Philips DS90C365 Service Manual

CHAPTER 7

PACKING METHODS

page

Introduction 7-2

Glossary of terms 7 - 2

Drypack for moisture sensitive SMDs 7 - 3

Survey of IC packing methods 7 - 5

Packing methods in exploded view 7 - 6

Packing quantities, box dimensions and carrier shapes 7 - 13

Philips Semiconductors IC packages

Packing methods Chapter 7

INTRODUCTION

The chapter contains a survey of the packing methods
most frequently used by Philips Semiconductors. It
includes information that may be important to customers
when making their purchasing decisions, for example the
main dimensions, shapes, and packing quantities.

Standardization

For semiconductors, packing serves two important
functions. The firstand most obvious function isprotection
duringstorageand transport to customers. This, ofcourse,
applies to all products, not just semiconductors.

The second is to act as a delivery medium for automatic
placement machines during equipment manufacture.

To do this effectively, the reels, trays and tubes that
components are packed in must meet recognized
standards.In this respect, PhilipsSemiconductors actively
cooperateswith standardization authorities throughout the
world.

In addition, its packing methods meet all major
international standards, including those of IEC
(International Electrotechnical Commission), JEDEC
(Joint Electron Device Engineering Council, USA) and
NEDA (National Electronic Distributor Association, USA).

Environmental care

Nowadays, an important issue is environmental impact.
Component and equipment manufacturers are
continuously working to improve the environment
friendliness of their products and packing, and have
devoted much effort to eliminating the use of toxic
materials and to looking at ways in which materials can be
recycled.

In these respects, Philips Semiconductors has taken
several important steps on the packing front. These
include:

• Reducingtheamountofpacking material by switching to
‘onepiece’boxes(insteadofboxeswithupperandlower
parts)

• Changing to ‘mono material’ to aid recycling.
For example, from aluminium-lined boxes to
carbon-coated boxes.

• Changing from white boxes to natural brown boxes to
eliminate the use of bleach (chlorine) in their
manufacture.

The aim is minimum waste and minimum environmental
impact. We have already gone a long way towards this in
the development of our packing methods. And future
developments will take us even further along this route.

For more information relating to environmental issues,
refer to Chapter 8 - Environmental data on ICs.

GLOSSARY OF TERMS

Through-hole mounted onto a PCB by insertion of leads into holes
Surface mount mounted on the surface of a PCB
Package container with terminals for an IC chip (also known as an envelope or outline)
Carrier plastic tube, tray or tape with cavities, which can contain semiconductor products
Packing method combination of a carrier and a box to protect products during transport and storage
Pin rigid plastic pin that closes a tube for DIPs by insertion through holes in its end
Plug flexible plastic plug that closes a tube for PLCCs or SILs by insertion into its end
Turnlock rigid plastic pin that closes a tube for SOs by insertion into its end and turning to lock in place
SPQ Smallest Packing Quantity, in one carrier
PQ Packing Quantity, in a box containing one or more SPQs

For a full definition ofIC package abbreviations and their suffixes, refer to

2000 May 11 7 - 2

Chapter 2 - IC Package range and dimensions

.

Philips Semiconductors IC packages

Packing methods Chapter 7

DRYPACK FOR MOISTURE SENSITIVE SMDs

If packed or stored incorrectly, moisture-sensitive plastic
SMDs can easily be damaged after a prolonged exposure
to the high temperatures associated with certain soldering
methods. If any moisture is present in the plastic package
during soldering, it may turn into steam and expand
rapidly. Under certain circumstances, the force exerted by
this expansion can cause internal delamination or, in the
most severe cases, may result in internal or external
package cracks (the popcorn effect). This effect is more
prominentwithinfrared and vapour-phase reflow soldering
methods when soldering temperatures can reach severe
levels.

To avoid this problem, and ensure trouble-free soldering,
we deliver moisture-sensitive ICs in a resealable
moisture-resistant plastic packing called a DRYPACK.

Moisture sensitivity level

Not all plastic packages are equally sensitive to moisture.
To differentiate between types, we assign each IC
package a moisturesensitivity level (MSL). The MSLof an
IC’s package is influenced by:

• chip area and size of the die-pad

• package body size

• package material properties

• moisture content of the package

• temperature and duration of the soldering process.

