Panasonic TH-65PHD8BK, TH-65PHD8EK, TH-65PHD8UK Service manual
y
A
A
ORDER NO. ITD0509054CE
High Definition Plasma Display
TH-65PHD8BK
TH-65PHD8EK
TH-65PHD8UK
GPH8D Chassis
D10
Specifications
Power Source (UK) 120 VAC, 50/60Hz
Power Source (BK/EK) 220 - 240 VAC, 50/60 Hz
Power Consumption (UK)
Maximum 675 W
Stand-bycondition Save OFF 0.7 W, Save ON 0.5 W
Power off condition 0.2 W
Power Consumption (BK/EK)
Normal use 615 W
Stand-bycondition Save off 0.9 W, Save on 0.7 W
Power off condition 0.35 W
Plasma Displaypanel Drive method:AC type 65-inch, 16:9 aspect ratio
Contrast Ratio 3000:1
Screen size 56.5” (1,434 mm) (W) × 31.7” (806 mm) (H) × 65” (1,645 mm) (diagonal)
(No. of pixels) 1,049,088 (1,366 (W) × 768 (H)) [4,098 × 768 dots]
Operating condition
Temperature 32 °F - 104 °F (0 °C - 40 °C)
Humidit
Applicablesignals
Color System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575)/50i 50p, 750 (720)/60p 50p, 1125 (1080) / 60i 50i 24p 25p
PC signals VGA, SVGA, XGA, SXGA, UXGA..... (compressed)
Connection terminals
V VIDEO IN / OUT (BNC) 1.0 Vp-p (75-ohm or high impedance)
20 % - 80 %
30p 24sF .... SMPTE274M, 1250 (1080) / 50i
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
S VIDEO IN (MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)
© 2005 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
Y
A
Y
/
/
A
A
y
y
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
COMPONENT / RGB (UK)
PC (UK) (HIGH-DENSITYMini-D-SUB 15PIN) R,G,B/0.7 Vp-p (75-ohm)
PC (BK/EK) (HIGH-DENSITYMini-D-SUB 15PIN) R,G,B/0.7 Vp-p (75-ohm)
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
SPEAKERS (8Ω) 20 W [10 W + 10 W] (10 % THD)
Accessories Supplied
Remote Control Transmitter EUR7636070R
(UK)
Remote Control Transmitter EUR7636090R
(BK/EK)
Batteries (UK) 2×AASize
Batteries (BK/EK) 2 × R6 Size
Fixing bands (TMME203) × 2
Dimensions (W×H×D) 61.2” (1,554 mm) × 36.4” (925 mm) × 3.9” (99 mm)
Mass (weight) (UK)
main unit onl
with speakers approx. 181.7 lbs
Mass (weight) (BK/EK)
main unit onl
with speakers approx. 82.4 kg
/ G (BNC) 1.0 Vp-p/composite (75-ohm)
0.7 Vp-p/non-composite (75-ohm)
PB/B (BNC), PR/R (BNC) 0.7 Vp-p (75-ohm)
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)
HD, VD/1.0 - 5.0 Vp-p (high impedance)
Component
:1.0 Vp-p (75-ohm : include sync)
P
CB:0.7 Vp-p (75-ohm)
B
P
CR:0.7 Vp-p (75-ohm)
R
UDIO IN (M3 JACK) 0.5 Vrms (high impedance)
HD, VD/1.0 - 5.0 Vp-p (high impedance)
UDIO IN (M3 JACK) 0.5 Vrms (high impedance)
(exclusive of protruding portion)
approx. 172.0 lbs
approx. 78.0 kg net
Notes:
· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
· This equipment complies with the EMC standards listed below. EN55022, EN55024, EN61000-3-2, EN61000-3-3. (BK/EK)
CONTENTS
Page Page
1 Applicable signals 5
2 Safety Precautions
2.1. General Guidelines
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
4 About lead free solder (PbF)
5 PCB Structure sheet of GPH8D chassis
6 Service Hint
7 Disassembly
10
11
6
6
7
8
9
7.1. Removal of the Back Cover
7.2. Removal of the HA-Board and the HB-Board
7.3. Removal of the Slot Block
7.4. Removal of the J-Board
7.5. Removal of the HX-Board
7.6. Removal of the PB-Board
7.7. Removal of the D-Board
