Panasonic TH-50PHD8UK Service manual

ORDER NO. ITD0508043CE

D10 Canada: B07

High Definition Plasma Display

TH-50PHD8UK

GPH8D Chassis

Specifications

Power Source 120 VAC, 50/60Hz Power Consumption

Maximum 440 W Stand-bycondition Save OFF 0.6 W, Save ON 0.4 W Power off condition 0.1W

Plasma Displaypanel Drive method:AC type 50-inch,

16:9 aspect ratio

Contrast Ratio 3000:1

Screen size 43.5” (1,106 mm) (W) × 24.5” (622 mm) (H) × 50” (1,269 mm) (diagonal)

(No. of pixels) 1,049,088 (1,366 (W) × 768 (H) [4,098 × 768 dots]

Operating condition

Temperature 32 °F - 104 °F (0 °C - 40 °C) Humidit

Applicablesignals

Color System NTSC, PAL, PAL60, SECAM, Modified NTSC Scanning format 525 (480) / 60i 60p, 625 (575)/50i 50p, 750 (720)/60p 50p, 1125 (1080) / 60i 50i 24p 25p

PC signals VGA, SVGA, XGA,

Connection terminals

V VIDEO IN / OUT (BNC) 1.0 Vp-p (75-ohm or high impedance)

COMPONENT / RGB

PC (HIGH-DENSITYMini-D-SUB 15PIN) R,G,B/0.7 Vp-p (75-ohm)

20 % - 80 %

30p 24sF .... SMPTE274M, 1250 (1080) / 50i

SXGA, UXGA..... (compressed)

Horizontal scanning frequency 15 - 110 kHz Vertical scanning frequency 48 - 120 Hz

S VIDEO IN (MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)

UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)

/ G (BNC) 1.0 Vp-p/composite (75-ohm)

0.7 Vp-p/non-composite (75-ohm)

PB/B (BNC), PR/R (BNC) 0.7 Vp-p (75-ohm)

UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)

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Component

:1.0 Vp-p (75-ohm : include sync)

CB:0.7 Vp-p (75-ohm)

CR:0.7 Vp-p (75-ohm)

HD, VD/1.0 - 5.0 Vp-p (high impedance)

UDIO IN (M3 JACK) 0.5 Vrms (high impedance) SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE SPEAKERS (6Ω) 16 W [8 W + 8 W] (10 % THD)

Accessories Supplied

Remote Control Transmitter EUR7636070R Batteries 2×AASize Fixing bands (TMME203 or TMME187) × 2

Dimensions (W×H×D) 47.6” (1,210 mm) × 28.5” (724 mm) × 3.7” (95 mm)

(exclusive of protruding portion)

Mass (weight)

main unit onl with speakers approx. 103.6 lbs

approx. 94.8 lbs

Notes:

· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

CONTENTS

Page Page

1 Applicable signals 4 2 Safety Precautions

2.1. General Guidelines

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 4 About lead free solder (PbF) 5 PCB Structure sheet of GPH8D chassis 6 Service Hint 7 Disassembly

