Philips HDD-120 Service Manual

Technical specification ......................................................1-1

Accessories .......................................................................1-1

Safety & Warnings.............................................................1-2

Service hints

Repair positions ............................................................2-1

Handling chip components............................................2-2

ESD protection equipment ............................................2-2

Pin descriptions of IC ..............................................3-1 to 3-7

Blockdiagram.....................................................................3-8

Circuit diagrams....................................................4-1 to 4-4

Layout diagrams

Copper side view...........................................................4-5

Component side view....................................................4-6

Exploded view ...................................................................5-1

Mechanical partslist ...........................................................5-1

Electrical partslist ....................................................6-1 to 6-3

Revision List ......................................................................7-1

Published by YT 0425 Service Audio Printed in The Netherlands Subject to modification

Digital Harddisk Player

TABLE OF CONTENTS

All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.

all versions

HDD100, HDD120

Version 1.1

1-1

TECHNICAL SPECIFICATION

General

Dimensions : 106.5 x 64.5 x 20.0mm Weight : 167g Output power : 2 x 5mW Frequency response : 20-20,000Hz Hard disk : low profile 1.8”HDD100 Capacity : 15GB (HDD100)

: 20GB (HDD120)

Battery life time : >10hr File transfer rate using USB1.1 : 900kbyte/s File transfer rate using USB2.0 : 11Mbyte/s Battery charging current : 600-700mA Maximum charging time : 4hr Battery cutoff voltage : 3.0V

Power supply

Battery level detection

Current consumption

Headphone out (headphone output load: 2x16Ω)

Maximum output power :+/-1.0mW (1kHz) Frequency response(16ohm load) :55Hz-15kHz Frequency response(15kohm load) :30Hz-15kHz SNR (A-wght) :>75dB (80dB typ.) THD (1kHz) :<0.3% (0.1% typ.) THD (20Hz-16kHz) :<1.0% (0.6% typ.) Left-Right Channel Separation :>50dB (55dB typ.) Left-Right Channel Balance :<1.5dB Default Output Power :0.04mW No.of Steps in Volume Control :32 Volume control :1dB

Mic-in Recording to Headphone out

Output Power at maximum volume :0.22mW typ. SNR (A-wght) :>25dBA (32dBA typ.) THD (1kHz) :<3% (1% typ.) Frequency response : 400Hz-3.2kHz (100Hz-4kHz)

Line-in Recording

Maximum output power :+/-1.0mW (1kHz) SNR (un-wght) :>70dB (75dB typ.) THD (1kHz) :<0.3% (0.1% typ.) THD (20Hz-16kHz) :<1.0% (0.6% typ.) Frequency response(16ohm load) :55Hz-15kHz Frequency response(15kohm load) :30Hz-15kHz Left-Right Channel Separation :>50dB (55dB typ.) Left-Right Channel Balance :<1.5dB

Accessories

ROF

SEIROSSECCA

HDD100

00/

50/ 71/

rotpadACD/CAY3192 A

HE570/77P

HARDDISK

PLAYER

AY3779

Remote control

AY3911 Cable USB2.0

3140 118 33801

3140 118 33811

3140 118 33821

9082 100 02001

3140 118 51541

3140 110 22411

AY3274 Pouch

3140 113 10661

Headphone

HDD120

00/

50/ 71/

CD Rom-IFU HDD100

3140 118 72071

4-step to 3-step voltage

3-step to 2-step voltage

2-step to 1-step voltage

Force Power Off voltage

3.90V

3.75V

3.65V

3.50V



1.5µA typ.

775mA typ.File tranfer using USB2.0 Idle with LCD Backlight on

Idle with LCD Backlight off

Playback without HDD reading

File tranfer using USB2.0

55mA typ.

85mA typ.

980mA typ.

100mA typ.

70mA typ.

650mA typ.

Playback without HDD reading

Battery Charging Current

Standby

Shutdown

2.2mA typ.



Regulated Voltage Supply

+3.3V

+2.5V

+1.8V

Remarks

For SPDIF Receiver only

For CPU and Audio Codec

LEVELNOITCETED Typ.

)V0.5(YLPPUSNI-CD )V.83(YLPPUS.TTAB

1 - 2

SAFETY & WARNINGS

All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD). Careless handling during repair can reduce life drastically. When repairing, make sure that you are connected with the same potential as the mass of the set via a wristband with resistance. Keep components and tools at this potential.

f ATTENTION

Tous les IC et beaucoup d´autres semi-conducteurs sont sensibles aux décharges statiques (ESD). Leur longévite pourrait être considérablement écourtée par le fait qu´aucune précaution nést prise à leur manipulation. Lors de réparations, s´assurer de bien être relié au même potentiel que la masse de l´appareil et enfileer le bracelet serti d´une résistance de sécurité. Veiller à ce que les composants ainsi que les outils que l´on utilise soient également à ce potentiel.

