Panasonic TH-50PV500E Schematic
Specifications
A
A
A
A
V
V
V
ORDER NO.PCZ0505059C2
Digital High Definition Plasma Television
TH-50PV500E
TH-50PV500B
GP8DE Chassis
Power Source
Power Consumption
Plasma Display panel
Drive method
Aspect Ratio 16:9
Contrast Ratio 3000:1
Visible screen size 127 cmV
(No. of pixels) 1,106 mm (W) × 622 mm (H) × 1,269 mm (diagonal)
Sound
Speaker Woofer (Ø 80 mm) × 2 pcs, Tweeter (16 mm × 73 mm) × 4 pcs
Audio Output 26 W (13 W + 13 W ), 10% THD
Headphones M3 (3.5 mm) Jack × 1
Applicable signals
Colour System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 480i(60Hz), 480p(60Hz), 576i(50Hz), 576p(50Hz), 720p(50Hz), 720p(60Hz), 1080i(50Hz), 1080i(60Hz)
PC signals
Receiving Systems /
Band name (PV500E)
C 220-240 V, 50 / 60 Hz
verage use : 461 W (TH-50PV500E)
verage use : 470 W (TH-50PV500B)
Standby condition : 0.3 W (TH-50PV500E)
Standby condition : 0.3 W (Without DVB Timer programmes) (TH-50PV500B)
Standby condition : 16 W (With DVB Timer programmes) (TH-50PV500B)
Ctype
1,049,088 (1,366 (W) × 768 (H)) [4,098 × 768 dots]
GA, SVGA, XGA
SXGA (compressed)
Horizontal scanning frequency 31 - 69 kHz
ertical scanning frequency 59 - 86 Hz
PAL B, G, H, SECAM B, G SECAM L / L’
VHF E2 - E12
VHF A - H (ITALY) UHF E21 - E69
CATV (S01 - S05) CATV S1 - S10 (M1 - M10)
CATV S11 - S20 (U1 - U10) CATV S21 - S41 (Hyperband)
HF H1 - H2 (ITALY)
© 2005 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
V
TH-50PV500E / TH-50PV500B
Receiving Systems /
Band name (PV500B)
Aerial - Rear UHF / VHF (PV500E)
Operating Conditions Temperature : 0 °C - 40 °C
Connection Terminals
AV1 (Scart connecter) 21 Pin terminal (Audio / Video in, Audio / Video out, RGB in)
AV2 (Scart connecter) 21 Pin terminal (Audio / Video in, Audio / Video out, S-Video in, Q-Link)
AV3 VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W)
AV4 (Scart connecter) 21 Pin terminal (Audio / Video in, Audio / Video out, RGB in, S-Video in, Q-Link)
Others COMPONENT Y
Output AUDIO L - R RCA PIN Type × 2 0.5 Vrms (high impedance)
Dimensions ( W × H × D ) 1,327 mm × 843 mm × 138 mm
Weight 52.0 kg Net
PAL D, K, SECAM D, K
VHF R1 - R2
HF R3 - R5
VHF R6 - R12 UHF E21 - E69
PAL 525/60
Playback of NTSC tape from some PAL Video recorders (VCR)
M.NTSC
Playback from M. NTSC Video recorders (VCR)
NTSC (AV input only)
Playback from NTSC Video recorders (VCR)
PAL I
UHF E21 - 68.
PAL 525/60
Playback of NTSC tape from some PAL Video recorders (VCR) or NTSC disc playback from DVD
player and recorder.
DVB
Digital terrestrial services via UHF aerial input.
M.NTSC
Playback from M.NTSC Video recorders (VCR).
NTSC (AV input only)
Playback from NTSC Video recorders (VCR).
UHF (PV500B)
Humidity : 20 % - 80 % RH (non-condensing)
S-VIDEO Mini DIN 4-pin Y:1.0 Vp-p (75 W) C:0.286 Vp-p (75 W)
AUDIO L - R RCA PIN Type × 2 0.5 Vrms
1.0 Vp-p (including synchronization)
P
B,PR
±0.35 Vp-p
HDMI TYPE A Connector
PC HIGH-DENSITY D-SUB 15PIN R,G,B / 0.7 Vp-p (75 W)
HD, VD / TTL Level 2.0 - 5.0 Vp-p (high impedance)
AUDIO L - R RCA PIN Type × 2 0.5 Vrms
Card slot SD CARD slot × 1, PC CARD slot × 1
Notes:
·
· Design and Specifi cations are subject to change without notice. Weight and Dimensions shown are approximate.
