Design and Specifications are subject to change without notice. Weight and Dimensions shown are approximate.
CONTENTS
Page Page
1 Applicable signals 4
2 Safety Precautions
2.1. General Guidelines
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
4 About lead free solder (PbF)
5 Service Hint
6 Plasma panel replacement method
6.1. Remove the Back cover.
6.2. Remove the P-Board.
6.3. Remove the PB-Board
6.4. Remove the D-Board
6.5. Remove the rear terminal cover
6.6. Remove the metal frame
6.7. Remove the DT-Board and DV-Board
6.8. Remove the DG-Board
6.9. Remove the H-Board
6.10. Remove the PA-Board
6.11. Remove the Z-Board
6.12. Remove the SU-Board
6.13. Remove the SD-Board
6.14. Remove the SC-Board
6.15. Remove the SS-Board
6.16. Remove the C1-Board
6.17. Remove the C2-Board
6.18. Remove the K-Board
6.19. Remove the S-Board
6.20. Remove the Speaker L, R
6.21. Remove the Plasma panel section from the Front frame
(glass)
6.22. Replace the plasma panel (finished).
7 Location of Lead Wiring
10
10
10
11
11
11
11
12
12
12
13
13
13
14
14
14
15
15
16
5
5
6
7
8
9
9
9
9
9
7.1. Lead of Wiring (1)
7.2. Lead of Wiring (2)
7.3. Lead of Wiring (3)
8 Self-check Function
8.1. How to access
8.2. Power LED Blinking timing chart
8.3. No Power
8.4. No Picture
8.5. Local screen failure
9 Serviceman Mode
9.1. How to enter into Serviceman Mode
9.2. Cancellation
9.3. Contents of adjustment mode
9.4. Option
10 Adjustment Procedure
10.1. Driver Set-up
10.2. Initialization Pulse Adjust
10.3. P.C.B. (Printed Circuit Board) exchange
10.4. Adjustment Volume Location
10.5. Test Point Location
11 Hotel mode
12 Conductor View
12.1. P-Board
12.2. PA-Board
12.3. PB-Board
12.4. H-Board
12.5. DT-Board
12.6. DV-Board
12.7. DG-Board
12.8. Z-Board
12.9. D-Board
12.10. C1-Bo ard
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17
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19
19
20
21
22
23
24
24
24
24
25
26
26
27
28
28
28
29
31
31
34
35
36
38
40
41
43
44
47
2
12.11. C2-Bo ard 48
12.12. SC-Bo ard
12.13. SU-Bo ard
12.14. SD-Bo ard
12.15. SS-Bo ard
12.16. K and S-Board
13 Block and Schematic Diagram
13.1. Schematic Diagram Notes
13.2. Main Block Diagram
13.3. P-Board Block Diagram
13.4. P-Board (1 of 6) Schematic Diagram
13.5. P-Board (2 of 6) Schematic Diagram
13.6. P-Board (3 of 6) Schematic Diagram
13.7. P-Board (4 of 6) Schematic Diagram
13.8. P-Board (5 of 6) Schematic Diagram
13.9. P-Board (6 of 6) Schematic Diagram
13.10. PA and PB-Board Block Diagram
13.11. PA-Bo ard Schematic Diagram
13.12. PB-Bo ard Schematic Diagram
13.13. H, K, S and Z-Board Block Diagram
13.14. H Board (1 of 3) Schematic Diagram
13.15. H-Boa rd (2 of 3) Schematic Diagram
13.16. H-Boa rd (3 of 3) Schematic Diagram
13.17. Z-Boa rd Schematic Diagram
13.18. K and S-Board Schematic Diagram
13.19. DT-Bo ard Block Diagram
13.20. DT-Bo ard (1 of 4) Schematic Diagram
13.21. DT-Bo ard (2 of 4) Schematic Diagram
13.22. DT-Bo ard (3 of 4) Schematic Diagram
13.23. DT-Bo ard (4 of 4) Schematic Diagram
13.24. DV-Bo ard Block Diagram
13.25. DV-Bo ard Schematic Diagram
13.26. DG-B oard (1 of 2) Block Diagram
13.27. DG-B oard (2 of 2) Block Diagram
13.28. DG-B oard (1 of 11) Schematic Diagram
13.29. DG-B oard (2 of 11) Schematic Diagram
13.30. DG-B oard (3 of 11) Schematic Diagram
13.31. DG-B oard (4 of 11) Schematic Diagram
13.32. DG-B oard (5 of 11) Schematic Diagram
49
52
53
54
56
57
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
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74
75
76
77
78
79
80
81
82
83
84
85
86
13.33. DG-B oard (6 of 11) Schematic Diagram
13.34. DG-B oard (7 of 11) Schematic Diagram
13.35. DG-B oard (8 of 11) Schematic Diagram
13.36. DG-B oard (9 of 11) Schematic Diagram
13.37. DG-B oard (10 of 11) Schematic Diagram
13.38. DG-B oard (11 of 11) Schematic Diagram