Determining MSL

We determine moisture sensitivity levels by testing
batches of each package according to a detailed
specification, which includes moisturizing and
infrared-reflowsoldering.Thissoldering method is used as
infrared radiation is readily absorbed by the black IC
packages and therefore is the most critical soldering
process when testing for the popcorn effect.

After moisturizing to predetermined levels, the packages
pass through an oven where they are first preheated, then
heated to a soldering temperature, and finally cooled. The
convection solder reflow requirements are given in
Table 1.

Although the profile has a low maximum temperature, the
packagesare exposed to 183 °Candabove for a relatively
long time. If this maximum temperature is higher than that
givenin Table 1, the effect ofsolderingwill be more severe
compared with the test on which the MSL ofthe specific IC
package is based. If, however, the package is soldered
well within its specified floor life limit (see Table 2), a
higher soldering temperature can be used as the
package’s moisture content will be much less.

Table 1 Convection solder reflow requirements

PROFILE PARAMETER REQUIREMENTS

Ramp-up rate (183 °C to peak) 3 K/s max.
Preheat temperature

(125 °C ± 25 °C)
Temperature maintained above

183 °C
Time within 5 °C of actual peak

temperature
Peak temperature range

Ramp down rate 6 K/s max.
Time from 25 °C to peak

temperature

Notes

1. Alltemperaturesrefertothe top side of thepackageas

measured on the centre of the plastic body surface.

2. Peak temperature requirements:

a) Packages with a thickness ≥ 2.5 mm and all BGA

packages: peak temp. 220 °C +5/ −0 °C.

b) Packages with a thickness < 2.5 mm and all with a

package volume ≥ 350mm3: peak temp. 220 °C
+5 /−0 °C.

c) Packages with a thickness < 2.5 mm and all with a

package volume < 350mm3: 235 °C +5/−0 °C.
(Packagevolume is defined asbody-height× width
× length, but excludes external leads and
non-integral heatsinks).

(2)

120 s max.

60 to 150 s

10 to 20 s

220 °C +5/−0 °C or
235 °C +5/−0 °C

6 minutes. max.

(1)

To reduce any moisture-related stresses within the
packages, they are first preheated to around 125 °C to
allow them to dry before they reach their maximum
temperature. The longer this preheating time, therefore,
thesmallerthe chance of packages being damagedduring
the high temperatures associated with soldering.

2000 May 11 7 - 3

Philips Semiconductors IC packages

Packing methods Chapter 7

Table 2 Floor life versus moisture sensitivity levels

MSL CONDITIONS FLOOR LIFE

130°C / 90% RH unlimited
230°C / 60% RH 1 year

2a 30 °C / 60% RH 4 weeks

330°C / 60% RH 168 hours
430°C / 60% RH 72 hours
530°C / 60% RH 48 hours

5a 30 °C / 60% RH 24 hours

(2)

6

Notes

1. Packages that are not sensitive to moisture do not
require DRYPACK.

2. MSL 6 packages must be baked before use, after
which they have a 6-hour floor life.

No problems are associated with wave soldering as the
components are only exposed to high temperatures for a
short time.

AllPhilipstestcentresperform these MSL investigations to
the same rigorous specification, and classify the moisture
sensitivity of packages into levels ranging from 1 (not
sensitive to moisture) to 6 (very sensitive to moisture).

In addition, and as part of our Reliability Monitoring
Program,we conduct regular stress testsonourSMDs. As
part of these tests, the packages are exposed to a
simulated moisturizing and soldering run to reproduce a
typical production process, then they are checked both
visuallyand electronically for anysignsof deterioration. As
a result, we guarantee that if the packages are stored
correctly, IC reliability will not be affected after soldering.

Philips DRYPACK

The Philips DRYPACK is a laminated plastic packing that
prevents the moisture content of the IC plastic packages
rising above 0.1% by weight for up to one year. The
DRYPACK must be stored at normal room temperature
(between 10 °C and 30 °C), and in an atmosphere of less
than 60% relative humidity (RH).

