Philips DVP-3236 Service Manual

DVD Player DVP3236/94 & DVP3236X/94

Service

Service Manual

Contents Survey of versions:

Chapter /94

Sec. 1: Adjustment Procedures

Schematic Diagrams and CBA's Exploded Views Spare Parts Lists

or otherwise without the prior permission of Philips.

Published by LM0820 Service AV Systems Printed in The Netherlands Subject to modification EN 3139 785 34141

Version 1.1

MAIN SECTION

DVD PLAYER

Main Section:

Adjustment Procedures Schematic Diagrams and CBA’s Exploded Views Spare Parts List

TABLE OF CONTENT

LASER BEAM SAFETY PRECAUTIONS . . . . . . . . . . . . . . . . . . …. . . . . . . . . . . . . . . . . . . .. . . 1

IMPORTANT SAFETY PRECAUTIONS. . . . . . . . . . . . . . . . . . . . . . . . . ….. . . . . . . . . . . . .. . . . 2

STANDARD NOTES FOR SERVICING . . . . . . . . . . . . . . . . . . . . . . . . . . . …. . .. . . . . . .. . . . . . 3

OPERATING CONTROLS AND FUNCTIONS. . . . . . . . . . . . . . . . . . . . . . . . . ... . . . . . .. . .. . . . 7

DISASSEMBLY INSTRUCTIONS . . . . . . . . . . . . . . . . …………… . . . . . . . . . . . . . . . . .. . .. . . . 9

HOW TO INITIALIZE THE DVD PLAYER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. .. .. . . . . 17

MODE FOR SERVICE…………………………………………………………………………….. …19

FIRMWARE RENEWAL MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

BLOCK WIRING DIAGRAMS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . 22

SCHEMATIC DIAGRAMS ………………………………… . . . . . . . . . . . . . . . . . . . . . . . . . …. ... 23

WAVEFORMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . 41

SYSTEM CONTROL TIMING CHARTS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . 46

EXPLODED VIEWS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

SPARE PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . …… . . . . . . . . . . . . . …… . . . .. 48

REVISION LIST……………………………………………………………………..…………………….51

LASER BEAM SAFETY PRECAUTIONS

Page 1 of 51

This DVD player uses a pickup that emits a laser beam.

Do not look directly at the laser beam coming from the pickup or allow it to strike against your skin.

The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser beam. CAUTION: Use of controls and adjustments, or doing procedures ot her than those specified herein, may result in hazardous radiation exposure.

CAUTION

LASER RADIATION

WHEN OPEN. DO NOT

STARE INTO BEAM.

Location: Top of DVD mechanism.

IMPORTANT SAFETY PRECAUTIONS

Page 2 of 51

Product Safety Notice

Some electrical and mechanical parts have special safety-related characteristi cs wh ich are often not evident from visual inspection, nor can the protection they give necessarily be obtained by replacing them with components rated for higher voltage, wattage, etc. Parts that have special safety characteristics are

identified by a # o lists. Use of a substitute replacement that does not have the same safety characteristics as the recommended replacement part might create shock, fire, and/or other hazards. The Product’s Safety is under review continuously and new instructions are issued whenever appropriate. Prior to shipment from the factory, our products are carefully inspected to confirm with the recognized product safety and

rical codes of the countries in which they

elect are to be sold. However, in order to maintain such compliance, it is equally important to implement the following precautions when a set is being serviced.

Precautions during Servicing

A. Parts identified by the # symbol are critical

for safety. Replace only with part number specified.

B. In addition assemblies are specified for conformance with regulations applying to spurious radiation. These must also be replaced only with specified replacements. Examples: RF converters, RF cables, noise blocking capacitors, and noise blocking filters, etc.

C. Use sp especially:

1) Wires covered with PVC tubing

2) Double insulated wires

3) High voltage leads D. Use sp

hazardous live parts. Note especially:

1) PVC tubing

2) Spacers

3) Insulators for transistors E. When replacing AC primary side

com wrap ends of wires securely about the terminals before soldering.

F. Obse

ecified internal wiring. Note

ecified insulating materials for

ponents (transformers, power cord, etc.),

rve that the wires do not contact heat

n schematics and in parts

to safety, other parts and

producing parts (heat sinks, oxide metal film resistors, fusible resistors, etc.).

G. Che sharp edges or pointed parts.

H. Whe check that5 - 6 kg of force in any direction will not loosen it.

I. A locations.

J. B solder droplets, etc.) do not remain inside the set.

K. Crim The power transformer uses crimp type con the primary side of the transformer. When replacing the transformer, follow these steps carefully and precisely to prevent shock hazards. Replacement procedure

1) Remove the old connector by cutting the wires at a poi Important: Do not re-use a con (Discard it.)

2) Strip about 15 mm of the insulation from the ends of the wires. If the wires a twist the strands to avoid frayed conductors.

3) Align the lengths of the wires to be c connector.

4) Use a crimping tool to crimp the metal sleeve at its center. Be su the complete closure of the tool.

