Panasonic TH-50PF9UK Service manual

High Definition Plasma Display

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TH-50PF9UK

GPF9D Chassis

Specifications

Power Source 120 VAC, 50 / 60Hz
Power Consumption

Maximum 650 W
Stand-bycondition Save OFF 1.0 W, Save ON 0.8 W
Power off condition 0.1W

Plasma Displaypanel Drive method:AC type 50-inch,

16:9 aspect ratio

Screen size 43.5” (1,106 mm) (W) × 24.5” (622 mm) (H) × 50” (1,269 mm) (diagonal)

(No. of pixels) 2,073,600 (1,920 (W) × 1,080 (H) [5,760 × 1,080 dots]

ORDER NO. ITD0610069CE

B34 Canada: D10

Operating condition

Temperature 32 °F - 104 °F (0 °C - 40 °C)
Humidit

Applicablesignals

Color System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575)/50i 50p, 750 (720)/60p 50p, 1125 (1080) / 60i 60p 50i 50p

PC signals VGA, SVGA, XGA,SXG

Connection terminals

DVI-D Video Input DVI-D 24 Pin × 1

COMPONENT / RGB

20 % - 80 %

24p 25p 30p 24sF .... SMPTE274M, 1250 (1080) / 50i

UXGA..... (compressed)

Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz

compliance with DVI Revision 1.0

udio Input Stereo minijack (M3) × 1

0.5Vrms

Content Protection Compatible with HDCP 1.1

/ G (BNC)

PB/ B (BNC), P

UDIO IN (RCA PIN JACK) 0.5 Vrms

R (BNC) 0.7 Vp-p (75-ohm)

R

or G with/sync1.0 Vp-p (75-ohm)

© 2006 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.

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TH-50PF9UK

PC (HIGH-DENSITYMini D-SUB 15PIN)

B/P

B

R/P

R

HD/VD :1.0 - 5.0 Vp-p (high impedance)

VBS (use HD port) with/picture 1.0 Vp-p (high impedance)

UDIO IN (M3 JACK) 0.5 Vrms
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
SPEAKERS (6-ohm) 16 W [8 W + 8 W] (10 % THD)

Accessories Supplied

Remote Control Transmitter EUR7636070R
Batteries 2×AASize
Fixing bands (TMME203 or TMME187) × 2

Dimensions (W×H×D) 47.6” (1,210 mm) × 28.5” (724 mm) × 3.7” (95 mm)
Mass (weight)

main unit onl
with speakers approx. 101.4 lbs

approx. 92.6 lbs

or G with/sync1.0 Vp-p (75-ohm)

or G without/sync0.7 Vp-p (75-ohm)
CB:0.7 Vp-p (75-ohm)
CR:0.7 Vp-p (75-ohm)

without/picture 0.3 Vp-p (high impedance)

Notes:



 · Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.



CONTENTS

Page Page

1 Applicable signals 4
2 Safety Precautions

2.1. General Guidelines

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices
4 About lead free solder (PbF)
5 Service Hint
6 Disassembly

6.1. Removal of the Back Cover

6.2. Removal of the HA-Board

6.3. Removal of the HDD-Board

6.4. Removal of the DS-Board

6.5. Removal of the HX-Board

6.6. Removal of the PB-Board

6.7. Removal of the DN-Board

6.8. Removal of the D-Board

6.9. Removal of the P-Board

6.10. Removal of the SU-Board and the SD-Board

6.11. Removal of the SC-Board

6.12. Removal of the SS-Board

6.13. Removal of the H3-Board (L, R)

6.14. Removal of the C1, C2, C3, C4, C5 and the C6-Board

6.15. Removal of the S1-Board

6.16. Removal of the Fan

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15

6.17. Removal of the Escutcheon

5

5

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7
8
9

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9

6.18. Removal of the V1-Board and the V2-Board

6.19. Removal of the Plasma Panel

7 Location of Lead Wiring
8 Adjustment Procedure

8.1. Driver Set-up

8.2. Initialization Pulse Adjust

8.3. P.C.B. (Printed Circuit Board) Remove

8.4. Adjustment Volume Location

8.5. Test Point Location

9 Service mode

9.1. CAT (computer Aided Test) mode

9.2. IIC mode structure (following items value is sample data)

10 Adjustment

10.1. RGB white balance adjustment

10.2. HD white balance adjustment

10.3. Power control adjustment

11 Trouble shooting guide

11.1. Self Check

11.2. No Power

11.3. No Picture

11.4. Local screen failure

12 Option Setting

15
15
16

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22

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24
24

25

25

29

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34

35

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37
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38

