Panasonic TH-42PS9UK Service manual

ORDER NO. MNTC060479CE

D10 Canada: B07

Progressive Wide Plasma Display

TH-42PS9UK

GP9D Chassis

Specifications

Power Source 120 VAC, 50/60Hz Power Consumption

Power on 290W Stand-bycondition Save OFF 0.6W, Save ON 0.4 W Power off condition 0.1 W

Plasma Displaypanel Drive method:AC type 42-inch,

16:9 aspect ratio

Contrast Ratio Max10000:1

Screen size 36.2” (920 mm) (W) × 20.4” (518 mm) (H) × 42” (1,056 mm) (diagonal)

(No. of pixels) 408,960 (852 (W) × 480(H))

[2,556 × 480 dots]

Operating condition

Temperature 32 °F - 104 °F (0 °C - 40 °C) Humidit

Applicablesignals

Color System NTSC, PAL, PAL60, SECAM, Modified NTSC Scanning format 525 (480) / 60i 60p, 625 (575)/50i 50p, 750 (720)/60p 50p, 1125 (1080) / 60i 50i 24p 25p

PC signals VG

Connection terminals

COMPONENT/RGB Y/G (BNC) 1.0 Vp-p/composite (75Ω)

20% - 80%

30p 24sF.... SMPTE274M, 1250 (1080) / 50i

SVGA, XGA, SXGA, UXGA..... (compressed)

Horizontal scanning frequency 15 - 110 kHz Vertical scanning frequency 48 - 120 Hz

VIDEO IN (BNC) 1.0 Vp-p (75 Ω or high impedance) VIDEO OUT (BNC) 1.0 Vp-p (high impedance) S VIDEO IN (MINI DIN 4PIN) Y: 1 Vp-p (75 Ω ), C: 0.286 Vp-p (75Ω)

UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)

0.7 Vp-p/non-composite (75Ω)

PB/ B (BNC), P

R (BNC) 0.7 Vp-p (75Ω)

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UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)

PC (HIGH-DENSITYMini-D-SUB 15PIN) R,G,B/0.7 Vp-p (75Ω)

HD, VD/1.0-5.0 Vp-p (high impedance)

Component

:1.0 Vp-p (75Ω : include sync)

CB:0.7 Vp-p (75Ω )

CR:0.7 Vp-p (75Ω )

UDIO IN (M3 JACK) 0.5 Vrms (high impedance) SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE SPEAKERS (6Ω) 16W [8 W + 8W] (10% THD)

Accessories Supplied

Remote Control Transmitter EUR7636070R Batteries 2×AASize Fixing bands (TMME203 or TMME187) × 2

Dimensions (W×H×D) 40.2” (1,020 mm) × 24” (610 mm) × 3.5” (89 mm) Mass (weight)

main unit onl with speakers approx. 66.1 lbs

approx. 57.3 lbs

Notes:

· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

CONTENTS

Page Page

1 Applicable signals 4 2 Safety Precautions

2.1. General Guidelines

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 4 About lead free solder (PbF) 5 PCB Structure sheet of GP9D chassis 6 Service Hint 7 Disassembly