7.1. Removal of the Back Cover

7.2. Removal of the HA-Board and the HB-Board

7.3. Removal of the Slot Block

7.4. Removal of the J-Board

7.5. Removal of the HX-Board

7.6. Removal of the PB-Board

7.7. Removal of the D-Board

7.8. Removal of the P-Board

7.9. Removal of the H3-Board

7.10. Removal of the SU-Board and the SD-Board

7.11. Removal of the SC-Board

7.12. Removal of the SS2-Board and the SS3-Board

7.13. Removal of the SS-Board

7.14. Removal of the C1, C2, C3, C4, C5 and the C6-Board

7.15. Removal of the S1-Board

7.16. Removal of the Fan

10 10 10 10 11 11 11 12 12 12 13 13 13 14 15 16

7.17. Removal of the Escutcheon

6 7 8 9

7.18. Removal of the V1-Board and V2-Board

7.19. Removal of the Plasma Panel

8 Location of Lead Wiring 9 Adjustment Procedure

9.1. Driver Set-up

9.2. Initialization Pulse Adjust

9.3. P.C.B. (Printed Circuit Board) Remove

9.4. Adjustment Volume Location

9.5. Test Point Location

10 Service mode

10.1. CAT (computer Aided Test) mode

10.2. IIC mode structure (following items value is sample data.)

11 Alignment

11.1. PC / RGB panel white balance

11.2. HD / 525ip / 625ip panel white balance

12 Trouble shooting guide

12.1. Self Check

12.2. No Power

12.3. No Picture

12.4. Local screen failure

13 Option Setting 14 Circuit Board Layout

14.1. P-Board

16 17 17

21 23

23 24 24 25 25

29 31

33 34 34 35

36 39

14.2. PB-Board 42

14.3. HA-Board

14.4. HB-Board

14.5. HX-Board

14.6. J-Board

14.7. D-Board

14.8. C1-Board

14.9. C2-Board

14.10. C3-Board

14.11. C4-Board

14.12. C5-Board

14.13. C6-Board

14.14. SC-Board

14.15. SU-Board

14.16. SD-Board

14.17. SS, SS2 and SS3-Board

14.18. H3, S1, V1 and V2-Board

15 Schematic Diagrams

15.1. Schematic Diagram Notes

15.2. Main Block Diagram

15.3. P-Board Block Diagram

15.4. P-Board (1 of 2) Schematic Diagram

15.5. P-Board (2 of 2) Schematic Diagram

15.6. PB-Board Block and Schematic Diagram

15.7. HA-Board Block and Schematic Diagram

15.8. HB-Board Block Diagram

15.9. HB-Board (1 of 2) Schematic Diagram

15.10. HB-Board (2 of 2) Schematic Diagram

15.11. HX-Board Block and Schematic Diagram

15.12. J-Board (1 of 2) and H3-Board Block Diagram

15.13. J-Board (2 of 2) Block Diagram

15.14. J-Board (1 of 4) and H3-Board Schematic Diagram

15.15. J-Board (2 of 4) Schematic Diagram

15.16. J-Board (3 of 4) Schematic Diagram

15.17. J-Board (4 of 4) Schematic Diagram

15.18. D-Board (1 of 2) Block Diagram

15.19. D-Board (2 of 2) Block Diagram

15.20. D-Board (1 of 12) Schematic Diagram

15.21. D-Board (2 of 12) Schematic Diagram

15.22. D-Board (3 of 12) Schematic Diagram

15.23. D-Board (4 of 12) Schematic Diagram

15.24. D-Board (5 of 12) Schematic Diagram

15.25. D-Board (6 of 12) Schematic Diagram

15.26. D-Board (7 of 12) Schematic Diagram 43 44 45 46 48 50 51 52 53 54 55 56 59 60 61 63

65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88

15.27. D-Board (8 of 12) Schematic Diagram

15.28. D-Board (9 of 12) Schematic Diagram

15.29. D-Board (10 of 12) Schematic Diagram

15.30. D-Board (11 of 12) Schematic Diagram

15.31. D-Board (12 of 12) Schematic Diagram

15.32. C1, C2, C5 and C6-Board Block Diagram

15.33. C3 and C4-Board Block Diagram

15.34. C1-Board (1 of 2) Schematic Diagram

15.35. C1-Board (2 of 2) Schematic Diagram

15.36. C2-Board (1 of 2) Schematic Diagram

15.37. C2-Board (2 of 2) Schematic Diagram

15.38. C3-Board (1 of 2) Schematic Diagram

15.39. C3-Board (2 of 2) Schematic Diagram

15.40. C4-Board (1 of 2) Schematic Diagram

15.41. C4-Board (2 of 2) Schematic Diagram

15.42. C5-Board (1 of 2) Schematic Diagram

15.43. C5-Board (2 of 2) Schematic Diagram

15.44. C6-Board (1 of 2) Schematic Diagram

15.45. C6-Board (2 of 2) Schematic Diagram

