Philips FB2031BB, CD3206BB Datasheet

INTEGRATED CIRCUITS

FB2031

9-bit latched/registered/pass-thru Futurebus+ transceiver

Product specification IC19 Data Handbook

 

1995 May 25

Philips Semiconductors Product specification

FB20319-bit latched/registered/pass-thru Futurebus+ transceiver

FEA TURES

•Latched, registered or straight through in

either A to B or B to A path

•Drives heavily loaded backplanes with

equivalent load impedances down to 10Ω.

•High drive 100mA BTL open collector

drivers on B-port

•Allows incident wave switching in heavily

loaded backplane buses

•Reduced BTL voltage swing produces less

noise and reduces power consumption

•Built-in precision band-gap reference

provides accurate receiver thresholds and improved noise immunity

•Compatible with IEEE Futurebus+ or

proprietary BTL backplanes

•Each BTL driver has a dedicated Bus GND

for a signal return

•Controlled output ramp and multiple GND

pins minimize ground bounce

•Glitch-free power up/power down operation

•Low I

current

•Tight output skew

•Supports live insertion

QUICK REFERENCE DATA

SYMBOL PARAMETER TYPICAL UNIT

PLH

PHL

PLH

PHL

C I

Propagation delay An to Bn

Propagation delay Bn to An

2.7 ns

4.4

4.2 Output capacitance (B0 – Bn only) 6 pF Output current (B0 – Bn only) 100 mA

Supply current

AIn to Bn (outputs Low or High)

Bn to AOn (outputs Low) 50 mA

17 mA

Bn to AOn (outputs High) 25

ORDERING INFORMATION

PACKAGE

COMMERCIAL RANGE

VCC = 5V±10%; T

= 0°C to +70°C

amb

VCC = 5V±10%; T

52-pin Plastic Quad Flat Pack (QFP) FB2031BB CD3206BB SOT379-1

INDUSTRIAL RANGE

= –40°C to +85°C

amb

DRAWING

NUMBER

PIN CONFIGURATION

LOGIC GND

52 51 50 49 48 47 46 45 44 43 42 41 40

1 2

3 4

9-Bit latched/registered transceiver

5 6

7 8

9 10 11

12 13

14 15 16 17 18 19 20 21 22 23 24 25 26

SEL1

LCBA

OEA

BIAS V

OEB0

FB2031

52-lead PQFP

BG V

LCAB

SEL0

BG GND

TCK (option)

OEB1

TDI (option)

TDO (option)

TMS (option)

BUS GND

39 38 37 36 35

34 33 32 31 30 29 28 27

BUS GND

BUS GND B1 BUS GND B2 BUS GND B3 BUS GND B4 BUS GND B5 BUS GND B6 BUS GND

SG00060

1995 May 25 853-1714 15279

Philips Semiconductors Product specification

FB20319-bit latched/registered/pass-thru Futurebus+ transceiver

DESCRIPTION

The FB2031 is a 9-bit latched/registered transceiver featuring a latched, registered or pass-thru mode in either the A-to-B or B-to-A direction. The FB2031 is intended to provide the electrical interface to a high performance wired-OR bus.

The TTL-level side (A port) has a common I/O. The common I/O, open collector B port operates at BTL signal levels. The logic element for data flow in each direction is controlled by two mode select inputs (SEL0 and SEL1). A “00” configures latches in both directions. A “10” configures thru mode in both directions. A “01” configures register mode in both directions. A “11” configures register mode in the A-to-B direction and latch mode in the B-to-A direction.

When configured in the buffer mode, the inverse of the input data appears at the output port. In the register mode, data is stored on the rising edge of the appropriate clock input (LCAB or LCBA). In the latch mode, clock pins serve as transparent-Low latch enables. Regardless of the mode, data is inverted from input to output.

The 3-State A port is enabled by asserting a High level on OEA. The B port has two output enables, OEB0 and OEB1 is High and OEB1 enabled.

. Only when OEB0

is Low is the output

When either OEB0 is Low or OEB1 the B port is inactive and is pulled to the level of the pullup voltage. New data can be entered in the register and latched modes or can be retained while the associated outputs are in 3-State (A port) or inactive (B port).

The B-port drivers are Low-capacitance open collectors with controlled ramp and are designed to sink 100mA. Precision band gap references on the B-port insure very good noise margins by limiting the switching threshold to a narrow region centered at

1.55V. The B-port interfaces to “Backplane

Transceiver Logic” (see the IEEE 1194.1 BTL standard). BTL features low power consumption by reducing voltage swing (1V p-p, between 1V and 2V) and reduced capacitive loading by placing an internal series diode on the drivers. BTL also provides incident wave switching, a necessity for high performance backplanes.

