0-12 (PAL B AUST.)28-69 (PAL B AUST.)1-125 (USA CATV)
1-9 (PAL B N.Z.)13-57 (PAL D, K)C13-C49 (JAPAN)
1-12 (PAL/SECAM D)13-62 (NTSC M Japan)S21-S41 (HYPER)
1-12 (NTSC M Japan)14-69 (NTSC M USA)Z1-Z37 (CHINA)
2-13 (NTSC M USA)5A, 9A (AUST.)
Receiving ChannelsVHF 0 to 12PAL B
(PV500A)UHF 21 to 69PAL G
S’1 to S’3HYPER TUNER
S1 to S41(One tuner)
Aerial-RearUHF / VHF
Operating ConditionsTemperature: 0 °C - 40 °C
Humidity: 20 % - 80% RH (non-condensing)
Connection Terminals
AV1AUDIO L-RRCA PIN Type × 20.5 Vrms
InputVIDEORCA PIN Type × 11.0 Vp-p (75 W)
S VIDEOMINI DIN 4-PinY: 1.0 Vp-p (75 W) C: 0.286 Vp-p (75 W)
AV2AUDIO L-RRCA PIN Type × 20.5 Vrms
InputVIDEORCA PIN Type × 11.0 Vp-p (75 W)
COMPONENTY1.0 Vp-p (including synchronization)
PB/CB,PR/C
R
±0.35 Vp-p
AV3AUDIO L-RRCA PIN Type × 20.5 Vrms
InputVIDEORCA PIN Type × 11.0 Vp-p (75 W)
S VIDEOMINI DIN 4-PinY: 1.0 Vp-p (75 W) C: 0.286 Vp-p (75 W)
AV4AUDIO L-RRCA PIN Type × 20.5 Vrms
InputVIDEORCA PIN Type × 11.0 Vp-p (75 W)
COMPONENTY1.0 Vp-p (including synchronization)
PB/CB,PR/C
R
±0.35 Vp-p
Others HDMI InputTYPE A Connecter
PC InputHIGH-DENSITY D-SUB 15PINR, G, B/0.7 Vp-p (75 W)
HD, VD/TTL Level 2.0 - 5.0 Vp-p (high impedance)
Audio InputRCA PIN Type × 20.5 Vrms
Card slotSD CARD slot × 1, PC CARD slot × 1
Output AUDIO L-RRCA PIN Type × 20.5 Vrms (high impedance)
VIDEORCA PIN Type × 11.0 Vp-p (75 W)
Dimensions (W × H × D)1,327 mm × 843 mm × 138 mm
Weight52.0 kg Net
Note:
·
· Design and Specifi cations are subject to change without notice. Weight and Dimensions shown are approximate.
