Copyright 2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or
transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without
the prior permission of Philips.
Published by Helen-RY 1207 Service Audio Printed in The Netherlands Subject to modification
DVD-Video, DVD+R/+RW, DVD-R/-RW,
DVD+R/-R DL, CD-R/CD-RW, Audio CD,
Video CD/SVCD, Picture fi les, MP3 media,
WMA media, DivX Plus HD media, USB
storage device
RMVB (Available only in Asia Pacifi c and China)
•
File formats
Audio: .aac, .mka, .mp3, .wma, .wav, .mp4, .m4a
•
•
Video:
•
.avi, .divx, .mp4, .mkv, .asf, .wmv, .mpg,
.mpeg,
.rmvb, .rm (Available only in Asia Pacifi c
•
and China)
Picture: .jpg, .jpeg, .gif, .png
•
Amplifi er
•
Total output power: 600W RMS (30% THD)
Frequency response: 20 Hz-20 kHz / ±3 dB
•
Signal-to-noise ratio: > 65 dB (CCIR) /
•
(A-weighted)
Input sensitivity:
•
•
AUX: 2 V
Music iLink: 1 V
•
Radio
•
Tuning range:
Europe/Russia/China: FM 87.5-108 MHz
•
(50 kHz)
•
Asia Pacifi c/Latin America: FM 87.5-108
MHz (50/100 kHz)
Signal-to-noise ratio: FM > 45 dB
•
•
Frequency response: FM 180 Hz-12.5 kHz /
±3 dB
USB
•
Compatibility: Hi-Speed USB (2.0)
Class support: USB Mass Storage Class
•
(MSC)
File system: FAT16, FAT32, NTFS
•
Maximum memory suppor t: < 160 GB
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Main unit
•Power supply: 110-240 V~, 50-60 Hz
Power consumption: 110 W
•
Standby power consumption: 0.9 W - 0.5 W
•
Dimensions (WxHxD): 360 x 58 x 325 mm
•
•
Weight: 2.62 kg
Subwoofer
Output power: 100 W RMS (30% THD)
•
Impedance: 4 ohm
•
Speaker drivers: 133 mm (5.25") woofer
•
•
Dimensions (WxHxD): 160 x 267.5 x 265 mm
Weight: 2.55 kg
•
Speakers
Center speaker:
Output power: 100 W RMS (30% THD)
•
Speaker impedance: 4 ohm
•
•
Speaker drivers: 1 x 63.5 mm (2.5") woofer
Dimensions (WxHxD): 160 x 85 x 95 mm
One must treat all sets from 1.1.2005 onwards, according
next rules.
Important note
be treated in this way as long as you avoid mixing
solder-alloys (leaded/ lead-free). So best to always use
SAC305 and the higher temperatures belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
x Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-paste is
required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste within
workshops should be avoided because paste is not easy
to store and to handle.
x Use only adequate solder tools applicable for lead-free
solder alloy. The solder tool must be able
x Adjust your solder tool so that a temperature around
360°C
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400°C otherwise
wear-out of tips will rise drastically and flux-fluid will be
destroyed. To avoid wear-out of tips switch off un-used
equipment, or reduce heat.
x Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is possible but PHILIPS recommends
strongly to avoid mixed
solder alloy types (leaded and lead-free). If one cannot
avoid, clean carefully the
solder-joint from old solder alloy and re-solder with new
solder alloy (SAC305).
: In fact also products a little older can also
o To reach at least a solder-temperature of 400°C,
o To stabilize the adjusted temperature at the
solder-tip
o To exchange solder-tips for different applications.
– 380°C is reached and stabilized at the solder
x Use only original spare-parts listed in the
Service-Manuals. Not listed standard-material
(commodities) has to be purchased at external
companies.
xSpecial information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for
de-soldering always use highest lead-free
temperature profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
‘dry-packaging’ (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on
indicator-label in the bag, the BGA-IC possibly
still has to be baked dry. This will be
communicated via AYS-website.
Do not re-use BGAs at all.
x For sets produced before 1.1.2005, containing
leaded soldering-tin and components, all needed
spare-parts will be available till the end of the
service-period. For repair of such sets nothing
changes.
x On our website:
www.atyourservice.ce.Philips.com
You find more information to:
BGA-de-/soldering (+ baking instructions)
Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information
within the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
Brief Guide
EN Before using your product, read all accompanying safety
information
MS Sebelum menggunakan produk anda, baca semua
maklumat keselamatan yang disertakan
2-1
User manual
1
EN Connect the home theater
MS Sambungkan teater rumah
2-2
FRONT
RIGHT
FRONT
LEFT
FRONT
CENTER
REAR
RIGHT
REAR
LEFT
SUB-
WOOFER
SUB
WOOFER
FRONT
LEFT
REAR
LEFT
FRONT
CENTER
FRONT
RIGHT
REAR
RIGHT
FRONT
RIGHT
FRONT
LEFT
FRONT
CENTER
REAR
RIGHT
REAR
LEFT
SUB
WOOFER
2
EN Connect to TV in one of these ways
MS Sambung kepada TV dalam salah satu cara berikut
2-3
HDMI ARC
HDMI OUT (ARC)
HDMI + OPTICAL
HDMI OUT (ARC)
OPTICAL
HDMI IN
HDMI
HDMI IN (ARC)
OPTICALHDMI
OPTICAL OUT
HDMI + COAXIAL
2-4
HDMICOAXIAL
DIGITAL IN
COAXIAL
HDMI OUT (ARC)
HDMI + AUDIO L/R
LR
AUDIO IN
HDMI OUT (ARC)
HDMI IN
COAXIAL
LR
HDMI IN
AUDIO OUT
AUDIO L/RHDMI
3
EN Switch on the home theater
MS Hidupkan teater rumah
1
2-5
2
3
4
EN Complete the fi rst time setup
MS Lengkapkan persediaan kali pertama