Panasonic TY-FB9TU Service Manual

ORDER NO.ITD0604018CE

D10 Canada: B07

U/V Tuner Board with MATE I/F Board

TY-FB9TU

Specification

Channel Capability-181 VHF-12: UHF-56: Cable-125 Connection Terminals

AV INPUT VIDEO (RCA PIN JACK TYPE) 1.0 Vp-p (75 W)

S VIDEO (Mini DIN 4-pin) Y: 1.0 Vp-p (75 W), C: 0.286 Vp-p (75 W) AUDIO L-R (RCA PIN JACK TYPE) 0.5 Vrms

AV OUTPUT Video (RCA PIN JACK TYPE) 1.0 Vp-p (75 W)

*Cannot output UHF/VHF signals. AUDIO L-R (M3 JACK TYPE) 0.5 Vrms

Digital interface port

(MATE)

Remote Control Model No. N2QAFB000003 Mass (weight) approx. 160 g (5.6 oz) (including batteries) Operating range approx. 7 m (23 feet) directly in front of the unit

RJ-11C

CONTENTS

Page Page

1 Safety Precautions 3

1.1. General Guidelines

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

3 About lead free solder (PbF)

4 5

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4 Installation 6 5 Antenna connection 6 Connection of external equipment 7 Circuit Board Layout

7.1. HMB-Board

8 Block and Schematic Diagram

8.1. Schematic Diagram Notes

8.2. HMB-Board Block Diagram

8.3. HMB-Board (1 of 4) Schematic Diagram

8.4. HMB-Board (2 of 4) Schematic Diagram

7 8 9

11 12 13

8.5. HMB-Board (3 of 4) Schematic Diagram

8.6. HMB-Board (4 of 4) Schematic Diagram

9 Replacement Parts List

9.1. Replacement Parts List Notes

9.2. Electrical Replacement Parts List

9.3. Mechanical Replacement Parts List

9.4. Parts Location (1)

9.5. Parts Location (2)

14 15 16

17 18 22 23 24

1 Safety Precautions

1.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MW and 5.2MW.

When the exposed metal does not have a return path to the chassis, the reading must be

TY-FB9TU

Figure 1

1.1.2. Leakage Current Hot Check (See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

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2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES)Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" componen ts. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such asthe brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

3 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

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PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

Caution

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.

· ·

Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

· ·

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto

· ·

the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

stamped on the back of PCB.

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4 Installation

5 Antenna connection

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6 Connection of external equipment

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