![](/html/1a/1aea/1aea9d8d2e66111c1a04b7ee89142452bf9906e0d2cbfd4012b19ac5a1f5dbca/bg1.png)
DISCRETE SEMICONDUCTORS
DATA SH EET
handbook, halfpage
M3D087
BDP32
PNP medium power transistor
Product specification
Supersedes data of 1997 Mar 10
1999 Apr 23
![](/html/1a/1aea/1aea9d8d2e66111c1a04b7ee89142452bf9906e0d2cbfd4012b19ac5a1f5dbca/bg2.png)
Philips Semiconductors Product specification
PNP medium power transistor BDP32
FEATURES
• High current (max. 3 A)
• Low voltage (max. 45 V).
PINNING
PIN DESCRIPTION
1 base
2,4 collector
APPLICATIONS
3 emitter
• General purpose medium power applications.
DESCRIPTION
handbook, halfpage
4
2, 4
PNP medium power transistor in a SOT223 plastic
package. NPN complement: BDP31.
123
Top view
1
3
MAM288
Fig.1 Simplified outline (SOT223) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
T
stg
T
j
T
amb
collector-base voltage open emitter −−45 V
collector-emitter voltage open base −−45 V
emitter-base voltage open collector −−5V
collector current (DC) −−3A
peak collector current −−6A
peak base current −−0.5 A
total power dissipation T
≤ 25 °C; note 1 − 1.35 W
amb
storage temperature −65 +150 °C
junction temperature − 150 °C
operating ambient temperature −65 +150 °C
Note
1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm
For other mounting conditions, see
Handbook”
.
“Thermal considerations for the SOT223 in the General Part of associated
1999 Apr 23 2
2
.
![](/html/1a/1aea/1aea9d8d2e66111c1a04b7ee89142452bf9906e0d2cbfd4012b19ac5a1f5dbca/bg3.png)
Philips Semiconductors Product specification
PNP medium power transistor BDP32
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
R
th j-s
Note
1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see
Handbook”
CHARACTERISTICS
=25°C unless otherwise specified.
T
amb
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
CBO
I
EBO
h
FE
V
CEsat
V
BEsat
f
T
thermal resistance from junction to ambient note 1 91 K/W
thermal resistance from junction to soldering point 10 K/W
“Thermal considerations for the SOT223 in the General Part of associated
.
collector cut-off current IE= 0; VCB= −40 V −−50 nA
= 0; VCB= −40 V; Tj= 150 °C −−10 µA
I
E
emitter cut-off current IC= 0; VEB= −5V −−50 nA
DC current gain IC= −0.5 A; VCE= −12 V; note 1; see Fig.2 40 −
I
= −2 A; VCE= −1 V; note 1; see Fig.2 20 −
C
collector-emitter saturation
voltage
IC= −500 mA; IB= −50 mA; note 1 −−300 mV
I
= −2 A; IB= −200 mA; note 1 −−700 mV
C
base-emitter saturation voltage IC= −500 mA; IB= −50 mA; note 1 −−1.2 V
I
= −2 A; IB= −200 mA; note 1 −−1.5 V
C
transition frequency VCE= −5 V; IC= −250 mA; f = 100 MHz 60 − MHz
Note
1. Pulse test: t
≤ 300 µs; δ≤0.02.
p
1999 Apr 23 3