Panasonic TH-37PR11UK-UH Schematic

Order Number MTNC080419CE

B34 Canada: D10

High Definition Hospitality Plasma Display

Model No. TH-37PR11UK Model No. TH-37PR11UH

GPH11D Chassis

TABLE OF CONTENTS

1 Safety Precautions ----------------------------------------------- 3

1.1. General Guidelines---------------------------------------- 3

2 Warning -------------------------------------------------------------- 4

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices---------- 4

2.2. About lead free solder (PbF)---------------------------- 5

3 Service Navigation ----------------------------------------------- 6

3.1. Service Hint ------------------------------------------------- 6

3.2. Applicable signals ----------------------------------------- 7

4 Specifications ----------------------------------------------------- 8 5 Operating Instructions------------------------------------------ 9 6 Service Mode ----------------------------------------------------- 11

6.1. CAT (Computer Aided Test) mode ------------------- 11

6.2. IIC mode structure (following items value is sample data) -----------------------------------------------14

7 Troubleshooting Guide----------------------------------------15

7.1. Self Check --------------------------------------------------15

7.2. No Power ---------------------------------------------------17

7.3. No Picture --------------------------------------------------17

7.4. Local screen failure --------------------------------------18

8 Disassembly and Assembly Instructions ---------------19

8.1. Removal of Rear Cover ---------------------------------19

8.2. Removal of Slot Block -----------------------------------19

8.3. Removal of HX-Board -----------------------------------19

8.4. Removal of DS-Board -----------------------------------19

PAG E PAG E

8.5. Removal of DN-Board ---------------------------------- 20

8.6. Removal of P-Board ------------------------------------- 20

8.7. Removal of D-Board------------------------------------- 20

8.8. Removal of SM-Board ---------------------------------- 20

8.9. Removal of SC-Board----------------------------------- 20

8.10. Removal of SS-Board ----------------------------------- 21

8.11. Removal of C1, C2-Board ----------------------------- 21

8.12. Removal of S-Board ------------------------------------- 21

8.13. Removal of GK-Board ---------------------------------- 22

8.14. Removal of K-Board ------------------------------------- 22

8.15. Removal of Cabinet, Speaker (L, R) and Front Glass -------------------------------------------------------- 22

8.16. Removal of Plasma Panel ----------------------------- 24

9 Measurements and Adjustments -------------------------- 27

9.1. Adjustment Procedure ---------------------------------- 27

9.2. Adjustment ------------------------------------------------- 30

10 Block Diagram --------------------------------------------------- 35

10.1. Block (1 of 7) Diagram ---------------------------------- 35

10.2. Block (2 of 7) Diagram ---------------------------------- 36

10.3. Block (3 of 7) Diagram ---------------------------------- 37

10.4. Block (4 of 7) Diagram ---------------------------------- 38

10.5. Block (5 of 7) Diagram ---------------------------------- 39

10.6. Block (6 of 7) Diagram ---------------------------------- 40

10.7. Block (7 of 7) Diagram ---------------------------------- 41

11 Wiring Connection Diagram--------------------------------- 43

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11.1. Wiring (1)--------------------------------------------------- 43

