Panasonic TX-P42ST30B Schematic

ORDER NO.PCZ1104069CE

Plasma Television

Model No. TX-P42ST30B

GPF14D-E Chassis

TABLE OF CONTENTS

PAG E PAG E

1 Safety Precautions -----------------------------------------------3

1.1. General Guidelines ----------------------------------------3

1.2. Touch-Current Check--------------------------------------3

2Warning--------------------------------------------------------------4

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices ----------4

2.2. About lead free solder (PbF) ----------------------------5

3 Service Navigation------------------------------------------------6

3.1. PCB Layout --------------------------------------------------6

3.2. Applicable signals ------------------------------------------7

4 Specifications ------------------------------------------------------8 5 Technical Descriptions------------------------------------------9

5.1. Specification of KEY for CI Plus, DTCP-IP, WIDEVINE and One-to-One ----------------------------9

6 Service Mode ----------------------------------------------------- 10

6.1. How to enter into Service Mode ---------------------- 10

6.2. Option - Mirror--------------------------------------------- 12

6.3. Service tool mode ---------------------------------------- 12

6.4. Hotel mode------------------------------------------------- 13

6.5. Data Copy by SD Card --------------------------------- 14

7 Troubleshooting Guide---------------------------------------- 17

7.1. Check of the IIC bus lines------------------------------ 17

7.2. Power LED Blinking timing chart --------------------- 18

7.3. No Power--------------------------------------------------- 18

7.4. No Picture -------------------------------------------------- 19

7.5. Local screen failure -------------------------------------- 20

8 Disassembly and Assembly Instructions --------------- 21

8.1. Remove the Rear cover -------------------------------- 21

8.2. Remove the AC inlet ------------------------------------ 21

8.3. Remove the P-Board ------------------------------------ 21

8.4. Remove the Side terminal cover and the shield metals ---------------------------------------------- 21

8.5. Remove the A-Board ------------------------------------ 21

8.6. Remove the Side unit assy ---------------------------- 22

8.7. Remove the SN-Board---------------------------------- 22

8.8. Remove the SS-Board ---------------------------------- 22

8.9. Remove the SS2-Board -------------------------------- 23

8.10. Remove the Fan------------------------------------------ 23

8.11. Remove the Speakers ----------------------------------23

8.12. Remove the Stand bracket----------------------------- 23

8.13. Remove the S-Board ------------------------------------ 23

8.14. Remove the Contact metal bottom B---------------- 24

8.15. Remove the Plasma panel section from the Cabinet assy----------------------------------------------- 24

8.16. Remove the Contact metals and the Bottom support metal---------------------------------------------- 24

8.17. Remove the C1-Board ---------------------------------- 24

8.18. Remove the C2-Board ---------------------------------- 25

8.19. Remove the K-Board ------------------------------------ 25

8.20. Remove the V-Board ------------------------------------ 25

8.21. Replace the Plasma panel ----------------------------- 25

9 Measurements and Adjustments -------------------------- 26

9.1. Adjustment ------------------------------------------------- 26

10 Block Diagram --------------------------------------------------- 33

10.1. Main Block Diagram ------------------------------------- 33

10.2. Block (1/4) Diagram ------------------------------------- 34

10.3. Block (2/4) Diagram ------------------------------------- 35

10.4. Block (3/4) Diagram ------------------------------------- 36

10.5. Block (4/4) Diagram ------------------------------------- 37

11 Wiring Connection Diagram -------------------------------- 39

11.1. Caution statement. -------------------------------------- 39

11.2. Wiring (1) -------------------------------------------------- 39

11.3. Wiring (2) -------------------------------------------------- 40

11.4. Wiring (3) -------------------------------------------------- 41

11.5. Wiring (4) -------------------------------------------------- 42

11.6. Wiring (5) -------------------------------------------------- 43

12 Schematic Diagram 13 Printed Circuit Board 14 Exploded View

1 Safety Precautions

1.1. General Guidelines

1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.

2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

3. When conducting repairs and servicing, do not twist the Fasten connectors but plug them straight in or unplug them straight out.