39

2

13 Conductor Views 41

13.1. P-Board

13.2. PB-Board

13.3. HA-Board

13.4. HX-Board

13.5. HDD-Board

13.6. H3, V1 and S1-Board

13.7. DS-Board

13.8. DN-Board

13.9. D-Board

13.10. C1-Board

13.11. C2-Board

13.12. C3-Board

13.13. C4-Board

13.14. C5-Board

13.15. C6-Board

13.16. SC-Board

13.17. SU-Board

13.18. SD-Board

13.19. SS-Board

14 Block and Schematic Diagram

14.1. Schematic Diagram Note

14.2. Main Block Diagram

14.3. P-Board (1 of 2) Block Diagram

14.4. P-Board (2 of 2) Block Diagram

14.5. P-Board (1 of 2) Schematic Diagram

14.6. P-Board (2 of 2) Schematic Diagram

14.7. PB, V1 and V2-Board Block and Schematic Diagram

14.8. HA-Board Block and Schematic Diagram

14.9. HX-Board Block and Schematic Diagram

14.10. HDD-Board Block Diagram

14.11. HDD-Board (1 of 2) Schematic Diagram

14.12. HDD-Board (2 of 2) Schematic Diagram

14.13. DS-Board (1 of 2) and H3-Board Block Diagram

14.14. DS-Board (2 of 2) Block Diagram

14.15. DS-Board (1 of 3) and H3-Board Schematic Diagram

14.16. DS-Board (2 of 3) Schematic Diagram

14.17. DS-Board (3 of 3) Schematic Diagram

14.18. DN-Board (1 of 3) Block Diagram

14.19. DN-Board (2 of 3) Block Diagram

14.20. DN-Board (3 of 3) Block Diagram

14.21. DN-Board (1 of 10) Schematic Diagram

14.22. DN-Board (2 of 10) Schematic Diagram

14.23. DN-Board (3 of 10) Schematic Diagram

14.24. DN-Board (4 of 10) Schematic Diagram

14.25. DN-Board (5 of 10) Schematic Diagram

14.26. DN-Board (6 of 10) Schematic Diagram

14.27. DN-Board (7 of 10) Schematic Diagram

41
47
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68
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14.28. DN-Board (8 of 10) Schematic Diagram