7.8. Removal of the P-Board
7.9. Removal of the SU-Board and the SD-Board
11
11
12
12
12
12
13
13
15
2
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
7.10. Removal of the SC-Board 15
7.11. Removal of the SS2-Board and the SS3-Board
7.12. Removal of the SS-Board
7.13. Removal of the H3-Board (L, R)
7.14. Removal of the C1, C2, C3, C4, C5 and the C6-Board
7.15. Removal of the Fan
7.16. Removal of the Escutcheon
7.17. Removal of the S1-Board and the V1-Board
7.18. Removal of the Plasma Panel
8 Location of Lead Wiring
9 Adjustment Procedure
9.1. Driver Set-up
9.2. Initialization Pulse Adjust
9.3. P.C.B. (Printed Circuit Board) Remove
9.4. Adjustment Volume Location
9.5. Test Point Location
10 Service mode
10.1. CAT (computer Aided Test) mode
10.2. IIC mode structure (following items value is sample data.)
11 Alignment
11.1. PC / RGB panel white balance
11.2. HD / 525ip / 625ip panel white balance
12 Trouble shooting guide
12.1. Self Check
12.2. No Power
12.3. No Picture
12.4. Local screen failure
13 Option Setting
14 Circuit Board Layout
14.1. P-Board (P-1), (P-2)
14.2. PB-Board
14.3. HA-Board
14.4. HB-Board
14.5. HX-Board
14.6. J-Board
14.7. D-Board
14.8. C1-Board
14.9. C2-Board
14.10. C3-Board
14.11. C4-Board
14.12. C5-Board
14.13. C6-Board
14.14. SC-Board
14.15. SU-Board
14.16. SD-Board
14.17. SS-Board
14.18. SS2 and SS3-Board
14.19. H3, S1 and V1-Board
15 Schematic Diagrams
15.1. Schematic Diagram Notes
15.2. Main Block Diagram
15.3. P-Board (1 of 2)Block Diagram
15.4. P-Board (2 of 2)Block Diagram
16
16
16
17
18
19
20
21
24
26
26
27
27
28
28
29
29
31
32
32
34
36
36
37
37
38
39
41
41
45
46
47
48
49
51
53
54
55
56
57
58
59
62
63
64
67
68
69
69
70
71
72
15.5. P-Board (1 of 3) Schematic Diagram
15.6. P-Board (2 of 3) Schematic Diagram
15.7. P-Board (3 of 3) Schematic Diagram
15.8. PB and V1-Board Block and Schematic Diagram
15.9. HA-Board Block and Schematic Diagram
15.10. HB-Board Block Diagram
15.11. HB-Board (1 of 2) Schematic Diagram
15.12. HB-Board (2 of 2) Schematic Diagram
15.13. HX-Board Block and Schematic Diagram
15.14. J-Board (1 of 2) and H3-Board Block Diagram
15.15. J-Board (2 of 2) Block Diagram
15.16. J-Board (1 of 4) and H3-Board Schematic Diagram
15.17. J-Board (2 of 4) Schematic Diagram
15.18. J-Board (3 of 4) Schematic Diagram
15.19. J-Board (4 of 4) Schematic Diagram
15.20. D-Board (1 of 2) Block Diagram
15.21. D-Board (2 of 2) Block Diagram
15.22. D-Board (1 of 12) Schematic Diagram
15.23. D-Board (2 of 12) Schematic Diagram
15.24. D-Board (3 of 12) Schematic Diagram
15.25. D-Board (4 of 12) Schematic Diagram
15.26. D-Board (5 of 12) Schematic Diagram
15.27. D-Board (6 of 12) Schematic Diagram
15.28. D-Board (7 of 12) Schematic Diagram
15.29. D-Board (8 of 12) Schematic Diagram
15.30. D-Board (9 of 12) Schematic Diagram
15.31. D-Board (10 of 12) Schematic Diagram
15.32. D-Board (11 of 12) Schematic Diagram
15.33. D-Board (12 of 12) Schematic Diagram
15.34. C1, C2, C5 and C6-Board Block Diagram
15.35. C2, C3, C4 and C5-Board Block Diagram
15.36. C1-Board (1 of 2) Schematic Diagram
15.37. C1-Board (2 of 2) Schematic Diagram
15.38. C2-Board (1 of 2) Schematic Diagram
15.39. C2-Board (2 of 2) Schematic Diagram