Output clamps are provided on the BTL outputs to further reduce switching noise. The “V effects during a Low-to-High transition. The “V clamp, the “trapped reflection” clamp, clamps out ringing below the BTL 0.5V V This clamp remains active for approximately 100ns after a High-to-Low transition.

” clamp reduces inductive ringing

” clamp is always active. The other

is High,

level.

To support live insertion, OEB0 is held Low during power on/off cycles to insure glitchfree B port drivers. Proper bias for B port drivers during live insertion is provided by the BIAS V pin when at a 5V level while V Low. The BIAS V pin is a low current input which will reverse-bias the BTL driver series Schottky diode, and also bias the B port output pins to a voltage between 1.62V and

2.1V. This bias function is in accordance with IEEE BTL Standard 1194.1. If live insertion is not a requirement, the BIAS V pin should be tied to a V

The LOGIC GND and BUS GND pins are isolated inside the package to minimize noise coupling between the BTL and TTL sides. These pins should be tied to a common ground external to the package.

Each BTL driver has an associated BUS GND pin that acts as a signal return path and these BUS GND pins are internally isolated from each other. In the event of a ground return fault, a “hard” signal failure occurs instead of a pattern dependent error that may be infrequent and impossible to troubleshoot.

As with any high power device, thermal considerations are critical. It is recommended that airflow (300Ifpm) and/or thermal mounting be used to ensure proper junction temperature.

pin.

P ACKAGE THERMAL CHARACTERISTICS

PARAMETER CONDITION 52-PIN PLASTIC QFP

θja Still air 80°C/W θja 300 Linear feet per minute air flow 58°C/W θjc Thermally mounted on one side to heat sink 20°C/W

PIN DESCRIPTION

SYMBOL PIN NUMBER TYPE NAME AND FUNCTION

A0 – A8 50, 52, 2, 4, 6, 8, 10, 12, 14 I/O BiCMOS data inputs/3-State outputs (TTL) B0 – B8

OEB0 46 Input Enables the B outputs when High OEB1 45 Input Enables the B outputs when Low

OEA 47 Input Enables the A outputs when High

BUS GND

LOGIC GND 51, 1, 3, 5, 7, 9, 11, 13 GND Logic ground (0V)

BIAS V 48 Power Live insertion pre-bias pin

BG V

BG GND 19 GND Band Gap threshold voltage reference ground

SEL0 20 Input Mode select

SEL1 15 Input Mode select LCAB 18 Input A to B clock/latch enable (transparent latch when Low) LCBA 16 Input B to A clock/latch enable (transparent latch when Low)

TMS 42 Input Test Mode Select (optional, if not implemented then no connect)

TCK 44 Input Test Clock (optional, if not implemented then no connect)

TDI 22 Input Test Data In (optional, if not implemented then no connect)

TDO 21 Output Test Data Out (optional, if not implemented then shorted to TDI)

40, 38, 36, 34, 32,

30, 28, 26, 24

25, 27, 29, 31, 33,

35, 37, 39, 41

23, 43, 49 Power Positive supply voltage

17 Power Band Gap threshold voltage reference

I/O Data inputs/Open Collector outputs, High current drive (BTL)

GND Bus ground (0V)

1995 May 25

Philips Semiconductors Product specification

MODE

An to Bn thru mode

An to Bn transparent latch

An to Bn latch and read

An to Bn register

Bn to An thru mode

Bn to An transparent latch

Bn to An latch and read

Bn to An register

Disable Bn outputs

Latch mode (Bn to An)

FB20319-bit latched/registered/pass-thru Futurebus+ transceiver

FUNCTION TABLE

INPUTS OUTPUTS

An Bn* OEB0 OEB1 OEA LCAB LCBA SEL0 SEL1 An Bn

L — H L L X X H L input H**

H — H L L X X H L input L

Bn outputs latched and read (preconditioned latch)

An outputs latched and read (preconditioned latch)

Disable An outputs X X X X L X X X X Z X

L — H L L L X L L input H**

H — H L L L X L L input L

l — H L L ↑ X L L input H**

h — H L L ↑ X L L input L

data

latched

data

X — H L X H X L L X

l — H L L ↑ X X H input H**

h — H L L ↑ X X H input L — L Disable H X X H L H input — H Disable H X X H L L input — L Disable H X L L L H input — H Disable H X L L L L input — L Disable H X L H H H input — H Disable H X L H H L input — l Disable H X ↑ L L H input — h Disable H X ↑ L L L input — l Disable H X ↑ H H H input — h Disable H X ↑ H H L input