14.29. DN-Board (9 of 10) Schematic Diagram

14.30. DN-Board (10 of 10) Schematic Diagram

14.31. D-Board (1 of 2) Block Diagram

14.32. D-Board (2 of 2) Block Diagram

14.33. D-Board (1 of 8) Schematic Diagram

14.34. D-Board (2 of 8) Schematic Diagram

14.35. D-Board (3 of 8) Schematic Diagram

14.36. D-Board (4 of 8) Schematic Diagram

14.37. D-Board (5 of 8) Schematic Diagram

14.38. D-Board (6 of 8) Schematic Diagram

14.39. D-Board (7 of 8) Schematic Diagram

14.40. D-Board (8 of 8) Schematic Diagram

14.41. C1, C2, C5 and C6 Block Diagram

14.42. C2, C3, C4 and C5 Block Diagram

14.43. C1-Board (1 of 2) Schematic Diagram

14.44. C1-Board (2 of 2) Schematic Diagram

14.45. C2-Board (1 of 2) Schematic Diagram

14.46. C2-Board (2 of 2) Schematic Diagram

14.47. C3-Board (1 of 2) Schematic Diagram

14.48. C3-Board (2 of 2) Schematic Diagram

14.49. C4-Board (1 of 2) Schematic Diagram

14.50. C4-Board (2 of 2) Schematic Diagram

14.51. C5-Board (1 of 2) Schematic Diagram

14.52. C5-Board (2 of 2) Schematic Diagram

14.53. C6-Board (1 of 2) Schematic Diagram

14.54. C6-Board (2 of 2) Schematic Diagram

14.55. SC-Board Block Diagram

14.56. SC-Board (1 of 2) Schematic Diagram

14.57. SC-Board (2 of 2) Schematic Diagram

14.58. SU and SD-Board Block Diagram

14.59. SU-Board (1 of 3) Schematic Diagram

14.60. SU-Board (2 of 3) Schematic Diagram

14.61. SU-Board (3 of 3) Schematic Diagram

14.62. SD-Board (1 of 3) Schematic Diagram

14.63. SD-Board (2 of 3) Schematic Diagram

14.64. SD-Board (3 of 3) Schematic Diagram

14.65. SS and S1-Board Block Diagram

14.66. SS and S1-Board Schematic Diagram

15 Parts Location

15.1. Exploded View

15.2. Fan part location enlarged views

15.3. Cable relation

15.4. Packing summary

16 Mechanica l Replacement Parts List
17 Replacement Parts List

17.1. Replacement Parts List Notes

17.2. Electrical Replacement Parts List

TH-50PF9UK

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TH-50PF9UK

1 Applicable signals

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TH-50PF9UK

2 Safety Precautions

2.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

2.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M: and 5.2M:.

When the exposed metal does not have a return path to

the chassis, the reading must be

.

Figure 1

2.1.2. Leakage Current Hot Check (See

Figure 1 .)

1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.

2. Connect a 1.5k:, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1 .

3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the
voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.

6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outsideof the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.

5

TH-50PF9UK

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistorsand
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
whichshould be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder Remove device. Some solder Remove devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or
comparableconductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).

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TH-50PF9UK

4 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

Caution



 ·Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.



Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).



 ·Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).



If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.



 ·After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto



the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also beused.

stamped on the back of PCB.

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TH-50PF9UK

5 Service Hint

Board Name Function Board Name Function

D Digital Signal Processor,

Format Converter,
Plasma AI Processor

DS Slot Interface (Audio / Video / Sync Input

Switch),
SYNC Processor, Audio Processor,
Speaker Out Amplifier,
DC-DC Converter

SS Sustain Drive V1 LED (Stand-By / Power On) & Remote

SC Scan Drive PB Fan Control
SU Scan Out (Upper) P Line Filter, Power Supply
SD Scan Out (Lower) HX PC / RS-232C
C1 Data Drive (Upper Right) HA BNC Component Video
C2 Data Drive (Upper Center) DN Dital Signal Processor, Micon
C3 Data Drive (Upper Left) HDD DVI-D Terminal

Note:

Extension cable kit for Slot Board is supplied as service fixtures and tools.
(Part No. TZSC07040)

C4 Data Drive (Lower Left)
C5 Data Drive (Lower Center)
C6 Data Drive (Lower Right)
H3 Speaker Terminal
S1 Power Switch

Receiver, Key Scan

V2 Key Switch

8

6 Disassembly



 ·To disassemble P.C.B., wait for 1 minute after power was



off for discharge from electrolysis capacitors.

and marks indicate screw positions.



 ·







6.1. Removal of the Back Cover

1. Remove the screws (×22 ,×6 ,×4 ) and then remove
the Back Cover.

TH-50PF9UK

6.3. Removal of the HDD-Board

1. Remove the 4 screws (D) and then remove the HDD
Terminal Block.

2. Remove the 4 screws (E).

3. Remove the 2 Hexagonal-Head screws (F) and then
remove the HDD-Board.

6.2. Removal of the HA-Board

1. Remove the 4 screws (A) and then remove the HA Terminal
Block.

2. Remove the 4 screws (B).

3. Remove the 2 screws (C) and then remove the HA-Board.

6.4. Removal of the DS-Board

1. Remove the HA Terminal Block and the HDD Terminal
Block.

(Reference to Removal of the HA-Board and the HDD­Board)

2. Remove the flexible cables from the couplers (DS1, DS6).

3. Disconnect the couplers (DS2, DS3, DS4, DS7, DS8,
DS10, DS14, DS15, DS30).

4. Remove the 4 screws and then remove the Slot Case.

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TH-50PF9UK

5. Remove the 9 screws and then remove the DS-Board and
Fixed Plate.

6.5. Removal of the HX-Board

1. Remove the HA Terminal Block and the HDD Terminal
Block.

(Reference to Removal of the HA-Board and the HDD­Board)