4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.2. Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUCH CURRENT) expressed as voltage U

For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);

For d. c.: U

Note:

The limit value of U

mA d. c. The limit value U

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

= 1.0 V,

= 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0

= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.

and U2, does not exceed the following values:

Figure 1

2Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it's manufacture due to environmental conservation issues. For service and repair work, we'd suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

3 Service Navigation

3.1. PCB Layout

Board Name Function Board Name Function

P Power Supply C1 Data Driver (Lower Right) A Main AV input, processing C2 Data Driver (Lower Left) K Remote receiver, Power LED, C.A.T.S. sensor SN Scan Drive S Power switch SS Sustain Drive V 3D Eyewear transmitter SS2 Sustain out (Lower)

3.2. Applicable signals

COMPONENT (Y, PB, PR), HDMI

* Mark: Applicable input signal

Signal name COMPONENT HDMI 525 (480) / 60i, 60p * * 625 (576) / 50i, 50p * * 750 (720) / 60p, 50p * * 1,125 (1,080) / 60i, 50i * * 1,125 (1,080) / 60p, 50p, 24p *

PC (from HDMI terminal)

Applicable input signal for PC is basically compatible to HDMI standard timing.

Signal name Horizontal frequency (kHz) Vertical frequency (Hz) 640 × 480 @60 Hz 31.47 60.00 750 (720) / 60p 45.00 60.00 1,125 (1,080) / 60p 67.50 60.00

Note

• Signals other than above may not be displayed properly.

• The above signals are reformatted for optimal viewing on your display.

• PC signal is magnified or compressed for display, so that it may not be possible to show fine detail with sufficient clarity.

4 Specifications

Power Source AC 220-240 V, 50 / 60 Hz Power Consumption

Rated Power Consumption 295 W Standby Power Consumption 0.30 W

16.00 W (With monitor out recording)

Display panel

Aspect Ratio 16:9 Visible screen size 106 cm (diagonal)

921 mm (W) × 518 mm (H)

Number of pixels 2,073,600 (1,920 (W) × 1,080 (H)) [5,760 × 1,080 dots]

Sound

Speaker (140 mm × 35 mm) × 2, 6 Ω Audio Output 20 W (10 W + 10 W) Headphones M3 (3.5 mm) stereo mini Jack × 1

Receiving Systems / Band name (UK) DVB-T / T2 Digital terrestrial services.

PAL I UHF E21-68 PAL 525/60 Playback of NTSC tape from some PAL Video recorders (VCR)

or NTSC disc playback from DVD player and recorder.

M.NTSC Playback from M.NTSC Video recorders (VCR). NTSC (AV input only) Playback from NTSC Video recorders (VCR).

Receiving Systems / Band name (Ireland)

Aerial input UHF (UK) VHF / UHF (Ireland) Operating Conditions

Connection Terminals

AV1 (SCART) 21 Pin terminal (Audio/Video in, Audio/Video out, RGB in, Q-Link) AV2 input VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 Ω)

COMPONENT input Y: 1.0 V [p-p] (including synchronization)

HDMI1 / 2 / 3 / 4 input TYPE A Connectors

Card slot SD CARD slot × 1

ETHERNET RJ45, IEEE802.3 10BASE-T / 100BASE-TX USB 1 / 2 USB2.0 DC 5 V, Max. 500 mA AUDIO IN RCA PIN Type × 2 0.5 V [rms] AUDIO OUT RCA PIN Type × 2 0.5 V [rms] (high impedance) DIGITAL AUDIO OUT PCM / Dolby Digital / DTS, Fiber optic

Dimensions (W × H × D) 1,020 mm × 675 mm × 320 mm (With Pedestal)

Mass 23.0 kg Net (With Pedestal)

DVB-T Digital terrestrial services. PAL I VHF A -J

PAL 525/60 Playback of NTSC tape from some PAL Video recorders (VCR)

M.NTSC Playback from M.NTSC Video recorders (VCR). NTSC (AV input only) Playback from NTSC Video recorders (VCR).

Temperature: 0 °C- 35 °C Humidity: 20 % - 80 % RH (non-condensing)

AUDIO L-R: RCA PIN Type × 2 0.5 V [rms]

, PR: ±0.35 V [p-p]

HDMI1 / 3 / 4 : 3D, Content Type, Deep Colour, x.v.Colour™ HDMI2 : 3D, Content Type, Audio Return Channel, Deep Colour,

• This TV supports " HDAVI Control 5 " function.

Common Interface slot × 1

1,020 mm × 640 mm × 69 mm (TV only)

19.5 kg Net (TV only)

UHF E21-69 CATV S1 - S20 CATV S21 - S41 (Hyperband)

or NTSC disc playback from DVD player and recorder.

x.v.Colour™

Note

• Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.