15.46. SC-Board Block Diagram

15.47. SC-Board (1 of 2) Schematic Diagram

15.48. SC-Board (2 of 2) Schematic Diagram

15.49. SU-Board Block Diagram

15.50. SU-Board (1 of 2) Schematic Diagram

15.51. SU-Board (2 of 2) Schematic Diagram

15.52. SD-Board Block Diagram

15.53. SD-Board (1 of 2) Schematic Diagram

15.54. SD-Board (2 of 2) Schematic Diagram

15.55. SS, SS2 and SS3-Board Block Diagram

15.56. SS-Board (1 of 2), SS2 and SS3-Board Schematic

Diagram

15.57. SS-Board (2 of 2) Schematic Diagram

15.58. S1, V1 and V2-Board Block and Schematic Diagram

16 Parts Location

16.1. Exploded View

16.2. Cable relation

16.3. Packing summary

17 Mechanica l Replacement Parts List 18 Replacement Parts List

18.1. Relpacement Parts List Notes

18.2. Electrical Replacement Parts List 89

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90 91 92 93 94 95 96 97 98

99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119

120 121 122

123

123 125 126

128 129

129 130

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1 Applicable signals

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2 Safety Precautions

2.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

2.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MΩ and 5.2MΩ.

When the exposed metal does not have a return path to

the chassis, the reading must be

Figure 1

2.1.2. Leakage Current Hot Check (See

Figure 1 .)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1 .

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

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3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistorsand semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder Remove device. Some solder Remove devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

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4 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

Caution

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb

solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

stamped on the back of PCB.

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5 PCB Structure sheet of GPH8D chassis

Board Name Function Remarks

D Digital Signal Processor,

Format Coverter, Plasma Ai Processor

J Slot Interface (Audio/Video/Sync input Switch),

SYNC processor, Audio processor, Speaker out amplifier,

DC-DC converter SS Sustain drive 1 SC Scan drive 1 SU Scan out (Upper) 1 SD Scan out (Lower) 1 C1 Data Drive (Upper Right) C2 Data Drive (Upper Center) C3 Data Drive (Upper Left) C4 Data Drive (Lower Left) C5 Data Drive (Lower Center) C6 Data Drive (Lower Right) H3 Speaker terminal S1 Power switch

SS2 Sustain out (Upper) SS3 Sustain out (Lower)

V1 LED (stand-by / Power on) & Remote receiver 1 V2 Key switch 1 PB Fan control 1

P Line filter, Power supply 1 HX PC / RS-232C HB BNC Composite Video HA BNC Component Video

Remarks

1: Recommend PCB´s for initial service for GPH8D chassis.

6 Service Hint

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Note:

Extension cable kit for Slot Board is supplied as service fixtures and tools. (Part No. TZSC07040)

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7 Disassembly

· To Remove P.C.B. , wait for 1 minute after power was off for discharge from electrolysis capacitors.

and marks indicate screw positions.

7.1. Removal of the Back Cover

1. Remove the screws (×19 ,×6 ,×4 ) and then remove the Back Cover.

7.3. Removal of the Slot Block

1. Disconnect the couplers(J1, J2, J3, J4, J5, J6, J7, J8, J10, J15).

2. Remove the 4 screws and then remove the Slot Block.

7.2. Removal of the HA-Board and the HB-Board

· Removal of the HB-Board

1. Remove the 4 screws(A) of the HBTerminal Block and then

remove the HB Terminal Block.