2. Remove the 4 screws and then remove the Slot Block
Case.

6.6. Removal of the PB-Board

1. Disconnect the couplers (PB30, PB31, PB32, PB33, PB34,
PB35, PB36, PB38).

2. Remove the 2 screws and then remove the PB-Board.

6.7. Removal of the DN-Board

1. Remove the flexible cables from the couplers (DN1, DN6).

2. Disconnect the couplers (DN2, DN3, DN51).

3. Remove the 4 screws and then remove the DN-Board.

3. Remove the 4 Hexagonal-Head screws (G) and the 2
screws of the HX-Board and then remove the HX-Board.

6.8. Removal of the D-Board

1. Remove the PB-Board. (Reference to Removal of the PB­Board)

2. Remove the flexible cables from the couplers (DN1, DN6).

3. Disconnect the couplers (D3, D5, D20, DN3).

4. Remove the 4 screws and then remove the DN-Board
Block.

10

5. Disconnect the coupler(D25).

6. Remove the flexible cables from the couplers (D31, D32,
D33, D34, D35, D36).

7. Remove the 4 screws and then remove the D-Board.

6.9. Removal of the P-Board

TH-50PF9UK

6.10. Removal of the SU-Board and
the SD-Board

1. Remove the flexible cables from the couplers (SU1, SU2,

SU3, SU4, SU5, SD1, SD2, SD3, SD4, SD5).

Please exchange fuse (F1601,F1602) at the same time
when you exchange P-Board.

The fuse is not bundled to P-Board for the repair.

1. Disconnect the couplers (P2, P5, P9, P10, P11, P12, P23,
P25, P51, P53, P55).

2. Remove the 10 screws and then remove the P-Board.

2. Disconnect the couplers (SU45, SD46).

3. Remove the each 2 screws.

4. Slide the SU-Board and the SD-Board to the left, remove
the SU-Board and the SD-Board from the couplers (SC41,
SC42, SC43, SC44).

Note:

The handling of a connector connecting with SC45­SU45 and SC46-SD46 must note enough.

(DISCONNECTION and TRANSFORMATION,etc.)

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TH-50PF9UK

6.11. Removal of the SC-Board

1. Disconnect the couplers (SU45, SD46).

2. Remove the each 4 screws.

3. Slide the SU-Board and the SD-Board to the left, remove
the SU-Board and the SD-Board from the couplers (SC41,
SC42, SC43, SC44).

4. Disconnect the couplers (SC2, SC20, SC23).

5. Remove the 9 screws of the SC-Board and slide the SC­Board in the direction of the arrow (A) and then remove the
SC-Board.

Note:

Remove the SC-Board not to damage the flexible cables
of the SU-Board and the SD-Board, parts on the SC­Board.

6.13. Removal of the H3-Board (L,
R)

1. Remove the each 1 screw and then remove the Speaker

Terminal Block (L, R).

6.12. Removal of the SS-Board

1. Disconnect the couplers (SS11, SS12, SS34, SS35, SS42,
SS44).

2. Remove the flexible cables from the couplers (SS51, SS52,
SS53, SS54, SS55, SS56).

3. Remove the 7 screws of the SS-Board and slide the SS­Board in the direction of the arrow (B) and then remove the
SS-Board.

Note:

Remove the SS-Board not to damage the flexible cables
of the Plasma Panel and parts on the SS-Board.

2. Disconnect the coupler(H37).

3. Remove the 3 screws (F) and then remove the H3-Board.

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6.14. Removal of the C1, C2, C3, C4,
C5 and the C6-Board

1. Remove the Slot Block.

(Reference to remove of the DS-Board).

2. Remove the Speaker Terminal Block(L, R).

(Refernce to remove of the Speaker Terminal Block(L, R).

3. Remove the each 4 screws (

Blocks(L, R).

4. Disconnect the Fan Relay Couplers.

5. Remove the 14 screws (

Blocks.

