Panasonic TH-50PH10UK Service manual

Order No.MTNC070520CE

B34 Canada: D10

High Definition Plasma Display

TH-50PH10UK

GPH10D Chassis

Specifications

Power Source 120 VAC, 50/60Hz Power Consumption

Maximum 505 W Stand-bycondition Save OFF 0.6 W, Save ON 0.4 W Power off condition 0.1W

Plasma Displaypanel Drive method:AC type 50-inch,

16:9 aspect ratio

Screen size 43.5” (1,106 mm) (W) × 24.5” (622 mm) (H) × 50” (1,269 mm) (diagonal)

(No. of pixels) 1,049,088 (1,366 (W) × 768 (H) [4,098 × 768 dots]

Operating condition

Temperature 32 °F - 104 °F (0 °C - 40 °C) Humidit

Applicablesignals

Color System NTSC, PAL, PAL60, SECAM, Modified NTSC Scanning format 525 (480) / 60i · 60p, 625 (575)/50i · 50p, 750 (720)/60p · 50p, 1125 (1080) / 60i · 50i · 24p · 25p ·

PC signals VGA, SVGA, XGA,

Connection terminals

VIN VIDEO IN (BNC) 1.0 Vp-p (75-ohm)

COMPONENT / RGB IN Y/G (BNC) with/sync1.0 Vp-p (75-ohm)

20 % - 80 %

30p · 24sF .... SMPTE274M, 1250 (1080) / 50i

SXGA, UXGA..... (compressed)

Horizontal scanning frequency 15 - 110 kHz Vertical scanning frequency 48 - 120 Hz

S VIDEO IN (MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)

UDIO IN (RCA PIN JACKx4) 0.5 Vrms (high impedance)

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PB/B (BNC), PR/R (BNC) 0.7 Vp-p (75-ohm)

UDIO IN (RCA PIN JACKx2) 0.5 Vrms (high impedance)

PC IN (HIGH-DENSITYMINI-D-SUB 15PIN)

B/P

R/PR/CR:

HD/VD:1.0 - 5.0 Vp-p (high impedance)

UDIO IN (M3 JACK) 0.5 Vrms (high impedance) SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE SPEAKERS (6Ω) 16 W [8 W + 8 W] (10 % THD)

Accessories Supplied

Remote Control Transmitter EUR7636070R Batteries 2×AASize Fixing bands TMME203 × 2

Dimensions (W×H×D) 47.6” (1,210 mm) × 28.5” (724 mm) × 3.7” (95 mm) Mass (weight)

main unit onl with speakers approx. 88.2 lbs

approx. 79.4 lbs

or G with/sync1.0 Vp-p (75-ohm) or G without/sync 0.7 Vp-p (75-ohm)

CB:0.7 Vp-p (75-ohm)

0.7 Vp-p (75-ohm)

Notes:

· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

CONTENTS

Page Page

1 Applicable signals 4 2 Safety Precautions

2.1. General Guidelines

3 Prevention of Electrostatic Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 4 About lead free solder (PbF) 5 Service Hint 6 Disassembly