15.40. C3-Board (1 of 2) Schematic Diagram
15.41. C3-Board (2 of 2) Schematic Diagram
15.42. C4-Board (1 of 2) Schematic Diagram
15.43. C4-Board (2 of 2) Schematic Diagram
15.44. C5-Board (1 of 2) Schematic Diagram
15.45. C5-Board (2 of 2) Schematic Diagram
15.46. C6-Board (1 of 2) Schematic Diagram
15.47. C6-Board (2 of 2) Schematic Diagram
15.48. SC, SU and SD-Board Block Diagram
15.49. SC-Board (1 of 3) Schematic Diagram
15.50. SC-Board (2 of 3) Schematic Diagram
15.51. SC-Board (3 of 3) Schematic Diagram
15.52. SU-Board (1 of 2) Schematic Diagram
15.53. SU-Board (2 of 2) Schematic Diagram
15.54. SD-Board (1 of 2) Schematic Diagram
15.55. SD-Board (2 of 2) Schematic Diagram
15.56. SS, S1, SS2 and SS3-Board Block Diagram
15.57. SS-Board (1 of 2), S1, SS2 and SS3-Board Schematic
Diagram
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
3
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
15.58. SS-Board (2 of 2) Schematic Diagram 126
16 Parts Location
16.1. Exploded View
16.2. Cable relation
16.3. Packing summary
127
127
129
130
17 Mechanica l Replacement Parts List
18 Replacement Parts List
18.1. Relpacement Parts List Notes
18.2. Electrical Replacement Parts List
133
134
134
135
4
1 Applicable signals
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
5
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MΩ and 5.2MΩ.
When the exposed metal does not have a return path to
the chassis, the reading must be
.
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1 .)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1 .
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
6
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder Remove device. Some solder Remove devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
todamage an ES device).
7
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
stamped on the back of PCB.
8
5 PCB Structure sheet of GPH8D chassis
Board Name Function Remarks
D Digital Signal Processor,
Format Converter,
Plasma AI Processor
J Slot Interface (Audio/Video/Sync input Switch),
SYNC processor, Audio processor,
Speaker out amplifier,
DC-DC converter
SS Sustain drive 1
SC Scan drive 1
SU Scan out (Upper) 1
SD Scan out (Lower) 1
C1 Data Drive (Upper Right)
C2 Data Drive (Upper Center)
C3 Data Drive (Upper Left)
C4 Data Drive (Lower Left)
C5 Data Drive (Lower Center)
C6 Data Drive (Lower Right)
H3 Speaker terminal
S1 Power switch
SS2 Sustain out (Upper)
SS3 Sustain out (Lower)
V1 LED (stand-by / Power on) & Remote receiver 1
PB Fan control 1
P Line filter, Power supply 1
HX PC / RS-232C
HB BNC Composite Video 2
HA BNC Component Video 3
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
1
1
Remarks
1: Recommend PCB´s for initial service for GPH8D chassis.
2: For TH-65PHD8BK/EK/UK
3: For TH-65PHD8UK
9
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
6 Service Hint
Note:
Extension cable kit for Slot Board is supplied as service fixtures and tools.
(Part No. TZSC07040)
10
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
7 Disassembly
· To remove P.C.B., wait for 1 minute after power was off for
discharge from electrolysis capacitors.
and marks indicate screw positions.