) and then remove the Stand

) and then remove the 4 Fan

TH-50PF9UK

6.14.2. Removal of the C2-Board

1. Remove the flexible cables from the couplers (C21, C22,
C24, C25).

2. Remove the 10 screws (
cables from the couplers (CA6, CA7, CA8, CA9, CA10).

3. Remove the 5 screws (

) and then remove the flexible

) and then remove the C2-Board.

6.14.3. Removal of the C3-Board

1. Remove the flexible cables from the coupler (C31).

2. Disconnect the couplers (C35).

3. Remove the 10 screws (
cables from the couplers (CA11, CA12, CA13, CA14,
CA15).

4. Remove the 5 screws (

) and then remove the flexible

) and then remove the C3-Board.

6.14.1. Removal of the C1-Board

1. Remove the flexible cables from the couplers (C10, C11).

2. Remove the 10 screws (
cables from the couplers (CA1, CA2, CA3, CA4, CA5).

3. Remove the 5 screws (

) and then remove the flexible

) and then remove the C1-Board.

13

TH-50PF9UK

6.14.4. Removal of the C4-Board

6.14.6. Removal of the C6-Board

1. Remove the flexible cable from the coupler (C41).

2. Disconnect the couplers (C42, C44).

3. Remove the 10 screws (
cables from the couplers (CB11, CB12, CB13, CB14,
CB15).

4. Remove the 5 screws (

) and then remove the flexible

) and then remove the C4-Board.

6.14.5. Removal of the C5-Board

1. Remove the flexible cables from the couplers (C51, C52,
C54, C55).

2. Remove the 10 screws (
cables from the couplers (CB6, CB7, CB8, CB9, CB10).

3. Remove the 5 screws (

) and then remove the flexible

) and then remove the C5-Board.

1. Remove the flexible cable from the coupler (C60, C61).

2. Remove the 10 screws (
cables from the couplers (CB1, CB2, CB3, CB4, CB5).

3. Remove the 5 screws (

) and then remove the flexible

) and then remove the C6-Board.

6.15. Removal of the S1-Board

1. Disconnect the coupler(SS34).

2. Remove the 2 screws(G) and then remove the S1-Board
Block.

3. Disconnect the coupler(S34).

4. Remove the 1 screw(H) and then remove the S1-Board.

14

6.16. Removal of the Fan

TH-50PF9UK

6.17. Removal of the Escutcheon

1. Disconnect the Fan Relay Couplers.

2. Remove the each 14 screws and then remove the 4 Fan
Blocks.

3. Remove the each 4 screws (J), 4 screws (K), (L) and then
remove the Fans.

1. Remove the S1-Board Block.
(Reference to Removal of the S1-Board)

2. Disconnect the couplers(J2, J15).

3. Remove the 2 screws of the Escutcheon.

4. Pull the bottom of the Plasma Panel forward (arrow1).

5. Slide the Plasma Panel and then remove the Plasma Panel
(arrow2).

4. Reassemble the Fans in reverse order.

5. Stick the Cushion (Fan) around the Fan.

Note:

The Cushion (Fan) are unsuitable to reuse.
Please use a new one at the time of Fan exchange.

6.18. Removal of the V1-Board and

the V2-Board

1. Remove the Escutcheon.
(Reference to Removal of the Escutcheon)

2. Remove the 6 screws and then remove the Fixed Angle.

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3. Remove the 2 screws (M) and 1 screw (N).

4. Disconnect the coupler (V2) and then remove the V1­Board.

5. Remove the operation button from the V2-Board.

6. Disconnect the coupler (V15) and then remove the V2­Board.

6.19. Removal of the Plasma Panel



 ·The C1,C2,C3,C4,C5,C6 Boards are connected with the



plasma panel for the repair.

1. Disconnect the couplers (PB30, PB31, PB32, PB33, PB34,
PB35, PB36, PB38).

2. Remove the 2 screws and then remove the PB-Board.

3. Remove the flexible cables from the couplers (DN1, DN6).

4. Remove the couplers (DN2, DN3, DN51).

5. Remove the 4 screws and then remove the DN-Board
Block.

6. Disconnect the couplers (DS2, DS4, DS7, DS8, DS10,
DS15, DS30).

7. Remove the 5 screws and then remove the Slot Block.

8. Disconnect the couplers (D20, D25).

9. Remove the flexible cables from the couplers (D31, D32,
D33, D34, D35, D36).

10. Remove the 4 screws and then remove the D-Board.

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11. Disconnect the couplers (P2, P9, P11, P12, P23, P51, P53,
P55).