6.1. Removal of the Back Cover

6.2. Removal of the HU-Board

6.3. Removal of the HA-Board

6.4. Removal of the DS-Board

6.5. Removal of the HX-Board

6.6. Removal of the D-Board

6.7. Removal of the P-Board

6.8. Removal of the DN-Board

6.9. Removal of the H3-Board (L, R)

6.10. Removal of the SU-Board and the SD-Board

6.11. Removal of the SC-Board

6.12. Removal of the SS2-Board and the SS3-Board

6.13. Removal of the SS-Board

6.14. Removal of the stand blocks

6.15. Removal of the C1, C2, and the C3-Board

6.16. Removal of the S1-Board

10 10 11 11 11 11 12 12 12 12 13 13

6.17. Removal of the Fan

6 7 8 9

9 9 9 9

6.18. Removal of the Escutcheon

6.19. Removal of the V1-Board and the V2-Board

6.20. Removal of the Plasma Panel

7 Location of Lead Wiring

7.1. Lead Wiring (1)

7.2. Lead Wiring (2)

8 Adjustment Procedure

8.1. Driver Set-up

8.2. Initialization Pulse Adjust

8.3. P.C.B. (Print Circuit Board) Remove

8.4. Adjustment Volume Location

8.5. Test Point Location

9 Service mode

9.1. CAT (Computer Aided Test) mode

9.2. IIC mode structure (following items value is sample data.)

10 Adjustment

10.1. RGB white balance adjustment

10.2. HD white balance adjustment

10.3. Power control adjustment

11 Trouble shooting guide

11.1. Self Check

11.2. No Power

14 14 14 15

19 20

21 22 22 23 23

28 30 32

33 35

11.3. No Picture 35

11.4. Local screen failure 36

12 Option Setting 37 13 Conductor Views 39

13.1. P-Board 39

13.2. HA-Board

13.3. HU-Board

42 43

13.4. HX-Board 44

13.5. H3, S1, V1 and V2-Board

13.6. DS-Board

45 46

13.7. DN-Board 48

13.8. D-Board 50

13.9. C1-Board 52

13.10. C2-Board

13.11. C3-Board 54

13.12. SC-Board 55

13.13. SU-Board

13.14. SD-Board 59

13.15. SS-Board 66

13.16. SS2 and SS3-Board 62

14 Schematic and Block Diagram 63

14.1. Schematic Diagram Notes 63

14.2. Main Block Diagram 64

14.3. P-Board Block Diagram

14.4. P-Board (1 of 2) Schematic Diagram 66

14.5. P-Board (2 of 2) Schematic Diagram 67

14.6. HA-Board Block and Schematic Diagram 68

14.7. HU-Board Block Diagram 69

14.8. HU-Board (1 of 2) Schematic Diagram 70

14.9. HU-Board (2 of 2) Schematic Diagram 71

14.10. HX-Board Block and Schematic Diagram 72

14.11. V1 and V2-Board Block and Schematic Diagram 73

14.12. DS-Board (1 of 2) Block Diagram 74

14.13. DS-Board (2 of 2) Block Diagram 75

14.14. DS-Board (1 of 5) Schematic Diagram 76

14.15. DS-Board (2 of 5) and H3-Board Schematic Diagram 77

14.16. DS-Board (3 of 5) Schematic Diagram 78

14.17. DS-Board (4 of 5) Schematic Diagram 79

14.18. DS-Board (5 of 5) Schematic Diagram 80

14.19. DN-Board (1 of 2) Block Diagram 81

14.20. DN-Board (2 of 2) Block Diagram 82

14.21. DN-Board (1 of 6) Schematic Diagram 83

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14.22. DN-Board (2 of 6) Schematic Diagram 84