· ·
·
· This equipment complies with the EMC standards listed below.
· ·
EN55013, EN61000-3-2, EN61000-3-3, EN55020, EN55022, EN 55024.
2
TH-50PV500E / TH-50PV500B
CONTENTS
Page Page
1 Applicable signals 5
2 Safety Precautions
2.1. General Guidelines
2.2. Touch-Current Check
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
4 About lead free solder (PbF)
5 Service Hint
6 Plasma panel replacement method
6.1. Remove the Back cover.
6.2. Remove the P-Board.
6.3. Remove the PB-Board
6.4. Remove the D-Board
6.5. Remove the rear terminal cover
6.6. Remove the metal frame
6.7. Remove the XV-Board (PV500B only)
6.8. Remove the DG-Board
6.9. Remove the H-Board and TA-Board
6.10. Remove the PA-Board
6.11. Remove the Z-Board
6.12. Remove the SU-Board
6.13. Remove the SD-Board
6.14. Remove the SC-Board
6.15. Remove the SS2-Board
6.16. Remove the SS3-Board
6.17. Remove the SS-Board
6.18. Remove the Fan
6.19. Remove the C1-Board
6.20. Remove the C2-Board
6.21. Remove the C3-Board
6.22. Remove the Speaker L, R
6.23. Remove the stand brackets.
6.24. Remove the C4-Board
6.25. Remove the C5-Board
6.26. Remove the C6-Board
6.27. Remove the front bracket
6.28. Remove the G-Board
6.29. Remove the GK-Board
6.30. Remove the GS-Board and SD-Module
6.31. Remove the K-Board
6.32. Remove the S-Board
6.33. Remove the Plasma panel section from the Front frame
(glass)
6.34. Replace the plasma panel (finished).
7 Location of Lead Wiring
7.1. Lead of Wiring (1)
7.2. Lead of Wiring (2)
7.3. Lead of Wiring (3)
7.4. Lead of Wiring (4)
7.5. Lead of Wiring (5)
7.6. Lead of Wiring (6)
10
10
10
10
10
11
11
11
11
12
12
12
12
13
13
14
14
14
14
15
15
15
15
16
16
17
17
17
17
18
18
18
19
19
19
20
20
21
22
23
24
25
7.7. Lead of Wiring (7)
6
8 Self Check
6
6
7
8
9
8.1. Power LED Blinking timing chart
8.2. No Power
8.3. No Picture
8.4. Local screen failure
9 Service Mode Function
9.1. How to enter SERVICE 1
9.2. How to enter SERVICE 2
9.3. Option Description
10 Adjustment Procedure
10.1. Driver Set-up
10.2. Initialization Pulse Adjust
10.3. P.C.B. (Printed Circuit Board) exchange
10.4. Adjustment Volume Location
10.5. Test Point Location
11 Adjustment
11.1. PAL panel white balance adjustment
11.2. 1080i white balance adjustment
11.3. Sub bright adjustment
11.4. ABL adjustment
11.5. TEXT Vref Auto Adjustment
12 Hotel mode
13 Conductor View
13.1. P-Board
13.2. PA-Board
13.3. PB-Board
13.4. H-Board
13.5. DG-Board
13.6. TA-Board
13.7. DV-Board
13.8. XV-Board (PV500B)
13.9. Z-Board
13.10. D-Board
13.11. C1-Board
13.12. C2-Board
13.13. C3-Board
13.14. C4-Board
13.15. C5-Board
13.16. C6-Board
13.17. SC-Board
13.18. SU-Board
13.19. SD-Board
13.20. SS-Board
13.21. G-Board
13.22. GK, GS, K and S-Board
14 Block and Sche matic Diagram
14.1. Schematic Diagram Notes
14.2. Main Block Diagram
14.3. P-Board Block Diagram
14.4. P-Board (1 of 2) Schematic Diagram
26
27
28
28
29
30
31
31
31
33
35
35
36
37
37
37
38
38
39
39
40
41
42
43
43
46
47
48
50
52
53
54
56
57
60
61
62
63
64
65
66
69
70
71
73
74
75
75
76
77
78
3
TH-50PV500E / TH-50PV500B
14.5. P-Board (2 of 2) Schematic Diagram 79
14.6. PA and PB-Board Block Diagram
14.7. PA-Board Schematic Diagram
14.8. PB-Board Schematic Diagram
14.9. H and TA-Board Block Diagram
14.10. G, GK, GS, K and S-Board Block Diagram
14.11. H-Board (1 of 2) Schematic Diagram
14.12. H-Board (2 of 2) Schematic Diagram
14.13. G-Board Schematic Diagram