30 °C / 60% RH 6 hours

(1)

The DRYPACK contains a desiccant and a humidity
indicator, used to monitor the moisture content when the
bag is opened.

Using ICs from a DRYPACK

Before using ICs from a DRYPACK, it's essential that the
humidity indicator is checked. If it shows that the RH has
remained below 20% (the colour of the 20% dot is blue),
the ICs are ready for use.

As soon as the ICs are removed for the DRYPACK,
however, they are immediately exposed to moisture in the
atmosphere. To prevent them absorbing excessive
moisture, they must be soldered onto the PCB within the
specified floor life period given in Table 2. These times are
related to the MSL of the package.

If the humidity indicator in a DRYPACK shows an RH of
more than 20% (the colour of the 20% dot has changed
from blue to pink), the DRYPACK has been damaged,
opened, or stored incorrectly. To prevent the popcorn
effect in such a situation, the ICs that were in the
DRYPACK must first be dried before soldering.

For example, the minimum drying time to reduce the
moisture content of an IC package from an initial level of

0.3% by weight to around 0.05% by weight, is given by:
Drying time (hours) = 5 × package thickness (mm) at a

drying temperature of 125 °C ± 5 °C.
Note:Hightemperaturesmaydeterioratesolderability.Itis

strongly recommended to dry at a maximum 125 °C ±
5 °C, and not to dry longer than required.

Resealing a DRYPACK

If some ICs from an opened DRYPACK are not used, the
desiccant and the humidity indicator should be reinserted
intotheDRYPACK and the DRYPACK resealed withinhalf
an hour after opening using commercially available
heat-sealing equipment

The time aresealed DRYPACK can be storeddepends on
thetime since it wasoriginally packed, and howlong it was
open before being resealed.

2000 May 11 7 - 4

Philips Semiconductors IC packages

Packing methods Chapter 7

SURVEY OF IC PACKING METHODS

PACKAGE NAME

TUBE TAPE/REEL TRAY

BGA − XX
DBS X −−
DIP X −−
HBCC − XX
HBGA − XX
HDIP X −−
HLQFP − XX
HQFP − XX
HSOP X X −
HSQFP −−X
HTQFP − XX
HTSSOP X X −
LFBGA − XX
LQFP − XX
MSQFP −−X
PLCC X X −
PMFP − X −
QFP − XX
RBS X −−
SDIP X −−
SIL X −−
SMS X X −
SO X X −
SOJ X X −
SQFP −−X
SSOP X X −
TBS X −−
TFBGA − XX
TO − X −
TQFP − XX
TSSOP X X −
VSO X X −

CARRIER TYPE

2000 May 11 7 - 5

Philips Semiconductors IC packages

Packing methods Chapter 7

PACKING METHODS IN EXPLODED VIEW
Packing for DIP (tube/pin)

handbook, full pagewidth

Stacking method

Item
Box

Seal
Labels
Endstops
Tubes
Strap

Material
Cardboard carbon coated

Acrylate
Paper
Polyvinylchloride
Polyvinylchloride
Polypropylene

(1)

For DIP,row pitch 0.6"

Printed plano box

Endplug (white)

Stacked tubes

Endplug (green)

Product orientation in tube
(pin 1 towards this side,
this is label side of box)

Weight

145

0.2

1.65

5.6
840

0.7

(1)

(g)

Strap

Space for additional label

Preprinted Hyatt patent

Preprinted ESD warning

Barcode label

QA seal

Strap

Fig.1 Packing for DIP (tube/pin).

2000 May 11 7 - 6

MSC042

Philips Semiconductors IC packages

Packing methods Chapter 7

Packing for PLCC/SIL (tube/plug)

handbook, full pagewidth

Stacking method

Item
Box

Seal
Labels
Endstops
Tubes
Strap
Foam
Foam

Material
Cardboard carbon coated

Acrylate
Paper
Polyvinylchloride soft
Polyvinylchloride
Polypropylene
Polyethylene
Ethylenevinylacetate

Printed plano box

Endplug (white)

Foam (optional)

Stacked tubes

Product orientation in tube
(Pin 1 towards this side,
this is label side of box)

Weight
145

0.2

1.65
115
1190

0.7
9
1

(1)

For PLCC84

(1)

(g)

Strap

Space for additional label

Preprinted Hyatt patent

Preprinted ESD warning

Barcode label

QA seal

Strap

Fig.2 Packing for PLCC/SIL (tube/plug).