• This equipment complies with the EMC standards listed below. EN55013, EN61000-3-2, EN61000-3-3, EN55020, EN55022, EN55024

5 Technical Descriptions

5.1. Specification of KEY for CI Plus, DTCP-IP, WIDEVINE and One-to-One

5.1.1. General information:

1. EEPROM (IC8902) for spare parts has the seed of KEY for each.

2. The final KEY data will be generated by Peaks IC (IC8000) when SELF CHECK was done and are stored in both Peaks IC (IC8000) and EEPROM (IC8902). Three KEY are not generated for all models. The necessary KEY are only generated and stored depend on the feature of models.

5.1.2. Replacement of ICs:

When Peaks IC (IC8000) is replaced, EEPROM (IC8902) should be also replaced with new one the same time. When EEPROM (IC8902) is replaced, Peaks IC (IC8000) is not necessary to be replaced the same time. After the replacement of IC, SELF CHECK should be done to generate the final KEY data. How to SELF CHECK: While pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote control for more than 3 seconds. TV will be forced to the factory shipment setting after this SELF CHECK.

5.1.3. Model and Keys:

Model No. Keys

One-to-One

(For USB Rec.)

TX-P42ST30B None None None Yes

CI Plus DTCP-IP WIDEVINE

6 Service Mode

6.1. How to enter into Service Mode

6.1.1. Purpose

After exchange parts, check and adjust the contents of adjustment mode.

While pressing [VOLUME ( - )] button of the main unit, press [0] button of the remote control three times within 2 seconds.

Note:

Service Mode can not be entered when 3D signal input. Input 2D signal to enter Service Mode.

6.1.2. Key command

[1] button...Main items Selection in forward direction [2] button...Main items Selection in reverse direction [3] button...Sub items Selection in forward direction [4] button...Sub items Selection in reverse direction [RED] button...All Sub items Selection in reverse direction [GREEN] button...All Sub items Selection in forward direction [VOL] button...Value of sub items change in forward direction ( + ), in reverse direction ( - )

6.1.3. How to exit

Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.

6.1.4. Contents of adjustment mode

• Value is shown as a hexadecimal number.

• Preset value differs depending on models.

• After entering the adjustment mode, take note of the value in each item before starting adjustment.

Main item Sub item Sample Data Remark

ADJUST CONTRAST 277

COLOR 36 TINT 00 SUB-BRT 800 H-POS 0 H-AMP 0 V-POS 0 V-AMP 0

WB-ADJ R-CUT 80

G-CUT 80 B-CUT 80 R-DRV EE G-DRV FF B-DRV 86 ALL-CUT 80 ALL-DRV FF

OPTION Panel-Type 42FHD Factory Preset

Boot ROM STBY-SET 00 EMERGENCY ON Y/C Delay OPT 1 00010100 OP T 2 1110 111 0 OPT 3 00000001 OPT 4 00010000 EDID-CLK MID MIRROR 00 (See Option-Mirror)

AMR-SELECT OFF VSUS LOW See Vsus selection AGING ALL WHITE Built-in test patterns can be

ALL BLUE WITH WHITE OUTSIDE FRAME

ALL GREEN

ALL RED

LOW STEP WHITE

LOW STEP BLUE

LOW STEP GREEN

LOW STEP RED

WHITE DIAGONAL STRIPE

RED DIAGONAL STRIPE

GREEN DIAGONAL STRIPE

BLUE DIAGONAL STRIPE

A-ZONE & B-ZONE

1% WINDOW

COLOR BAR

9 POINTS BRIGHT MEASURE

2 DOT OUTSIDE FRAME

ALL BLUE

DOUBLE FIXED 1% WINDOW

VERTICAL LINE SCROLL

ON/OFF OR WHITE

R/G/B/W ROTATION

HALF FIXED ALL WHITE

ALL WHITE WITH COUNT DISPLAY SRV-TOOL See Service tool mode

displayed.

Destination Check sum a78e

6.2. Option - Mirror

Picture can be reversed left and right or up and down. 00 : Default (Normal picture is displayed) 01 : Picture is reversed left and right. 02 : Picture is reversed up and down.

Hint : If the defective symptom (e.g. Vertical bar or Horizontal bar) is moved by selection of this mirror, the possible cause is in A-board.