14.23. DN-Board (3 of 6) Schematic Diagram 85

14.24. DN-Board (4 of 6) Schematic Diagram 86

14.25. DN-Board (5 of 6) Schematic Diagram 87

14.26. DN-Board (6 of 6) Schematic Diagram 88

14.27. D-Board Block Diagram

14.28. D-Board (1 of 6) Schematic Diagram

89 90

14.29. D-Board (2 of 6) Schematic Diagram 91

14.30. D-Board (3 of 6) Schematic Diagram

14.31. D-Board (4 of 6) Schematic Diagram

92 93

14.32. D-Board (5 of 6) Schematic Diagram 94

14.33. D-Board (6 of 6) Schematic Diagram 95

14.34. C1, C2 and C3-Board Block Diagram 96

14.35. C1-Board (1 of 3) Schematic Diagram

14.36. C1-Board (2 of 3) Schematic Diagram 98

14.37. C1-Board (3 of 3) Schematic Diagram 99

14.38. C2-Board (1 of 2) Schematic Diagram

100

14.39. C2-Board (2 of 2) Schematic Diagram 101

14.40. C3-Board (1 of 2) Schematic Diagram 102

14.41. C3-Board (2 of 2) Schematic Diagram 103

14.42. SC, SU and SD-Board Block Diagram 104

14.43. SC-Board (1 of 3) Schematic Diagram 105

14.44. SC-Board (2 of 3) Schematic Diagram 106

14.45. SC-Board (3 of 3) Schematic Diagram

107

14.46. SU-Board (1 of 2) Schematic Diagram 108

14.47. SU-Board (2 of 2) Schematic Diagram 109

14.48. SD-Board (1 of 2) Schematic Diagram 110

14.49. SD-Board (2 of 2) Schematic Diagram 111

14.50. SS, S1, SS2 and SS3-Board Block Diagram 112

14.51. SS-Board (1 of 2) and S1-Board Schematic Diagram 113

14.52. SS-Board (2 of 2), SS2 and SS3-Board Schematic Diagram 114

15 Parts Location 115

15.1. Exploded View 115

15.2. Fan part location enlarged views 116

15.3. Cable relation 117

15.4. Packing summary 118

16 Mechanica l Replacement Parts List 119 17 Replacement Parts List 120

17.1. Replacement Parts List Notes 120

17.2. Electrical Replacement Parts List 120

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1 Applicable signals

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2 Safety Precautions

2.1. General Guidelines

1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.

2. When wiring units (with cables, flexible cables or lead wires) aresupplied as repair parts and only one wire or some of the wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

3. When conducting repairs and servicing, do not twistthe Fasten connectors but plug them straight in or unplug them straight out.

4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

2.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MΩ and 5.2MΩ.

When the exposed metal does not have a return path to

the chassis, the reading must be

Figure 1

2.1.2. Leakage Current Hot Check (See Figure 1 .)

1. Plug the AC cord directly into the AC outlet. Do not use an

isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF

capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1 .

3. Use an AC voltmeter, with 1000 ohms/volt or more

sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the

voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the

above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outsideof the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

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3 Prevention of Electrostatic Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder Remove device. Some solder Remove devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions whenhandling unpackaged replacement ES devices. (Otherwise ham less motion such asthe brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

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4 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

Caution

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb

solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

stamped on the back of PCB.

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5 Service Hint

Board Name Function

DN Digital Signal Processor, Microcomputer

D Format Converter, Plasma Ai Processor

DS Slot Interface (Audio / Video / Sync input Switch), SYNC processor,

SS Sustain drive SC Scan drive SU Scan out (Upper) SD Scan out (Lower) C1 Data Drive (Lower Right) C2 Data Drive (Lower Center) C3 Data Drive (Lower Left) H3 Speaker terminal

S1 Power switch SS2 Sustain out (Upper) SS3 Sustain out (Lower)

V1 Remote receiver, LED-G, R

V2 Key switch

P Power supply HX PC / RS-232C Input terminal HU Dual Video terminal (BNC / S) HA Component Video terminal (BNC)

Sub-Filed Processor

Sound processor

Note:

Extension cable kit for Slot Board is supplied as service fixtures and tools. (Part No. TZSC0704)

6 Disassembly

· To disassemble P.C.B., wait for 1 minute after power was off for discharge from electrolysis capacitors.

and marks indicate screw positions.

6.1. Removal of the Back Cover

1. Remove screws (×7 ,×4 , ×10 , x12 ) and then remove the Back Cover.

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6.3. Removal of the HA-Board

1. Remove 4 screws(D) and then remove the HA Terminal Block.

2. Remove 4 screws(E).

3. Remove 3 screws(F) and then remove the HA-Board.

6.4. Removal of the DS-Board

6.2. Removal of the HU-Board

1. Remove 4 screws (A) and then remove the HU Terminal Block.

2. Remove 4 screws(B).

3. Remove 3 screws(C) and then remove the HU-Board.

1. Remove the HA Terminal Block and HU Terminal Block. (Reference to Removal of the HA-Board and the HU-Board)

2. Remove the flexible cable from the connector (DS1).

3. Disconnect the connectors (DS2, DS4, DS6, DS7, DS8, DS14).

4. Remove 4 screws and then remove the Slot-Block.

5. Remove the HU Terminal Block and the HATerminal Block. (Reference to Removal of the HU-Board and the HA-

Board)

6. Remove the Slot Block. (Reference to Removal of the Slot Block)

7. The Slot Block is turned inside out.

8. Remove 6 screws and then remove the Slot cover.

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9. Remove 6 screws.