11.2. Wiring (2)--------------------------------------------------- 44

11.3. Wiring (3)--------------------------------------------------- 45

11.4. Wiring (4)--------------------------------------------------- 46

12 Schematic Diagram--------------------------------------------- 47

12.1. Schematic Diagram Notes ----------------------------- 47

12.2. P-Board (1 of 6) Schematic Diagram --------------- 48

12.3. P-Board (2 of 6) Schematic Diagram --------------- 49

12.4. P-Board (3 of 6) Schematic Diagram --------------- 50

12.5. P-Board (4 of 6) Schematic Diagram --------------- 51

12.6. P-Board (5 of 6) Schematic Diagram --------------- 52

12.7. P-Board (6 of 6) Schematic Diagram --------------- 53

12.8. GK and K-Board Schematic Diagram--------------- 54

12.9. HX-Board Schematic Diagram------------------------ 55

12.10. DS-Board (1 of 6) Schematic Diagram ------------- 56

12.11. DS-Board (2 of 6) Schematic Diagram ------------- 57

12.12. DS-Board (3 of 6) Schematic Diagram ------------- 58

12.13. DS-Board (4 of 6) Schematic Diagram ------------- 59

12.14. DS-Board (5 of 6) Schematic Diagram ------------- 60

12.15. DS-Board (6 of 6) Schematic Diagram ------------- 61

12.16. DN-Board (1 of 7) Schematic Diagram ------------- 62

12.17. DN-Board (2 of 7) Schematic Diagram ------------- 63

12.18. DN-Board (3 of 7) Schematic Diagram ------------- 64

12.19. DN-Board (4 of 7) Schematic Diagram ------------- 65

12.20. DN-Board (5 of 7) Schematic Diagram ------------- 66

12.21. DN-Board (6 of 7) Schematic Diagram ------------- 67

12.22. DN-Board (7 of 7) Schematic Diagram ------------- 68

12.23. D-Board (1 of 5) Schematic Diagram --------------- 69

12.24. D-Board (2 of 5) Schematic Diagram --------------- 70

12.25. D-Board (3 of 5) Schematic Diagram --------------- 71

12.26. D-Board (4 of 5) Schematic Diagram --------------- 72

12.27. D-Board (5 of 5) Schematic Diagram --------------- 73

12.28. C1-Board (1 of 2) Schematic Diagram -------------- 74

12.29. C1-Board (2 of 2) Schematic Diagram -------------- 75

12.30. C2-Board (1 of 2) Schematic Diagram -------------- 76

12.31. C2-Board (2 of 2) Schematic Diagram -------------- 77

12.32. SC-Board (1 of 3) Schematic Diagram ------------- 78

12.33. SC-Board (2 of 3) Schematic Diagram ------------- 79

12.34. SC-Board (3 of 3) Schematic Diagram ------------- 80

12.35. SM-Board (1 of 4) Schematic Diagram ------------- 81

12.36. SM-Board (2 of 4) Schematic Diagram ------------- 82

12.37. SM-Board (3 of 4) Schematic Diagram ------------- 83

12.38. SM-Board (4 of 4) Schematic Diagram ------------- 84

12.39. SS-Board (1 of 2) and S-Board Schematic Diagram----------------------------------------------------- 85

12.40. SS-Board (2 of 2) Schematic Diagram ------------- 86

13 Printed Circuit Board ------------------------------------------ 87

13.1. P-Board ----------------------------------------------------- 87

13.2. GK, K and S-Board -------------------------------------- 90

13.3. HX-Board --------------------------------------------------- 91

13.4. DS-Board --------------------------------------------------- 92

13.5. DN-Board--------------------------------------------------- 93

13.6. D-Board ----------------------------------------------------- 95

13.7. C1-Board --------------------------------------------------- 96

13.8. C2-Board --------------------------------------------------- 97

13.9. SC-Board --------------------------------------------------- 98

13.10. SM-Board ------------------------------------------------ 101

13.11. SS-Board------------------------------------------------- 102

14 Exploded View and Replacement Parts List --------- 105

14.1. Exploded View and Mechanical Replacement Parts List ------------------------------------------------- 105

14.2. Electrical Replacement Parts List ------------------ 105

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1 Safety Precautions

1.1. General Guidelines

1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.

2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight out.

4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1Mohm and 5.2Mohm. When the exposed metal does not have a return path to

the chassis, the reading must be .

Figure 1

1.1.2. Leakage Current Hot Check (See Figure 1 .)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kohm, 10 watts resistor, in parallel with a

0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1 .

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

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2 Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

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2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used. PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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3 Service Navigation

3.1. Service Hint

Board Name Function

DN Digital Signal Processor, Microcomputer

D Format Converter, Plasma AI Processor

DS Slot Interface (Audio / Video / Sync Input

SS Sustain drive SC Scan drive SM Scan out C1 Data drive (Right) C2 Data drive (Left) SP Speaker

S Power switch K Remote receiver, LED-G, R

GK Key switch

P Power supply

HX PC / RS-232C_Input terminal

Sub-Field Processor

Switch), Sync Processor, Audio Processor, Speaker Out Amplifier, DC-DC Converter

Note:

Extension cable kit for Slot Board is supplied as service fixtures and tools. (Part No. TZSC07040)

3.2. Applicable signals

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4 Specifications

Power Source 120 V AC, 50/60Hz Power Consumption

Power on 315 W Stand-by condition Save OFF 1.5 W, Save ON 0.6 W Power off condition 0.2 W