14.14. GK, K, S, and TA-Board Schematic Diagram
14.15. GS-Board Schematic Diagram
14.16. DG-Board (1 of 2) Block Diagram
14.17. DG-Board (2 of 2) Block Diagram
14.18. DG-Board (1 of 13) Schematic Diagram
14.19. DG-Board (2 of 13) Schematic Diagram
14.20. DG-Board (3 of 13) Schematic Diagram
14.21. DG-Board (4 of 13) Schematic Diagram
14.22. DG-Board (5 of 13) Schematic Diagram
14.23. DG-Board (6 of 13) Schematic Diagram
14.24. DG-Board (7 of 13) Schematic Diagram
14.25. DG-Board (8 of 13) Schematic Diagram
14.26. DG-Board (9 of 13) Schematic Diagram
14.27. DG-Board (10 of 13) Schematic Diagram
14.28. DG-Board (11 of 13) Schematic Diagram
14.29. DG-Board (12 of 13) Schematic Diagram
14.30. DG-Board (13 of 13) Schematic Diagram
14.31. DV-Board Block Diagram
14.32. DV-Board Schematic Diagram
14.33. XV-Board Block Diagram (PV500B)
14.34. XV-Board (1 of 5) Schematic Diagram (PV500B)
14.35. XV-Board (2 of 5) Schematic Diagram (PV500B)
14.36. XV-Board (3 of 5) Schematic Diagram (PV500B)
14.37. XV-Board (4 of 5) Schematic Diagram (PV500B)
14.38. XV-Board (5 of 5) Schematic Diagram (PV500B)
14.39. Z-Board Block Diagram
14.40. Z-Board (1 of 2) Schematic Diagram
14.41. Z-Board (2 of 2) Schematic Diagram
14.42. D-Board Block Diagram
14.43. D-Board (1 of 6) Schematic Diagram
14.44. D-Board (2 of 6) Schematic Diagram
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
14.45. D-Board (3 of 6) Schematic Diagram
14.46. D-Board (4 of 6) Schematic Diagram
14.47. D-Board (5 of 6) Schematic Diagram
14.48. D-Board (6 of 6) Schematic Diagram
14.49. C1, C2, C5 and C6-Board Block Diagram
14.50. C3 and C4-Board Block Diagram
14.51. C1-Board (1 of 2) Schematic Diagram
14.52. C1-Board (2 of 2) Schematic Diagram
14.53. C2-Board (1 of 2) Schematic Diagram
14.54. C2-Board (2 of 2) Schematic Diagram
14.55. C3-Board (1 of 2) Schematic Diagram
14.56. C3-Board (2 of 2) Schematic Diagram
14.57. C4-Board (1 of 2) Schematic Diagram
14.58. C4-Board (2 of 2) Schematic Diagram
14.59. C5-Board (1 of 2) Schematic Diagram
14.60. C5-Board (2 of 2) Schematic Diagram
14.61. C6-Board (1 of 2) Schematic Diagram
14.62. C6-Board (2 of 2) Schematic Diagram
14.63. SC-Board Block Diagram
14.64. SC-Board (1 of 2) Schematic Diagram
14.65. SC-Board (2 of 2) Schematic Diagram
14.66. SU-Board Block Diagram
14.67. SU-Board (1 of 2) Schematic Diagram
14.68. SU-Board (2 of 2) Schematic Diagram
14.69. SD-Board Block Diagram
14.70. SD-Board (1 of 2) Schematic Diagram
14.71. SD-Board (2 of 2) Schematic Diagram
14.72. SS, SS2 and SS3-Board Block Diagram
14.73. SS-Board (1 of 2), SS2 and SS3-Board Schematic
Diagram
14.74. SS-Board (2 of 2) Schematic Diagram
15 Parts Locatio n & Mech anica l Replaceme n t Parts List
15.1. Parts Location
15.2. Packing Exploded Views (1)
15.3. Packing Exploded Views (2)
15.4. Packing Exploded Views (3)
15.5. Mechanical Replacement Parts List
16 Elect ri cal Replacement Parts List
16.1. Replacement Parts List Notes
16.2. Electrical Replacement Parts List
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
149
150
151
152
153
155
155
156
4
1 Applicable signals
TH-50PV500E / TH-50PV500B
5
TH-50PV500E / TH-50PV500B
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUGH CURRENT) expressed as voltage U
For a. c.: U
For d. c.: U
= 35 V (peak) and U2= 0.35 V (peak);
1
=1.0V,
1
Note:
The limit value of U
= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
2
mA d. c.