7.1. Removal of the Back Cover

7.2. Removal of the HU-Board

7.3. Removal of the HA-Board

7.4. Removal of the Slot Block

7.5. Removal of the J-Board

7.6. Removal of the HX-Board

7.7. Removal of the DA-Board

7.8. Removal of the P-Board

7.9. Removal of the D-Board

7.10. Removal of the H3-Board (L, R)

7.11. Removal of the SU-Board and the SD-Board

7.12. Removal of the SC-Board

7.13. Removal of the SS-Board

7.14. Removal of the C1, C2-Board

7.15. Removal of the S1-Board

10 10 10 10 11 11 11 12 12 12 12 13 13 13 14

7.16. Removal of the Escutcheon

6 7 8 9

7.17. Removal of the V1-Board and the V2-Board

7.18. Removal of the Plasma Panel

8 Location of Lead Wiring

8.1. Location of Lead Wiring (1)

8.2. Location of Lead wiring (2)

8.3. Location of Lead wiring (3)

8.4. Location of Lead Wiring (4)

9 Adjustment Procedure

9.1. Driver Set-up

9.2. Initialization Pulse Adjust

9.3. P.C.B. (Printed Circuit Board) exchange

9.4. Adjustment Volume Location

9.5. Test Point Location

10 Service mode

10.1. CAT (computer Aided Test) mode

10.2. IIC mode structure (following items value is sample data.)

11 Adjustment

11.1. RGB white balance adjustment

11.2. HD white balance adjustment

11.3. Power control adjustment

12 Trouble shooting guide

12.1. Self Check

14 15 15

18 18 19 19

20 21 21 22 22

27 29 31

12.2. No Power 34

12.3. No Picture

12.4. Local screen failure

13 Option Setting 14 Conduct Views

14.1. P-Board

14.2. HA-Board

14.3. HU-Board

14.4. HX-Board

14.5. H3, S1, V1and V2-Board

14.6. J-Board

14.7. DA-Board

14.8. D-Board

14.9. C1-Board

14.10. C2-Board

14.11. SC-Board

14.12. SU-Board

14.13. SD-Board

14.14. SS-Board

15 Block and Schematic Diagram

15.1. Schematic Diagram Notes

15.2. Main Block Diagram

15.3. P-Board Block Diagram

15.4. P-Board (1 of 6) Schematic Diagram

15.5. P-Board (2 of 6) Schematic Diagram

15.6. P-Board (3 of 6) Schematic Diagram

15.7. P-Board (4 of 6) Schematic Diagram

15.8. P-Board (5 of 6) Schematic Diagram

15.9. P-Board (6 of 6) Schematic Diagram

15.10. HA-Board Block and Schematic Diagram

15.11. HU-Board Block Diagram

15.12. HU-Board (1 of 2) Schematic Diagram

15.13. HU-Board (1 of 2) Schematic Diagram

15.14. V1 and V2Board Block and Schematic Diagram

15.15. HX-Board Block and Schematic Diagram

15.16. J-Board (1 of 2) Block Diagram

15.17. J-Board (2 of 2) Block Diagram

15.18. J-Board (1 of 5) Schematic Diagram

15.19. J-Board (2 of 5) Schematic Diagram

15.20. J-Board (3 of 5) Schematic Diagram 34 35

36 39

39 42 43 44 45 46 48 50 52 53 54 57 58 59

61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79

15.21. J-Board (4 of 5) Schematic Diagram

15.22. J-Board (5 of 5) Schematic Diagram

15.23. DA-Board (1 of 2) Block Diagram

15.24. DA-Board (2 of 2) Block Diagram

15.25. DA-Board (1 of 6) Schematic Diagram

15.26. DA-Board (2 of 6) Schematic Diagram

15.27. DA-Board (3 of 6) Schematic Diagram

15.28. DA-Board (4 of 6) Schematic Diagram

15.29. DA-Board (5 of 6) Schematic Diagram

15.30. DA-Board (6 of 6) Schematic Diagram

15.31. D-Board Block Diagram

15.32. D-Board (1 of 6) Schematic Diagram

15.33. D-Board (2 of 6) Schematic Diagram

15.34. D-Board (3 of 6) Schematic Diagram

15.35. D-Board (4 of 6) Schematic Diagram

15.36. D-Board (5 of 6) Schematic Diagram

15.37. D-Board (6 of 6) Schematic Diagram

15.38. C1 and C2-Board Block Diagram

15.39. C1-Board (1 of 2) Schematic Diagram

15.40. C1-Board (2 of 2) Schematic Diagram

15.41. C2-Board (1 of 2) Schematic Diagram

15.42. C2-Board (2 of 2) Schematic Diagram

15.43. SC, SU and SD-Board Block Diagram

15.44. SC-Board (1 of 2) Schematic Diagram

15.45. SC-Board (2 of 2) Schematic Diagram

15.46. SU-Board Schematic Diagram

15.47. SD-Board Schematic Diagram

15.48. SS and S-Board Block Diagram

15.49. SS and S-Board Schematic Diagram

16 Parts Location

16.1. Parts Location (1)

16.2. Parts Location (2)

16.3. Accessories Box

16.4. Cable relation

17 Mechanica l Replacement Parts List 18 Replacement Parts List

18.1. Replacement Parts List Notes

18.2. Electrical Replacement Parts List

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80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98

99 100 101 102 103 104 105 106 107 108 109

111

111 112 113 114

115 116

116 117

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1 Applicable signals

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2 Safety Precautions

2.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

2.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screw heads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MΩ and 5.2MΩ.

