Philips BF1202WR, BF1202R, BF1202 Datasheet

DISCRETE SEMICONDUCTORS
DATA SHEET
BF1202; BF1202R; BF1202WR
N-channel dual-gate PoLo MOS-FETs
Preliminary specification 1999 Nov 26
Philips Semiconductors Preliminary specification
FEATURES
Short channel transistor with high
forward transfer admittance to input capacitance ratio
Low noise gain controlled amplifier
Partly internal self-biasing circuit to
ensure good cross-modulation performance during AGC and good DC stabilization.
APPLICATIONS
VHF and UHF applications with
3 - 9 V supply voltage, such as digital and analogue television tuners and professional communications equipment.
DESCRIPTION
PINNING
PIN DESCRIPTION
1 source 2drain 3 gate 2 4 gate 1
handbook, 2 columns
BF1202; BF1202R;
BF1202WR
handbook, 2 columns
Top view MSB035
BF1202R marking code: LEp
Fig.2 Simplified outline
(SOT143R).
34
book, halfpage
43
12
43
Enhancement type N-channel field-effect transistor with source and substrate interconnected. Integrated diodes between gates and source
12
Top view MSB014
21
Top view MSB842
protect against excessive input voltage surges. The BF1202,
BF1202 marking code: LDp
BF1202WR marking code: LE
BF1202R and BF1202WR are encapsulated in the SOT143B, SOT143R and SOT343R plastic
Fig.1 Simplified outline
(SOT143B).
Fig.3 Simplified outline
(SOT343R).
packages respectively.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
DS
I
D
P
tot
y
forward transfer admittance 25 30 40 mS
fs
C
ig1-ss
C
rss
drain-source voltage −−10 V drain current −−30 mA total power dissipation −−200 mW
input capacitance at gate 1 1.7 2.2 pF reverse transfer capacitance f = 1 MHz 15 30 fF
F noise figure f = 800 MHz 1.0 1.8 dB X
mod
cross-modulation input level for k = 1% at
100 105 dBµV
40 dB AGC
T
j
operating junction temperature −−150 °C
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
1999 Nov 26 2
Philips Semiconductors Preliminary specification
Fig.4 Power derating curve.
N-channel dual-gate PoLo MOS-FETs
BF1202; BF1202R;
BF1202WR
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
I
D
I
G1
I
G2
P
tot
T
stg
T
j
Note
1. T
s
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-s
drain-source voltage 10 V drain current 30 mA gate 1 current −±10 mA gate 2 current −±10 mA total power dissipation Ts≤ 110 °C; note 1 200 mW storage temperature −65 +150 °C operating junction temperature +150 °C
is the temperature of the soldering point of the source lead.
thermal resistance from junction to soldering point 200 K/W
250
P
tot
(mW)
200
150
100
50
0
0 50 100 150 200
T
(°C)
s
1999 Nov 26 3
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