Plasma Display panel Drive method: AC type 37-inch,

16:9 aspect ratio

Screen size 32.2" (819 mm) (W) × 18.0" (457 mm) (H) × 37" (938 mm) (diagonal)

(No. of pixels) 737,280 (1,024 (W) × 720 (H) [3,072 × 720 dots]

Operating condition

Temperature 32 °F - 104 °F (0 °C - 40 °C) Humidity 20 % - 80 %

Applicable signals

Scanning format

PC signals VGA, SVGA, XGA, SXGA

Connection terminals

PC IN (HIGH-DENSITY Mini-D-SUB 15PIN) Y or G with sync 1.0 Vp-p (75-ohm)

SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE

Accessories Supplied

Fixing bands TMME203 × 1

Dimensions (W × H × D) 36.1" (917 mm) × 25.4" (644 mm) × 3.7" (95 mm)

Mass (weight) approx. 52.9 lbs Sound

Speaker 4.8" (120 mm) × 2.4" (60 mm) × 2 pcs, 8-ohm Audio Output 20 W [10 W + 10 W] (10 % THD)

Note:

• Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

525 (480) / 60i 60p, 625 (575) / 50i 50p, 750 (720) / 60p 50p, 1125 (1080) /

60i 60p 50i 50p 24p 25p 30p 24sF 1250 (1080) / 50i

UXGA ..... (compressed)

Horizontal scanning frequency 15 - 110 kHz Vertical scanning frequency 48 - 120 Hz

Y or G without sync 0.7 Vp-p (75-ohm)

B/P

: 0.7 Vp-p (75-ohm)

B/CB

: 0.7 Vp-p (75-ohm)

R/P

R/CR

HD/VD: 1.0 - 5.0 Vp-p (high impedance)

AUDIO IN (M3 JACK) 0.5 Vrms (high impedance)

(4.3" (109 mm) when including protruding portion of slots)

5 Operating Instructions

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Option Menu for GPH11D series

GPH11D chassis series have special function and operation setting facility called Option Menu. This Option Menu is useful for special function required customers. This should be set at the installation stage.

Option menus default setting Contents Weekly Command Timer --- Sets Weekly Command Timer. Onscreen display On Enable/Disable to display input mode indication after power on and no signal

Initial INPUT Off Sets the initial input mode when the power is turned on. Allow input mode selec-

Initial VOL level Off Sets the initial volume level when the power is turned on. Allow Volume control

Maximum VOL Level Off Sets the maximum volume to desired level. Volume cannot exceed this level. INPUT lock Off Fixes the input mode to AV, Component/RGB or PC. Can not change input

Button lock Off Enable/Disable bottom operation buttons (Input, Menu, Enter and/or volume up/

Remocon User Level Off Remote key invalidation.

Advanced PIP Off Off: Sets normal two screen display mode.

Off-timer function Enable Off-timer operation Enable/Disable. Initial Power Mode Normal Sets the power mode of the unit for when the power recovers from failure or

ID select 0 Set ID number from 0 to 100. Remote ID Off Remote ID function On/Off.

Serial ID Off Serial ID function On/Off Slot power Off Sets the slot power mode while the power is turned on.

Power On Screen Delay Off You can set the power-on delay time of the displays to reduce the power load,

Clock Display Off Clock Display function On/Off. All Aspect Default Aspect mode: default/All aspect mode. Serial Slot Select Slot1 Selects the slot which communicates serial.

indication.

tion while power is on.

while power is on.

mode by input selection key.

down)

Off: Valid key is all key of remote. User1: Valid key are only Stand-by (ON/OFF), Input, Direct input, Picture, Surround, Sound mute On/Off, and volume adjustment. User2: Valid key is only Stand-by (ON/OFF). User3: All keys are null and void

On: Sets Advanced PIP mode.

after plugging off and in again.

(While the Remote ID on, standard remote function can not control the unit.)

Allow Optional Terminal Board insert Slots while power is on.

when you press to turn on the multiple displays that are set together, for example, on MULTI DISPLAY system. Set each display’s setting individually.

Note: The setting of an external command can be set only from the fixed serial terminal.