2. Remove the 4 screws(B).

3. Remove the 2 screws(C) and then remove the HB-Board.

7.4. Removal of the J-Board

1. Remove the HA Terminal Block and the HB Terminal Block. (Reference to remove of the HA-Board and remove of the

HB-Board)

2. Remove the Slot Block. (Reference to remove of the Slot Block)

3. Remove the 8 screws and then remove the J-Board.

· Removal of the HA-Board

1. Remove the 4 screws(D) of the HA Terminal Block and then remove the HA Terminal Block.

2. Remove the 4 screws(E).

3. Remove the 2 screws(F) and then remove the HA-Board.

7.5. Removal of the HX-Board

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7.6. Removal of the PB-Board

1. Remove the HA Terminal Block and the HB Terminal Block. (Reference to remove of the HA-Board and remove of the

HB-Board)

2. Remove the Slot Block. (Reference to remove of the Slot Block)

3. Remove the J-Board. (Reference to remove of the J-Board)

4. Remove the 6 screws and then remove the Slot Case.

5. Remove the 4 Hexagonal-Head screws and the screw of the HX-Board and then remove the HX-Board.

1. Disconnect the couplers(PB30, PB31, PB33, PB35).

2. Remove the screw and then remove the PB-Board.

7.7. Removal of the D-Board

1. Disconnect the couplers(PB30, PB31, PB33, PB35).

2. Remove the 3 screws and then remove the PB-Board Block.

3. Disconnect the couplers(D1, D3, D5, D20, D25).

4. Disconnect the flexible cables(D31, D32, D33, D34).

5. Remove the 3 screws and then remove the D-Board.

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7.8. Removal of the P-Board

1. Remove the 4 screws and then remove the Case Cover.

2. Disconnect the couplers(P2, P5, P9, P10, P11, P12, P23, P25, P30).

3. Remove the 4 screws and then remove the P-Board.

2. Disconnect the coupler (H37).

3. Remove the 3 screws(D) and then remove the H3-Board.

7.10. Removal of the SU-Board and the SD-Board

1. Remove the Speaker Terminal Block(R).

(Reference to remove of the Speaker Terminal Block(R)).

2. Disconnect the couplers(SU45, SD46).

3. Remove the each 3 screws.

4. Slide the SU-Board and the SD-Board to the left(arrow1).

7.9. Removal of the H3-Board

1. Remove the each 1 screw and then remove the Speaker Terminal Blocks(L, R).

5. Disconnect the flexible cables(SU1, SU2, SU3, SU4) and then remove the SU-Board.

6. Disconnect the flexible cables(SD1, SD2, SD3, SD4) and then remove the SD-Board.

7.11. Removal of the SC-Board

1. Remove the Speaker Terminal Block(R). (Reference to remove of the Speaker Terminal Block(R)).

2. Disconnect the couplers(SC45, SC46).

3. Remove the each 3 screws.

4. Slide the SU-Board and the SD-Board to the left(arrow1). (Reference to remove of the SU-Board and the SD-Board)

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7.12. Removal of the SS2-Board and the SS3-Board

1. Disconnect the couplers(SS22, SS23).

2. Disconnect the flexible cables(SS55, SS56).

3. Remove the each 2 screws and then remove the SS2-

Board and the SS3-Board.

5. Disconnect the couplers(SC2, SC20, SC23).

6. Remove the 9 screws and then remove the SC-Board.

7.13. Removal of the SS-Board

1. Disconnect the couplers(SS11, SS12, SS20, SS21, SS34,

SS35, SS42, SS44).

2. Disconnect the flexible cables(SS51, SS52, SS53, SS54).

3. Remove the 7 screws and then remove the SS-Board.

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7.14. Removal of the C1, C2, C3, C4, C5 and the C6-Board

1. Remove the Slot Block.

(Reference to remove of the Slot Block).

2. Remove the Speaker Terminal Block(L, R).

(Refernce to remove of the Speaker Terminal Block(L, R).

3. Remove the each 4 screws and then remove the Stand

Blocks(L, R).

4. Remove the each 3 screws and then remove the 3 Fan

Blocks.