10. Remove the DS-Board.

6.5. Removal of the HX-Board

1. Remove the HU Terminal Block and the HATerminal Block. (Reference to Removal of the HU-Board and the HA-Board)

2. Remove the Slot Block. (Reference to Removal of the Slot Block)

3. Remove the DS-Board. (Reference to Removal of the DS-Board)

4. Remove 2 screws and then remove the Slot Case.

6.6. Removal of the D-Board

1. Remove the Slot Block. (Reference to Removal of the Slot Block)

2. Disconnect the connectors (D5, D25).

3. Remove the Flexible Cable from the connectors (D20, D31, D32).

4. Remove 4 screws and then remove the D-Board.

5. Remove 4 Hexagonal-Head screws and 2 screws and then remove the HX-Board.

6.7. Removal of the P-Board

1. Disconnect the connectors (P2, P6, P7, P9, P11, P12, P25).

2. Remove 6 screws (

) and then remove the P-Board.

6.8. Removal of the DN-Board

1. Remove the flexible cable from the connectors (DN1).

2. Disconnect the connectors (D6, D31, D33, D35).

3. Remove 4 screws and then remove the DN-Board.

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6.10. Removal of the SU-Board and the SD-Board

1. Remove the Speaker Terminal Block(R).

(Reference to Removal of the H3-Board (L, R))

2. Remove the Flexible cables (SU1, SU2, SU3, SU4,)

connected to the SU-Board and remove the connector (SC45-SU45).

3. Remove 6 screws.

4. Slide the SU-Board to the left to disconnect from a

connector (SC41-SU41) on the SC-Board and remove the SU-Board.

6.9. Removal of the H3-Board (L, R)

1. Remove each 1 screw and then remove the Speaker

Terminal Block (L, R).

2. Disconnect the connector (H37).

3. Remove 3 screws (F) and then remove the H3-Board.

5. Disconnect the connectors(SU45, SD46).

6. Slide the SU-Board and the SD-Board to the left, remove the SU-Board and the SD-Board from the connectors (SC41, SC42).

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6.11. Removal of the SC-Board

6.13. Removal of the SS-Board

1. Remove the SU-Board and SD-Board (Reference to removal Su-Board and SD-Board).

2. Disconnect the connector (SC2).

3. Disconnect the flexible cable (SC20).

4. Remove 9 screws ( right.

) and then slide the SC-Board to the

6.12. Removal of the SS2-Board and

the SS3-Board

1. Disconnect the connector (SS23).

2. Disconnect the Flexible Cable (SS52).

3. Disconnect the connector (SS24).

4. Disconnect the Flexible Cable (SS57).

5. Remove each 2 screws and then remove the SS2-Board and the SS3-Board.

1. Disconnect the connectors (SS11, SS12, SS21, SS22, SS33, SS34, SS35).

2. Remove the Flexible Cable from the connectors (SS53, SS54, SS55, SS56).

3. Remove 7 screws and then remove the SS-Board.

6.14. Removal of the stand blocks

1. Remove the plasma panel section from the servicing stand and lay on a flat surface such as a table (covered) with the plasma panel surface facing downward.

2. Remove the stand blocks (left, right) fastening screws (x 4 each) and remove the stand blocks (left, right).

6.15. Removal of the C1, C2, and the C3-Board

6.15.1. Removal of the C1-Board

1. Remove the Flexible Cable from the connectors (C10,

C11).

2. Remove 10 screws (

from the connectors (CB1, CB2, CB3,CB4,CB5).

3. Remove 6 screws (

6.15.2. Removal of the C2-Board

1. Remove the Flexible Cable from the connectors (C20, C21,

C22).

2. Remove 6 screws (

from the connectors (CB6, CB7, CB8).

3. Remove 4 screws (

) and then remove the Flexible Cable

) and then remove the C1-Board.

) and then remove the Flexible Cable

) and then remove the C5-Board.