L. When internal connectors, first, disconnect the AC plug from the AC outlet.

ck that replaced wires do not contact

n a power cord has been replaced,

lso check areas surrounding repaired

e careful that foreign objects (screws,

p type wire connector

nectors which connect the power cord and

nt close to the connector.

nector.

re stranded,

onnected. Insert the wires fully into the

re to crimp fully to

connecting or disconnecting the

STANDARD NOTES FOR SERVICING

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Circuit Board Indications

1. The output pin of the 3 pin Regulator ICs is indicated as shown.

2. For other ICs, pin 1 and every fifth pin are indicated as shown.

3. The 1st pin of every male connector is indicated as shown.

Instructions for Connectors

1. When you connect or disconnect the FFC (Flexible Foil Connector) cable, be sure to first disconnect the AC cord.

2. FFC (Flexible Foil Connector) cable should be inserted parallel into the connector, not at an angle.

Pb (Lead) Free Solder

When soldering, be sure to use the Pb free solder.

IDENTIFICATION:

Regardless of special logo (not always

indicated) One must treat all sets from 1.1.2005 onwards, according next rules. Important note: In fact also products a little older can also be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.

Due to lead-free technology some rules have to be respected by the workshop during a repair:

Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder paste is required, please contact the manufacturer of your solder-equipment. In general use of solder paste within workshops should be avoided because paste is not easy to store and to handle.

Use only adequate solder tools applicable for leadfree solder alloy. The solder tool must be able

To reach at least a solder-temperature of

400°C,

To stabilize the adjusted temperature at

the solder-tip

To exchange solder-tips for different applications.

Adjust your solder tool so that a temperature around 360°C - 380°C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400°C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat.

Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305).

Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs:

- always use the 12nc-recognizable soldering temperature profile of the specific BGA (for desoldering always use highest lead-free

temperature profile, in case of doubt)

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- lead free BGA-ICs will be delivered in so-called 'dry-packaging' (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicatorlabel in the bag, the BGA-IC possibly still has to be baked dry. This will be communicated via AYS-website. Do not re-use BGAs at all.

For sets produced before 1.1.2005, containing leaded soldering-tin and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes.

On our website

www.atyourservice.ce.Philips.com

more information to:

BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets. You will find this and more technical information within the “magazine”, chapter “workshop news”. For additional questions please contact your local repair-helpdesk.

you find

How to Remove / Install Flat Pack-IC

1. Removal

With Hot-Air Flat Pack-IC Desoldering Machine:

1. Prepare the hot-air flat pack-IC desoldering machine, then apply hot air to the Flat Pack-IC (about 5 to 6 seconds). (Fig. S-1-1)

be melted). (Fig. S-1-6)

4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)

CAUTION:

1. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC.

2. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2)

3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it.

With Soldering Iron:

1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)

2. Remove the flat pack-IC with tweezers while applying the hot air.

3. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will

2. Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)

3. Bottom of the flat pack-IC is fixed with glue

Page 5 of 51

to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)

4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)

With Iron Wire:

1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)

2. Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5.

3. While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig.S-1-5.

4. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)

5. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied.

2. Installation

1. Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily.

2. The “●” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.)

3. Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges.

2. Ground for Workbench

Page 6 of 51

Be sure to place a conductive sheet or copper plate with proper grounding (1 M∧) on the workbench or other surface, where the semi-conductors are to be placed. Because the static electricity charge on clothing will not escape through the body grounding band, be careful to avoid contacting semi-conductors with your clothing.

Instructions for Handling Semiconductors

Electrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electrostatic charge during unpacking or repair work.

1. Ground for Human Body

Be sure to wear a grounding band (1 M∧) that is properly grounded to remove any static electricity that may be charged on the body.

OPERATING CONTROLS AND FUNCTIONS

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Front Panel

Back Panel

Remote Control

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DISASSEMBLY INSTRUCTIONS

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1. Disassembly Flowchart

This flowchart indicates the disassembly steps to gain access to item(s) to be serviced. When reassembling, follow the steps in reverse order. Bend, route, and dress the cables as they were originally.

Top Cas e

Loader Main

Board

Standby

Board

Front Panel

Power

Board

Control

Board

Amplifier

Board

Jack Board

Page 10 of 51

2. Dismantling of top case

2-1. Ensure no disc in the tray and keep tray close, turn off the DVD player and then disconnect the mains supply.

Loosen 5 screws ”A” as shown in figure 2-1.

Figure 2-1.

2-2. Take off the top case as shown in figure 2-2.

Figure 2-2.

OPEN

3. Dismantling of control + standby board

Page 11 of 51

3-1. Release the lock “B” at the same time as shown figure 3-1.

PUSH PUSH

PUSH

Figure 3-1

3-2. Loosen 5 screws “C” as shown in figure 3-2.

Figure 3-2

4. Dismantling of loader

Page 12 of 51

4-1. Loosen 3 screws “D” as shown in figure 4-1.

Figure 4-1.

5. Dismantling of main board

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5-1. Loosen 5 screws as shown in figure 5-1.

Figure 5-1.

6. Dismantling of power board

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6-1. Loosen 2 screws “F” as shown in figure 6-1.

6-2. With a pincers to nip rubber nail “G” as shown in figure 6-1.

Figure 6-1

7. Dismantling of amplifier board

Page 15 of 51

7-1. Loosen 1 screw “H” as shown in figure 7-1.

Figure 7-1.

+ 38 hidden pages