— X X X H X H L L

— X X X H X H H H — l Disable H X ↑ L H H input

— h Disable H X ↑ L H L input

X X L X X X X X X X H** X X X H X X X X X X H**

latched

FUNCTION SELECT TABLE

NOTES:

H = High voltage level L = Low voltage level l = Low voltage level one set-up time prior to the Low-to-High LCXX transition h = High voltage level one set-up time prior to the Low-to-High LCXX transition

1995 May 25

MODE SELECTED SEL0 SEL1

Thru mode H L Register mode (An to Bn) X H Latch mode (An to Bn) L L Register mode (Bn to An) L H

L L

H H

X = Don’t care Z = High-impedance (OFF) state — = Input not externally driven ↑ = Low-to-High transition H** = Goes to level of pull-up voltage

* = Precaution should be taken to ensure B inputs do not float. If they do, they are equal to Low state. Disable = OEB0 is Low or OEB1

is High.

Philips Semiconductors Product specification

FB20319-bit latched/registered/pass-thru Futurebus+ transceiver

LOGIC DIAGRAM

OEB0

OEB1

OEA

DQ E DQ

Clk

MUX

A ⇒ B

TTL

MUX

A ⇐ B

DQ E

Clk

DQ E

DQ Clk

DQ E DQ Clk

MUX

A ⇒ B

MUX

A ⇐ B

MUX

A ⇒ B

MUX

A ⇐ B

MUX

A ⇒ B

Clk

DQ E

Clk

DQ E

Clk

BTL

1995 May 25

LCAB

SEL0 SEL1

LCBA

TMS TCK

TDI

TDO

20 15

(JTAG Boundary Scan pins)

44 22 21

Decode

OutIn

MUX

A ⇐ B

DQ E

Clk

LOGIC GND = 1, 3, 5, 7, 9, 11, 13, 51 BUS GND = 25, 27, 29, 31, 33, 35, 37, 39, 41 BIAS V = 48

BG V BG GND = 19

= 23, 43, 49 =17

SG00061

Philips Semiconductors Product specification

FB20319-bit latched/registered/pass-thru Futurebus+ transceiver

ABSOLUTE MAXIMUM RATINGS

Operation beyond the limits set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the operating free-air temperature range.

SYMBOL

OUT

STG

Supply voltage -0.5 to +7.0 V Input voltage All inputs except B0 – B8 -1.2 to +7.0 V

Input current -40 to +5.0 mA Voltage applied to output in High output state -0.5 to +V Current applied to output in Low output state A0 – A8 48 mA

Storage temperature -65 to +150 °C

RECOMMENDED OPERATING CONDITIONS (Industrial)

SYMBOL PARAMETER LIMITS UNIT

C T

amb

Supply voltage 4.5 5.0 5.5 V High-level input voltage Except B0–B8 2.0 V

Low-level input voltage Except B0 – B8 0.8 V

Input clamp current Control inputs -40 mA

High-level output current A0 – A8 -3 mA Low-level output current A0 – A8 24 mA

Off device input current Except B0 – B8,

Output capacitance of B port 6 7 pF Operating free-air temperature range –40 +85 °C

PARAMETER RATING UNIT

B0 – B8 -1.2 to +3.5

B0 – B8 200

MIN TYP MAX

B0 – B8 1.62 1.55

B0 – B8 1.47

B0 – B8 & A0 – A8 -18

B0 – B8 100

100 µA

VI = 0 to 5.5V, VCC = 0V

RECOMMENDED OPERATING CONDITIONS (Commercial)

SYMBOL PARAMETER LIMITS UNIT

MIN TYP MAX

amb

1995 May 25

Supply voltage 4.5 5.0 5.5 V High-level input voltage Except B0–B8 2.0 V

B0 – B8 1.62 1.55

Low-level input voltage Except B0 – B8 0.8 V

B0 – B8 1.47

Input clamp current Control inputs -40 mA

B0 – B8 & A0 – A8 -18 High-level output current A0 – A8 -3 mA Low-level output current A0 – A8 24 mA

B0 – B8 100 Off device input current Except B0 – B8,

100 µA

VI = 0 to 5.5V, VCC = 0V Output capacitance of B port 6 7 pF Operating free-air temperature range 0 +70 °C

+ 12 hidden pages