Panasonic TH-50PHW5UZ Service manual
Specifications
ORDER NO. ITD0207016C1
B02
Wide Plasma Display
TH-50PHW5UZ
GPH5D2 Chassis
Power Source: AC120V 50/60Hz
Power Consumption: 495 W
2.4W (stand-by condition)
0.9W (Power off condition)
Plasma Display panel: Drive method AC type
50-inch, 16:9 aspect ratio
Contrast Ratio 3000:1
Screen size: 1,106 mm (W)×622 mm (H)
1,269 mm (diagonal)
No. of pixels
1,049,088 (1,366 (W)×768 (H))
[4,098×768 dots]
Operating condition:
Temperature 34 °F - 104 °F (0 °C - 40 °C)
Humidity 20 % - 80 %
Horizontal scanning frequency 15.6 - 110kHz
Vertical scanning frequency 48 - 120Hz
Connection terminals:
AV
Video in 1.0 Vp-p (75-ohm)
S-VIDEO IN
(MINI DIN 4PIN)
AUDIO IN
(RCA PIN JACK × 2)
Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p
(75-ohm)
0.5 Vrms (high impedance)
COMPONENT/RGB
Y/G 1.0 Vp-p/composite (75-ohm)
0.7 Vp-p/non-composite (75-ohm)
PB/B 0.7 Vp-p (75-ohm)
PR/R 0.7 Vp-p (75-ohm)
HD 1.0 - 5.0 Vp-p (high impedance)
VD 1.0 - 5.0 Vp-p (high impedance)
AUDIO IN
(RCA PIN JACK×2)
PC
(HIGH-DENSITY
D-SUB15PIN)
AUDIO IN (M3 JACK) 0.5Vrms (high impedance)
SERIAL
EXTERNAL CONTROL
TERMINAL (D-SUB9PIN)
SPEAKERS (External
speakers)
Dimensions (W×H×D): 47.6” (1,210 mm)×28.5” (724mm)×3.9” (98
Weight (Mass) approx. 94.8 Ibs (42.5 kg) (main unit only)
0.5 Vrms (high impedance)
R,G,B/0.7 Vp-p (75-ohm)
HD, VD/1.0 - 5.0 Vp-p (high
impedance)
RS-232C COMPATIBLE
69 16W [8W+8W] (10% THD)
mm)
approx. 104.9 Ibs (47.1kg) (with speakers)
© 2002 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-50PHW5UZ
CONTENTS
1 Applicable signals 3
2 Safety Precautions
2.1. General Guidelines
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
4 About lead free solder (PbF)
5 PCB Structure sheet of GPH5D2 chassis
6 Service Hint
7 Location of Lead Wiring
8 Adjustment Procedure
8.1. +B Set-up
8.2. Driver Set-up
8.3. Initialization Pulse Adjust
8.4. P.C.B. (Printed Circuit Board) exchange
8.5. Adjustment Volume Location
8.6. Test Point Location
9 Service mode
9.1. CAT (computer Aided Test) mode
9.2. IIC mode structure (following items value is sample data.)
10 Alignment
10.1. Pedestal setting
10.2. NTSC panel white balance
10.3. PAL/SECAM panel white balance
10.4. PC/RGB panel white balance
10.5. HD/ 525i /525p panel white balance
10.6. 625i panel balance
10.7. Sub brightness setting
Page Page
11 Trouble shooting guide 27
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4
5
6
7
8
9
10
10
10
11
12
12
12
13
13
15
16
16
17
18
20
22
24
25
11.1. Self Check
11.2. No Power
11.3. No Picture
11.4. Local screen failure
12 Option Setting
13 Block Diagram
13.1. Main Block Diagram
13.2. Power Block Diagram
13.3. HX-Board Block Diagram
13.4. HY and HZ-Board Block Diagram
13.5. D1-Board Block Diagram
13.6. D2-Board Block Diagram
13.7. C1, C2, C3, C4, C5, C6 and C9-Board (1 of 2) Block
Diagram
13.8. C1, C2, C3, C4, C5, C6 and C9-Board (2 of 2) Block
Diagram
13.9. SC-Board Block Diagram
13.10. SU-Board Block Diagram
13.11. SD-Board Block Diagram
13.12. SS-Board Block Diagram
13.13. Z-Board Block Diagram
14 Parts Location
14.1. Parts Location1
14.2. Parts Location2
14.3. Parts Location3
15 Mechanical Replacement Parts List
27
28
29
29
30
33
33
34
35
36
37
38
39
40
41
42
43
44
45
47
47
48
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50
2
1 Applicable signals
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3
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2 Safety Precautions
2.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M9 and 5.2M9.
When the exposed metal does not have a return path to
the chassis, the reading must be
.
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5k9, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reversethe AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
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TH-50PHW5UZ
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After r emoving an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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TH-50PHW5UZ
4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.
· ·
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· Pb free solder will tend to splash when heated too high (about 1100 °F or600°C).
· ·
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
· ·
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
stamped on the back of PCB.