· ·
2
TH-50PV500A / TH-50PV500H / TH-50PV500M
CONTENTS
Page Page
1 Applicable signals 5
2 Safety Precautions
2.1. General Guidelines
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
4 About lead free solder (PbF)
5 Service Hint
6 Plasma panel replacement method
6.1. Remove the Back cover.
6.2. Remove the P-Board.
6.3. Remove the PB-Board
6.4. Remove the D-Board
6.5. Remove the rear terminal cover
6.6. Remove the metal frame
6.7. Remove the DV-Board
6.8. Remove the DG-Board
6.9. Remove the H-Board and TA/TB-Board
6.10. Remove the PA-Board
6.11. Remove the Z-Board
6.12. Remove the SU-Board
6.13. Remove the SD-Board
6.14. Remove the SC-Board
6.15. Remove the SS2-Board
6.16. Remove the SS3-Board
6.17. Remove the SS-Board
6.18. Remove the Fan
6.19. Remove the C1-Board
6.20. Remove the C2-Board
6.21. Remove the C3-Board
6.22. Remove the Speaker L, R
6.23. Remove the stand brackets.
6.24. Remove the C4-Board
6.25. Remove the C5-Board
6.26. Remove the C6-Board
6.27. Remove the front bracket
6.28. Remove the G-Board
6.29. Remove the GK-Board
6.30. Remove the GS-Board and SD-Module
6.31. Remove the K-Board
6.32. Remove the S-Board
6.33. Remove the Plasma panel section from the Front frame
(glass)
6.34. Replace the plasma panel (finished).
7 Location of Lead Wiring
7.1. Lead of Wiring (1)
7.2. Lead of Wiring (2)
7.3. Lead of Wiring (3)
7.4. Lead of Wiring (4)
7.5. Lead of Wiring (5)
7.6. Lead of Wiring (6)
7.7. Lead of Wiring (7)
8 Self Check
6
6
7
8
9
10
10
10
10
10
11
11
11
11
12
12
12
12
13
13
14
14
14
14
15
15
15
15
16
16
17
17
17
17
18
18
18
19
19
19
20
20
21
22
23
24
25
26
8.1. Power LED Blinking timing chart
8.2. No Power
8.3. No Picture
8.4. Local screen failure
9 Service Mode Function
9.1. How to enter SERVICE 1
9.2. How to enter SERVICE 2
9.3. Option Description
9.4. Option Code
10 Adjustment Procedure
10.1. Driver Set-up
10.2. Initialization Pulse Adjust
10.3. P.C.B. (Printed Circuit Board) exchange
10.4. Adjustment Volume Location
10.5. Test Point Location
11 Adjustment
11.1. PAL panel white balance adjustment
11.2. 1080i white balance adjustment
11.3. Sub bright adjustment
11.4. ABL adjustment
11.5. TEXT Vref Auto Adjustment
12 Hotel mode
13 Conductor View
13.1. P-Board
13.2. PA-Board
13.3. PB-Board
13.4. H-Board
13.5. DG-Board
13.6. TA-Board
13.7. TB-Board
13.8. DV-Board
13.9. Z-Board
13.10. D-Boa rd
13.11. C1-Bo ard
13.12. C2-Bo ard
13.13. C3-Bo ard
13.14. C4-Bo ard
13.15. C5-Bo ard
13.16. C6-Bo ard
13.17. SC-Bo ard
13.18. SU-Bo ard
13.19. SD-Bo ard
13.20. SS-Bo ard
13.21. G-Boa rd
13.22. GK, GS, K and S-Board
14 Block and Schematic Diagram
14.1. Schematic Diagram Notes
14.2. Main Block Diagram
14.3. P-Board Block Diagram
14.4. P-Board (1 of 2) Schematic Diagram
27
28
28
29
30
31
31
31
33
35
36
36
37
38
38
38
39
39
40
40
41
42
43
45
45
48
49
50
52
54
55
56
57
58
61
62
63
64
65
66
67
70
71
72
74
75
77
77
78
79
80
3
TH-50PV500A / TH-50PV500H / TH-50PV500M
14.5. P-Board (2 of 2) Schematic Diagram 81
14.6. PA and PB-Board Block Diagram
14.7. PA-Board Schematic Diagram
14.8. PB-Board Schematic Diagram
14.9. H, TA and TB-Board Block Diagram
14.10. TA and TB-Board Schematic Diagram
14.11. H-Boa rd (1 of 3) Schematic Diagram
14.12. H-Boa rd (2 of 3) Schematic Diagram
14.13. H-Boa rd (3 of 3) Schematic Diagram