2000 May 11 7 - 7

Endplug (green)

MSC043

Philips Semiconductors IC packages

Packing methods Chapter 7

Packing for SO (tube/turnlock)

handbook, full pagewidth

Printed plano box

Turnlock (white)

Tube

Stacked tubes

Item
Box

Seal
Labels
Endstops
Tubes

Material
Cardboard carbon coated

Acrylate
Paper
Polyvinylchloride
Polyvinylchloride

(1)

For SO, row pitch 0.15"

or

Stacking method

Weight

61

0.2

1.65
4
164

(1)

(g)

Barcode label

Preprinted ESD warning

Space for additional label

QA seal

MSC044

Fig.3 Packing for SO (tube/turnlock).

Product orientation in tube
(pin 1 towards this side).

Turnlock (green)

2000 May 11 7 - 8

Philips Semiconductors IC packages

Packing methods Chapter 7

Packing for SO/PLCC/QFP (tape/reel)

handbook, full pagewidth

Cover tape

Carrier tape

Tape

Barcode label

Guard band

Item
Box

Reel
Cover tape
Carrier tape
Seals
Tape
Labels

Material
Cardboard carbon coated

Polystyrene
Polyester
Polystyrene
Acrylate
Paper

(1)

For SO large 8/16 pins

Weight
165

310
10
73

0.2

0.15

1.77Paper

(1)

(g)

Reel assembly

Printed plano box

Space for additional label

Preprinted ESD warning

Barcode label

MSC046

Fig.4 Packing for SO/PLCC/QFP (tape/reel).

2000 May 11 7 - 9

Preprinted Hyatt patent

Printed plano box

QA seal

Philips Semiconductors IC packages

Packing methods Chapter 7

Drypack for tube-packing

handbook, full pagewidth

Moisture caution print

Relative humidity indicator

Barcode label

Fill up plate

material

Stacking method

Dry-agent

Item
Box

Tubes
Endstops
Bag
Strap
Foam
Labels
Dry-Agent
Rel. Hum. Ind.

Material
Cardboard

Polyvinylchloride
Polyvinylchloride
Aluminium/Polyethylene/Polyolefine
Polypropylene
Polyethylene
Paper
Amorphous Silicic Acid
Paper+CoCl

2

(1)

For SO large, row pitch 0.3"

Bag

Turnlock (white)

Stacked tubes

Tube

Weight
112

724
10
38

0.6
2

2.8
88

1.15

(1)

(g)

ESD print

Drypack ID sticker

Space for additional label

Preprinted Hyatt patent

Preprinted ESD warning

Barcode label

QA seal

Fig.5 Drypack for tube-packing.

2000 May 11 7 - 10

Product orientation in tube
(Pin 1 towards this side,
this is label side of box)

Turnlock (green)

Printed plano box

Strap

MSC045

Philips Semiconductors IC packages

Packing methods Chapter 7

Drypack for tape/reel-packing

handbook, full pagewidth

Barcode label

Moisture caution

Barcode label

Bag

ESD print

print

Tape

Guard band

Item
Box

Reel
Cover tape
Carrier tape
Seals
Tape
Labels
Bag
Dry-Agent
Rel. Hum. Ind.

Material
Cardboard

Polystyrene
Polyester
Polystyrene
Acrylate
Paper
Paper
Aluminium/Polyethylene/Polyolefine
Amorphous Silicic Acid
Paper+CoCl

2

(1)

For TSSOP24, for example

Weight

203
288
16
177

0.2

0.15

3.66
94
88

1.15

(1)

(g)

Dry-agent

Relative humidity
indicator

ESD embossed

Reel assembly

Printed plano box

Cover tape

Carrier tape

MSC047

Fig.6 Drypack for tape/reel-packing.

2000 May 11 7 - 11

Space for additional
label

Preprinted ESD
warning

Barcode label

Drypack ID sticker

Preprinted Hyatt patent

Printed plano box

QA seal