6
5 PCB Structure sheet of GPH5D2 chassis
Board Name Function Remarks
D1 Format Converter 1
D2 Plasma AI Sub-Field Processor 1
Z Audio out
SS Scan out 1
SC Scan out 1
SU Sustain connection (Upper) 1
SD Sustain connection (Lower) 1
C1 Data Drive (Upper Left)
C2 Data Drive (Upper Center)
C3 Data Drive (Upper Right)
C4 Data Drive (Lower Right)
C5 Data Drive (Lower Center)
C6 Data Drive (Lower Left)
C9 Energy recovery circuit
H3 Speaker terminal
S1 Power switch
SS2 Sustain connection (Upper)
SS3 Sustain connection (Lower)
V1 Front SW. & Remote receiver
F Line filter
P Power supply 1
P3 Drive voltage oscillator
P5 Primary oscillator
P6 PFC oscillator
P7 Drive voltage protection
P8 Process voltage protection
HX PC_type_Input terminal
HZ RCA type_Input terminal
TH-50PHW5UZ
Remarks
1.Recommend PCB´s for initial service for GPH5D2 chassis.
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6 Service Hint
8
7 Location of Lead Wiring
TH-50PHW5UZ
9
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8 Adjustment Procedure
8.1. +B Set-up
8.1.1. Item / Preparation
1.Input a Grey scale signal.
2.Set the picture controls: Picture mode: Normal
White balance: Normal
8.1.2. Adjustments
Adjust and confirm indicated test point for the specified voltage.
Adjust
Name Test point Voltage Volume
PFC P24 pin 1 400V ±1V R548
Vsus P1 pin 2 175V ±1V R639
Vda P3 pin 1 75.0V ±0.5V R545
Confirm
Name Test point Voltage
+18V P4 pin 1 17.2V ±0.5V
+13.5V P5 pin 1 13.2V ±0.5V
Audio +15V P6 pin 1 13.5V ±0.5V
Audio -15V P6 pin 3 -13.5V ±0.5V
5.25V P5 pin 5 5.1V ±0.3V
STB5V P7 pin4 5.0V ±0.3V
8.2. Driver Set-up
8.2.1. Item / Preparation
1.Input an APL 100 % white signal.
2.Set the picture controls: Picture mode: Normal
White balance: Cool
Aspect: 16:9
8.2.2. Adjustments
Adjust driver section voltages referring the panel data on the
panel data label.
Name Test point Voltage Volume
Vsus TPVSUS
(SS-BOARD)
Vbk TPVBK
(SC-BOARD)
Ve TPVE
(SS-BOARD)
Vset TPVSET
(SC-BOARD)
Vad TPVAD
(SC-BOARD)
Vda TP117
(C9-BOARD)
Vscn TPVSCN
(SC-BOARD)
Vsus ±1V* R639
(P3-BOARD)
Vbk ±5V* R6670
(SC-BOARD)
Ve ±1V* R6770
(SS-BOARD)
218 V ±6V ---
Vad ±1V* R6477
(SC-BOARD)
74V±1V R545
(P1-BOARD)
Vad+118±2V ---
*See the Panel label.
10
8.3. Initialization Pulse Adjust
1.Input a Cross hatch signal.
2.Set the picture controls: Picture mode: Normal
White balance: Cool
Adjust the indicated test point for the specified wave form.
Test point Volume Level
T1 TPSC1 (SC) R6523 (SC) 0Sec
T2 TPSC1 (SC) R6557 (SC) 170 ± 10µ Sec
TPSC1 SCAN OUTPUT
TH-50PHW5UZ
TPSS1 SUSTAIN OUTPUT
T1 0
VSET
T2 170±10µs
Scan
TPSC1
VSUS VBK
VSCN VAD
VSET2
5.0µs
VSUS
Sustain
TPSS1
INITIALIZE SCAN PRE-INITIALIZE
VE
SUSTAIN
ADDRESS PERIOD
11
VSUS
TH-50PHW5UZ
8.4. P.C.B. (Printed Circuit Board) exchange
8.4.1. Caution
1.To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.
8.4.2. Quick adjustment after P.C.B. exchange
P.C.B. Item Volume Test point Level
P board PFC R548 (P3) P24 connector pin 1 400V ± 1V
Vsus R639 (P3) TPVsus (SS) Vsus ± 1V*
Vda R545 (P1) TP117 (C9) 74V ± 1V
SC board Vad R6477 (SC) TPVAD (SC) Vad ± 1V*
Vbk R6670 (SC) TPVBK (SC) Vbk ± 5V*
SS board Ve R6770 (SS) TPVE (SS) Ve ± 1V*
D1, D2 board White balance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625I signals.
*See the Panel label.
8.5. Adjustment Volume Location
8.6. Test Point Location
12
9 Service mode
9.1. CAT (computer Aided Test) mode
TH-50PHW5UZ
To exit the CAT mode, access the ID mode and switch off the main power.
9.1.1. IIC mode
Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on
the remote control.
Subject and item are mentioned on page 14.
To exit the IIC mode, press the R button on the remote control.
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TH-50PHW5UZ
9.1.2. CD mode
Select the CD mode by Up/Down button on the remote control at the front page of CAT mode then press the Mute button on the
remote control more than 5 sec.
Micom software version (IC9354), this version can be upgrade by
1.replace of new version IC
2.Loading the new version software from loader tool, TZSC07036.
Memory data change
To exit the CD mode, press the R button on the remote control.
9.1.3. SD mode
Select the SD mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on the
remote control.
To exit the SD mode, press the R button on the remote control.
14
9.2. IIC mode structure (following items value is sample data.)
TH-50PHW5UZ
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