6.3. Service tool mode

6.3.1. How to access

1. Select [SRV-TOOL] in Service Mode.

2. Press [OK] button on the remote control.

6.3.2. Display of SOS History

SOS History (Number of LED blinking) indication. From left side; Last SOS, before Last, three occurrence before, 2nd occurrence after shipment, 1st occurrence after shipment. This indication will be cleared by [Self-check indication and forced to factory shipment setting].

6.3.3. POWER ON Time, On/Off

Note : To display TIME/COUNT menu, highlight position, then press MUTE for 3 sec. Time : Cumulative power on time, indicated hour : minute by decimal On/Off : Number of On/Off switching by decimal Note : This indication will not be cleared by either of the self-checks or any other command.

6.3.4. Exit

1. Disconnect the AC cord from wall outlet or switch off the power with [ Power ] button on the main unit.

6.4. Hotel mode

1. Purpose Restrict a function for hotels.

2. Access command to the Hotel mode setup menu In order to display the Hotel mode setup menu: While pressing [VOLUME (-)] button of the main unit, press [AV] button of the remote control three times within 2 seconds.

Then, the Hotel mode setup menu is displayed.

3. To exit the Hotel mode setup menu Disconnect AC power cord from wall outlet.

4. Explain the Hotel mode setup menu

Item Function Hotel Mode Select hotel mode On/Off Initial INPUT Select input signal modes.

Set the input, when each time power is switched on. Selection : Off/Analogue/DVB/AV1/AV2/COMPONENT/ HDMI1/HDMI2/HDMI3/HDMI4

• Off: give priority to a last memory. However, Euro model is compulsorily set to TV.

• AVnS/AVnC: only Euro model selectable

Initial POS Select programme number.

Selection : Off/0 to 99

• Off: give priority to a last memory

Initial VOL Level Adjust the volume when each time power is

switched on. Selection/Range : Off/0 to 100

• Off: give priority to a last memory

Maximum VOL Level

Button Lock Select local key conditions.

Remote Lock Select remote control key conditions.

Private Information Select private information for VIERA Cast is Keep

Adjust maximum volume. Range : 0 to 100

Selection : Off/SETUP/MENU/ALL

• Off: altogether valid

• SETUP: only F-key is invalid (Tuning guide (menu) can not be selected.)

• MENU: only F-key is invalid (only Volume/Mute can be selected.)

• ALL: altogether invalid.

Selection : Off/SETUP/MENU

• Off: altogether valid

• SETUP: only Setup menu is invalid

• MENU: Picture/Sound/Setup menu are invalid

or Reset if Hotel mode is set to [On] when TV power on. Selection : Keep/Reset

• Keep: private information for VIERA Cast is keep

• Reset: private information for VIERA Cast is reset

6.5. Data Copy by SD Card

6.5.1. Purpose

(a) Board replacement (Copy the data when exchanging A-board):

When exchanging A-board, the data in original A-board can be copied to SD card and then copy to new A-board.

(b) Hotel (Copy the data when installing a number of units in hotel or any facility):

When installing a number of units in hotel or any facility, the data in master TV can be copied to SD card and then copy to other TVs.

6.5.2. Preparation

Make pwd file as startup file for (a) or (b) in a empty SD card.

1. Insert a empty SD card to your PC.

2. Right-click a blank area in a SD card window, point to New, and then click text document. A new file is created by default (New Text Document.txt).

3. Right-click the new text document that you just created and select rename, and then change the name and extension of the file to the following file name for (a) or (b) and press ENTER.

File name:

(a) For Board replacement : boardreplace.pwd (b) For Hotel : hotel.pwd

Note:

Please make only one file to prevent the operation error.

No any other file should not be in SD card.

6.5.3. Data copy from TV set to SD Card

1. Turn on the TV set.

2. Insert SD card with a startup file (pwd file) to SD slot. On-screen Display will be appeared according to the startup file automatically.

3. Input a following password for (a) or (b) by using remote control.

(a) For Board replacement : 2770

(b) For Hotel : 4850 Data will be copied from TV set to SD card. It takes around 2 to 6 minutes maximum for copying.

4. After the completion of copying to SD card, remove SD card from TV set.

5. Turn off the TV set.

Note:

Following new folder will be created in SD card for data from TV set.