·
7.1. Removal of the Back Cover
1. Remove the screws (×20 ,×9 ,×4 ) and then remove
the Back Cover.
7.2. Removal of the HA-Board and
the HB-Board
7.2.1. TH-65PHD8UK
· Removal of the HA-Board
1. Remove the 4 screws (D) of the HA Terminal Block and
then remove the HA Terminal Block.
2. Remove the 4 screws (E).
3. Remove the 2 screws (F) and then remove the HA-Board.
7.2.2. TH-65PHD8EK/BK
· Removal of the HB-Board
1. Remove the 4 screws (G) of the HB Terminal Block and
then remove the HB Terminal Block.
2. Remove the 4 screws (H).
3. Remove the 2 screws (J) and then remove the HB-Board.
· Removal of the HB-Board
1. Remove the 4 screws (A) of the HB Terminal Block and
then remove the HB Terminal Block.
2. Remove the 4 screws (B).
3. Remove the 2 screws (C) and then remove the HB-Board.
11
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
7.3. Removal of the Slot Block
1. Disconnect the couplers(J1, J3, J4, J5, J6, J7, J10, J34).
2. Remove the 4 screws and then remove the Slot Block.
7.4. Removal of the J-Board
1. Remove the HA Terminal Block and the HB Terminal Block.
(Reference to Removal of the HA-Board and the HB-Board)
2. Remove the Slot Block.
(Reference to Removal of the Slot Block)
3. Remove the 8 screws and then remove the J-Board.
5. Remove the 4 Hexagonal-Head screws and the 1 screw of
the HX-Board and then remove the HX-Board.
7.6. Removal of the PB-Board
7.5. Removal of the HX-Board
1. Remove the HA Terminal Block and the HB Terminal Block.
(Reference to Removal of the HA-Board and the HB-Board)
2. Remove the Slot Block.
(Reference to Removal of the Slot Block)
3. Remove the J-Board.
(Reference to Removal of the J-Board)
4. Remove the 6 screws and then remove the Slot Case.
1. Disconnect the couplers(PB30, PB31, PB32, PB33, PB34,
PB35, PB37, PB38).
2. Remove the 3 scewqs and then remove the PB-Board
Block.
3. Remove the 1 screw and then remove the PB-Board.
12
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
7.7. Removal of the D-Board
1. Remove the PB-Board Block.(Reference to Removal of the
PB-Board)
2. Disconnect the couplers(D1, D3, D5, D20, D25).
3. Remove the flexible cables from the couplers(D31, D32,
D33, D34).
4. Remove the 3 screws and then remove the D-Board.
7.8. Removal of the P-Board
7.8.1. Removal of the P(P-1)-Board
1. Disconnect the couplers(CN01, CN02, CN03).
2. Remove the 5 screws.(Top view)
3. Remove the 8 screws.(Bottom view)
1. Disconnect the couplers(P2, P5, P9, P10, P11, P12, P23,
P25, P30).
2. Remove the 8 screws and then remove the P-Board.
4. Remove the P(P-1)-Board from the 6 molding props.
13
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
7.8.2. Removal of the P(P-2)-Board
1. Disconnect the couplers(CN05, CN06, CN08).
2. Remove the 5 screws.(Top view)
3. Remove the 8 screws.(Bottom view)
Note:
· When assembling the P(P-1)-Board and the P(P-2)Board, the position of each hole of the insulation
sheets(A, B, C, D) is set to the position of each hole of
the P(P-1)-Board and the P(P-2)-Board and then
assemble them. (
marks indicate setting positions.)
4. Remove the P(P-2)-Board from the 6 molding props.
14
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
7.9. Removal of the SU-Board and
the SD-Board
1. Disconnect the couplers(SC45, SC46).
2. Remove the each 4 screws.
3. Slide the SU-Board and the SD-Board to the left (arrow1).
4. Disconnect the coupler(SU45).
5. Remove the flexible cables from the couplers(SU1, SU2,
SU3, SU4) and then remove the SU-Board.