When the exposed metal does not have a return path to

the chassis, the reading must be

Figure 1

2.1.2. Leakage Current Hot Check (See

Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

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3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

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4 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

Caution

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.

Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto

the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

stamped on the back of PCB.

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5 PCB Structure sheet of GP9D chassis

Board Name Function Remarks

DA Digital Signal Processor, Micon 1

D Format Converter, Plasma AI Processor

Sub-Field Processor

J Slot Interface (Audio/Video/Sync input Switch),

SYNC processor, Sound processor, SS Sustain drive 1 SC Scan drive 1 SU Scan out (Upper) 1 SD Scan out (Lower) 1 C1 Data Drive (Right) C2 Data Drive (Left) H3 Speaker terminal S1 Power switch V1 LED (Stand-by/Power on) & Remote receiver V2 Key switch

P Power supply 1

HX PC / RS-232C_Input terminal

HU BNC Dual Video HA BNC Component Video

Remarks

1: Recommend PCB´s for initial service for GP9D chassis.

6 Service Hint

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Note:

· Extension cable kit for Slot Board is supplied as service fixtures and tools.

(Parts No. TZSC0704)

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7 Disassembly

· To disassemble P.C.B., wait for 1 minute after power was

off for discharge from electrolysis capacitors.

and marks indicate screw positions.

7.1. Removal of the Back Cover

1. Remove the screws (×16 ,×6 ,×4 ) and then remove the Back Cover.

7.3. Removal of the HA-Board

1. Remove the 4 screws(D) and then remove the HA Terminal Block.

2. Remove the 4 screws(E).

3. Remove the 2 screws(F) and then remove the HA-Board.

7.4. Removal of the Slot Block

7.2. Removal of the HU-Board

1. Remove the 4 screws(A) and then remove the HU Terminal Block.

2. Remove the 4 screws(B).

3. Remove the 3 screws(C) and then remove the HU-Board.

1. Disconnect the couplers (J1, J2, J3, J4, J5, J6, J7, J8, J10, J15).

2. Remove the 4 screws and then remove the Slot Block.

7.5. Removal of the J-Board

1. Remove the HU Terminal Block and the HATerminal Block. (Reference to Removal of the HU-Board and the HA-Board)

2. Remove the Slot Block. (Reference to Removal of the Slot Block)

3. The slot block is turned inside out.

4. Remove the 6 screws and then remove the Slot cover.

5. Remove the 6 screws, release the coupler(J14) from HXBoard and then remove the J-Board.

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5. Remove the 4 Hexagonal-Head screws and the 1 screw and then remove the HX-Board.

7.6. Removal of the HX-Board

1. Remove the HU Terminal Block and the HATerminal Block. (Reference to Removal of the HU-Board and the HA-Board)

2. Remove the Slot Block. (Reference to Removal of the Slot Block)

3. Remove the J-Board. (Reference to Removal of the J-Board)

4. Remove the 2 screws and then remove the Slot Case.

7.7. Removal of the DA-Board

1. Disconnect the couplers(DA1, DA3, DA5, DA6).

2. Remove the Flexible Cable from the coupler(DA2).

3. Remove the 4 screws and then remove the DA-Board.

Note:

A re-setup of the destination is performed by MS mode after DA-Board exchange.

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7.8. Removal of the P-Board

1. Disconnect the couplers(P2, P5, P9, P10, P11, P12, P23, P25)

2. Remove the 6 screws and then remove the P-Board.

7.9. Removal of the D-Board

1. Remove the Slot Block. (Reference to Removal of the Slot Block)

2. Disconnect the couplers(D5, D20, D25)

3. Remove the Flexible Cable from the couplers (D3, D31, D32).

4. Remove the 4 screws and then remove the D-Board.

2. Disconnect the coupler(H37).

3. Remove the 3 screws and then remove the H3-Board.

7.11. Removal of the SU-Board and the SD-Board

1. Remove the each 2 screws.

2. Remove the Flexible Cable from the couplers(SU1, SU2,

SU3).

3. Remove the Flexible Cable from the couplers(SD1, SD2,

SD3).