(a) For Board replacement : user_setup (b) For Hotel : hotel

6.5.4. Data copy from SD Card to TV set

1. Turn on the TV set.

2. Insert SD card with Data to SD slot. On-screen Display will be appeared according to the Data folder automatically.

3. Input a following password for (a) or (b) by using remote control.

(a) For Board replacement : 2771 (b) For Hotel : 4851

Data will be copied from SD card to TV set.

4. After the completion of copying to SD card, remove SD card from TV set.

(a) For Board replacement : Data will be deleted after copying (Limited one copy). (b) For Hotel : Data will not be deleted and can be used for other TVs.

5. Turn off the TV set.

Note:

1. Depending on the failure of boards, function of Data copy for board replacement does not work.

2. This function can be effective among the same model numbers.

7 Troubleshooting Guide

Use the self-check function to test the unit.

1. Checking the IIC bus lines

2. Power LED Blinking timing

7.1. Check of the IIC bus lines

7.1.1. How to access

7.1.1.1. Self-check indication only:

Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [OK] button on the remote control for more than 3 seconds.

7.1.1.2. Self-check indication and forced to factory shipment setting:

Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote control for more than 3 seconds.

7.1.2. Screen display

7.1.3. Check Point

Confirm the following parts if NG was displayed.

DISPLAY Check Ref. No. Description Check P.C.B. TUN TU4801 TUNER A-BOARD STBY IC8000 PEAKS-LDA3(STM) A-BOARD MEM1 IC8902 PEAKS EEPROM A-BOARD MEM2 IC8901 STM EEPROM A-BOARD AVSW IC3001 AUDIO/VIDEO SW A-BOARD TEMP IC2001 TEMP SENSOR A-BOARD LAN IC8601 ETHERPHY A-BOARD FE IC6700 OFDM A-BOARD ID2 A-BOARD LP1 IC9300 LP1 A-BOARD HDMI-SW IC4700 HDMI SW A-BOARD IRDRV IC5901 IR LED DRIVER A-BOARD

7.1.4. Exit

Disconnect the AC cord from wall outlet or switch off the power with [ Power ] button on the main unit.

7.2. Power LED Blinking timing chart

1. Subject Information of LED Flashing timing chart.

2. Contents When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.

Blinking Times Contents Check point

1 Panel information SOS

LP1 Start SOS 3 P+ 3.3V SOS A-Board 4 Power SOS P-Board 5 P+ 5V SOS A-Board 6Driver SOS1

(SN Energy recovery circuit)

(A-SN FPC DET) 7Driver SOS2

(SN Connector DET)

(SN Scan and Logic IC) 8Driver SOS3

(SS FPC DET)

(SS Energy recovery circuit)

9 Discharge Control SOS A-Board

10 Sub 5V SOS

Sub 3.3V SOS

Tuner power SOS

11 FAN SOS A-Board

12 Sound SOS A-Board

13 Emergency SOS A-Board 14 IROM SOS (ROM in Peaks IC) A-Board

SN-Board

A-SN FPC

SN-Board

SS-Board

SS2-Board

SS FPC

SS2 FPC

A-Board SN-Board SS-Board

P-Board

FAN

Speaker

P-Board

7.3. No Power

First check point There are following 3 states of No Power indication by power LED.

1. No lit.

2. Green is lit then turns red blinking a few seconds later. (See 7.2.)

3. Only red is lit.

7.4. No Picture

7.5. Local screen failure

Plasma display may have local area failure on the screen. Fig-1 is the possible defect P.C.B. for each local area.

Fig-1

8 Disassembly and Assembly Instructions

8.1. Remove the Rear cover

1. See PCB Layout (Section 3)

8.2. Remove the AC inlet

Caution:

To remove P.C.B. wait 1 minute after power was off for discharge from electrolysis capacitors.

1. Unlock the cable clampers to free the cable.

2. Disconnect the connector (P9).

3. Remove the screws (×2 ) and remove the Inlet metal.

4. Remove the screw (×1 ) and remove the AC inlet.

8.4. Remove the Side terminal cover and the shield metals

1. Remove the claw (×1 ).

2. Remove the Side terminal cover.

3. Remove the screws (×2 ).

4. Remove the Bottom shield metal.

5. Remove the screw (×1 ).

6. Remove the Side shield metal.

8.3. Remove the P-Board

Caution:

To remove P.C.B. wait 1 minute after power was off for discharge from electrolysis capacitors.