AVAILABLE ESD PROTECTION EQUIPMENT :

anti-static table mat large 1200x650x1.25mm 4822 466 10953 small 600x650x1.25mm 4822 466 10958 anti-static wristband 4822 395 10223 connection box (3 press stud connections, 1MΩ) 4822 320 11307 extendible cable (2m, 2MΩ, to connect wristband to connection box) 4822 320 11305 connecting cable (3m, 2MΩ, to connect table mat to connection box) 4822 320 11306 earth cable (1MΩ, to connect any product to mat or to connection box) 4822 320 11308 KIT ESD3 (combining all 6 prior products - small table mat) 4822 310 10671 wristband tester 4822 344 13999

d WARNUNG

Alle ICs und viele andere Halbleiter sind empfindlich gegenüber elektrostatischen Entladungen (ESD). Unsorgfältige Behandlung im Reparaturfall kann die Lebensdauer drastisch reduzieren. Sorgen Sie dafür, daß Sie im Reparaturfall über ein Pulsarmband mit Widerstand mit dem Massepotential des Gerätes verbunden sind. Halten Sie Bauteile und Hilfsmittel ebenfalls auf diesem Potential.

ESD

ñ WAARSCHUWING

Alle IC´s en vele andere halfgeleiders zijn gevoelig voor electrostatische ontladingen (ESD). Onzorgvuldig behandelen tijdens reparatie kan de levensduur drastisch doen vermindern. Zorg ervoor dat u tijdens reparatie via een polsband met weerstand verbonden bent met hetzelfde potentiaal als de massa van het apparaat. Houd componenten en hulpmiddelen ook op ditzelfde potentiaal.

i AVVERTIMENTO

Tutti IC e parecchi semi-conduttori sono sensibili alle scariche statiche (ESD). La loro longevità potrebbe essere fortemente ridatta in caso di non osservazione della più grande cauzione alla loro manipolazione. Durante le riparationi occorre quindi essere collegato allo stesso potenziale che quello della massa delápparecchio tramite un braccialetto a resistenza. Assicurarsi che i componenti e anche gli utensili con quali si lavora siano anche a questo potenziale.

Safety regulations require that the set be restored to its original condition and that parts which are identical with those specified be used. Safety components are marked by the symbol

Les normes de sécurité exigent que l`appareil soit remis à l`état d`origine et que soient utilisées les pièces de rechange identiques à celles spécifiées. Les composants de sécurité sont marqués

DANGER: Invisible laser radiation when open. AVOID DIRECT EXPOSURE TO BEAM.

Bei jeder Reparatur sind die geltenden Sicherheitsvorschriften zu beachten. Der Originalzustand des Gerätes darf nicht verändert werden. Für Reparaturen sind Originalersatzteile zu verwenden. Sicherheitsbauteile sind durch das Symbol markiert.

s Varning !

Osynlig laserstrålning när apparaten är öppnad och spärren är urkopplad. Betrakta ej strålen.

SAFETY

Veiligheidsbepalingen vereisen, dat het apparaat in zijn oorspronkeliijke toestand wordt teruggebracht en dat onderdelen, identiek aan de gespecificeerde, worden toegepast. De Veiligheidsonderdelen zijn aangeduid met het symbool

Le norme di sicurezza estigono che l´apparecchio venga rimesso nelle condizioni originali e che siano utilizzati i pezzi di ricambiago identici a quelli specificati. Componenty di sicurezza sono marcati con

∂ Advarsel !

Usynlig laserstråling ved åbning når sikkerhedsafbrydere er ude af funktion. Undgå udsaettelse for stråling.

ß Varoitus !

Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina näkymättömälle laserisäteilylle. Älä katso säteeseen !

After servicing and before returning the set to customer perform a leakage current measurement test from all exposed metal parts to earth ground, to assure no shock hazard exists. The leakage current must not exceed 0.5mA.

"Pour votre sécurite, ces documents doivent être utilisés par des spécialistes agréés, seuls habilités à réparer votre appareil en panne".

