Panasonic TH-37PG9W, TH-42PG9W Service manual

ORDER NO. ITD0609073CE

Progressive Wide Hospitality Plasma Display

TH-37PG9W TH-42PG9W

GP9D Chassis

Specifications

Power Source 220-240 VAC, 50/60Hz Power Consumption

Power on 250 W (37 inch) 280 W (42 inch) Stand-bycondition Save OFF 0.8 W, Save ON 0.6 W (37 inch) Save OFF 0.8 W, Save ON 0.6 W (42 inch) Power off condition 0.2 W (37 inch) 0.2 W (42 inch)

Plasma Displaypanel Drive method:AC type 37-inch, Drive method:AC type 42-inch,

16:9 aspect ratio (37 inch) 16:9 aspect ratio (42 inch)

Contrast Ratio Max10000:1

Screen size 818 mm (W) × 461 mm (H) × 939 mm (diagonal) (37 inch)

920 mm (W) × 518 mm (H) × 1,056 mm (diagonal) (42 inch)

(No. of pixels) 408,960 (852 (W) × 480(H))

[2,556 × 480 dots]

Operating condition

Temperature 0 °C - 40 °C Humidit

Applicablesignals

Scanning format 525 (480) / 60i 60p, 625 (575)/50i 50p, 750 (720)/60p 50p, 1125 (1080) / 60i 50i 24p 25p

PC signals VG

Connection terminals

COMPONENT Y/G(BNC)

PC (HIGH-DENSITYMini-D-SUB 15PIN)

20% - 80%

30p 24sF.... SMPTE274M, 1250 (1080) / 50i

SVGA, XGA, SXGA, UXGA..... (compressed)

Horizontal scanning frequency 15 - 110 kHz Vertical scanning frequency 48 - 120 Hz

PB/B(BNC),PR/R(BNC) AUDIO IN (RCA PIN JACK × 2)

B/P

or G with/sync1.0 Vp-p (75-ohm)

0.7 Vp-p (75-ohm)

0.5 Vrms or G with/sync1.0 Vp-p (75-ohm) or G without / sync0.7 Vp-p (75-ohm)

CB:0.7 Vp-p (75-ohm)

TH-37PG9W / TH-42PG9W

R/P

CR:0.7 Vp-p (75-ohm)

HD/VD:1.0 - 5.0 Vp-p (high impedance)

VBS (use HD port) with/picture 1.0 Vp-p (high impedance)

without/picture 0.3 Vp-p (high impedance)

UDIO IN (M3 JACK) 0.5 Vrms

SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE

Accessories Supplied

Fixing bands TMME187 × 2

Dimensions (W×H×D) 917 mm × 644 mm × 95 mm 1,020 mm ×705 mm × 95 mm

(109 mm when including protruding portion of slots) (37 inch)

Mass (weight) approx. 26.0 kg net (37 inch) approx. 30.0 kg net (42 inch) Sound

Speaker 120 mm × 60 mm × 2 pcs, 8-ohm

udio output 20W〔10W + 10W〕（10％THD）

(109 mm when including protruding portion of slots) (42 inch)

Notes:

· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

CONTENTS

Page Page

1 Applicable signals 4 2 Safety Precautions

2.1. General Guidelines

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 4 About lead free solder (PbF) 5 Service Hint 6 Disassembly