6. Disconnect the coupler(SD46).
7. Remove the flexible cables from the couplers(SD1, SD2,
SD3, SD4) and then remove the SD-Board.
7.10. Removal of the SC-Board
1. Disconnect the couplers(PB31, PB32).
2. Remove the each 4 screws and then remove the Fan Block
(C).
3. Slide the SU-Board and the SD-Board to the left.
(Refarence to Removal of the SU-Board and the SD-Board)
4. Disconnect the couplers(SC2, SC20, SC23).
5. Remove the 10 screws of the SC-Board and slide the SCBoard in the direction of the arrow (A) and then remove the
SC-Board.
Note:
Remove the SC-Board not to damage the flexible cables
of the SU-Board and the SD-Board, parts on the SCBoard.
15
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
7.11. Removal of the SS2-Board and
the SS3-Board
1. Disconnect the coupler(SS23).
2. Remove the flexible cables from the couplers(SS51, SS52).
3. Disconnect the coupler(SS27).
4. Remove the flexible cables from the couplers(SS57, SS58).
5. Remove the each 3 screws and then remove the SS2-
Board and the SS3-Board.
7.13. Removal of the H3-Board (L,
R)
1. Remove the each 2 screws and then remove the Speaker
Terminal Blocks (L, R).
7.12. Removal of the SS-Board
1. Disconnect the couplers(PB35, PB38).
2. Remove the 4 screws and then remove the Fan Block (D).
3. Disconnect the couplers(SS11, SS12, SS23, SS27, SS34,
SS35, SS42, SS44).
4. Remove the flexible cables from the couplers(SS53, SS54,
SS55, SS56).
5. Remove the 10 screws of the SS-Board and slide the SSBoard in the direction of the arrow (B) and then remove the
SS-Board.
Note:
Remove the SS-Board not to damage the flexible cables
of the Plasma Panel and parts on the SS-Board.
2. Disconnect the coupler(H37).
3. Remove the 3 screws (K) and then remove the H3-Board.
16
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
7.14. Removal of the C1, C2, C3, C4,
C5 and the C6-Board
1. Remove the each 4 screws and then remove the Fan
Blocks (A, B).
2. Remove the each 2 screws and then remove the Speaker
Terminal Blocks (L, R).
7.14.1. Removal of the C1-Board
1. Remove the flexible cable from the coupler(C10).
2. Disconnect the coupler(C11).
3. Remove the 8 screws and then remove the flexible cables
from the couplers(CA1, CA2, CA3, CA4).
4. Remove the 6 screws and then remove the C1-Board.
7.14.2. Removal of the C2-Board
1. Remove the flexible cables from the couplers(C20, C21,
C24, C25).
2. Disconnect the couplers(C22, C23).
3. Remove the 6 screws and then remove the flexible cables
from the couplers(CA5, CA6, CA7).
4. Remove the 6 screws and then remove the C2-Board.
7.14.3. Removal of the C3-Board
1. Remove the flexible cable from the coupler(C31).
2. Disconnect the couplers(C33, C35).
3. Remove the 8 screws and then remove the flexible cables
from the couplers(CA8, CA9, CA10, CA11).
4. Remove the 6 screws and then remove the C3-Board.
17
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
7.14.4. Removal of the C4-Board
1. Remove the flexible cable from the coupler(C41).
2. Disconnect the couplers(C42, C43, C44).
3. Remove the 8 screws and then remove the flexible cables
from the couplers(CB8, CB9, CB10, CB11).
4. Remove the 6 screws and then remove the C4-Board.
7.14.5. Removal of the C5-Board
1. Remove the flexible cables from the couplers(C50, C51,
C54, C55).
2. Disconnect the couplers(C52, C53).
3. Remove the 6 screws and then remove the flexible cables
from the couplers(CB5, CB6, CB7).
4. Remove the 6 screws and then remove the C5-Board.
7.14.6. Removal of the C6-Board
1. Remove the flexible cable from the coupler(C60).
2. Disconnect the coupler(C61).
3. Remove the 8 screws and then remove the flexible cables
from the couplers(CB1, CB2, CB3, CB4).