The limit value U
= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
1
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
and U2, does not exceed the following values:
1
Figure 1
6
TH-50PV500E / TH-50PV500B
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
7
TH-50PV500E / TH-50PV500B
4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
· ·
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
· ·
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
· ·
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
stamped on the back of PCB.
8
5 Service Hint
TH-50PV500E / TH-50PV500B
Board Name Function Board Name Function
P Power Supply C1 Data Driver (Up Left)
PA DC-DC Converter, Power SOS C2 Data Driver (Up Center)
PB Audio Power, Fan control C3 Data Driver (Up Right)
H AV Terminal, AV Switch C4 Data Driver (Down Right)
TA Tuner C5 Data Driver (Down Center)
XV ATSC Interface C6 Data Driver (Down Left)
DV HDMI Interface
None serviceable.
DV-Board should be exchanged for service.
DG Digital Signal Processor SS Sustain Drive
Z Speaker out, Audio AMP SS2 Sustain Connector (Up)
D Format Converter, Plasma Ai Processor SS3 Sustain Connector (Down)
K Remote receiver, OPT G PC Card Slot, Front Terminal
S Power Switch GS SD Card Slot
SD-M SD Module (MPEG4/PHOTO view, SD recording)
None serviceable.
SD Module should be exchanged for service.
SC Scan Drive
SU Scan out (Up)
SD Scan out (Down)
GK Key Switch
9
TH-50PV500E / TH-50PV500B
6 Plasma panel replacement method
6.1. Remove the Back cover.
1. See Service Hint (Section 5).
6.2. Remove the P-Board.
Caution:
To remove P.C.B., wait 1 minute after power was off for
discharge from electrolisis capacitors.
1. Disconnect the couplers (P2, P5, P9, P10, P11, P12, P23,
P25 and P30).
2. Remove the screws (×5
) and remove the P-Board.
6.4. Remove the D-Board
6.3. Remove the PB-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PB5, PB7, PB30, PB33 and
PB34).
3. Remove the screws (×3
metal frame.
4. Remove the screws (× 4
) and remove the PB-Board
) and remove the PB-Board.
1. Remove the PB-Board.
2. Disconnect the couplers (D3, D5, D20 and D25) and
3. Disconnect the flexible cables (D33 and D34).
4. Remove the screws (×4
) and remove the D-Board.
10
6.5. Remove the rear terminal
cover
TH-50PV500E / TH-50PV500B
6.7. Remove the XV-Board
(PV500B only)
1. Remove the screws (×4 ), and rhe screw (×7 ).
2. Remove the rear terminal cover.
6.6. Remove the metal frame
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (D3, D5, H7, P10 and PB7) and
relay connector (SP-R, SP-L).
3. Remove the screws (×4
) remove the metal frame.
1. Disconnect the antenna cable.
2. Remove the screws (×5
3. Remove the XV-Board unit.
(Be careful the couplers (XV22 and DG22) when remove
the XV-Board unit.)
4. Remove the screws (×5
5. Remove the XV-Board.
).
).
6.8. Remove the DG-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (DG3 and DG5).
3. Disconnect the flexible cables (DG1, DG2 and DG20).
4. Remove the screws (×2
) and remove the DG-Board.
11
TH-50PV500E / TH-50PV500B
6.9. Remove the H-Board and TABoard
1. Unlock the cable clampers to free the cable.
2. Remove the screws (×2
3. Disconnect the couplers (H52 and H53).
4. Disconnect the flexible ables (H1, H2, H30 and H50).
5. Remove the screws (×3
) and remove the TA-Board.
) and remove the H-Board.
6.11. Remove the Z-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (Z2).
3. Disconnect the flexible cable (Z50).
4. Remove the screws (×2
) and remove the Z-Board.
6.10. Remove the PA-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PA7 and PA10).
3. Disconnect the flexible cables (PA20 and PA30).
4. Remove the screws (×4
) and remove the PA-Board.
