Philips BFG425W Datasheet

DISCRETE SEMICONDUCTORS
BFG425W
NPN 25 GHz wideband transistor
Product specification Supersedes data of 1997 Oct 28 File under Discrete Semiconductors, SC14
1998 Mar 11
NPN 25 GHz wideband transistor BFG425W
FEATURES
Very high power gain
Low noise figure
High transition frequency
Emitter is thermal lead
Low feedback capacitance.
APPLICATIONS
RF front end
Wideband applications, e.g. analog and digital cellular
telephones, cordless telephones (PHS, DECT, etc.)
Radar detectors
Pagers
Satellite television tuners (SATV)
High frequency oscillators.
DESCRIPTION
NPN double polysilicon wideband transistor with buried layer for low voltage applications in a plastic, 4-pin dual-emitter SOT343R package.
PINNING
PIN DESCRIPTION
1 emitter 2 base 3 emitter 4 collector
handbook, halfpage
Marking code: P5.
43
21
Top view
MSB842
Fig.1 Simplified outline SOT343R.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CBO
V
CEO
I
C
P
tot
h
FE
C
re
f
T
G
max
F noise figure I
collector-base voltage open emitter −−10 V collector-emitter voltage open base −−4.5 V collector current (DC) 25 30 mA total power dissipation Ts≤ 103 °C −−135 mW DC current gain IC= 25 mA; VCE=2V; Tj=25°C 5080120 feedback capacitance IC= 0; VCB= 2 V; f = 1 MHz 95 fF transition frequency IC= 25 mA; VCE= 2 V; f = 2 GHz; T maximum power gain IC= 25 mA; VCE= 2 V; f = 2 GHz; T
= 2 mA; VCE= 2 V; f = 2 GHz; ΓS= Γ
C
=25°C 25 GHz
amb
=25°C 20 dB
amb
opt
1.2 dB
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
1998 Mar 11 2
NPN 25 GHz wideband transistor BFG425W
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
P
tot
T
stg
T
j
Note
1. T
s
THERMAL CHARACTERISTICS
collector-base voltage open emitter 10 V collector-emitter voltage open base 4.5 V emitter-base voltage open collector 1V collector current (DC) 30 mA total power dissipation Ts≤ 103 °C; note 1; see Fig.2 135 mW storage temperature 65 +150 °C operating junction temperature 150 °C
is the temperature at the soldering point of the emitter pins.
SYMBOL PARAMETER VALUE UNIT
R
th j-s
handbook, halfpage
P
tot
(mW)
thermal resistance from junction to soldering point 350 K/W
200
150
100
50
0
0 40 160
80 120
MGG681
Ts (°C)
Fig.2 Power derating curve.
1998 Mar 11 3
NPN 25 GHz wideband transistor BFG425W
CHARACTERISTICS
T
=25°C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CBO
h
FE
C
c
C
e
C
re
f
T
G
max
S
21
F noise figure I
P
L1
ITO third order intercept point I
collector-base breakdown voltage IC= 2.5 µA; IE=0 10 −−V collector-emitter breakdown voltage IC= 1 mA; IB= 0 4.5 −−V emitter-base breakdown voltage IE= 2.5 µA; IC=0 1 −−V collector-base leakage current IE= 0; VCB= 4.5 V −−15 nA DC current gain IC= 25 mA; VCE= 2 V; see Fig.3 50 80 120 collector capacitance IE=ie= 0; VCB= 2 V; f = 1 MHz 300 fF emitter capacitance IC=ic= 0; VEB= 0.5 V; f = 1 MHz 575 fF feedback capacitance IC= 0; VCB= 2 V; f = 1 MHz;
95 fF
see Fig.4
transition frequency IC= 25 mA; VCE= 2 V; f = 2 GHz;
T
=25°C; see Fig.5
amb
maximum power gain; note 1 IC= 25 mA; VCE= 2 V; f = 2 GHz;
T
=25°C; see Figs 7 and 8
amb
insertion power gain I
2
output power at 1 dB gain compression
= 25 mA; VCE= 2 V; f = 2 GHz;
C
T
=25°C; see Fig.8
amb
= 2 mA; VCE= 2 V; f = 900 MHz;
C
ΓS= Γ
I
C
ΓS= Γ
; see Fig.13
opt
= 2 mA; VCE= 2 V; f = 2 GHz;
; see Fig.13
opt
IC= 25 mA; VCE= 2 V; f = 2 GHz; ZS=Z
= 25 mA; VCE= 2 V; f = 2 GHz;
C
ZS=Z
S opt
S opt
; ZL=Z
; ZL=Z
L opt
L opt
; note 2
; note 2
25 GHz
20 dB
17 dB
0.8 dB
1.2 dB
12 dBm
22 dBm
Notes
1. G
is the maximum power gain, if K > 1. If K < 1 then G
max
2. ZS is optimized for noise; ZL is optimized for gain.
1998 Mar 11 4
= MSG; see Figs 6, 7 and 8.
max
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