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6.16. Removal of the S1-Board

1. Disconnect the connector (SS34).

2. Remove 2 screws(G) and then remove the S1-Board Block.

3. Disconnect the connector (S34).

4. Remove 1 screw(H) and then remove the S1-Board.

6.15.3. Removal of the C3-Board

1. Remove the Flexible Cable from the connector (C32).

2. Remove the connectors (C33 and C35).

3. Remove 6 screws and (

from the connectors (CB9, CB10, CB11).

4. Remove 4 screws and (

) then remove the Flexible Cable

) then remove the C3-Board.

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6.17. Removal of the Fan

1. Disconnect the Fan Relay Couplers.

2. Remove each 3 screws and then remove 2 Fan Blocks.

3. Remove each 4 screws (J) and then remove the Fans.

4. Slide the Plasma Panel and then remove the Plasma Panel (arrow2).

6.19. Removal of the V1-Board and

the V2-Board

1. Remove the Escutcheon. (Reference to Removal of the Escutcheon)

2. Remove 6 screws and then remove the Fixed Angle.

4. Reassemble the Fans in reverse order.

5. Stick the Cushion (Fan) around the Fan.

Note:

The Cushion (Fan) are unsuitable to reuse. Please use a new one at the time of Fan exchange.

6.18. Removal of the Escutcheon

1. Remove the S1-Board Block. (Refer to Removal of the S1-Board)

2. Remove 6 screws of the Escutcheon.

3. Remove the 1 screw(K).

4. Disconnect the coupler(V2) and then remove the V1-Board.

5. Remove the operation button from the V2-Board.

6. Disconnect the coupler(V15) and then remove the V2Board.

3. Pull the bottom of the Plasma Panel forward (arrow1). 14

6.20. Removal of the Plasma Panel

1. Disconnect the Fan Relay connectors.

2. Remove each 3 screws ( Blocks.

3. Remove each 4 screws ( Black(L, R).

4. Remove each 1 screws ( Terminal Block(L, R).

) and then remove the 2 Fan

) and then remove the Stand

) and then remove the Speaker

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P25).

11. Remove 6 screws (

12. Disconnect the connectors (D5, D25).

13. Remove the Flexible Cable from the connectors(D20, D31, D32).

14. Remove 4 screws and then remove the D-Board.

) and then remove the P-Board.

5. Disconnect the connectors (DS1, DS2, DS4, DS6, DS7, DS8, DS14, DS15).

6. Remove 4 screws and then remove the Slot Block.

7. Disconnect the connectors (DN6, DN31, DN33, DN35).

8. Remove the Flexible Cable from the connector (DN1).

9. Remove 4 screws and then remove the DN-Board Block.

15. Remove the Flexible Cable from the connectors (SU1, SU2, SU3, SU4, SD1, SD2, SD3, SD4).

16. Remove 6 screws.

10. Disconnect the connectors (P2, P6, P7, P9, P11, P12,

17. Disconnect the connectors (SU45, SD46).

18. Slide the SU-Board and the SD-Board to the left, remove the SU-Board and the SD-Board from the connectors (SC41, SC42).

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19. Remove the SU-Board and SC-Board.

20. Disconnect the connector (SC2).

21. Disconnect the flexible cable (SC20).

22. Remove 9 screws and (

) then remove the SC-Board.

23. Disconnect the connector (SS23).

24. Remove the Flexible Cable from the connector (SS52).

25. Disconnect the connector (SS24).

26. Remove the Flexible Cable from the connector (SS57).

27. Remove each 2 screws and then remove the SS2-Board and the SS-3Board.

31. Remove the plasma panel section from the servicing stand and lay on a flat surface such as a t with the plasma panel surface facing downward.

32. Remove the stand blocks (left, right) fastening screws (x4 each) and remove the stand blocks (left, right).

33. Remove the Flexible Cable from the connectors (C10, C11).

28. Disconnect the connectors (SS11, SS12, SS21, SS22, SS33, SS34, SS35).

29. Remove the Flexible Cable from the connectors (SS53, SS54, SS55, SS56).

30. Remove 7 screws and then remove the SS-Board.

34. Remove the Flexible Cable from the connector (C20).

35. Remove the connectors (C21 and C22).

36. Disconnect the connectors (C32, C33, C35).

37. Disconnect the connector (SS34).

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44. Remove 2 screws and then remove the S1-Board Block.