5. Remove the 4 screws and then remove the Plate.

7.14.2. Removal of the C2-Board

1. Disconnect the flexible cables(C20, C21, C24, C25).

2. Disconnect the couplers(C22, C23).

3. Remove the 8 screws and then disconnect the flexible cables(CA4, CA5, CA6, CA7).

4. Remove the 5 screws and then remove the C2-Board.

7.14.3. Removal of the C3-Board

7.14.1. Removal of the C1-Board

1. Disconnect the flexible cable(C10).

2. Disconnect the coupler(C11).

3. Remove the 6 screws and then disconnect the flexible cables(CA1, CA2, CA3).

4. Remove the 5 screws and then remove the C1-Board.

1. Disconnect the flexible cable(C31).

2. Disconnect the couplers(C33, C35).

3. Remove the 8 screws and then disconnect the flexible cables(CA8, CA9, CA10, CA11).

4. Remove the 5 screws and then remove the C3-Board.

7.14.4. Removal of the C4-Board

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7.14.6. Removal of the C6-Board

1. Disconnect the flexible cable(C41).

2. Disconnect the couplers(C42, C43, C44).

3. Remove the 8 screws and then disconnect the flexible cables(CB8, CB9, CB10,CB11).

4. Remove the 5 screws and then remove the C4-Board.

7.14.5. Removal of the C5-Board

1. Disconnect the flexible cables (C50, C51, C54, C55).

2. Disconnect the couplers(C52,C53).

3. Remove the 8 screws and then disconnect the flexible cables(CB4, CB5, CB6, CB7).

4. Remove the 5 screws and then remove the C5-Board.

1. Disconnect the flexible cable(C60).

2. Disconnect the coupler(C61).

3. Remove the 6 screws and then disconnect the flexible cables(CB1, CB2, CB3).

4. Remove the 5 screws and then remove the C6-Board.

7.15. Removal of the S1-Board

1. Disconnect the coupler (SS34).

2. Remove the 2 screws(L) and then remove the S1-Board Block.

3. Disconnect the coupler(S34).

4. Remove the 1 screw(M) and then remove the S1-Board.

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7.16. Removal of the Fan

1. Disconnect the couplers(PB31, PB33, PB35).

2. Remove the each 3 screws and then remove the Fan Blocks(A, B, C).

3. Remove the each 2 screws(N) and then remove the 3 Fans.

4. Remove the each 4 sponge(Fan Corner) and then remove the 3 Fans.

5. Reassemble the Fans in reverse order (4-1) and then stick the Sponge(Fan center) on the central part of the Fan.

Note:

The Sponge(Fan center) is unsuitable to reuse. Please use a new one at the time of Fan remove.

7.17. Removal of the Escutcheon

1. Remove the S1-Board Block. (Reference to remove of the S1-Board Block).

2. Disconnect the couplers(V15).

3. Remove the screw and then remove the Angle.

4. Remove the coupler(J2) and then remove the 2 screws.

5. Pull the bottom of the Escutcheon forward. (arrow1)

6. Lift up the Escutcheon to remove.(arrow2)

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7.19. Removal of the Plasma Panel

1. Remove the each 4 screws and then remove the Stand Brackets(L, R).

2. Disconnect the couplers(PB31, PB33, PB35).

3. Remove the each 3 screws and then remove the Fan Blocks(A, B, C).

7.18. Removal of the V1-Board and V2-Board

1. Operate procedure 1 to 4 of the Escutcheon remove.

2. Remove the 2 screws(N) and then remove the Angle.

3. Remove the screw(O).

4. Remove the 5key Button.

5. disconnect the coupler(V15) and then remove the V2-

Board.

6. Disconnect the coupler(V2) and then remove the V1-Board.

4. Remove the Slot Block. (Reference to remove of the Slot Block).

5. Disconnect the couplers(D20, D25, PB30).

6. Disconnect the flexible cables(D31, D32, D33, D34).

7. Remove the 7 screws and then remove the PB-Board Block and D-Board.

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8. Remove the 2 screws and then remove the Shield Plate(R).

9. Remove the Shield Plate(L).

10. Remove the 4 screws and then remove the Case Cover.

16. Disconnect the flexible cables (SU1, SU2, SU3, SU4, SD1, SD2, SD3, SD4) and then remove the SU-Board and the SD-Board.