6.1. Removal of the Back Cover

6.2. Removal of the HA-Board

6.3. Removal of the Slot Block

6.4. Removal of the J-Board

6.5. Removal of the HX-Board

6.6. Removal of the DA-Board

6.7. Removal of the P-Board

6.8. Removal of the D-Board

6.9. Removal of the Speaker (L, R)

6.10. Removal of the SU-Board and the SD-Board

6.11. Removal of the SC-Board

6.12. Removal of the SS-Board

6.13. Removal of the C1, C2-Board

6.14. Removal of the S-Board

6.15. Removal of the GK-Board

6.16. Removal of the K-Board

6.17. Removal of the Control Panel, the Power SW and the Door

6.18. Removal of the Front Glass

10 10 11 11 11 11 12 12 13 13 14 14 14

15 15

6 7 8 9

9 9 9

6.19. Removal of the Escutcheon

6.20. Removal of the Plasma Panel

7 Location of Lead Wiring

7.1. Location of Lead Wiring (1)

7.2. Location of Lead wiring (2)

7.3. Location of Lead wiring (3)

7.4. Location of Lead Wiring (4)

8 Adjustment Procedure

8.1. Driver Set-up

8.2. Initialization Pulse Adjust

8.3. P.C.B. (Printed Circuit Board) exchange

8.4. Adjustment Volume Location

8.5. Test Point Location

9 Service mode

9.1. CAT (computer Aided Test) mode

9.2. IIC mode structure (following items value is sample data.)

10 Adjustment

10.1. RGB white balance adjustment

10.2. HD white balance adjustment

10.3. Power control adjustment

11 Troublesh ooting guide

11.1. Self Check

11.2. No Power

11.3. No Picture

11.4. Local screen failure

12 Option Setting

16 18

20 21 22 23

24 25 25 26 27

32 34 36

37 39 39 40

TH-37PG9W / TH-42PG9W

13 Conduct Views 43

13.1. P-Board (37inch)

13.2. P-Board (42inch)

13.3. HA-Board

13.4. HX-Board

13.5. GK, K and S-Board

13.6. J-Board

13.7. DA-Board

13.8. D-Board

13.9. C1-Board (37inch)

13.10. C1-Board (42inch)

13.11. C2-Board (37inch)

13.12. C2-Board (42inch)

13.13. SC-Board

13.14. SU-Board (37inch)

13.15. SU-Board (42inch)

13.16. SD-Board (37inch)

13.17. SD-Board (42inch)

13.18. SS-Board

14 Block and Schematic Diagram

14.1. Schematic Diagram Notes

14.2. Main Block Diagram

14.3. P-Board Block Diagram (37inch)

14.4. P-Board (1 of 6) Schematic Diagram (37inch)

14.5. P-Board (2 of 6) Schematic Diagram (37inch)

14.6. P-Board (3 of 6) Schematic Diagram (37inch)

14.7. P-Board (4 of 6) Schematic Diagram (37inch)

14.8. P-Board (5 of 6) Schematic Diagram (37inch)

14.9. P-Board (6 of 6) Schematic Diagram (37inch)

14.10. P-Board Block Diagram (42inch)

14.11. P-Board (1 of 6) Schematic Diagram (42inch)

14.12. P-Board (2 of 6) Schematic Diagram (42inch)

14.13. P-Board (3 of 6) Schematic Diagram (42inch)

14.14. P-Board (4 of 6) Schematic Diagram (42inch)

14.15. P-Board (5 of 6) Schematic Diagram (42inch)

14.16. P-Board (6 of 6) Schematic Diagram (42inch)

14.17. HA-Board Block and Schematic Diagram

14.18. HX-Board Block and Schematic Diagram

14.19. GK and K-Board Block and Schematic Diagram

14.20. J-Board (1 of 2) Block Diagram

14.21. J-Board (2 of 2) Block Diagram

14.22. J-Board (1 of 5) Schematic Diagram

14.23. J-Board (2 of 5) Schematic Diagram

14.24. J-Board (3 of 5) Schematic Diagram

14.25. J-Board (4 of 5) Schematic Diagram

43 46 49 50 51 52 54 56 58 59 60 61 62 65 66 67 68 69

71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95

14.26. J-Board (5 of 5) Schematic Diagram

14.27. DA-Board (1 of 2) Block Diagram

14.28. DA-Board (2 of 2) Block Diagram

14.29. DA-Board (1 of 6) Schematic Diagram

14.30. DA-Board (2 of 6) Schematic Diagram

14.31. DA-Board (3 of 6) Schematic Diagram

14.32. DA-Board (4 of 6) Schematic Diagram