1. Unlock the cable clampers to free the cable

2. Disconnect the connectors (P2, P6, P11, P34 and P35).

3. Remove the screws (×5 ) and remove the P-Board.

8.5. Remove the A-Board

1. Remove the Side terminal cover and the Shield metals. (See section 8.4.)

2. Unlock the cable clampers to free the cable.

3. Disconnect the connectors (A1, A6, A8, A11 and A14).

4. Disconnect the flexible cables (A20, A31, A32 and A40).

5. Remove the screw (×1 ) and remove the A-Board.

8.6. Remove the Side unit assy

1. Disconnect the connector (C14).

2. Remove the claws (×2 ) and remove the Side unit assy.

3. Remove the screw (×1 ).

4. Remove the Side unit mount metal.

8.7. Remove the SN-Board

1. Disconnect the flexible cables (SN1, SN2, SN3, SN4, SN5, SN6, SN7 and SN8) connected to the SN-Board.

2. Disconnect the connector (SN2).

3. Disconnect the flexible cable (SN20).

4. Remove the screws (×9 ) and remove the SN-Board.

8.8. Remove the SS-Board

1. Disconnect the connector (SS11).

2. Disconnect the flexible cable (SS33).

3. Disconnect the flexible cable (SS61).

4. Remove the screws (×4 , ×3 ) and remove the SS- Board.

8.9. Remove the SS2-Board

1. Disconnect the Side terminal cover and the Shield metals (See section 8.4.).

2. Remove the SS-Board (See section 8.8.).

3. Disconnect the flexible cable (SS66).

4. Remove the screws (×2 ) and remove the SS2-Board.

8.11. Remove the Speakers

1. Unlock the cable clampers to free the cable.

2. Disconnect the Relay connector.

3. Remove the screws (×2 each) and remove the Speakers (L, R).

8.12. Remove the Stand bracket

1. Remove the Plasma panel section from the servicing stand and lay on a flat surface such as a table (covered by a soft cloth) with the Plasma panel surface facing downward.

2. Unlock the cable clampers to free cable.

3. Remove the Stand bracket fastening screws (×9 ) and the Stand bracket.

8.10. Remove the Fan

1. Unlock the cable clampers to free the cable.

2. Remove the screws (×3 ).

3. Remove the Relay connector and remove the Fan.

8.13. Remove the S-Board

1. Remove the screws (×2 ) and remove the S-Board unit.

2. Remove the screws (×2 ).

3. Disconnect the connector (S10) and remove the S-Board from the Power button bracket.

8.14. Remove the Contact metal bot-

8.16. Remove the Contact metals

tom B

1. Remove the Stand bracket. (See section 8.12.)

2. Remove the screws (×5 , ×7 , ×1).

3. Remove the Contact metal bottom B.

8.15. Remove the Plasma panel section from the Cabinet assy

1. Place the Cabinet assy on a flat surface of a table (covered by a soft cloth) and a cushion.

and the Bottom support metal

1. Remove the Cabinet assy. (See section 8.15.)

2. Remove the Tape from the Contact metals.

3. Remove the screws (×8 ).

4. Remove the Contact metal side (L, R).

5. Remove the screws (×6 ).

6. Remove the Contact metal top.

7. Remove the screws (×15 ).

8. Remove the Bottom support metal and the Contact metal bottom A.

2. Remove the Contact metal bottom B. (See section 8.14.)

3. Remove the screws (×6 ).

4. Remove the Plasma panel section from the Cabinet assy.

8.17. Remove the C1-Board

1. Remove the Bottom support metal and the Contact metal bottom A. (See section 8.16.)

2. Disconnect the flexible cables (CB1, CB2, CB3, CB4, CB5, CB6 and CB7).

3. Disconnect the flexible cables (C10 and C11).

4. Disconnect the connector (C14).

5. Remove the screws (×4 ) and remove the C1-Board.

8.18. Remove the C2-Board

1. Remove the Bottom support metal and the Contact metal bottom A. (See section 8.16.)

2. Disconnect the flexible cables (CB8, CB9, CB10, CB11, CB12, CB13, CB14 and CB15).

3. Disconnect the flexible cables (C20 and C21).

4. Disconnect the connector (C25).

5. Remove the screws (×4 ) and remove the C2-Board.

8.21. Replace the Plasma panel

Caution:

Place the Plasma panel on a flat surface of a table (covered by a soft cloth) and a cushion.