6.12. Remove the SU-Board
1. Remove the screws (×3 ).
2. Slide the SU-Board to the left to disconnect from a coupler
(SC41 - SU41) on the SC-Board and remove a coupler
(SU45 or SC45).
12
TH-50PV500E / TH-50PV500B
3. Remove the flexible cables (SU1, SU2, SU3, SU4)
connected to the SU-Board, and remove the SU-Board.
6.13. Remove the SD-Board
3. Remove the flexible cables (SD1, SD2, SD3, SD4)
connected to the SD-Board, and remove the SD-Board.
6.14. Remove the SC-Board
1. Remove the screws (×3 ).
2. Slide the SD-Board to the left to disconnect from a coupler
(SC42 - SD42) on the SC-Board and remove a coupler
(SD46 or SC46).
1. Disconnect the couplers (SC2, SC20, SC23)
2. Remove the screws (×9
) and remove the SC-Board.
13
TH-50PV500E / TH-50PV500B
6.15. Remove the SS2-Board
6.17. Remove the SS-Board
1. Disconnect the coupler (SS23) and disconnect the flexible
cable (SS55).
2. Remove the screws (×2
) and remove the SS2-Board.
6.16. Remove the SS3-Board
1. Disconnect the coupler (SS22) and disconnect the flexible
cable (SS56).
2. Remove the screws (×2
) and remove the SS3-Board.
1. Remove the SS2-Board and SS3-Board.
2. Disconnect the couplers (SS11, SS12, SS34, SS35, SS42
and SS44).
3. Disconnect the flexible cables (SS51, SS52, SS53 and
SS54).
4. Remove the screws (×7
) and remove the SS-Board.
6.18. Remove the Fan
1. Remove the screws (×3 each) remove the fan and
disconnect the relay coupler.
14
6.19. Remove the C1-Board
TH-50PV500E / TH-50PV500B
6.21. Remove the C3-Board
1. Remove the fan.
2. Remove the flexible cables holder fastening screws (×6
) and disconnect the flexible cables (CA1~CA3).
3. Disconnect the flexible cable (C10) and disconnect the
coupler (C11).
4. Remove the screw (×5
) and remove the C1-Board.
1. Remove the fan.
2. Remove the flexible cables holder fastening screws (×8
) and disconnect the flexible cables (CA8~CA11).
3. Disconnect the flexible cable (C31) and disconnect the
couplers (C33, C35).
4. Remove the screws (×5
) and remove the C3-Board.
6.20. Remove the C2-Board
1. Remove the fan.
2. Remove the flexible cables holder fastening screws (×8
) and disconnect the flexible cables (CA4~CA7).
3. Disconnect the Flexible cables (C20, C21, C24, C25) and
disconnect the couplers (C22, C23).
4. Remove the screws (×5
) and remove the C2-Board.
6.22. Remove the Speaker L, R
1. Remove the screws(×4 ) and remove the Speaker cover
L, R.
15
TH-50PV500E / TH-50PV500B
2. Remove the screws (×3 ) and disconnect the relay
connector L, R.
3. Remove the Speaker L, R.
6.23. Remove the stand brackets.
1. Remove the plasma panel section from the servicing stand
and lay on a flat surface such as a table (covered), with the
plasma panel surface facing downward.
Spread a soft cloth or similar on the table for protection, so
the panel surface is not scratched.
2. Remove the stand bracket (left, right) fastening screws (×4
each) and remove the stand brackets (left, right).
6.24. Remove the C4-Board
1. Remove the flexible cables holder fastening screws (×8
) and disconnct the flexible cables (CB8~CB11).
2. Release the speaker cables from clampers.
3. Disconnect the flexible cables (C41) and disconnect the
couplers (C42, C43, C44).
4. Remove the screws (×5
) and remove the C4-Board.
16
6.25. Remove the C5-Board
TH-50PV500E / TH-50PV500B
6.27. Remove the front bracket
1. Remove the flexible cables holder fastening screws (×8
) and disconnect hte flexible cables (CB4~CB7).
2. Release the speaker cables from clampers.
3. Disconnect the flexible cables (C50, C51, C54, C55) and
disconnect the couplers (C52, C53).
4. Remove the screws (×5 ) and remove the C5-Board.
6.26. Remove the C6-Board
1. Remove the flexible cables holder fastening screws (×6
) and disconnect the flexible cables (CB1~CB3).