Note:

When both main unit buttons and remote control are disabled due to the “Button lock”, “Remocon User level” or “Remote ID” adjustments, set all the values “Off” so that all the buttons are enabled again. Press the “Volume down” button on main unit together with “R” button on the remote control and hold for more than 5 seconds. The “SHIPPING“ menu is displayed and the lock is released when it disappears.

6 Service Mode

6.1. CAT (Computer Aided Test) mode

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To exit the CAT mode, access the ID mode and switch off the main power.

6.1.1. IIC mode

Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

Subject and item are mentioned on “IIC mode structure”. To exit the IIC mode, press the R button on the remote control.

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6.1.2. CD mode

Select the CD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 3 seconds.

Microcomputer software version (IC4702), this version can be upgrade by

1. Replace of new version IC

2. Loading the new version software from loader tool, TZSC07036.

Memory data change

To exit the CD mode, press the R button on the remote control.

6.1.3. SD mode

Select the SD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

To exit the SD mode, press the R button on the remote control.

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6.1.4. MS mode

Select the MS mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 3 seconds.

To exit the MS mode, press the R button on the remote control.

Caution:

Market Select should be set after exchange of DN-Board.

Destination number

Number Destination Number Destination

0 Japan 16 -1North America17 -2 Europe 18 China 3 Others 19 China (Hotel) 4 Britain 20 Russia 5 Taiwan 21 Russia (Hotel) 6 Thailand 22 Hong Kong 7--23-8 Japan (Hotel) 24 --

9 North America (Hotel) 25 -10 Europe (Hotel) 26 -11 -- 2 7 -12 Britain (Hotel) 28 Middle East/Hong Kong 13 -- 29 Middle East/Hong Kong (Hotel) 14 Thailand (Hotel) 30 Australia 15 -- 31 Australia (Hotel)

Default setting

Number Destination

1 North America

6.1.5. ID mode

Select the ID mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 3 seconds.

To exit the ID mode, press the R button on the remote control.

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6.2. IIC mode structure (following items value is sample data)

7 Troubleshooting Guide

7.1. Self Check

7.1.1. Display Indication

1. Self-check is used to automatically check the bus line controlled circuit of the Plasma display.

2. To get into the Self-check mode, press the volume down button on the customer controls at the bottom of the set, at the same time pressing the OFF-TIMER button on the remote control, and the screen will show.

If the IIC ports have been checked and found to be incorrect Or not located then “ - - ” will appear in place of “ OK ” “ 01 ” in the line of the “ PTCT ” means the number of blinks of the Power LED is 1. (Reference to 7.1.2) “ H09 ” in the line of the “ PTCT ” is the error code.

To exit the CAT mode switch off the main power.

Note:

The line of the “ PTCT ” displays when you get into the Selfcheck mode for the first time only after the Power LED blinks.

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7.1.2. Power LED Blinking timing chart

1. Subject Information of LED Blinking timing chart.

2. Contents When an abnormality has occurred to the unit, the protection circuit operates and resets to the stand by mode. At this time, the defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.

About blinking LED

7.2. No Power

First check point There are following 3 states of No Power indication by power LED.

1. No lit.

2. Green is lit then turns red blinking a few seconds later.

3. Only red is lit.

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7.3. No Picture

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7.4. Local screen failure

Plasma display may have local area failure on the screen. Fig - 1 is the possible defect P.C.B. for each local area.

Fig - 1

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8 Disassembly and Assem-

bly Instructions

• To disassemble P.C.B., wait for 1 minute after power was off for discharge from electrolysis capacitors.

• , , , , and marks indicate screw positions.

8.1. Removal of Rear Cover

1. Remove screws (×4 , x6 , ×8 , ×15 ) and then

remove the Rear Cover.

2. Remove 6 screws and then remove the Slot Case.

3. Disconnect the connector (HX1).

4. Remove 4 Hexagonal-Head screws and 2 screws and then remove HX-Board.

8.2. Removal of Slot Block

1. Disconnect the connectors (DS4, DS6, DS7).

2. Remove the Flexible Cables from the connectors (DS1, DS3).

3. Disconnect the Relay Connectors (DS2, DS8, DS15).

4. Remove 5 screws and then remove the Slot Block.

8.3. Removal of HX-Board

1. Remove the Slot Block. (Refer to Removal of Slot Block)

8.4. Removal of DS-Board

1. Remove the Slot Block. (Refer to Removal of Slot Block)

2. Remove the Slot Case. (Refer to Removal of HX-Board)

3. Disconnect the connectors (DS2, DS8, DS14, DS15).

4. Remove 8 screws and then remove the Slot Plate.

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5. Remove 3 screws and then remove DS-Board.