45. Remove 3 screws and then remove the AC-Inlet Block.

38. Remove 2 screws(G) and then remove the S1-Board Block.

39. Disconnect the connector (S34).

40. Remove 1 screw(H) and then remove the S1-Board.

41. Remove the Flexible Cable from the connectors (C20, C21, C22).

42. Disconnect the Fan Relay Couplers.

43. Remove each 3 screws and then remove 2 Fan Blocks.

46. Remove 6 screws of the Escutcheon.

47. Pull the bottom of the Plasma Panel forward (arrow1).

48. Slide the Plasma Panel and then remove the Plasma Panel (arrow2).

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7 Location of Lead Wiring

7.1. Lead Wiring (1)

The lead wiring is dressed as shown in figure.

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7.2. Lead Wiring (2)

The lead wiring is dressed as shown in figure.

8 Adjustment Procedure

8.1. Driver Set-up

8.1.1. Item / Preparation

1. Set Aging pattern 0 (Vset adjustment pattern) by IIC mode.

2. Set the picture controls as follows.

· Picture menu : Standard

· Picture : 25

· Aspect : Full

8.1.2. Adjustments

Adjust driver section voltages referring the panel data label.

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Caution

1. First perform Vsus voltage adjustment.

2. Confirmation of Vscn voltage should be performed after confirmation of Vad voltage adjustment. When Vad = -105V, Voltage of Vscn is 40V ± 4V.

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8.2. Initialization Pulse Adjust

1. Input the white signal to plasma video input.

2. Set the picture adjustment items as follows.

· Picture menu : Standard

· Color temperature : Normal

· Picture : 25

· Aspect : Full

3. Connect Oscilloscope to TPSC1 (T2) and sdjust VR6602 for 185 ± 10µ Sec.

Test Point Volume Level

T2 TPSC1 (SC) VR6602 (SC) 185 ± 10µ Sec

8.3. P.C.B. (Print Circuit Board) Remove

8.3.1. Caution

1. To remove P.C.B., wait 1 minute after power was off for discharge from electrolysis capacitors.

8.3.2. Quick adjustment after P.C.B. Remove

P.C.B. Name Test Point Voltage Volume Remarks P Board Vsus TPVSUS (SS) Vsus ± 2V VR251 (P) * SC Board Vad TPVAD -105V ± 1V VR6600 (SC)

Vbk TPVBK 155V ± 1V VR6604 (SC) SS Board Ve TPVE Ve ± 1V VR6000 (SS) * DS Board White balance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals DN Board Set Market Select Number to correct destination by Ms mode (See chap. 9.1.4)

*See the Panel label.

Caution

Absolutely do not reduce Vsus below Ve not to damage the P.C.B.

8.4. Adjustment Volume Location

8.5. Test Point Location

TH-50PH10UK

9 Service mode

9.1. CAT (Computer Aided Test) mode

TH-50PH10UK

To exit the CAT mode, access the ID mode and switch off the main power.

9.1.1. IIC mode

Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

Subject and item are mentioned on “IIC mode structure”. To exit the IIC mode, press the R button on the remote control.

TH-50PH10UK

9.1.2. CD mode

Select the CD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 3 seconds.

Microcomputer software version (IC4702), this version can be upgrade by

1. Replace of new version IC

2. Loading the new version software from loader tool, TZSC07036. Memory data change

To exit the CD mode, press the R button on the remote control.

9.1.3. SD mode

Select the SD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

To exit the SD mode, press the R button on the remote control.

TH-50PH10UK

9.1.4. MS mode

Select the MS mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 3 seconds.

To exit the MS mode, press the R button on the remote control.

Caution:

Market Select should be set after exchange of DN-Board.