2. Release the speaker cables from clampers.
3. Disconnect the flexible cables (C60) and disconnect the
coupler (C61).
4. Remove the screws (×5 ) and remove the C6-Board.
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (G2) and the flexible cables (G11
and G51).
3. Remove the screws (×7
) and remove the front bracket.
6.28. Remove the G-Board
1. Remove the front bracket.
2. Disconnect the coupler (G3).
3. Remove the screws (×3
cover.
4. Remove the screws (×5
) and remove the G-Board
) and remove the G-Board unit.
5. Remove the screws (×3 ) and remove the G-Board.
17
TH-50PV500E / TH-50PV500B
6.29. Remove the GK-Board
1. Remove the G-Board.
2. Remove the GK-Board.
6.30. Remove the GS-Board and SDModule
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (H52) and the flexible cable (G11).
3. Remove the screws (×2
(×2).
4. Remove the SD-Unit.
5. Remove the screw (×1
6. Remove the SD-Metal.
) and remove the grommets
).
9. Disconnect the coupler (GS52) and the flexible cable
(GS12).
10. Remove the screws (×2
11. Remove the GS-Board and SD-Module.
).
6.31. Remove the K-Board
1. Disconnect the couplers (K1).
2. Remove the screws (×2
3. Remove the K-Board.
) and remove the grommet (×1).
7. Remove the screw (×1 ).
8. Remove the SD-Module cover.
18
6.32. Remove the S-Board
1. Remove the screw (×2 ).
2. Disconnect the couplers (S1).
3. Remove the screws (×2
) and remove the S-Board.
TH-50PV500E / TH-50PV500B
3. For leaving the plasma panel from the front frame, pull the
bottom of the front frame forward, lift, and remove.
6.33. Remove the Plasma panel
section from the Front frame
(glass)
1. Remove the front frame and the plasma panel fastening
screw (×8
2. Remove the front frame and the stand brackets fastening
screw (×6
).
).
6.34. Replace the plasma panel
(finished).
1. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
2. Attach the C1-Board and the C2-Board, connect the flexible
cables (×7) from the Plasma panel to the C1-Board and C2Board, and fix the flexible cable holders.
3. Attach the Hooks (left, right) and fit the stand brackets (left,
right) to the new plasma panel.
4. Place the plasma panel section on the servicing stand.
5. Attach the front frame and the each P.C.Board and so on,
to the new plasma panel.
* When fitting the front frame, be careful not to allow
any debris, dust or handling residues to remain
between the front glass and plasma panel.
19
TH-50PV500E / TH-50PV500B
7 Location of Lead Wiring
7.1. Lead of Wiring (1)
MAKE WIRE DRESSING AS IF ILLUSTRATED BELOW.
NOTES:
1. CONNECT CONNECTORS SURELY.
2. KEEP MODERATE SLACK IN WIRES NOT TO GIVE ANY STRESS TO CONNECTORS.
3. MANAGE THE WIRES THAT ARE AROUND ELECTRIC FAN FAN ASSEMBLIES NOT TO TOUCH A BLADE OF
ELECTRIC FAN NOR EDGE OF FAN MOUNT METAL.
4. MANAGE P2 WIRE AND P23 WIRE SO THAT THEY PASS THE TOP SIDE OF P-PCB.
20
7.2. Lead of Wiring (2)
MAKE WIRE DORESSING AS IF ILLUSTRATD BELOW.
NOTES:
1. CONNECT CONNECTORS SURELY.
2. KEEP MODERATE SLACK IN WIRES NOT TO GIVE ANY STRESS TO CONNECTORS.
3. CLAMP WIRES SURELY.
TH-50PV500E / TH-50PV500B
21
TH-50PV500E / TH-50PV500B
7.3. Lead of Wiring (3)
MAKE WIRE DRESSING AS IF ILLUSTRATED BELOW.
NOTES:
1. CONNECT CONNECTORS SURELY.
2. KEEP MODERATE SLACK IN WIRES NOT TO GIVE ANY STRESS TO CONNECTORS.
3. MANAGE THE WIRES THAT ARE AROUND ELECTRIC FAN ASSEMBLIES NOT TO TOUCH A BLADE OF ELECTRIC
FAN NOR EDGE OF FAN MOUNT METAL.