14.14. G, GK, GS, K and S-Board Block Diagram
14.15. G-Boa rd Schematic Diagram
14.16. GK, K and S-Board Schem atic Diagram
14.17. GS-B oard Schematic Diagram
14.18. DG-B oard (1 of 2) Block Diagram
14.19. DG-B oard (2 of 2) Block Diagram
14.20. DG-B oard (1 of 6) Schematic Diagram
14.21. DG-B oard (2 of 6) Schematic Diagram
14.22. DG-B oard (3 of 6) Schematic Diagram
14.23. DG-B oard (4 of 6) Schematic Diagram
14.24. DG-B oard (5 of 6) Schematic Diagram
14.25. DG-B oard (6 of 6) Schematic Diagram
14.26. DV-Bo ard Block Diagram
14.27. DV-Bo ard Schematic Diagram
14.28. Z-Boa rd Block Diagram
14.29. Z-Boa rd (1 of 2) Schematic Diagram
14.30. Z-Boa rd (2 of 2) Schematic Diagram
14.31. D-Boa rd Block Diagram
14.32. D-Boa rd (1 of 6) Schematic Diagram
14.33. D-Boa rd (2 of 6) Schematic Diagram
14.34. D-Boa rd (3 of 6) Schematic Diagram
14.35. D-Boa rd (4 of 6) Schematic Diagram
14.36. D-Boa rd (5 of 6) Schematic Diagram
14.37. D-Boa rd (6 of 6) Schematic Diagram
14.38. C1, C2, C5 and C6-Board Block Diagram
14.39. C3 and C4-Board Block Diagra m
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
14.40. C1-Bo ard (1 of 2) Schematic Diagram
14.41. C1-Bo ard (2 of 2) Schematic Diagram
14.42. C2-Bo ard (1 of 2) Schematic Diagram
14.43. C2-Bo ard (2 of 2) Schematic Diagram
14.44. C3-Bo ard (1 of 2) Schematic Diagram
14.45. C3-Bo ard (2 of 2) Schematic Diagram
14.46. C4-Bo ard (1 of 2) Schematic Diagram
14.47. C4-Bo ard (2 of 2) Schematic Diagram
14.48. C5-Bo ard (1 of 2) Schematic Diagram
14.49. C5-Bo ard (2 of 2) Schematic Diagram
14.50. C6-Bo ard (1 of 2) Schematic Diagram
14.51. C6-Bo ard (2 of 2) Schematic Diagram
14.52. SC-Bo ard Block Diagram
14.53. SC-Bo ard (1 of 2) Schematic Diagram
14.54. SC-Bo ard (2 of 2) Schematic Diagram
14.55. SU-Bo ard Block Diagram
14.56. SU-Bo ard (1 of 2) Schematic Diagram
14.57. SU-Bo ard (2 of 2) Schematic Diagram
14.58. SD-Bo ard Block Diagram
14.59. SD-Bo ard (1 of 2) Schematic Diagram
14.60. SD-Bo ard (2 of 2) Schematic Diagram
14.61. SS, SS2 and SS3-Board Block Diagram
14.62. SS-Bo ard (1 of 2), SS2 and SS3-B oard Schematic
Diagram
14.63. SS-Bo ard (2 of 2) Schematic Diagram
15 Parts Location & Mechanical Replacement Parts List
15.1. Parts Location
15.2. Packing Exploded Views (1)
15.3. Packing Exploded Views (2)
15.4. Packing Exploded Views (3)
15.5. Mechanical Replacement Parts List
16 Electrical Replacement Parts List
16.1. Replacement Parts List Notes
16.2. Electrical Replacement Parts List
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
141
141
142
143
144
145
147
147
148
4
1 Applicable signals
TH-50PV500A / TH-50PV500H / TH-50PV500M
5
TH-50PV500A / TH-50PV500H / TH-50PV500M
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MW and 5.2MW.
When the exposed metal does not have a return path to the
chassis, the reading must be
.
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
6
TH-50PV500A / TH-50PV500H / TH-50PV500M
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
7
TH-50PV500A / TH-50PV500H / TH-50PV500M
4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
· ·
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
· ·
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
· ·
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
stamped on the back of PCB.