8.5. Removal of DN-Board

1. Disconnect the connector (DN5).

2. Remove the Flexible Cables from the connectors (DN1, DN2).

3. Remove 4 screws and then remove DN-Board and the Fixed Plate.

4. Remove 4 screws and then remove D-Board.

8.8. Removal of SM-Board

1. Disconnect the connectors (SM41, SM42, SM46).

2. Remove the Flexible Cables from the connectors (SM1, SM2, SM3, SM4, SM5, SM6).

3. Remove 7 screws and then remove SM-Board.

Note:

A re-setup of the destination is performed by MS mode after DN-Board exchange.

8.6. Removal of P-Board

1. Disconnect the connectors(P2, P6, P7, P9, P11, P12, P25)

2. Remove 10 screws and then remove P-Board.

8.7. Removal of D-Board

1. Remove the Slot Block. (Refer to Removal of Slot Block)

2. Disconnect the connectors (D5, D25)

3. Remove the Flexible Cables from the connectors (D20, D31, D32).

8.9. Removal of SC-Board

1. Disconnect the connectors (SM41, SM42, SM46).

2. Remove 7 screws ( ) and then slide SM-Board to the left.

3. Disconnect the connectors (SC2, SC20).

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4. Remove 6 screws and then remove SC-Board.

8.10. Removal of SS-Board

1. Disconnect the connectors (SS11, SS12, SS23, SS34).

2. Remove the Flexible Cables from the connectors (SS53, SS56)

3. Remove 5 screws and then remove SS-Board.

Cables from the connectors (CB1, CB2, CB3, CB4).

3. Remove 4 screws ( ) and then remove C1-Board.

8.11.2. Removal of C2-Board

1. Remove 3 screws and then remove the AC-Inlet Block.

2. Disconnect the connector (C23).

3. Remove the Flexible Cables from the connectors (C20, C21).

4. Remove 8 screws ( ) and then remove the Flexible Cables from the connectors (CB5, CB6, CB7, CB8).

5. Remove 4 screws ( ) and then remove C2-Board.

8.11. Removal of C1, C2-Board

1. Remove the Slot Block. (Refer to Removal of Slot Block)

2. Remove 2 screws ( ) and then remove the Ferrite Core from the Stand Block (L, R).

3. Remove 12 screws ( ) and then remove the Stand Block (L, R).

8.11.1. Removal of C1-Board

1. Remove the Flexible Cables from the connectors (C10, C11).

2. Remove 8 screws ( ) and then remove the Flexible

8.12. Removal of S-Board

1. Disconnect the connector (S1).

2. Remove 1 screw and then remove the Ground wire from the S-Board Block.

3. Remove 1 screw (A) and then remove the S-Board Block.

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4. Remove 2 screws (B) and then remove S-Board.

8.13. Removal of GK-Board

1. Remove 2 screws (C) and then remove the Plate (A).

2. Remove 2 screws (D).

3. Disconnect the connector (GK3) and then remove GKBoard.

5. Remove 1 screw ( ) and then remove the Ferrite Core from the Stand Block (L).

6. Connected terminal hook is pushed, and the speaker lead in 4 places is pulled out.

8.14. Removal of K-Board

1. Remove 2 screws.

2. Remove K-Board and disconnect the connector(K1).

8.15. Removal of Cabinet, Speaker (L, R) and Front Glass

8.15.1. Removal of Cabinet and Speaker

(L, R)

1. Disconnect the Relay connectors (DS2, DS8, DS15).

2. Disconnect the connector (K1).

3. Disconnect the connector (S1).

4. Remove 1 screw ( ) from the S-Board Block.

7. Remove 1 screw ( ) and then remove the Ferrite Core from the Stand Block (R).

8. Remove 10 screws ( ).

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9. Remove 3 Ferrite Core.