13.39. D-Boa rd Block Diagram
13.40. D-Boa rd (1 of 6) Schematic Diagram
13.41. D-Boa rd (2 of 6) Schematic Diagram
13.42. D-Boa rd (3 of 6) Schematic Diagram
13.43. D-Boa rd (4 of 6) Schematic Diagram
13.44. D-Boa rd (5 of 6) Schematic Diagram
13.45. D-Boa rd (6 of 6) Schematic Diagram
13.46. C1 and C2-Board Block Diagra m
13.47. C1-Bo ard (1 of 2) Schematic Diagram
13.48. C1-Bo ard (2 of 2) Schematic Diagram
13.49. C2-Bo ard (1 of 2) Schematic Diagram
13.50. C2-Bo ard (2 of 2) Schematic Diagram
13.51. SC-Bo ard Block Diagram
13.52. SC-Bo ard (1 of 2) Schematic Diagram
13.53. SC-Bo ard (2 of 2) Schematic Diagram
13.54. SU-Bo ard Block Diagram
13.55. SU-Bo ard Schematic Diagram
13.56. SD-Bo ard Block Diagram
13.57. SD-Bo ard Schematic Diagram
13.58. SS-Bo ard Block Diagram
13.59. SS-Bo ard Schematic Diagram
14 Parts Location & Mechanical Replacement Parts List
14.1. Parts Location
14.2. Pcaking Exploded Views (1)
14.3. Pcaking Exploded Views (2)
14.4. Pcaking Exploded Views (3)
14.5. Mechanical Replacement Parts List
15 Replacement Parts List
15.1. Replacement Parts List Notes
15.2. Electrical Replacement Parts List
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98
99
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TH-42PD50U
1 Applicable signals
4
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2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MW and 5.2MW.
When the exposed metal does not have a return path to
the chassis, the reading must be
.
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
5
TH-42PD50U
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
6
TH-42PD50U
4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
·
Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
HAV Terminal, AV SwitchSUScan out (Upper)
DTATSC InterfaceSDScan out (Lower)
DVHDMI Interface
None serviceable.
DV-Board should be exchanged for service.
DGDigital Signal Processor
ZSpeaker out, Audio AMP
DFormat Converter, Plasma AI Processor
SSSustain Drive
KRemote receiver, Keyscan
SPower Switch
8
6 Plasma panel replacement method
6.1. Remove the Back cover.
1. See Service hint (Section 5).
6.2. Remove the P-Board.
Caution:
To remove P.C.B., wait 1 minute after power was off for
discharge from electrolisis capacitors.
1. Disconnect the couplers (P2, P5, P9, P10, P11, P12, P23,
P25 and P30).
2. Remove the screws (×5
) and remove the P-Board.
6.4. Remove the D-Board
TH-42PD50U
6.3. Remove the PB-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PB5, PB7, PB30, PB33 and
PB34).
3. Remove the screws (×3
metal frame.
4. Remove the screws (× 4
) and remove the PB-Board
) and remove the PB-Board.
1. Remove the PB-Board.
2. Disconnect the couplers (D3, D5, D20 and D25) and
3. Disconnect the flexible cables (D33 and D34).
4. Remove the screws (×4
) and remove the D-Board.
9
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6.5. Remove the rear terminal
cover
1. Remove the screws (×4).
2. Remove the rear terminal cover.
6.6. Remove the metal frame
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (D3, D5, H7, P10 and PB7) and
relay connector (SP-L and SP-R).
3. Remove the screws (×4
) remove the metal frame.
4. Remove the screws (×1) and remove the DV-Board.
5. Remove the screws (×2
).
6. Remove the DT-Board metal cover and remove the DT-
Board.
) and Remove the screws (×5
6.7. Remove the DT-Board and DVBoard
1. Unlock the cable clampers to free the cable.
2. Remove the screws (×5
3. Remove the DT-Board and DV-Board unit.
(Be careful the couplers (DV15 and DT22) when remove
the DT-Board and DV-Board unit.)
).
10
6.8. Remove the DG-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (DG3 and DG5).
3. Disconnect the flexible cables (DG1, DG2 and DG20).
4. Remove the screws (×2
) and remove the DG-Board.