8
5 Service Hint
TH-50PV500A / TH-50PV500H / TH-50PV500M
Board NameFunctionBoard NameFunction
PPower SupplyC1Data Driver (Up Right)
PADC-DC Converter, Power SOSC2Data Driver (Up Center)
PBAudio Power, Fan controlC3Data Driver (Up Left)
HAV Terminal, AV SwitchC4Data Driver (Down Left)
TA/TBTunerC5Data Driver (Down Center)
DVHDMI InterfaceC6Data Driver (Down Right)
DGDigital Signal ProcessorSCScan Drive
ZSpeaker out, Audio AMPSUScan out (Up)
DFormat Converter, Plasma Ai ProcessorSDScan out (Down)
KRemote receiver, OPTSSSustain Drive
SPower SwitchSS2Sustain Connector (Up)
SD-MSD Module (MPEG4/PHOTO view, SD recording)
None serviceable.
SD Module should be exchanged for service.
SS3Sustain Connector (Down)
GPC Card Slot, Front Terminal
GSSD Card Slot
GKKey Switch
9
TH-50PV500A / TH-50PV500H / TH-50PV500M
6 Plasma panel replacement method
6.1. Remove the Back cover.
1. See Service Hint (Section 5).
6.2. Remove the P-Board.
Caution:
To remove P.C.B., wait 1 minute after power was off for
discharge from electrolisis capacitors.
1. Disconnect the couplers (P2, P5, P9, P10, P11, P12, P23,
P25 and P30).
2. Remove the screws (×6
) and remove the P-Board.
6.3. Remove the PB-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PB5, PB7, PB30, PB31, PB32,
PB33 and PB34).
3. Remove the screws (×3
metal frame.
4. Remove the screws (× 4
) and remove the PB-Board
) and remove the PB-Board.
6.4. Remove the D-Board
1. Remove the PB-Board.
2. Disconnect the couplers (D3, D5, D20 and D25) and
3. Disconnect the flexible cables (D31, D32, D33 and D34).
4. Remove the screws (×4
) and remove the D-Board.
10
TH-50PV500A / TH-50PV500H / TH-50PV500M
6.5. Remove the rear terminal
cover
1. Remove the screws (×4), and rhe screw (×7).
2. Remove the rear terminal cover.
6.6. Remove the metal frame
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (D3, D5, H7, P10 and PB7) and
relay connector (SP-R, SP-L).
3. Remove the screws (×4
) remove the metal frame.
6.7. Remove the DV-Board
1. Remove the screws (×1).
2. Disconnect the coupler (DV15).
3. Remove the screws (×1
) and remove the DV-Board.
6.8. Remove the DG-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (DG3 and DG5).
3. Disconnect the flexible cables (DG1, DG2 and DG20).
4. Remove the screws (×2
) and remove the DG-Board.
11
TH-50PV500A / TH-50PV500H / TH-50PV500M
6.9. Remove the H-Board and
TA/TB-Board
1. Unlock the cable clampers to free the cable.
2. Remove the screws (×2
3. Disconnect the couplers (H52 and H53).
4. Disconnect the flexible ables (H1, H2, H30 and H50).
5. Remove the screws (×3
) and remove the TA/TB-Board.
) and remove the H-Board.
6.11. Remove the Z-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (Z1 and Z2).
3. Disconnect the flexible cable (Z50).
4. Remove the screws (×2
) and remove the Z-Board.
6.10. Remove the PA-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PA7 and PA10).
3. Disconnect the flexible cables (PA20 and PA30).
4. Remove the screws (×4
) and remove the PA-Board.
6.12. Remove the SU-Board
1. Remove the screws (×3).
2. Slide the SU-Board to the left to disconnect from a coupler
(SC41 - SU41) on the SC-Board and remove a coupler
(SU45 or SC45).
12
TH-50PV500A / TH-50PV500H / TH-50PV500M
3. Remove the flexible cables (SU1, SU2, SU3 and SU4)
connected to the SU-Board, and remove the SU-Board.
6.13. Remove the SD-Board
3. Remove the flexible cables (SD1, SD2, SD3 and SD4)
connected to the SD-Board, and remove the SD-Board.