4. PLACE A SAG OF P10 WIRE IN THE TOP SIDE OF P-PCB.
22
TH-50PV500E / TH-50PV500B
7.4. Lead of Wiring (4)
MAKE WIRE DORESSING AS IF ILLUSTRATED BELOW.
NOTES:
1. CONNECT CONNECTORS SURELY.
2. KEEP MODERATE SLACK IN WIRES NOT TO GIVE ANY STRESS TO CONNECTORS.
3. MANAGE THE WIRES THAT ARE AROUND THE ELECTRIC FAN ASSEMBLIES NOT TO TOUCH A BLADE OF
ELECTRIC FAN NOR EDGE OF A FAN MOUNT METAL.
4. MANAGE WIRES NOT TO PRESS THE MC701 OF P-PCB WITH THEM.
5. PASS THE SS11 WIRE AND THE SS12 WIRE BETWEEN A M8 BOSS AND P-PCB, MANAGE THEM TO KEEP AWAY
FROM A M8 BOSS.
6. PAY ATTENTION NOT TO GIVE ANY LOAD TO THE MC701 OF P-PCB.
23
TH-50PV500E / TH-50PV500B
7.5. Lead of Wiring (5)
MAKE WIRE DRESSING AS IF ILLUSTRATED BELOW.
NOTES:
1. CONNECT CONNECTORS SURELY.
2. KEEP MODERATE SLACK IN WIRES NOT TO GIVE ANY STRESS TO CONNECTORS.
3. CONNECT FFC SURELY.
PAY ATTENTION NOT TO MAKE WRONG DIRECTION CONNECTION NOR INCOMPLETE CONNECTION.
4. BEFORE CONNECTING FLEXIBLE CABLES, CLEAN CONNECTION PARTS BY BLOWING AIR.
24
7.6. Lead of Wiring (6)
CONNECT SPAKER WIRES, THEN HAUL THEIR SAG TO THE DIRECTION OF TUNER UNIT.
TH-50PV500E / TH-50PV500B
25
TH-50PV500E / TH-50PV500B
7.7. Lead of Wiring (7)
1. Make wire dressing as if illustrated below.
Keep moderate slack in wires not give any stress to the connectors.
2. Fix a barrier to a glass holder bottom ass’y by a screw.
Handle a barrier not to protrude from the back end of a bottom shield.
Torque of the screw THEL035N should be 80 to 120 N
Screws of THEL035N are not reuseble.
cm.
26
8 Self Check
1. Self-Check is used to automatically check the bus lines and hexadecimal code of the TV set.
2. To get into the Self -Check mode press the Down (
time pressing the Information button on the remote control, and the screen will show :
) button on the customer controls at the front of the set, at the same
TH-50PV500E / TH-50PV500B
If the CCU ports have been checked and found to be incorrect or not located then “--” will appear in place of “O.K.”.
Display Ref.No. Description Board
MEM IC1107 EEPROM DG-Board
GC4P IC4054 Global Core Processor DG-Board
GC3FS IC4013 Global Core for Sub DG-Board
HAD IC4012 OSD RGB A/D DG-Board
AVSW1 IC2105 Video SW H-Board
AVSW2 IC3005 Audio SW H-Board
Tun1 TU001 Tuner TA-Board
VIF - - DAC1 IC1106 Ext. DAC DG-Board
DAC2 IC1116 Ext. DAC DG-Board
DAC3 IC3006 Ext. DAC H-Board
DAC4 - - MSP IC2106 Multi Sound Processor H-Board
SOUND IC2300 Sound Control Z-Board
PANEL IC9003 Convert Micom D-Board
IPC IC8013 PEAKS Life XV-Board
SDM SD-Module MPEG4/PHOTO view, SD recording SD-Module
HDMI IC5003 HDMI I/F Reciever DV-Board
ADV IC4005 10bit A/D DG-Board
27
TH-50PV500E / TH-50PV500B
8.1. Power LED Blinking timing chart
1. Subject
Information of LED Flashing timing chart.
2. Contents
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.
8.2. No Power
First check point
There are following 3 states of No Power indication by power LED.
1. No lit
2. Green is lit then turns red blinking a few seconds later.
3. Only red is lit.
1. No lit
28
8.3. No Picture
TH-50PV500E / TH-50PV500B
29
TH-50PV500E / TH-50PV500B
8.4. Local screen failure
Plasma display may have local area failure on the screen. Fig-1 is the possible defect P.C.B. for each local area.
Fig-1
30
Loading...