4. Remove the 6 screws and then remove the C6-Board.
7.15. Removal of the Fan
1. Disconnect the couplers(PB31, PB32, PB33, PB34, PB35,
PB37, PB38).
2. Remove the each 4 screws and then remove the Fan
Blocks(A, B, C, D).
18
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
7.15.1. Removal of the Fan (Middle/R)
1. Remove the 4 screws and then remove the Fan (Middle/R).
7.15.2. Removal of the Fan (Big) and the
Fan (Middle/L)
1. Remove the 4 screws and then remove the Fan (Big).
2. Remove the 4 screws and then remove the Fan (Middle/L).
7.15.4. Removal of the Fan (SC/SS) on the
SS-Board side
1. Remove the each 4 screws and then remove the Fans (SC/
SS).
7.16. Removal of the Escutcheon
1. Disconnect the couplers(J34, SS34).
2. Remove the 13 screws.
7.15.3. Removal of the Fan (SC/SS) on the
SC-Board side
1. Remove the each 4 screws and then remove the Fans
(SC/SS).
3. Pull the bottom of the Escutcheon in the direction of the
arrow1 and lift up the Escutcheon in the direction of the
arrow2 and then remove the Escutcheon.
19
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
4. Remove the 2 screws(L) and then remove the S1-Board
Block and then Power Button Block.
5. Remove the 2 screws(M) amd then remove the V1-Board
and the Hinge Button Block.
7.17. Removal of the S1-Board and
the V1-Board
1. Remove the Escutcheon.
(Refernce to Removal of Escutcheon)
2. Remove the 2 screws (N) and then remove the S1-Board
Block.
3. Remove the 1 screw (P) and then remove the S1-Board.
4. Remove the 2 screws (R) and then remove the V1-Board.
5. Disconnect the coupler(S34) and then remove the S1-
Board.
6. Disconnect the coupler(V34) and then remove the V1-
Board.
20
7.18. Removal of the Plasma Panel
1. Disconnect the couplers(PB31, PB32, PB33, PB34, PB35,
PB37, PB38).
2. Remove the each 4 screws and then remove the Fan
Blocks(A, B, C, D).
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
9. Disconnect the couplers(P2, P9, P11, P12, P23).
10. Remove the 8 screws and then remove the P-Board.
11. Remove the each 2 screws and then remove the Speaker
Terminal Blocks (L, R).
3. Remove the each 2 screws and then remove the
Reinforcement Angles (L, R).
4. Remove the each 2 screws and then remove the
Connection Plate (A, B, C, D).
5. Remove of the Slot Block.
(Reference to Removal of the Slot Block).
6. Disconnect the couplers(D20, D25, PB30).
7. Remove the flexible cables from the couplers(D31, D32,
D33, D34).
8. Remove the 7 screws and then remove the PB-Board Block
and D-Board.
12. Disconnect the couplers(SC45, SC46).
13. Remove the each 4 screws and then slide the SU-Board
and the SD-Board to the left (arrow 1).
14. Remove the flexible cables from the couplers(SU1, SU2,
SU3, SU4, SD1, SD2, SD3, SD4) and then remove the SUBoard and the SD-Board.
21
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
15. Remove the 10 screws and then remove the SC-Board.
22. Disconnect the couplers(C11, C33).
23. Remove the flexible cables from the couplers(C10, C21,
C24, C25).
24. Remove the each 6 screws and then remove the C1-Board,
the C2-Board and the C3-Board.
16. Remove the SS2-Board and the SS3-Board.
(Reference to Removal of the SS2-Board and the SS3-
Board).
17. Disconnect the couplers(SS34, SS35, SS42, SS44).
18. Remove the flexible cables from the couplers(SS53, SS54,
SS55, SS56).
19. Remove the 10 screws and then remove the SS-Board.
20. Remove the 22 screws.
21. Remove the flexible cables from the couplers(CA1, CA2,
CA3, CA4, CA5, CA6, CA7, CA8, CA9, CA10, CA11).