2 -1

SERVICE HINTS

REPAIR POSITION COPPERSIDE

To get access to the copperside of the printed board assembly proceed as follows:

1.Remove screws 2pcs (1.4X4 on the cap assy) Remove CAP right and left

2.Remove screws 5pcs (1.7x5 on the rear cabinet)

3.Lift battery and copper foil

REPAIR POSITION COMPONENTSIDE

To get access to the compomentside of the printed board assembly proceed as follows:

1.Remove screws 2pcs (1.4X4 on the cap assy) Remove CAP right and left

2.Remove screws 5pcs (1.7x5 on the rear cabinet)

3.Lift battery and copper foil

4.Remove screws 5pcs(1.4x4 on the PCB assy)

2 - 2

ESD PROTECTION EQUIPMENT

Anti-static table mat large 1200x650x1.25mm 4822 466 10953

small 600x650x1.25mm 4822 466 10958

Anti-static wristband 4822 395 10223 Connection box (3press stud connections,1MΩ) 4822 320 11307 Extendible cable (2m,2MΩ ,to connect wristband to connection box) 4822 320 11305 Connecting cable (3m,2MΩ ,to connect table mat to connection box) 4822 320 11306 Earth cable (1MΩ , to connect any product to mat or to connection box) 4822 320 11308 KIT ESD3(combining all 6 prior products - small table mat) 4822 310 10671 Wristband tester 4822 344 12999

HANDLING CHIP COMPONENTS

3 - 1

PIN DESCRIPTIONS OF IC CY7C68013

4.1 CY7C68013 Pin Descriptions

Table 4-1. FX2 Pin Descriptions

128

TQFP

100

TQFP56SSOP56QFN Name Type Default Description

10 9 10 3 AVCC Power N/A Analog V

13 12 13 6 AGND Power N/A Analog Ground. Connect to ground with as short a path as possi-

19 18 16 9DMINUS I/O/Z Z USB D– Signal. Connect to the USB D– signal.

18 17 15 8 DPLUS I/O/Z Z USB D+ Signal. Connect to the USB D+ signal.

94 A0 Output L 8051 Address Bus. This bus is driven at all times. When the 8051

95 A1 Output L

96 A2 Output L

97 A3 Output L

117 A 4 Output L

118 A 5 Output L

119 A 6 Output L

120 A 7 Output L

126 A 8 Output L

127 A 9 Output L

128 A 10 Output L

21 A11 Output L

22 A12 Output L

23 A13 Output L

24 A14 Output L

25 A15 Output L

59 D0 I/O/Z Z 8051 Data Bus. This bidirectional bus is high-impedance when

60 D1 I/O/Z Z

61 D2 I/O/Z Z

62 D3 I/O/Z Z

63 D4 I/O/Z Z

86 D5 I/O/Z Z

87 D6 I/O/Z Z

88 D7 I/O/Z Z

39 PSEN# Output H Program Store Enable. This active-LOW signal indicates an 8051

34 28 BKPT Output L Breakpoint. This pin goes active (HIGH) when the 8051 address

99 77 49 42 RESET# Input N/A Active LOW Reset. Resets the entire chip. This pin is normally tied

Note:

5. Unused inputs should not be left floating. Tie either HIGH or LOW as appropriate. Outputs should only be pulled up or down to ensure signals at power-up and in standby.

[5]

. This signal provides power to the analog section of

the chip.

ble.

is addressing internal RAM it reflects the internal address.

inactive, input for bus reads, and output for bus writes. The data bus is used for external 8051 program and data memory. The data bus is active only for external bus accesses, and is driven LOW in suspend.

code fetch from external memory. It is active for program memory fetches from 0x2000–0xFFFF when the EA pin is LOW, or from 0x0000–0xFFFF when the EA pin is HIGH.

bus matches the BPADDRH/L registers and breakpoints are enabled in the BREAKPT register (BPEN = 1). If the BPPULSE bit in the BREAKPT register is HIGH, this signal pulses HIGH for eight 12-/24-/48-MHz clocks. If the BPPULSE bit is LOW, the signal remains HIGH until the 8051 clears the BREAK bit (by writing 1 to it) in the BREAKPT register.

through a 100K resistor, and to GND through a 0.1-µF ca-

to V

pacitor.

3 - 2

PIN DESCRIPTIONS OF IC CY7C68013

[5]

Table 4-1. FX2 Pin Descriptions

128

TQFP

Port A

100

TQFP56SSOP56QFN Name Type Default Description

35 EA Input N/A External Access. This pin determines where the 8051 fetches

12 11 12 5 XTALIN Input N/A Crystal Input. Connect this signal to a 24-MHz parallel-resonant,

11 10 11 4 XTALOUT Output N/A Crystal Output. Connect this signal to a 24-MHz parallel-resonant,

1100 5 54 CLKOUT O/Z 12 MHz 12-, 24- or 48-MHz clock, phase locked to the 24-MHz input clock.