A new Plasma panel itself without Contact metals is fragile. To avoid the damage to new Plasma panel, carry a new Plasma panel taking hold of the Contact metals.

8.19. Remove the K-Board

1. Remove the Contact metal bottom B. (See section 8.14.)

2. Remove the screws (×2 ).

3. Remove the claw (×1 ).

4. Disconnect the connector (K1) and remove the K-Board from the LED Panel.

8.20. Remove the V-Board

1. Remove the Contact metal bottom B. (See section 8.14.)

2. Remove the Claw (×1 ).

3. Disconnect the connector (V14) and remove the V-Board from the 3D emitter panel.

1. Place a carton box packed a new Plasma panel on the flat surface of the work bench.

2. Open a box and without taking a new Plasma panel.

3. Attach the Cabinet assy and each P.C.Board and so on, to the new Plasma panel.

9 Measurements and Adjustments

9.1. Adjustment

9.1.1. Vsus selection

Caution:

When Plasma panel or A-board is replaced, Vsus should be set to LOW or HIGH.

Procedure

1. Go into main item [VSUS] in Service Mode. LOW or HIGH will be displayed.

2. Press [OK] button to go to TEST stage. White pattern without On-Screen Display will be displayed during TEST and CONF stage. Press [5] button to display the On-Screen Display.

3. Press [VOL (-)] button to set to LOW.

4. In LOW setting

a. If no several dead pixel is visible remarkably in white pattern, press [3] button to go to CONF stage. b. If the several dead pixels are visible remarkably in white pattern, Set to HIGH by press [VOL (+)] button. Press [3] button

to go to CONF stage if the symptom is improved.

5. Press [OK] button in CONF stage to store LOW or HIGH.

6. Exit Service Mode by pressing [Power] button.

9.1.2. Sub-Contrast adjustment

Name of measuring instrument Connection Remarks RF generator Base Band signal generator HD signal generator

Steps Remarks Connect IIC cable (bus controller-cable) after banner OSD appear. And after SRQ-L, begin an adjustment 2 seconds later.

Adjustment of TV (RF system)

Note:

In adjustment, you must setting to modulation of signal at 80%.

1. Receive a RF PAL 100% Full White or Split Colour bar shown as below.

2. Goes into service mode.

3. Push a [ 1 ] or [ 2 ] key, and goes into adjustment mode for [ CONTRAST ].

Note:

Sub-contrast adjustment is unadjusted for AV/ HD input. But, when needing the adjustment chosen manually, please refer to [ alternative method ].

Adjustment

1. The colour key yellow button of remote control is pushed.

2. The OSD character of sub-contrast becomes red. (Inside under automatic adjustment)

3. The OSD character of sub-contrast returns to black. When [NG] is displayed, adjustment failure.

4. End.

Steps Remarks

Another procedure

Connect IIC cable (bus controller-cable) after banner OSD appear. And after SRQ-L, begin an adjustment 2 seconds later.

Adjustment of AV system

1. PAL 100% Full White or Split Colour bar receive AV1(or AV2), shown as below.

2. Goes into service mode.

3. Push [ 1 ] or [ 2 ] key, and goes into adjustment mode for [ CONTRAST ].

Adjustment

1. The colour key yellow button of remote control is pushed.

2. The OSD character of sub-contrast becomes red. (Inside under automatic adjustment)

3. The OSD character of sub-contrast returns to black. When [NG] is displayed, adjustment failure.

4. End.

Steps Remarks

Another procedure

Connect IIC cable (bus controller-cable) after banner OSD appear. And after SRQ-L, begin an adjustment 2 seconds later.

Adjustment of HD system

1. At 1080i 100% Full White or Split colour bar receive component signal, as shown below.

2. Goes into service mode.

3. Push [ 1 ] or [ 2 ] key, and goes into adjustment mode for [ CONTRAST ].

Adjustment

1. The colour key yellow button of remote control is pushed.

2. The OSD character of sub-contrast becomes red. (Inside under automatic adjustment)

3. The OSD character of sub-contrast returns to black. When [NG] is displayed, adjustment failure.

4. End.

9.1.3. White balance adjustment

The adjusting method is different according to the PEAKS EEPROM version.