25. Remove the 22 screws.
26. Remove the flexible cables from the couplers(CB1, CB2,
CB3, CB4, CB5, CB6, CB7, CB8, CB9, CB10, CB11).
27. Disconnect the couplers(C43, C61).
28. Remove the flexible cables from the couplers(C41, C50,
C54, C55).
22
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
29. Remove the each 6 screws and then remove the C4-Board,
the C5-Board and the C6-Board.
30. Remove the each 2 screws and then remove the Shield
Plate and the Angle.
31. Remove the 4 screws and then remove the AC Inlet Block.
arrow2 and then remove the Plasma Panel.
32. Remove the each 2 screws and then remove the Shield
Plates (A, B).
33. Remove the each 3 screws and then remove the Cable
Holders (A, B) and the flexible cables.
34. Remove the 13 screws of the Escutcheon.
35. Lift up the bottom of the Plasma Panel in the direction of the
arrow1 and pull the Plasma Panel in the direction of the
23
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
8 Location of Lead Wiring
24
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
25
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
9 Adjustment Procedure
9.1. Driver Set-up
9.1.1. Item / Preparation
1. Input a white signal of the RGB signal generator.
2. Set the picture adjustment items as follows.
· Picture menu : Standard
· Color temperature : Normal
· Picture : 25
· Aspect : Full
9.1.2. Adjustments
Adjust driver section voltages referring the panel data on the panel data label.
Caution
1. First perform Vsus voltage adjustment.
2. Confirmation of Vscn voltage should be performed after confirmation of Vad voltage adjustment.
When Vad = -85V, Voltage of Vscn is 35V ± 4V.
26
9.2. Initialization Pulse Adjust
1. Input a white signal to plasma video input.
2. Set the picture adjustment items as follows.
· Picture menu : Standard
· Color temperature : Normal
· Picture : 25
· Aspect : Full
3. Connect Oscilloscope to TPSC1 (T1) and check for 20 ± 15µ Sec.
4. Connect Oscilloscope to TPSC1 (T2) and adjust VR6602 for 155 ± 10µ Sec.
Test point Volume Level
T1 TPSC1 (SC) Fixed 20 ± 15µ Sec
T2 TPSS1 (SS) VR6602(SC) 155 ± 10µ Sec
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
9.3. P.C.B. (Printed Circuit Board) Remove
9.3.1. Caution
1. To remove P.C.B., wait 1 minute after power was off for discharge from electrolysis capacitors.
9.3.2. Quick adjustment after P.C.B. Remove
P.C.B. Name Test Point Voltage Volume Remarks
P Board Vsus TPVSUS 182V ± 2V VR351 (P) *
SC Board Vad TPVAD -85V ± 1V VR6801 (SC)
Vscn TPVSCN Vad + 120V ± 4V Fixed
Vset TPVSET 230V ± 7V Fixed
Vbk TPVBK 140V ± 1V VR6802 (SC)
SS Board Ve TPVE 150V ± 2V VR6250 (SS) *
Vda TPVDA 75V ± 1V Fixed
D, J Board White balance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals
*See the Panel label.
Caution:
Absolutely do not reduce Vsus below Ve not to damage the P.C.B.
27
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
9.4. Adjustment Volume Location
9.5. Test Point Location
28
10 Service mode
10.1. CAT (computer Aided Test) mode
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
To exit the CAT mode, access the ID mode and switch off the main power.
10.1.1. IIC mode
Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button
on the remote control.
Subject and item are mentioned on “IIC mode structure”.
To exit the IIC mode, press the R button on the remote control.
29
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK
10.1.2. CD mode
Select the CD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button
on the remote control more than 5 seconds.
Micom software version (IC9702), this version can be upgrade by
1. replace of new version IC
2. Loading the new version software from loader tool, TZSC07036.
Memory data change
To exit the CD mode, press the R button on the remote control.
10.1.3. SD mode
Select the SD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button
on the remote control.
To exit the SD mode, press the R button on the remote control.
30
Loading...