7.10. Removal of the H3-Board (L, R)

1. Remove the each 1 screw and then remove the Speaker

Terminal Block (L, R).

4. Disconnect the couplers(SU45, SD46).

5. Slide the SU-Board and the SD-Board to the left, remove the SU-Board and the SD-Board from the couplers(SC41, SC42).

7.12. Removal of the SC-Board

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7.14. Removal of the C1, C2-Board

1. Disconnect the couplers(SU45, SD46).

2. Remove the 4 screws ( the SD-Board to the left.

3. Disconnect the couplers(SC2, SC20, SC23).

4. Remove the 6 screws and then remove the SC-Board.

) and then slide the SU-Board and

1. Remove the Slot Block. (Reference to Removal of the Slot Block)

2. Remove the each 3 screws and then remove the Stand Block(L,R).

7.14.1. Removal of the C1-Board

1. Remove the Flexible Cable from the couplers(C11, C12).

2. Remove the 6 screws ( Cable from the couplers(CB1, CB2, CB3).

3. Remove the 3 screws (

) and then remove the Flexible

) and then remove the C1-Board.

7.13. Removal of the SS-Board

1. Disconnect the couplers(SS11, SS12, SS23, SS34).

2. Remove the Flexible Cable from the couplers(SS41, SS42, SS43, SS44)

3. Remove the 6 screws and then remove the SS-Board.

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7.14.2. Removal of the C2-Board

1. Remove the Flexible Cable from the couplers(C21, C22).

2. Remove the 8 screws ( Cable from the couplers(CB4, CB5, CB6, CB7).

3. Remove the 4 screws (

) and then remove the Flexible

) and then remove the C2-Board.

7.16. Removal of the Escutcheon

1. Remove the S1-Board Block. (Remove to the Removal of the S1-Board)

2. Disconnect the couplers(J2, J15)

3. Remove the 2 screws of the Escutcheon.

7.15. Removal of the S1-Board

1. Disconnect the coupler(SS34).

2. Remove the 2 screws(H) and then remove the S1-Board Block.

3. Disconnect the coupler(S34).

4. Remove the 1 screw(J) and then remove the S1-Board.

4. Pull the bottom of the Escutcheon in the direction of the arrow 1 and then lift up the Escutcheon to remove in the direction of the arrow 2.

7.17. Removal of the V1-Board and the V2-Board

1. Remove the Escutcheon.

(Reference to Removal of the Escutcheon)

2. Remove the 5 screws and then remove the Fixed Angle.

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7.18. Removal of the Plasma Panel

1. Remove the each 3 screws ( ) and then remove the Stand Black(L, R).

2. Remove the each 1 screw ( Speaker Terminal Black(L, R).

) and then remove the

3. Remove the 1 screw(K).

4. Remove the operation button from the V2-Board.

5. Disconnect the coupler(V15) and then remove the V2Board.

6. Disconnect the coupler(V2) and then remove the V1-Board.

3. Disconnect the couplers(J1, J2, J3, J4, J5, J6, J7, J8, J10, J15).

4. Remove the 4 screws and then remove the Slot Block.

5. Disconnect the coupler(DA5).

6. Remove the Flexible Cable from the couplers(DA2).

7. Remove the 4 screws and then remove the DA-Board Block.

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8. Disconnect the couplers(P2, P9, P11, P12, P23, P25).

9. Remove the 6 screws and then remove the P-Board.

10. Disconnect the coupler(D20).

11. Remove the Flexible Cable from the couplers(D31, D32).

12. Remove the 4 screws and then remove the D-Board.

15. Disconnect the couplers(SS23, SS34).

16. Remove the Flexible Cable from the couplers(SS41, SS42, SS43, SS44)

17. Remove the 6 screws and then remove the SS-Board.

18. Remove the Flexible Cable from the coupler(C12).

19. Remove the 6 screws and then remove the Flexible Cable from the couplers(CB1, CB2, CB3).

20. Remove the 3 screws and then remove the C1-Board.

13. Remove the SU-Board and the SD-Board. (Reference to Removal of the SU-Board and the SD-Board)

14. Remove the 6 screws and then remove the SC-Board.

21. Remove the 8 screws and then remove the Flexible Cable from the couplers(CB4, CB5, CB6, CB7).

22. Remove the 4 screws and then remove the C2-Board.

23. Remove the 2 screws ( ) and then remove the S1-Board Block.

24. Remove the 3 screws (

) and then remove the AC Inlet

Block.