6.14. Remove the SC-Board
1. Remove the screws (×3).
2. Slide the SD-Board to the left to disconnect from a coupler
(SC42 - SD42) on the SC-Board and remove a coupler
(SD46 or SC46).
1. Disconnect the couplers (SC2, SC20 and SC23)
2. Remove the screws (×9
) and remove the SC-Board.
13
TH-50PV500A / TH-50PV500H / TH-50PV500M
6.15. Remove the SS2-Board
1. Disconnect the coupler (SS23) and disconnect the flexible
cable (SS55).
2. Remove the screws (×2
) and remove the SS2-Board.
6.16. Remove the SS3-Board
1. Disconnect the coupler (SS22) and disconnect the flexible
cable (SS56).
2. Remove the screws (×2
) and remove the SS3-Board.
6.17. Remove the SS-Board
1. Remove the SS2-Board and SS3-Board.
2. Disconnect the couplers (SS11, SS12, SS34, SS35, SS42
and SS44).
3. Disconnect the flexible cables (SS51, SS52, SS53 and
SS54).
4. Remove the screws (×7
) and remove the SS-Board.
6.18. Remove the Fan
1. Remove the screws (×3each) remove the fan and
disconnect the relay coupler.
14
TH-50PV500A / TH-50PV500H / TH-50PV500M
6.19. Remove the C1-Board
1. Remove the fan.
2. Remove the flexible cables holder fastening screws (×6
) and disconnect the flexible cables (CA1, CA2 and
CA3).
3. Disconnect the flexible cable (C10) and disconnect the
coupler (C11).
4. Remove the screw (×5
) and remove the C1-Board.
6.21. Remove the C3-Board
1. Remove the fan.
2. Remove the flexible cables holder fastening screws (×8
) and disconnect the flexible cables (CA8, CA9, CA10
and CA11).
3. Disconnect the flexible cable (C31) and disconnect the
couplers (C33 and C35).
4. Remove the screws (×5
) and remove the C3-Board.
6.20. Remove the C2-Board
1. Remove the fan.
2. Remove the flexible cables holder fastening screws (×8
) and disconnect the flexible cables (CA4, CA5, CA6
and CA7).
3. Disconnect the Flexible cables (C20, C21, C24 and C25)
and disconnect the couplers (C22 and C23).
4. Remove the screws (×5
) and remove the C2-Board.
6.22. Remove the Speaker L, R
1. Remove the screws (×4) and remove the Speaker cover
L, R.
15
TH-50PV500A / TH-50PV500H / TH-50PV500M
2. Disconnect the relay connector L, R.
3. Remove the Speaker L, R.
6.23. Remove the stand brackets.
1. Remove the plasma panel section from the servicing stand
and lay on a flat surface such as a table (covered), with the
plasma panel surface facing downward.
Spread a soft cloth or similar on the table for protection, so
the panel surface is not scratched.
2. Remove the stand bracket (left, right) fastening screws (×4
each) and remove the stand brackets (left, right).
6.24. Remove the C4-Board
1. Remove the flexible cables holder fastening screws (×8
) and disconnct the flexible cables (CB8, CB9, CB10
and CB11).
2. Release the speaker cables from clampers.
3. Disconnect the flexible cables (C41) and disconnect the
couplers (C42, C43 and C44).
4. Remove the screws (×5
) and remove the C4-Board.
16
TH-50PV500A / TH-50PV500H / TH-50PV500M
6.25. Remove the C5-Board
1. Remove the flexible cables holder fastening screws (×8
) and disconnect hte flexible cables (CB4, CB5, CB6
and CB7).
2. Release the speaker cables from clampers.
3. Disconnect the flexible cables (C50, C51, C54 and C55)
and disconnect the couplers (C52 and C53).
4. Remove the screws (×5
) and remove the C5-Board.