11. Disconnect the couplers(P2, P9, P11, P12, P23).

12. Remove the 4 screws and then remove the P-Board.

13. Remove the each screw and then remove the Speaker Terminal Block(L, R).

14. Disconnect the couplers(SC45, SC46).

15. Remove the each 3 screws and then slide the SU-Board and the SD-Board to the left(arrow1).

17. Remove the 9 screws and then remove the SC-Board.

18. Remove the SS2-Board and the SS3-Board. (Reference to remove of the SS2-Board and the SS3-

Board).

19. Disconnect the couplers(SS35, SS42, SS44).

20. Disconnect the flexible cables(SS51, SS52, SS53, SS54).

21. Remove the 7 screws and then remove the SS-Board.

22. Remove the 22 screws.

23. Disconnect the flexible cables(CA1, CA2, CA3, CA4, CA5, CA6, CA7, CA8, CA9, CA10, CA11).

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28. Remove the 22 screws.

29. Disconnect the flexible cables(CB1, CB2, CB3, CB4, CB5, CB6, CB7, CB8, CB9, CB10, CB11).

24. Disconnect the couplers(C11, C23).

25. Disconnect the flexible cables(C10, C21, C24, C25).

26. Remove the each 5 screws and then remove the C1-Board, the C2-Board and the C3-Board.

27. Remove the 4 screws and then remove the Plate.

30. Disconnect the couplers(C43, C52).

31. Disconnect the flexible cables(C41, C50, C54, C55).

32. Remove the each 5 screws and then remove the C4-Board, the C5-Board and the C6-Board.

33. Remove the 2 screws and then remove the S1-Board.

34. Remove the 2 screws and then remove the AC-Inlet.

35. Remove the 1 screw and then remove the Angle.

36. Disconnect the coupler(V15).

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37. Remove the each 3 screws of the Fixed Sheets(A, B) and then remove the Fixed Sheets(A, B).

38. Remove the 2 screws and then remove the Shield Sheet.

39. Remove the each 3 screws and then remove the Cable Holders(A, B) and the Flexible cables(A, B).

40. Remove the 2 screws of the Escutcheon.

41. Pull the bottom of the Plasma Panel forward (arrow1).

42. Slide the Plasma Panel and then remove the Plasma Panel (arrow2).

8 Location of Lead Wiring

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9 Adjustment Procedure

9.1. Driver Set-up

9.1.1. Item / Preparation

1. Input a white signal of the RGB signal generator.

2. Set the picture adjustment items as follows.

· Picture menu : Standard

· Color temperature : Normal

· Picture : 25

· Aspect : Full

9.1.2. Adjustments

Adjust driver section voltages referring the panel data on the panel data label.

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Caution

1. First perform Vsus voltage adjustment.

2. Confirmation of Vscn voltage should be performed after confirmation of Vad voltage adjustment. When Vad = -90V, Voltage of Vscn is 40V ± 4V.

TH-50PHD8UK

9.2. Initialization Pulse Adjust

1. Input a white signal to plasma video input.

2. Set the picture adjustment items as follows.

· Picture menu : Standard

· Color temperature : Normal

· Picture : 25

· Aspect : Full

3. Connect Oscilloscope to TPSC1 (T1) and check for 20 ± 15µ Sec.

4. Connect Oscilloscope to TPSC1 (T2) and adjust VR6602 for 155 ± 10µ Sec.

Test point Volume Level T1 TPSC1 (SC) Fixed 20 ± 15µ Sec T2 TPSS1 (SS) VR6602(SC) 155 ± 10µ Sec

9.3. P.C.B. (Printed Circuit Board) Remove

9.3.1. Caution

1. To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.

9.3.2. Quick adjustment after P.C.B. Remove

P.C.B. Name Test Point Voltage Volume Remarks P Board Vsus TPVSUS 176V ± 2V VR351 (P) * SC Board Vad TPVAD -90V ± 1V VR6801 (SC)

Vscn TPVSCN Vad+ 130V ± 4V Fixed Vset TPVSET 225V ± 7V Fixed

SS Board Ve TPVE 150V ± 1V VR6250 (SS) *

Vda TPVDA 75V ± 1V Fixed

D, J Board White balance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals

*See the Panel label.