Destination number

Number Destination Number Destination

0 Japan 16 -1 North America 17 -2 Europe 18 China 3 Others 19 China (Hotel) 4 Britain 20 Russia 5 Taiwan 21 Russia (Hotel) 6 Thailand 22 Hong Kong 7 -- 23 -8 Japan (Hotel) 24 --

9 North America (Hotel) 25 -10 Europe (Hotel) 26 -11 -- 27 -12 Britain (Hotel) 28 Middle East/Hong Kong 13 -- 29 Middle East/Hong Kong (Hotel) 14 Thailand (Hotel) 30 Australia 15 -- 31 Australia (Hotel)

Default setting

Number Destination

1 North America

9.1.5. ID mode

Select the ID mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 3 seconds.

To exit the ID mode, press the R button on the remote control.

9.2. IIC mode structure (following items value is sample data.)

TH-50PH10UK

10 Adjustment

Instrument Name Connection Remarks

· RGB VGA W/B pattern

· Color analyzer

(Minolta CA-100 or equivalent)

Procedure Remarks

· Ensure aging is adequate.

· Make sure the front panel to be used on the final set is fitted.

· Make sure a color signal is not being shown before adjustment.

· Put the color analyzer where there is little color variation.

1. Set COMPONET/RGB-IN SELECT to RGB.

2. Select the IIC mode “PANEL W/B Adj.” item.

3. Check that the color temperature is “COOL (High)”.

4. Output a white balance pattern.

5. Touch the signal receiver of color analyzer to the highlight window’s center.

6. Fix G drive at E0h and adjust B drive and R drive so x, y become the “Color temperature High” in the below table.

7. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

8. Set color temperature to “NORMAL (Medium)”.

9. Fix G drive at E0h and adjust B drive and R drive so the highlight window’s x, y becomes the “Color temperature Medium” in the below table.

10. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

11. Set color temperature to “WARM(Low)”.

12. Set G drive to E0h and adjust B drive and R drive so the highlight window’s x, y become the “Color temperature Low” shown in the below table.

13. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

14. Copy the R drive, G drive and B drive data in NTSC, PAL DVI region.

PC input Panel surface

10.1. RGB white balance adjustment

User setting: Normal (Picture menu: Standard)

Picture Menu: Standard Picture: 25 Aspect: Full Position and size: Normal

· Highlight section Signal amplitude 75%

· Cutoff standard G: 80h

· Drive standard G: E0h

Adjustment target Hi-light: x ± 0.003 y ± 0.003 Hi-light is target of the number at drive adjustment in the hi-light windows. Therefore, it is not target of the hi-light number at after adjustment white balance.

TH-50PH10UK

10.2. HD white balance adjustment

Instrument Name Connection Remarks

· HD W/B pattern (COMPONENT Output)

· Color analyzer

(Minolta CA-100 or equivalent)

Procedure Remarks

· Ensure aging is adequate.

· Make sure the front panel to be used on the final set is fitted.

· Make sure a color signal is not being shown before adjustment.

· Put the color analyzer where there is little color variation.

1. Set COMPONENT/RGB-IN SELECT to COMPONENT.

2. Select the IIC mode "PANEL W/B Adj.” item.

3. Check that the color temperature is “COOL (High)”.

4. Output a white balance pattern.

5. Touch the signal receiver of color analyzer to the highlight window’s center.

6. Fix G drive at E0h and adjust B drive and R drive so x, y become the "Color temperature High" in the below table.

7. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

8. Set color temperature to “NORMAL (Medium)”.

9. Fix G drive at E0h and adjust B drive and R drive so the highlight window´s x, y becomes the "Color temperature Medium" in the below table.

10. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

11. Set color temperature to "WARM (Low)".

12. Set G drive to E0h and adjust B drive and R drive so the highlight window´s x, y become the “Color temperature Low” shown in the below table.

13. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

14. Copy the R drive, G drive and B drive data in YUV1_525ip, YUV3_625ip region.

PC input Panel surface

User setting: Normal (Picture menu: Standard)

Picture Menu: Standard Picture: 25 Aspect: Full Position and size: Normal

· Highlight section Signal amplitude 75%

· Cutoff standard G: 80h

· Drive standard G: E0h

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