6.11. Remove the Z-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (Z2).
3. Disconnect the flexible cable (Z50).
4. Remove the screws (×2
) and remove the Z-Board.
TH-42PD50U
6.9. Remove the H-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (H7).
3. Disconnect the flexible cables (H1, H2, H30 and H50).
4. Remove the screws (×4
) and remove the H-Board.
6.10. Remove the PA-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PA7 and PA10).
3. Disconnect the flexible cables (PA20 and PA30).
4. Remove the screws (×4
) and remove the PA-Board.
11
TH-42PD50U
6.12. Remove the SU-Board
1. Remove the screws (×2)
2. Slide the SU-Board to the left to disconnect from a coupler
(SC41 - SU41) on the SC-Board and disconnect a coupler
(SU45 or SC45).
3. Disconnect the flexible cables (SD1, SD2, SD3) connected
to the SU-Board, and remove the SD-Board.
3. Disconnect the flexible cables (SU1, SU2, SU3) connected
to the SU-Board, and remove the SU-Board.
6.13. Remove the SD-Board
6.14. Remove the SC-Board
1. Disconnect the couplers (SC2, SC20, SC23).
2. Remove the screws (×6
) and remove the SC-Board.
1. Remove the screws (×2)
2. Slide the SD-Board to the left to disconnect from a coupler
(SC42 - SD42) on the SC-Board and disconnect a coupler
(SD46 or SC46).
12
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6.15. Remove the SS-Board
1. Disconnect the couplers (SS11, SS12, SS23 and SS34).
2. Disconnect the flexible cables (SS41, SS42, SS43 and
SS44).
3. Remove the screws (×6
) and remove the SS-Board.
6.17. Remove the C2-Board
1. Remove the flexible cables holder fastening screws (×8
).
2. Disconnect the flexible cables (CB4, CB5, CB6 and CB7).
3. Disconnect the flexible cable (C21).
4. Disconnect the couplers (C22 and C23).
5. Remove the screws (×3
left and remove the C2-Board.
) and slide the C2-Board to the
6.16. Remove the C1-Board
1. Remove the flexible cables holder fastening screws (×6
).
2. Disconnect the flexible cables (CB1, CB2 and CB3).
3. Disconnect the flexible cable (C11).
4. Disconnect the coupler (C12).
5. Remove the screws (×3
) and remove the C1-Board.
13
TH-42PD50U
6.18. Remove the K-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (H7 and SS34).
3. Remove the screws (×3
) and remove the K-Board.
6.20. Remove the Speaker L, R
6.19. Remove the S-Board
1. Remove the screw (×2) and remove the S-Board unit.
2. Unlock the cable clampers to free the cable.
3. Disconnect the couplers (S1 and S2).
4. Remove the screws (×2
) and remove the S-Board.
1. Remove the screw (×8) and remove the Speaker L, R.
14
6.21. Remove the Plasma panel
section from the Front frame
(glass)
1. Remove the front frame and the plasma panel fastening
screw (×8
2. Remove the front frame and the stand brackets fastening
screw (×6
).
).
TH-42PD50U
6.22. Replace the plasma panel
(finished).
1. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
2. Attach the C1-Board and the C2-Board, connect the flexible
cables (×7) from the Plasma panel to the C1-Board and C2Board, and fix the flexible cable holders.
3. Attach the Hooks (left, right) and fit the stand brackets (left,
right) to the new plasma panel.
4. Place the plasma panel section on the servicing stand.
5. Attach the front frame and the each P.C.Board and so on,
to the new plasma panel.
* When fitting the front frame, be careful not to allow
any debris, dust or handling residues to remain
between the front glass and plasma panel.
3. For leaving the plasma panel from the front frame, pull the
bottom of the front frame forward, lift, and remove.
15
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7 Location of Lead Wiring
7.1. Lead of Wiring (1)
16
7.2. Lead of Wiring (2)
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17
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7.3. Lead of Wiring (3)
18
TH-42PD50U
8 Self-check Function
When symptoms like “the power fails sometimes” or “sometimes there is no picture and/or sound” can not be confirmed at the
time of servicing, the self-check function can be used to confirm the occurrence and to find the defective circuit.
In case of “power failure”, flashing of the “POWER” indication (red) at the front of the unit can be used to narrow down the +B
line.
8.1. How to access
8.1.1. Access
Produce TV reception screen and, while pressing [VOLUME-] button on the main unit, press [SLEEP] button on the remote
controller unit simultaneously.
8.1.2. Exit
When the AC code is pulled out and opened, the display returns to the normal screen.