82 67 40 33 PA0 or

INT0#

83 68 41 34 PA1 or

INT1#

84 69 42 35 PA2 or

SLOE

85 70 43 36 PA3 or

WU2

89 71 44 37 PA4 or

FIFOADR0

90 72 45 38 PA5 or

FIFOADR1

91 73 46 39 PA6 or

PKTEND

(continued)

I/O/Z I

(PA0)

(PA1)

(PA2)

(PA3)

(PA4)

(PA5)

(PA6)

code between addresses 0x0000 and 0x1FFF. If EA = 0 the 8051 fetches this code from its internal RAM. IF EA = 1 the 8051 fetches this code from external memory.

fundamental mode crystal and 20-pF capacitor to GND. It is also correct to drive XTALIN with an external 24 MHz square wave derived from another clock source.

fundamental mode crystal and 20-pF capacitor to GND. If an external clock is used to drive XTALIN, leave this pin open.

The 8051 defaults to 12-MHz operation. The 8051 may tri-state this output by setting CPUCS.1 = 1.

Multiplexed pin whose function is selected by: PORTACFG.0

PA0 is a bidirectional IO port pin. INT0# is the active-LOW 8051 INT0 interrupt input signal, which is

either edge triggered (IT0 = 1) or level triggered (IT0 = 0).

Multiplexed pin whose function is selected by: PORTACFG.1

PA1 is a bidirectional IO port pin. INT1# is the active-LOW 8051 INT1 interrupt input signal, which is

either edge triggered (IT1 = 1) or level triggered (IT1 = 0).

Multiplexed pin whose function is selected by two bits: IFCONFIG[1:0].

PA2 is a bidirectional IO port pin. SLOE is an input-only output enable with programmable polarity

(FIFOPOLAR.4) for the slave FIFOs connected to FD[7..0] or FD[15..0].

Multiplexed pin whose function is selected by: WAKEUP.7 and OEA.3

PA3 is a bidirectional I/O port pin. WU2 is an alternate source for USB Wakeup, enabled by WU2EN

bit (WAKEUP.1) and polarity set by WU2POL (WAKEUP.4). If the 8051 is in suspend and WU2EN = 1, a transition on this pin starts up the oscillator and interrupts the 8051 to allow it to exit the suspend mode. Asserting this pin inhibits the chip from suspending, if WU2EN=1.

Multiplexed pin whose function is selected by: IFCONFIG[1..0].

PA4 is a bidirectional I/O port pin. FIFOADR0 is an input-only address select for the slave FIFOs con-

nected to FD[7..0] or FD[15..0].

Multiplexed pin whose function is selected by: IFCONFIG[1..0].

PA5 is a bidirectional I/O port pin. FIFOADR1 is an input-only address select for the slave FIFOs con-

nected to FD[7..0] or FD[15..0].

Multiplexed pin whose function is selected by the IFCONFIG[1:0] bits.

PA6 is a bidirectional I/O port pin. PKTEND is an input-only packet end with programmable polarity

(FIFOPOLAR.5) for the slave FIFOs connected to FD[7..0] or FD[15..0].

3 - 3

PIN DESCRIPTIONS OF IC CY7C68013

[5]

Table 4-1. FX2 Pin Descriptions

128

TQFP

Port B

PORT C

100

TQFP56SSOP56QFN Name Type Default Description

92 74 47 40 PA7 or

FLAGD or SLCS#

44 34 25 18 PB0 or

FD[0]

45 35 26 19 PB1 or

FD[1]

46 36 27 20 PB2 or

FD[2]

47 37 28 21 PB3 or

TXD1 or FD[3]

54 44 29 22 PB4 or

FD[4]

55 45 30 23 PB5 or

FD[5]

56 46 31 24 PB6 or

FD[6]

57 47 32 25 PB7 or

FD[7]

72 57 PC0 or

GPIFADR0

73 58 PC1 or

GPIFADR1

74 59 PC2 or

GPIFADR2

75 60 PC3 or

GPIFADR3

76 61 PC4 or

GPIFADR4

(continued)

I/O/Z I

(PA7)

(PB0)

(PB1)

(PB2)

(PB3)

(PB4)

(PB5)

(PB6)

(PB7)

(PC0)

(PC1)

(PC2)

(PC3)

(PC4)

Multiplexed pin whose function is selected by the IFCONFIG[1:0] and PORTACFG.7 bits.

PA7 is a bidirectional I/O port pin. FLAGD is a programmable slave-FIFO output status flag signal. SLCS# gates all other slave FIFO enable/strobes