Caution:

Absolutely do not reduce Vsus below Ve not to damage the P.C.B.

9.4. Adjustment Volume Location

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9.5. Test Point Location

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10 Service mode

10.1. CAT (computer Aided Test) mode

To exit the CAT mode, access the ID mode and switch off the main power.

10.1.1. IIC mode

Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

Subject and item are mentioned on “IIC mode structure”.

To exit the IIC mode, press the R button on the remote control.

TH-50PHD8UK

10.1.2. CD mode

Select the CD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 5 seconds.

Micom software version (IC9702), this version can be upgrade by

1. replace of new version IC

2. Loading the new version software from loader tool, TZSC07036. Memory data change

To exit the CD mode, press the R button on the remote control.

10.1.3. SD mode

Select the SD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

To exit the SD mode, press the R button on the remote control.

TH-50PHD8UK

10.2. IIC mode structure (following items value is sample data.)

11 Alignment

11.1. PC / RGB panel white balance

INPUT Alignment menu ProcedureEquipment Setting

TH-50PHD8UK

1 PC (VGA) Color

Gray Scale Analyzer Pattern

High light 75%

Low light 15%

Picture menu:

Standard

Picture:

Color temperature:

Cool

Aspect:

Full

POS./Size:

Normal

Component/ RGB-IN Select:

RGB

IIC mode:

Panel W/B Adj

Note: · Before adjustment, color signal has not been displayed on panel.

· The pedestal adjustment has been done.

PANEL W/B

G cut off

PANEL W/B

G Drive 3) Set G Drive to " E0 ".

PANEL W/B

B Drive 4) Adjust B and R Drive to set the High color temperature

R Drive as shown Table 1.

PANEL W/B

R,G,B Drive 5) Increase equaly R, G and B Drive to get the

· The signal root must be A side.

1) Set G cut off to " 80 ".

2)Find 75% (amplitude) of white area by color sensor.

largest level of 3 color drive to "FC".

Color Temp. x y

Cool(Hi) 0.276 0.276

Normal(Mid) 0.288 0.296

Warm(Low) 0.313 0.329

Table 1 W/B adjustment values

2 1) Change color temperature to "Normal".

3 1) Change color temperature to "Warm".

· NTSC

4 1) Copy the R drive, G drive and B drive data obtained in above

· PAL

· DVI

Picture menu:

Standard

Picture:

Color temperature:

Normal

Aspect:

Full

POS./Size:

Normal

Picture menu:

Standard

Picture:

Color temperature:

Warm

Aspect:

Full

POS./Size:

Normal

PANEL W/B

R,G,B Drive

PANEL W/B

R,G,B Drive

G cut off 2) In Mid color temperature, repeat the procedures 1) to 5) of

Cool mode.

G cut off 2) In Low color temperature, repeat the procedures 1) to 5) of

Cool mode.

steps into NTSC, PAL and DVI area.

TH-50PHD8UK

Color temperature

High

Medium

Low

A0-11AD

A0-11B0

A0-11B3

A0-11AE

A0-11B1

A0-11B4

Table 2 Drive data addresses (PC/RGB)

Color temperature

High

Medium

Low

A0-1180

A0-1183

A0-1186

A0-1181

A0-1184

A0-1187

Table 3 Drive data addresses (NTSC)

Color temperature

A0-11AF

A0-11B2

A0-11B5

A0-1182

A0-1185

A0-1188

High

Medium

Low

A0-1189

A0-118C

A0-118F

A0-118A

A0-118D

A0-1190

Table 4 Drive data addresses (PAL)

Color temperature

High

Medium

Low

A0-11B6

A0-11B9

A0-11BC

A0-11B7

A0-11BA

A0-11BD

Table 5 Drive data addresses (DVI)

A0-118B

A0-118E

A0-1191

A0-11B8

A0-11BB

A0-11BE

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