25. Remove the 2 screws of the Escutcheon.

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26. Lift up the bottom of the Plasma Panel in the direction of the arrow 1 and pull the Plasma Panel in the direction of the arrow 2 and then remove the Plasma Panel.

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8 Location of Lead Wiring

8.1. Location of Lead Wiring (1)

The lead wiring is dressed as shown in figure.

8.2. Location of Lead wiring (2)

The lead wiring is dressed as shown in figure.

8.3. Location of Lead wiring (3)

The lead wiring is dressed as shown in figure.

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8.4. Location of Lead Wiring (4)

The lead wiring is dressed as shown in figure.

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9 Adjustment Procedure

9.1. Driver Set-up

9.1.1. Item / Preparation

1. Input a white signal to plasma video input.

2. Set the picture controls as follows. Picture menu: Standard Picture: +25 Aspect: Full

Caution

1. First perform Vsus adjustment.

2. Confirmation of Vscn voltage should be performed after

confirmation of Vad adjustment. When Vad=-90V, Voltage of Vscn is 35V ±4V.

9.1.2. Adjustments

Adjust driver section voltages referring the panel data on the panel data label.

Check or adjust the following voltages with the multimeter.

Name Test Point Voltage Volume Remarks

Vsus TPVSUS

(SS) Ve TPVE (SS) Ve ± 1V VR6000 (SS) * Vset TPVSET

(SC) Vad TPVAD (SC) -90V ± 1V VR6600

Vscn TPVSCN

(SC) Vda TPVDA (SS) 70V ± 1V Fixed Vdat P12-1, 5 (P) 70.2V ± 0.1V R665 (P) PFC C446 (+)(-) 396V ± 0.5V R443 (P)

*See the Panel label.

Vsus ± 1V R628 (P) *

232V ± 7V Fixed

(SC)

Vad+125V ±4VFixed

9.2. Initialization Pulse Adjust

1. Input the White signal to plasma video input.

2. Set the picture controls as follows. Picture menu: Standard Picture: +25 Aspect: Full

3. Connect Oscilloscope to TPSC1 (T2) and adjust VR6602 for 170±5µ Sec.

Test point Volume Level

T2 TPSC1 (SC) VR6602 (SC) 170 ± 5µ Sec.

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9.3. P.C.B. (Printed Circuit Board) exchange

9.3.1. Caution

1. To remove P.C.B., wait for 1 minute after power was off for discharge from electrolysis capacitors.

9.3.2. Quick adjustment after P.C.B. exchange

Adjust the following voltages with the multimeter.

P.C.B. Name Test Point Voltage Volume Remarks

P Board Vsus TPVSUS (SS) Vsus ± 1V R628 (P) *

Vdat P12-1, 5 (P) 70.2V ± 0.1V R665 (P)

PFC C446 (+) (-) (P) 396V ± 0.5V R443 (P) SC Board Vad TPVAD (SC) -90V ± 1V VR6600 (SC) SS Board Ve TPVE (SS) Ve ± 1V VR6000 (SS) * D, J, DA Board White balance for NTSC, PAL, HD, PC and 625i signals DA Board Set Market Select Number to correct destination by MS mode. (See chap. 10.1.4)

*See the Panel label.

Caution:

Absolutely do not reduce Vsus below Ve not to damage the P.C.B.

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9.4. Adjustment Volume Location

9.5. Test Point Location

10 Service mode

10.1. CAT (computer Aided Test) mode

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To exit the CAT mode, access the ID mode and switch off the main power.

10.1.1. IIC mode

Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

Subject and item are mentioned on “IIC mode structure”.

To exit the IIC mode, press the R button on the remote control.

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10.1.2. CD mode

Select the CD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 5 seconds.

Micom software version (IC9702), this version can be upgrade by

1. replace of new version IC

2. Loading the new version software from loader tool, TZSC07036. Memory data change

To exit the CD mode, press the R button on the remote control.

10.1.3. SD mode

Select the SD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

To exit the SD mode, press the R button on the remote control.

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10.1.4. MS mode

Select the MS mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 5 seconds.

To exit the MS mode, press the R button on the remote control.