[copy adjustment] : Peaks EEPROM ver.1.00[Differential and copy adjustment] : Peaks EEPROM ver.1.**-

Name of measuring instrument Connection Remarks W/ B pattern Color analyzer (Minolta CA-100 or equivalent)

Steps Remarks

[copy adjustment] Connect IIC cable (bus controller-cable) after banner OSD appear. And after SRQ-L, begin an adjustment 2 seconds later.

• Make sure the front panel to be used on the final set is fitted.

• Make sure a color signal is not being shown before adjustment.

• Put the color analyzer where there is little colour variation.

Note:

Copy Adjustment method in service mode. When you push [OK] key in each item, Adjustment data is copied between HD data and SD data.

1. Enter the service mode. Please receive the Analog-RF. Or, please select CVBS/YUV/HDMI. (No inputting is possible.). (Forbid Analog-RF with no signal.)

2. A number key [1] or [2] are operated and [WB-ADJ] is displayed. Check that the color temp is [COOL].

3. A number key [0] is operated and select [METHOD 01].

4. A number key [5] is operated and [INNER PATTERN] is displayed.

Panel surface

Picture menu : Dynamic ASPECT : 16:9

Condition is same at alternative method too.

METHOD=01 copy adjustments

5. Select [G-CUTOFF] item, using the number-key [3] or [4], and set to [80], using the volume-key [+] or [-]. Also, [B-CUTOFF] and [R-CUTOFF] set to [80].

6. Set [G-DRIVE] at [D0].

7. Touch the signal receiver of color analyzer to the INNER PATTERN center, and adjust B drive and R drive so x, y become the [COLOR TEMP COOL] in the below table1.

8. All RGB drive increase so that the maximum drive value of RGB may become [FF]. ([ALL-DRIVE] set to [FF].)

9. Set color temp to [NORMAL] using [7] key.

10. Fix G-CUTOFF, B-CUTOFF and R-CUTOFF at [80].

11. Set [G-DRIVE] at [D0].

12. Adjust B-DRIVE and R-DRIVE so the INNER PATTERN x, y become the [COLOR TEMP NORMAL] in the below table1.

13. All RGB drive increase so that the maximum drive value of RGB may become [FF]. ([ALL-DRIVE] set to [FF].)

14. Set color temp to [WARM] using [7] key.

15. Fix G-CUTOFF, B-CUTOFF and R-CUTOFF at [80].

16. Set [G-DRIVE] at [D0].

17. Adjust B-DRIVE and R-DRIVE so the INNER PATTERN x, y become the [COLOR TEMP WARM] in the below table1.

18. All RGB drive increase so that the maximum drive value of RGB may become [FF]. ([ALL-DRIVE] set to [FF].)

19. Confirm [METHOD=01].

Please refer table2-3 to address.

Asking matter to execute white balance difference adjustment. Please feed back the DAC value in the adjusted each color temperature in an internal pattern.

Steps Remarks

[Differential and copy adjustment]

Execute adjustment for color temp. [NORMAL], and set data for color temp. [COOL], [WARM] by data shift WB of HD (or PAL) copies the adjustment data from an adjusted format side.

Note:

The adjustment does only color temp. [NORMAL]. A adjustment value difference from [NORMAL] is written to EEPROM as for [COOL] and [WARM] by operating a [OK] key. As for WB of HD (or RF), the adjustment data from an adjusted format side is copied simultaneously. Text color of the adjusted value changes into red → black at the same time too.

1. Enter the service mode. Please receive the Analog-RF. Or, please select CVBS/YUV/HDMI. (No inputting is possible.). (Forbid Analog-RF with no signal.)

2. A number key [1] and [2] are operated and [WB-ADJ] is displayed. Check that the color temp is [NORMAL].

3. A number key [0] is operated and select [METHOD 03].

4. A number key [5] is operated and [INNER PATTERN] is displayed.

METHOD=03 Differential and copy adjustment

5. Select [G-CUTOFF] item, using the number-key [3] or [4], and set to [80], using the volume-key [+] or [-]. Also, [B-CUTOFF] and [R-CUTOFF] set to [80].

6. Set [G-DRIVE] at [D0].

7. Touch the signal receiver of color analyzer to the INNER PATTERN center, and adjust B drive and R drive so x, y become the [COLOR TEMP NORMAL] in the table 1.

8. All RGB drive increase so that the maximum drive value of RGB may become [FF]. ([ALL-DRIVE] set to [FF].)

9. A number key [0] is operated and select [METHOD=01].

Please refer table2-3 to address.

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