10. Lift up the bottom of Plasma Panel to the arrow1 direction.

11. Pull the Plasma Panel to the arrow2 direction and then remove the Plasma Panel.

19. Remove 4 hooks and then remove the Power SW.

20. Remove screws and then remove the Glass Fixed Plate (L, R, Upper, Lower).

Removed number of screws:

12 screws (L, R) ( )

5 screws (Upper) ( )

6 screws (Lower) ( )

12. Remove the S-Board Block. (Refer to Removal of S-Board)

13. Remove K-Board. (Refer to Removal of K-Board)

14. Remove GK-Board. (Refer to Removal of GK-Board)

15. Remove 5 screws (F) and then remove the Plate (B).

16. Remove 2 screws (G) and then remove the Control Panel.

17. Remove 1 screw (H) and then remove the Spring.

18. Remove 3 hooks and then remove the Door.

21. Remove the Front Glass.

22. Remove 2 screws ( ) and then remove the Plate (L, R).

23. Remove 8 screws ( ) and then remove the Speaker (L, R).

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8.15.2. Removal of Front Glass

1. Remove the Cabinet. (Refer to Removal of Cabinet and Speaker (L, R))

Note: when Front Glass is exchanged

• Along each fixed Angles of an top and bottom, right and left order and the sponge for the Front Glass is pasted to the Front Glass.

Note

• The sponges are parts which cannot be recycled. Please use the new article when you exchange the Front Glass.

6. Remove 5 screws and then remove the Slot Block.

7. Disconnect the connector (DN5).

8. Remove 4 screws and then remove DN-Board Block.

8.16. Removal of Plasma Panel

The C1, C2 Boards are connected with the plasma panel for the repair.

1. Remove 3 screws ( ) and then remove the Ferrite Core from the Stand Block (L, R) and Plasma Panel.

2. Remove 12 screws ( ) and then remove the Stand Block (L, R).

3. Disconnect the connectors (DS4, DS6, DS7).

4. Remove the Flexible Cables from the connectors (DS1, DS3).

5. Disconnect the Relay Connectors (DS2, DS8, DS15).

9. Disconnect the connectors (P2, P9, P11, P12, P25).

10. Remove 10 screws ( ) and then remove P-Board.

11. Remove 3 screws ( ) and then remove the AC-Inlet Block.

12. Remove the Flexible Cables from the connectors (C11, C21, SC20).

TH-37PR11UK / TH-37PR11UH

13. Remove 4 screws and then remove D-Board.

14. Disconnect the connectors (SM41, SM42, SM46).

15. Remove the Flexible Cables from the connectors (SM1, SM2, SM3, SM4, SM5, SM6).

16. Remove 7 screws and then remove SM-Board.

22. Remove the SS-Barrier.

23. Remove the Flexible Cable from the connectors (C10, C20).

17. Remove 6 screws and then remove SC-Board.

18. Remove the SC-Barrier.

19. Disconnect the connectors (C23, SS34).

20. Remove the Flexible Cables from the connectors (SS53, SS56).

21. Remove 5 screws and then remove SS-Board.

24. Remove 6 screws.

25. Lift up the bottom of Plasma Panel to the arrow1 direction.

26. Pull the Plasma Panel to the arrow2 direction and then remove the Plasma Panel.

TH-37PR11UK / TH-37PR11UH

27. Remove the Rear Cover Hook Right and Rear Cover Hook Left from the Plasma Panel.

28. Remove the 6 Spacers and Spacer Rings from the Plasma Panel.

Caution:

• Please confirm the installation place of Rear Cover Hook Right, Rear Cover Hook Left, Spacer and Spacer Ring when you exchange the Plasma Panel, and install them in an original installation place after exchanging the Plasma Panel.

9 Measurements and Adjustments

9.1. Adjustment Procedure

9.1.1. Driver Set-up

9.1.1.1. Item / Preparation

1. Set Aging pattern (white pattern signal) by IIC mode.

2. Set the picture controls as follows. Picture menu: Standard Picture: +25 Aspect: Full

Caution

1. First perform Vsus adjustment.

2. Confirmation of Vscn voltage should be performed after confirmation of Vad adjustment. When Vad=-149V, Voltage of Vscn is -4V ±4V.

9.1.1.2. Adjustments

Adjust driver section voltages. (Refer to the panel data on the Panel Label). Check or adjust the following voltages with the multimeter.