12. Remove the 10 screws and then remove the P-Board.

13. Disconnect the Fan Relay Couplers.

14. Remove the each 3 screws (

), each 4 screws and then

remove the 4 Fan Blocks.

15. Remove the each 4 screws (

) and then remove the Stand

Black(L, R).

16. Remove the each 1 screw (

) and then remove the

Speaker Terminal Black(L, R).

18. Disconnect the couplers (SU45, SU46).

19. Remove the each 2 screws and then slide the SU-Board
and the SD-Board to the left.and then remove the SU-Board
and the SD-Board from the couplers (SC41, SC42, SC43,
SC44).

20. Remove the 9 screws and then remove the SC-Board.

17. Remove the flexible cables from the couplers (SU1, SU2,
SU3, SU4, SU5, SD1, SD2, SD3, SD4, SD5).

21. Disconnect the couplers (SS11, SS12, SS34, SS35, SS42,
SS44).

22. Remove the flexible cables from the couplers (SS53, SS54,
SS55, SS56).

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23. Remove the 7 screws and then remove the SS-Board.

28. Remove the 2 screws and then remove the S1-Board Block.

29. Remove the 3 screws and then remove the AC-Inlet Block.

24. Disconnect the coupler (C35).

25. Remove the flexible cables from the couplers (C10, C11,
C21, C22, C24, C25, C31).

26. Disconnect the couplers (C42, C44).

27. Remove the flexible cables from the couplers (C41, C51,
C52, C54, C55, C60, C61).

30. Remove the 2 screws of the Escutcheon.

31. Pull the bottom of the Plasma Panel forward (arrow1).

32. Slide the Plasma Panel and then remove the Plasma Panel
(arrow2).

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7 Location of Lead Wiring

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8 Adjustment Procedure

8.1. Driver Set-up

8.1.1. Item / Preparation

1. Input a Vset adjustment pattern to plasma video input.
Aging pattern : 0

2. Set the picture adjustment items as follows.



 ·Picture menu : Standard





 ·Color temperature : Normal





 ·Picture : 25





 ·Aspect : Full



8.1.2. Adjustments

Adjust driver section voltages referring the panel data on the panel data label.

Caution

1. First perform Vsus voltage adjustment.

2. Confirmation of Vscn voltage should be performed after confirmation of Vad voltage adjustment.

When Vad = -90V, Voltage of Vscn is 50V ± 4V.

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8.2. Initialization Pulse Adjust

1. Input a white signal to plasma video input.
Aging pattern : 0

2. Set the picture adjustment items as follows.



 ·Picture menu : Standard





 ·Color temperature : Normal





 ·Picture : 25





 ·Aspect : Full



3. Connect Oscilloscope to TPSC1 (T1) and check for less than 40µ Sec.

4. Connect Oscilloscope to TPSC1 (T2) and adjust VR6602 for 160 ± 10µ Sec.

Test point Volume Level
T1 TPSC1 (SC) Fixed Less than 40µ Sec
T2 TPSS1 (SS) VR6602 (SC) 160 ± 10µ Sec

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8.3. P.C.B. (Printed Circuit Board) Remove

8.3.1. Caution

1. To remove P.C.B., wait 1 minute after power was off for discharge from electrolysis capacitors.

8.3.2. Quick adjustment after P.C.B. Remove

P.C.B. Name Test Point Voltage Volume Remarks
P Board Vsus TPVSUS Vsus ± 2V VR251 (P) *
SC Board Vad TPVAD -90V ± 1V VR6600 (SC)

Vscn TPVSCN Vad + 140V ± 4V Fixed
Vset TPVSET 240V ± 7V Fixed

SS Board Ve TPVE Ve ± 1V VR6600 (SC) *

Vda TPVDA 75V ± 1V, -3V Fixed
D, DS Board White balance and Sub brightness for NTSC, PAL, HD, PC and 625i signals
DN Board Set Market Select Number to correct destination by Ms mode (See chap. 9.1.4)

*See the Panel label.

