1.80

1.65

IEC JEDEC EIAJ

0.25

0.38

0.25

UNIT A1A2A3b

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

Fig 13. SSOP14 package outline.

detail X

scale

eHELLpQZywv θ

5.4

5.2

7.9

0.65 1.25 0.2

7.6

1.03

0.63

0.9

0.7

EUROPEAN

PROJECTION

0.13 0.1

(1)

1.4

0.9

ISSUE DATE

95-02-04
96-01-18

o

8

o

0

9397 750 06329

© Philips Electronics N.V. 1999. All rights reserved.

Preliminary specification Rev. 01 — 4 October 1999 11 of 17

Philips Semiconductors

ISP1103

USB transceiver

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm

D

c

y

Z

14

pin 1 index

8

17

w M

b

e

p

A

2

A

1

E

H

E

L

detail X

SOT402-1

A

X

v M

A

Q

(A )

3

A

θ

L

p

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT A1A2A3b

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

A

max.

0.15

mm

1.10

OUTLINE
VERSION

SOT402-1 MO-153

0.05

0.95

0.25

0.80

IEC JEDEC EIAJ

p

0.30

0.19

0.2

0.1

(1)E(2) (1)

cD

5.1

4.9

REFERENCES

eHELLpQZywv θ

4.5

4.3

0.65

6.6

6.2

0.75

0.50

0.4

0.3

EUROPEAN

PROJECTION

0.13 0.10.21.0

0.72

0.38

ISSUE DATE

94-07-12
95-04-04

o

8

o

0

Fig 14. TSSOP14 package outline.

9397 750 06329

Preliminary specification Rev. 01 — 4 October 1999 12 of 17

© Philips Electronics N.V. 1999. All rights reserved.

Philips Semiconductors

12. Soldering

12.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our

Packages

There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering is not always suitable for surface mount ICs, or for printed-circuit boards
with high population densities. In these situations reflow soldering is often used.

12.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, infrared/convection heating in a
conveyor type oven. Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating method.

ISP1103

USB transceiver

Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

Typical reflow peak temperatures range from 215 to 250 °C. The top-surface
temperature of the packages should preferable be kept below 230 °C.

12.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

If wave soldering is used the following conditions must be observed for optimal
results:

Use a double-wave soldering method comprising a turbulent wave with high

•

upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):

•

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45° angle

•

to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

9397 750 06329

Preliminary specification Rev. 01 — 4 October 1999 13 of 17

© Philips Electronics N.V. 1999. All rights reserved.

Philips Semiconductors

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.

12.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.

12.5 Package related soldering information

Table 13: Suitability of surface mount IC packages for wave and reflow soldering

Package Soldering method

BGA, LFBGA, SQFP, TFBGA not suitable suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,

SMS
PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

ISP1103

USB transceiver

methods

Wave Reflow

not suitable

[3]

, SO, SOJ suitable suitable

[2]

[3] [4]
[5]

suitable

suitable
suitable

[1]

[1] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the

Circuit Packages; Section: Packing Methods

[2] These packages are not suitable for wavesoldering as a solder joint between the printed-circuit board

and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).

[3] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[4] Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger

than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[5] Wave soldering is only suitableforSSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

13. Revision history

Table 14: Revision history

Rev Date CPCN Description

01 19991004 Preliminary specification; initial version.

Data Handbook IC26; Integrated

.

9397 750 06329

Preliminary specification Rev. 01 — 4 October 1999 14 of 17

© Philips Electronics N.V. 1999. All rights reserved.

Philips Semiconductors

14. Data sheet status

ISP1103

USB transceiver

Datasheet status Product status Definition

Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may

change in any manner without notice.

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips

Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.

Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any

time without notice in order to improve design and supply the best possible product.

[1] Please consult the most recently issued data sheet before initiating or completing a design.

15. Definitions

Short-form specification — The data in a short-form specification is

extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

[1]

16. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.

9397 750 06329

© Philips Electronics N.V. 1999 All rights reserved.

Preliminary specification Rev. 01 — 4 October 1999 15 of 17

Philips Semiconductors

Philips Semiconductors - a worldwide company

ISP1103

USB transceiver

Argentina: see South America
Australia: Tel. [phone], Fax. [phone]
Austria: Tel. [phone], Fax. [phone]
Belarus: Tel. [phone], Fax. [phone]
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Tel. [phone], Fax. [phone]
Canada: Tel. [phone]
China/Hong Kong: Tel. [phone], Fax. [phone]
Colombia: see South America
Czech Republic: see Austria
Denmark: Tel. [phone], Fax. [phone]
Finland: Tel. [phone], Fax. [phone]
France: Tel. [phone], Fax. [phone]
Germany: Tel. [phone], Fax. [phone]
Hungary: see Austria
India: Tel. [phone], Fax. [phone]
Indonesia: see Singapore
Ireland: Tel. [phone], Fax. [phone]
Israel: Tel. [phone], Fax. [phone]
Italy: Tel. [phone], Fax [phone]
Japan: Tel. [phone], Fax. [phone]
Korea: Tel. [phone], Fax. [phone]
Malaysia: Tel. [phone], Fax. [phone]
Mexico: Tel. [phone]
Middle East: see Italy

Netherlands: Tel. [phone], Fax. [phone]
New Zealand: Tel. [phone], Fax. [phone]
Norway: Tel. [phone], Fax. [phone]
Philippines: Tel. [phone], Fax. [phone]
Poland: Tel. [phone], Fax. [phone]
Portugal: see Spain
Romania: see Italy
Russia: Tel. [phone], Fax. [phone]
Singapore: Tel. [phone], Fax. [phone]
Slovakia: see Austria
Slovenia: see Italy
South Africa: Tel. [phone], Fax. [phone]
South America: Tel. [phone], Fax. [phone]
Spain: Tel. [phone], Fax. [phone]
Sweden: Tel. [phone], Fax. [phone]
Switzerland: Tel. [phone], Fax. [phone]
Taiwan: Tel. [phone], Fax. [phone]
Thailand: Tel. [phone], Fax. [phone]
Turkey: Tel. [phone], Fax. [phone]
Ukraine: Tel. [phone], Fax. [phone]
United Kingdom: Tel. [phone], Fax. [phone]
United States: Tel. [phone]
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: Tel. [phone], Fax. [phone]

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications,
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. [phone]

Internet: http://www.semiconductors.philips.com

(SCA68)

9397 750 06329

Preliminary specification Rev. 01 — 4 October 1999 16 of 17

© Philips Electronics N.V. 1999. All rights reserved.

Philips Semiconductors

Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Functional description . . . . . . . . . . . . . . . . . . . 4

6.1 Function selection. . . . . . . . . . . . . . . . . . . . . . . 4

6.2 Operating functions. . . . . . . . . . . . . . . . . . . . . . 4

7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

9 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7

10 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9

11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

12.1 Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

12.2 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13

12.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 13

12.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14

12.5 Package related soldering information . . . . . . 14

13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

14 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 15

15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

ISP1103

USB transceiver

© Philips Electronics N.V. 1999. Printed in The Netherlands

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.

The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.

Date of release: 4 October 1999 Document order number: 9397 750 06329