Caution:

Market Select should be set after exchange of DA-Board.

Destination number

Number Destination Number Destination

0 Japan 14 Thailand (Hotel) 1 North America 15 -2 Europe 16 Mexico 3 Others 17 Mexico (Hotel) 4 Britain 18 China 5 Taiwan 19 China (Hotel) 6 Thailand 20 -7 -- 21 -8 Japan (Hotel) 22 --

9 North America (Hotel) 23 -10 Europe (Hotel) 24 -11 Others (Hotel) 25 -12 Britain (Hotel) 26 --

Number Destination

Default setting

1 North America

10.1.5. ID mode

Select the ID mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 5 seconds.

To exit the ID mode, press the R button on the remote control.

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10.2. IIC mode structure (following items value is sample data.)

11 Adjustment

11.1. RGB white balance adjustment

Instrument Name Connection Remarks

· RGB VGA W/B pattern

· Color analyzer

(Minolta CA-100 or equivalent)

Procedure Remarks

· Ensure aging is adequate.

· Make sure the front panel to be used on the final set is fitted.

· Make sure a color signal is not being shown before adjustment.

· Put the color analyzer where there is little color variation.

1. Set COMPONET/RGB-IN SELECT to RGB.

2. Select the IIC mode “PANEL W/B Adj.” item.

3. Check that the color temperature is “COOL (High)”.

4. Output a white balance pattern.

5. Touch the signal receiver of color analyzer to the highlight window’s center.

6. Fix G drive at E0h and adjust B drive and R drive so x, y become the “Color temperature High” in the below table.

7. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

8. Set color temperature to “NORMAL (Medium)”.

9. Fix G drive at E0h and adjust B drive and R drive so the highlight window’s x, y becomes the “Color temperature Medium” in the below table.

10. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

11. Set color temperature to “WARM(Low)”.

12. Set G drive to E0h and adjust B drive and R drive so the highlight window’s x, y become the “Color temperature Low” shown in the below table.

13. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

14. Copy the R drive, G drive and B drive data in NTSC, PAL DVI region.

PC input Panel surface

User setting: Normal (Picture menu: Standard)

Picture Menu: Standard Picture: 25 Aspect: Full Position and size: Normal

· Highlight section Signal amplitude 75%

· Cutoff standard G: 80h

· Drive standard G: E0h

TH-42PS9UK

Adjustment target Hi-light: x ± 0.003 y ± 0.003 Hi-light is target of the number at drive adjustment in the hi-light windows. Therefore, it is not target of the hi-light number at after adjustment white balance.

TH-42PS9UK

11.2. HD white balance adjustment

Instrument Name Connection Remarks

· HD W/B pattern (COMPONENT Output)

· Color analyzer

(Minolta CA-100 or equivalent)

Procedure Remarks

· Ensure aging is adequate.

· Make sure the front panel to be used on the final set is fitted.

· Make sure a color signal is not being shown before adjustment.

· Put the color analyzer where there is little color variation.

1. Set COMPONENT/RGB-IN SELECT to COMPONENT

2. Select the IIC mode "PANEL W/B Adj.” item.

3. Check that the color temperature is “COOL (High)”.

4. Output a white balance pattern.

5. Touch the signal receiver of color analyzer to the highlight window’s center.

6. Fix G drive at E0h and adjust B drive and R drive so x, y become the "Color temperature High" in the below table.

7. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

8. Set color temperature to “NORMAL (Medium)”.

9. Fix G drive at E0h and adjust B drive and R drive so the highlight window´s x, y becomes the "Color temperature Medium" in the below table.

10. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

11. Set color temperature to "WARM (Low)".

12. Set G drive to E0h and adjust B drive and R drive so the highlight window´s x, y become the “Color temperature Low” shown in the below table.

13. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

14. Copy the R drive, G drive and B drive data in YUV1_525ip, YUV3_625ip region.

PC input Panel surface

User setting: Normal (Picture menu: Standard)

Picture Menu: Standard Picture: 25 Aspect: Full Position and size: Normal

· Highlight section Signal amplitude 75%

· Cutoff standard G: 80h

· Drive standard G: E0h

TH-42PS9UK

+ 108 hidden pages

Panasonic TH-42PS9UK Service manual

Specifications and Main Features

Frequently Asked Questions

User Manual