Caution:

Absolutely do not reduce Vsus below Ve not to damage the P.C.B.

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8.4. Adjustment Volume Location

8.5. Test Point Location

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9 Service mode

9.1. CAT (computer Aided Test) mode

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To exit the CAT mode, access the ID mode and switch off the main power.

9.1.1. IIC mode

Select the IIC mode by Up / Down button on the remote control at the front page of CAT mode and then press the Action button
on the remote control.

Subject and item are mentioned on “IIC mode structure”.

To exit the IIC mode, press the R button on the remote control.

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9.1.2. CD mode

Select the CD mode by Up / Down button on the remote control at the front page of CAT mode and then press the Mute button
on the remote control more than 5 seconds.

Micom software version (IC9702), this version can be upgrade by

1. replace of new version IC

2. Loading the new version software from loader tool, TZSC07036.
Memory data change

To exit the CD mode, press the R button on the remote control.

9.1.3. SD mode

Select the SD mode by Up / Down button on the remote control at the front page of CAT mode and then press the Action button
on the remote control.

To exit the SD mode, press the R button on the remote control.

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9.1.4. MS mode

Select the MS mode by Up / Down button on the remote control at the front page of CAT mode and then press the Mute button
on the remote control more than 5 seconds.

To exit the MS mode, press the R button on the remote control.

Caution:

Market Select should be set after exchange of DN-Board.

Destination number

Number Destination Number Destination

0 Japan 14 Thailand (Hotel)
1 North America 15 -­2 Europe 16 Mexico
3 Others 17 Mexico (Hotel)
4 Britain 18 China
5 Taiwan 19 China (Hotel)
6 Thailand 20 -­7 -- 21 -­8 Japan (Hotel) 22 --

9 North America (Hotel) 23 -­10 Europe (Hotel) 24 -­11 Others (Hotel) 25 -­12 Britain (Hotel) 26 --

Number Destination

Default setting

1 North America

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9.1.5. ID mode

Select the ID mode by Up / Down button on the remote control at the front page of CAT mode and then press the Mute button
on the remote control more than 5 seconds.

To exit the ID mode, press the R button on the remote control.

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9.2. IIC mode structure (following items value is sample data)

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10 Adjustment

10.1. RGB white balance adjustment

Instrument Name Connection Remarks



 · RGB VGA W / B pattern





 · Color analyzer



(Minolta CA-100 or equivalent)

Procedure Remarks

[condition]



 · Ensure aging is adequate.





 · Make sure the front panel to be used on the final set is fitted.





 · Make sure a color signal is not being shown before adjustment.





 · Put the color analyzer where there is little color variation.



1. Set COMPONET / RGB-IN SELECT to RGB.

2. Select the IIC mode “PANEL W / B Adj.” item.

3. Check that the color temperature is “COOL (High)”.

4. Output a white balance pattern.

5. Touch the signal receiver of color analyzer to the highlight window’s center.

6. Fix G drive at E0h and adjust B drive and R drive so x, y become the “Color temperature
High” in the below table.

7. Increase R / G / B together so the maximum drive value in R / G / B becomes FCh.

8. Set color temperature to “NORMAL (Medium)”.

9. Fix G drive at E0h and adjust B drive and R drive so the highlight window’s x, y becomes
the “Color temperature Medium” in the below table.

10. Increase R / G / B together so the maximum drive value in R / G / B becomes FCh.

11. Set color temperature to “WARM (Low)”.

12. Set G drive to E0h and adjust B drive and R drive so the highlight window’s x, y become
the “Color temperature Low” shown in the below table.

13. Increase R / G / B together so the maximum drive value in R / G / B becomes FCh.

14. Copy the R drive, G drive and B drive data in NTSC, PAL DVI region.

PC input
Panel surface

User setting: Normal
(Picture menu: Standard)

Picture Menu: Standard
Picture: 25
Aspect: Full
Position and size: Normal



 · Highlight section Signal amplitude 75%





 · Cutoff standard G: 80h





 · Drive standard G: E0h



Adjustment target
Hi-light: x ± 0.003 y ± 0.003
Hi-light is target of the number at drive adjustment in the hi-light windows.
Therefore, it is not target of the hi-light number at after adjustment white balance.

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