INTEGRATED CIRCUITS
74ABT2240
Octal inverting buffer with 30Ω series termination resistors (3-State)
Product specification
1998 Jan 16
Supersedes data of 1996 Oct 08 IC23 Data Handbook
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Philips Semiconductors |
Product specification |
Octal inverting buffer with 30Ω series termination
74ABT2240
resistors (3-State)
FEATURES
•Octal bus interface
•3-State buffers
•Live insertion/extraction permitted
•Outputs include series resistance of 30Ω, making external termination resistors unnecessary
•Output capability: +12mA/±32mA
•Latch-up protection exceeds 500mA per Jedec Std 17
•ESD protection exceeds 2000 V per MIL STD 883 Method 3015 and 200 V per Machine Model
•Power-up 3-State
•Same part as 74ABT240-1
QUICK REFERENCE DATA
DESCRIPTION
The 74ABT2240 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed.
The 74ABT2240 device is an octal inverting buffer that is ideal for driving bus lines. The device features two Output Enables (1OE, 2OE), each controlling four of the 3-State outputs.
The 74ABT2240 is designed with 30Ω series resistance in both the
High and Low states of the output. This design reduces line noise in applications such as memory address drivers, clock drivers and bus receivers/transmitters.
The 74ABT2240 is the same as the 74ABT240-1. The part number has been changed to reflect industry standards.
SYMBOL |
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PARAMETER |
CONDITIONS |
TYPICAL |
UNIT |
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Tamb = 25°C; GND = 0V |
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tPLH |
Propagation delay |
CL = 50pF; VCC = 5V |
2.8 |
ns |
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tPHL |
An to Yn |
4.3 |
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CIN |
Input capacitance |
VI = 0V or VCC |
3 |
pF |
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COUT |
Output capacitance |
Outputs disabled; VO = 0V or VCC |
7 |
pF |
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ICCZ |
Total supply current |
Outputs disabled; VCC = 5.5V |
50 |
μA |
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ORDERING INFORMATION
PACKAGES |
TEMPERATURE RANGE |
OUTSIDE NORTH AMERICA |
NORTH AMERICA |
DWG NUMBER |
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20-Pin Plastic DIP |
±40°C to +85°C |
74ABT2240 N |
74ABT2240 N |
SOT146-1 |
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20-Pin plastic SO |
±40°C to +85°C |
74ABT2240 D |
74ABT2240 D |
SOT163-1 |
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20-Pin Plastic SSOP Type II |
±40°C to +85°C |
74ABT2240 DB |
74ABT2240 DB |
SOT339-1 |
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20-Pin Plastic TSSOP Type I |
±40°C to +85°C |
74ABT2240 PW |
7ABT2240PW DH |
SOT360-1 |
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PIN CONFIGURATION |
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PIN DESCRIPTION |
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PIN NUMBER |
SYMBOL |
NAME AND FUNCTION |
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2, 4, 6, 8 |
1A0 ± 1A3 |
Data inputs |
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20 |
VCC |
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1OE |
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1 |
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11, 13, 15, 17 |
2A0 ± 2A3 |
Data inputs |
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1A0 |
2 |
19 |
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2OE |
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18, 16, 14, 12 |
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1Y0 ± 1Y3 |
Data outputs |
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2Y0 |
3 |
18 |
1Y0 |
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9, 7, 5, 3 |
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Data outputs |
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1A1 |
4 |
17 |
2A0 |
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2Y0 ± 2Y3 |
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5 |
16 |
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2Y1 |
1Y1 |
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1, 19 |
1OE, 2OE |
Output enables |
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1A2 |
6 |
15 |
2A1 |
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10 |
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GND |
Ground (0V) |
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7 |
14 |
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2Y2 |
1Y2 |
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20 |
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VCC |
Positive supply voltage |
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1A3 |
8 |
13 |
2A2 |
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9 |
12 |
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2Y3 |
1Y3 |
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GND |
10 |
11 |
2A3 |
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SA00034 |
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1998 Jan 16 |
2 |
853-1626 18865 |
Philips Semiconductors |
Product specification |
Octal inverting buffer with 30Ω series termination
74ABT2240
resistors (3-State)
LOGIC SYMBOL
2 |
1A0 |
1Y0 |
18 |
4 |
1A1 |
1Y1 |
16 |
6 |
1A2 |
1Y2 |
14 |
8 |
1A3 |
1Y3 |
12 |
1 |
1OE |
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17 |
2A0 |
2Y0 |
3 |
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15 |
2A1 |
2Y1 |
5 |
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13 |
2A2 |
2Y2 |
7 |
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11 |
2A3 |
2Y3 |
9 |
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19 |
2OE |
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SA00035
LOGIC SYMBOL (IEE/IEC)
1 |
EN |
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2 |
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18 |
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4 |
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16 |
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6 |
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14 |
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8 |
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12 |
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19 |
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EN |
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17 |
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3 |
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15 |
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5 |
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13 |
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7 |
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11 |
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9 |
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FUNCTION TABLE
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INPUTS |
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OUTPUTS |
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1An |
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2An |
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1OE |
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2OE |
1Yn |
2Yn |
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L |
L |
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L |
L |
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H |
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H |
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L |
H |
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L |
H |
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L |
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L |
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H |
X |
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H |
X |
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Z |
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Z |
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H |
= High voltage level |
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L |
= Low voltage level |
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X |
= Don't care |
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Z |
= High impedance ºoffº state |
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SCHEMATIC OF EACH OUTPUT
VCC
OUTPUT
GND
SA00030
SA00036
ABSOLUTE MAXIMUM RATINGS1, 2
SYMBOL |
PARAMETER |
CONDITIONS |
RATING |
UNIT |
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VCC |
DC supply voltage |
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±0.5 to +7.0 |
V |
IIK |
DC input diode current |
VI < 0 |
±18 |
mA |
VI |
DC input voltage3 |
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±1.2 to +7.0 |
V |
IOK |
DC output diode current |
VO < 0 |
±50 |
mA |
V |
DC output voltage3 |
output in Off or High state |
±0.5 to +5.5 |
V |
OUT |
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IOUT |
DC output current |
output in Low state |
128 |
mA |
Tstg |
Storage temperature range |
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±65 to 150 |
°C |
NOTES:
1.Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under ªrecommended operating conditionsº is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2.The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3.The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 Jan 16 |
3 |
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