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.
3. Remarks
Above Fan function is operated during the fans are installed.
20
8.3. No Power
First check point
There are following 2 states of No Power indication by power LED.
1. No lit
2. Red is lit then turns red blinking a few seconds later. (See 8.2.)
1. No lit
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21
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8.4. No Picture
22
8.5. Local screen failure
Plasma display may have local area failure on the screen. Fig - 1 is the possible defect P.C.B. for each local area.
TH-42PD50U
Fig - 1
23
TH-42PD50U
9 Serviceman Mode
9.1. How to enter into Serviceman Mode
While pressing [VOLUME-] button of the main unit, press [RECALL] button of the remote control three times in a row (within 2
seconds).
9.1.1. Adjustment method.....Use the remote control.
“1” button...Main items Selection in forward direction
“2” button...Main items Selection in reverse direction
“3” button...Sub items Selection in forward direction
“4” button...Sub items Selection in reverse direction
“VOL” button...Value of sub items change in forward direction (
), in reverse direction ()
9.2. Cancellation
Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.
9.3. Contents of adjustment mode
·
Value is shown as a hexadecimal number.
·
Preset value differs depending on models.
·
After entering the adjustment mode, take note of the value in each item before starting adjustment.
1. To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.
10.3.2. Quick adjustment after P.C.B. exchange
P.C.B.NameTest PointVoltageVolumeRemarks
P BoardVsusTPVSUS (SS)175V ± 1VR628 (P)*
VdaTPVDA (SS)67V ± 1VR665 (P)
SC BoardVadTPVAD (SC)-90V ± 1VVR6477 (SC)
VsetTPVSET (SC)232V ± 6VFixed
VscnTPVSCN (SC)Vad + 120 ± 3VFixed
SS BoardVeTPVE (SS)156V ± 1VVR6074 (SS)*
D, DG BoardWhite blance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals
*See the Panel label.
10.4. Adjustment Volume Location
10.5. Test Point Location
28
11 Hotel mode
TH-42PD50U
1. Purpose
Restrict a function for hotels.
2. Access command
·
Enter to the Service Mode.
·
Press MUTE button on remote control. Hold few
seconds.
·
Press the ch “UP” or “Down” button and Vol. “UP” or
“Down” button to Set the data of EEPROM(ADDRESS
1584) to 01.
Push the Power switch(button) off/on the set(the remote
control) to turn the set off/on.
It can be made Hotel mode.
3. Exit command
·
First, set the data of EEPROM (ADDRESS 1584) to 00.
Next, Push the Power switch(button) off/on the set(the
remote control) to turn the set off/on.
Then, it is no longer hotel mode.
4. Access command to the Hotel mode setup menu
·
<Prerequisite> : It is conditions that the data of
EEPROM(ADDRESS 1584) is 01.
In order to display the Hotel mode setup menu, please
enter the following command (within 2 second).
(ADDRESS 1584) will be 01, even if each settings were
done.
itemFunction
ModeSelect hotel mode ON/OFF
InputSelect input signal modes.
ChannelSelect channel when input signal is RF.
VolumeAdjust output Volume.
Vol. MaxAdjust maximum volume.
OSD CtrlRestrict the OSD.
FP CtrlSelect flont key conditions.
Pow CtrlSelect power on control when AC power on.
Set this signal, each time power is switched
on.
<Selection> :
Off/RF/COMP1/COMP2/HDMI1/HDMI2/VID
EO1/VIDEO2
·
Off: give priority to a last memory.
Set the channel, each time power is switched
on.
<Selection>:0 to Last setting value
Set this volume, each time power is switched
on.
If the value of InitVol is changed, volume will
change. However, priority is given to a last
memory when InitVol is Off. When "InitVol" is
larger than "MaxVol", make "InitVol" and
"MaxVol" the same.
<Selection/Range> :
Off/0 to 63
·
Off: give priority to a last memory
Set this max. volume, each time power is
switched on.
When "MaxVol" is smaller than "InitVol",
make "MaxVol" and "InitVol" the same, if
"InitVol" is not Off.
<Range> :
0to63
Restrict the OSD, each time power is
switched on.
<Selection>:Off: altogether valid.
Pattern1: restrict the OSD.
Set this condition, each time power is
switched on.
<Selection> :
Off/Pattern1/All
·
Off: altogether valid
·
Pattern: restrict input selection
·
All: altogether invalid.
Off: Power on in the state of last.
ON: Power on when AC power on.
5. Explain the Hotel mode setup menu
CAUTION
This setup is not valid, unless data of EEPROM
29
TH-42PD50U
30
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