Name Test Point Voltage Volume Remarks

Vsus TPVSUS

Ve TPVE (SS) Ve ± 1V VR6000 (SS) * Vset TPVSET

Vad TPVAD (SC) -149V ± 1V VR6600 (SC) Vscn TPVSCN

Vda TPVDA (SS) 75V + 1V, -2V Fixed PFC C446 (+)(-) 396V ± 0.5V R443 (P)

TH-37PR11UK / TH-37PR11UH

Vsus ± 2V R628 (P) *

(SS)

320V + 7V, -9VFixed

(SC)

Vad+145V ± 4VFixed

(SC)

*See the Panel Label.

TH-37PR11UK / TH-37PR11UH

9.1.2. Initialization Pulse Adjust

1. Set Aging pattern (white pattern signal) by IIC mode.

2. Set the picture controls as follows. Picture menu: Standard Picture: +25 Aspect: Full

3. Connect Oscilloscope to TPSC1 and adjust VR6602 for 210 ± 10V.

Test Point Volume Level

TPSC1 (SC) VR6602 (SC) 210 ± 10V

at 100

µs period on the down slope.

9.1.3. P.C.B. (Print Circuit Board) exchange

9.1.3.1. Caution

1. To remove P.C.B., wait 1 minute after power was off for discharge from electrolysis capacitors.

9.1.3.2. Quick adjustment after P.C.B. exchange

Adjust the following voltages with the multimeter.

P.C.B. Name Test Point Voltage Volume Remarks

P Board Vsus TPVSUS (SS) Vsus ± 2V R628 (P) *

PFC C446 (+) (-) (P) 396V ± 0.5V R443 (P) SC Board Vad TPVAD (SC) -149V ± 1V VR6600 (SC) SS Board Ve TPVE (SS) Ve ± 1V VR6000 (SS) * D, DS, DN Board White balance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals DN Board Set Market Select Number to correct destination by MS mode. (See chap. 6.1.4)

*See the Panel Label.

Caution

Absolutely do not reduce Vsus voltage below Ve not to damage the P.C.B.

9.1.4. Adjustment Volume Location

TH-37PR11UK / TH-37PR11UH

9.1.5. Test Point Location

TH-37PR11UK / TH-37PR11UH

9.2. Adjustment

9.2.1. RGB white balance adjustment

Instrument Name Connection Remarks

• RGB VGA W / B pattern

• Color analyzer (Minolta CA-100 or equivalent)

Procedure Remarks

[condition]

• Ensure aging is adequate.

• Make sure the front panel to be used on the final set is fitted.

• Make sure a color signal is not being shown before adjustment.

• Put the color analyzer where there is little color variation.

1. Set COMPONET / RGB-IN SELECT to RGB.

2. Select the IIC mode “PANEL W / B Adj.” item.

3. Check that the color temperature is “COOL (High)”.

4. Output a white balance pattern.

5. Touch the signal receiver of color analyzer to the highlight window’s center.

6. Fix G drive at E0h and adjust B drive and R drive so x, y become the “Color temperature High” in the below table.

7. Increase R / G / B together so the maximum drive value in R / G / B becomes FCh.

8. Set color temperature to “NORMAL (Medium)”.

9. Fix G drive at E0h and adjust B drive and R drive so the highlight window’s x, y becomes the “Color temperature Medium” in the below table.

10. Increase R / G / B together so the maximum drive value in R / G / B becomes FCh.

11. Set color temperature to “WARM (Low)”.

12. Set G drive to E0h and adjust B drive and R drive so the highlight window’s x, y become the “Color temperature Low” shown in the below table.

13. Increase R / G / B together so the maximum drive value in R / G / B becomes FCh.

14. Copy the R drive, G drive and B drive data in NTSC, PAL DVI region.

PC input Panel surface

User setting: Normal (Picture menu: Standard)

Picture Menu: Standard Picture: 25 Aspect: Full Position and size: Normal

• Highlight section Signal amplitude 75%

• Cutoff standard G: 80h

• Drive standard G: E0h

Adjustment target Hi-light: x ± 0.003 y ± 0.003 Hi-light is target of the number at drive adjustment in the hi-light windows. Therefore, it is not target of the hi-light number at after adjustment white balance.

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