6.27. Remove the front bracket
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (G2) and the flexible cables (G11
and G51).
3. Remove the screws (×7
) and remove the front bracket.
6.28. Remove the G-Board
1. Remove the front bracket.
2. Disconnect the coupler (G3).
3. Remove the screws (×3
cover.
4. Remove the screws (×5
) and remove the G-Board
) and remove the G-Board unit.
6.26. Remove the C6-Board
1. Remove the flexible cables holder fastening screws (×6
) and disconnect the flexible cables (CB1, CB2 and
CB3).
2. Release the speaker cables from clampers.
3. Disconnect the flexible cables (C60) and disconnect the
coupler (C61).
4. Remove the screws (×5
) and remove the C6-Board.
5. Remove the screws (×3) and remove the G-Board.
17
TH-50PV500A / TH-50PV500H / TH-50PV500M
6.29. Remove the GK-Board
1. Remove the G-Board.
2. Remove the GK-Board.
6.30. Remove the GS-Board and SDModule
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (H52) and the flexible cable (G11).
3. Remove the screws (×2
(×2).
4. Remove the SD-Unit.
5. Remove the screw (×1
6. Remove the SD-Metal.
) and remove the grommets
).
9. Disconnect the coupler (GS52) and the flexible cable
(GS12).
10. Remove the screws (×2
11. Remove the GS-Board and SD-Module.
).
6.31. Remove the K-Board
1. Disconnect the couplers (K1).
2. Remove the screws (×2
3. Remove the K-Board.
) and remove the grommet (×1).
7. Remove the screw (×1).
8. Remove the SD-Module cover.
18
6.32. Remove the S-Board
1. Remove the screw (×2).
2. Disconnect the couplers (S1).
3. Remove the screws (×2
) and remove the S-Board.
TH-50PV500A / TH-50PV500H / TH-50PV500M
3. For leaving the plasma panel from the front frame, pull the
bottom of the front frame forward, lift, and remove.
6.33. Remove the Plasma panel
section from the Front frame
(glass)
1. Remove the front frame and the plasma panel fastening
screw (×8
2. Remove the front frame and the stand brackets fastening
screw (×6
).
).
6.34. Replace the plasma panel
(finished).
1. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
2. Attach the C1, C2, C3, C4, C5-Board and the C6-Board,
connect the flexible cables (×7) from the Plasma panel to
the C1, C2, C3, C4, C5-Board and C6-Board, and fix the
flexible cable holders.
3. Attach the Hooks (left, right) and fit the stand brackets (left,
right) to the new plasma panel.
4. Place the plasma panel section on the servicing stand.
5. Attach the front frame and the each P.C.Board and so on,
to the new plasma panel.
* When fitting the front frame, be careful not to allow
any debris, dust or handling residues to remain
between the front glass and plasma panel.
19
TH-50PV500A / TH-50PV500H / TH-50PV500M
7 Location of Lead Wiring
7.1. Lead of Wiring (1)
MAKE WIRE DRESSING AS IF ILLUSTRATED BELOW.
NOTES:
1. CONNECT CONNECTORS SURELY.
2. KEEP MODERATE SLACK IN WIRES NOT TO GIVE ANY STRESS TO CONNECTORS.
3. MANAGE THE WIRES THAT ARE AROUND ELECTRIC FAN FAN ASSEMBLIES NOT TO TOUCH A BLADE OF
ELECTRIC FAN NOR EDGE OF FAN MOUNT METAL.
4. MANAGE P2 WIRE AND P23 WIRE SO THAT THEY PASS THE TOP SIDE OF P-PCB.
20
7.2. Lead of Wiring (2)
MAKE WIRE DRESSING AS IF ILLUSTRATD BELOW.
NOTES:
1. CONNECT CONNECTORS SURELY.
2. KEEP MODERATE SLACK IN WIRES NOT TO GIVE ANY STRESS TO CONNECTORS.
3. CLAMP WIRES SURELY.
TH-50PV500A / TH-50PV500H / TH-50PV500M
21
TH-50PV500A / TH-50PV500H / TH-50PV500M
7.3. Lead of Wiring (3)
MAKE WIRE DRESSING AS IF ILLUSTRATED BELOW.
NOTES:
1. CONNECT CONNECTORS SURELY.
2. KEEP MODERATE SLACK IN WIRES NOT TO GIVE ANY STRESS TO CONNECTORS.
3. MANAGE THE WIRES THAT ARE AROUND ELECTRIC FAN ASSEMBLIES NOT TO TOUCH A BLADE OF ELECTRIC
FAN NOR EDGE OF FAN MOUNT METAL.
4. PLACE A SAG OF P10 WIRE IN THE TOP SIDE OF P-PCB.
22
TH-50PV500A / TH-50PV500H / TH-50PV500M
7.4. Lead of Wiring (4)
MAKE WIRE DRESSING AS IF ILLUSTRATED BELOW.
NOTES:
1. CONNECT CONNECTORS SURELY.
2. KEEP MODERATE SLACK IN WIRES NOT TO GIVE ANY STRESS TO CONNECTORS.
3. MANAGE THE WIRES THAT ARE AROUND THE ELECTRIC FAN ASSEMBLIES NOT TO TOUCH A BLADE OF
ELECTRIC FAN NOR EDGE OF A FAN MOUNT METAL.
4. MANAGE WIRES NOT TO PRESS THE MC701 OF P-PCB WITH THEM.
5. PASS THE SS11 WIRE AND THE SS12 WIRE BETWEEN A M8 BOSS AND P-PCB, MANAGE THEM TO KEEP AWAY
FROM A M8 BOSS.
6. PAY ATTENTION NOT TO GIVE ANY LOAD TO THE MC701 OF P-PCB.
23
TH-50PV500A / TH-50PV500H / TH-50PV500M
7.5. Lead of Wiring (5)
MAKE WIRE DRESSING AS IF ILLUSTRATED BELOW.
NOTES:
1. CONNECT CONNECTORS SURELY.
2. KEEP MODERATE SLACK IN WIRES NOT TO GIVE ANY STRESS TO CONNECTORS.
3. CONNECT FFC SURELY.
PAY ATTENTION NOT TO MAKE WRONG DIRECTION CONNECTION NOR INCOMPLETE CONNECTION.
4. BEFORE CONNECTING FLEXIBLE CABLES, CLEAN CONNECTION PARTS BY BLOWING AIR.
24
7.6. Lead of Wiring (6)
CONNECT SPEAKER WIRES, THEN HAUL THEIR SAG TO THE DIRECTION OF TUNER UNIT.
TH-50PV500A / TH-50PV500H / TH-50PV500M
25
TH-50PV500A / TH-50PV500H / TH-50PV500M
7.7. Lead of Wiring (7)
1. Make wire dressing as if illustrated below.
Keep moderate slack in wires not give any stress to the connectors.
2. Fix a barrier to a glass holder bottom ass’y by a screw.
Handle a barrier not to protrude from the back end of a bottom shield.
Torque of the screw THEL035N should be 80 to 120 N
Screws of THEL035N are not reuseble.
cm.
26
8 Self Check
1. Self-Check is used to automatically check the bus lines and hexadecimal code of the TV set.
2. To get into the Self -Check mode press the Down (
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.
8.2. No Power
First check point
There are following 3 states of No Power indication by power LED.
1. No lit
2. Green is lit then turns red blinking a few seconds later.
3. Only red is lit.
1. No lit
28
8.3. No Picture
TH-50PV500A / TH-50PV500H / TH-50PV500M
29
TH-50PV500A / TH-50PV500H / TH-50PV500M
8.4. Local screen failure
Plasma display may have local area failure on the screen. Fig-1 is the possible defect P.C.B. for each local area.
Fig-1
30
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