14.33. DA-Board (5 of 6) Schematic Diagram

14.34. DA-Board (6 of 6) Schematic Diagram

14.35. D-Board Block Diagram

14.36. D-Board (1 of 6) Schematic Diagram

14.37. D-Board (2 of 6) Schematic Diagram

14.38. D-Board (3 of 6) Schematic Diagram

14.39. D-Board (4 of 6) Schematic Diagram

14.40. D-Board (5 of 6) Schematic Diagram

14.41. D-Board (6 of 6) Schematic Diagram

14.42. C1 and C2-Board Block Diagram

14.43. C1-Board (1 of 2) Schematic Diagram (37inch)

14.44. C1-Board (2 of 2) Schematic Diagram (37inch)

14.45. C1-Board (1 of 2) Schematic Diagram (42inch)

14.46. C1-Board (2 of 2) Schematic Diagram (42inch)

14.47. C2-Board (1 of 2) Schematic Diagram (37inch)

14.48. C2-Board (2 of 2) Schematic Diagram (37inch)

14.49. C2-Board (1 of 2) Schematic Diagram (42inch)

14.50. C2-Board (2 of 2) Schematic Diagram (42inch)

14.51. SC, SU and SD-Board Block Diagram

14.52. SC-Board (1 of 2) Schematic Diagram

14.53. SC-Board (2 of 2) Schematic Diagram

14.54. SU-Board Schematic Diagram (37inch)

14.55. SU-Board Schematic Diagram (42inch)

14.56. SD-Board Schematic Diagram (37inch)

14.57. SD-Board Schematic Diagram (42inch)

14.58. SS and S-Board Block Diagram

14.59. SS and S-Board Schematic Diagram

15 Parts Location

15.1. Exploded View

15.2. Cable relation

15.3. Packing summary

16 Mechanica l Replacement Parts List 17 Replacement Parts List

17.1. Replacement Parts List Notes

17.2. TH-37PG9W Electrical Replacement Parts List

17.3. TH-42PG9W Electrical Replacement Parts List

18 Schematic Diagram for printing with A4

96 97 98

99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129

131

131 132 133

135 136

136 137 158

179

TH-37PG9W / TH-42PG9W

1 Applicable signals

TH-37PG9W / TH-42PG9W

2 Safety Precautions

2.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

2.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screw heads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MΩ and 5.2MΩ.

When the exposed metal does not have a return path to

the chassis, the reading must be

Figure 1

2.1.2. Leakage Current Hot Check (See

Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

TH-37PG9W / TH-42PG9W

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

TH-37PG9W / TH-42PG9W

4 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

Caution

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb

solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

stamped on the back of PCB.

TH-37PG9W / TH-42PG9W

5 Service Hint

Note:

· The remote control transmitter is not included with this set.

· Execute by the following remote control transmitter when repairing.

product number : EUR7636070R

Board Name Function

DA Digital Signal Processor, Micon

D Format Converter, Plasma AI Processor

J Slot Interface (Audio / Video / Sync input

SS Sustain drive SC Scan drive SU Scan out (Upper) SD Scan out (Lower) C1 Data Drive (Right) C2 Data Drive (Left) SP Speaker

S Power switch K Remote receiver, LED_G,R

GK Key switch

P Power supply HX PC / RS-232C_Input terminal HA BNC Component Video

Sub-Field Processor

Switch), SYNC processor, Sound processor,

Note:

· Extension cable kit Slot Board is supplied as service fixtures and tools. (Parts No. TZCS07040)

6 Disassembly

· To disassemble P.C.B., wait for 1 minute after power was off for discharge from electrolysis capacitors.

and marks indicate screw positions.

6.1. Removal of the Back Cover

1. Remove the screws (×6 ,×6 , ×14 ,×8 ) and then remove the Back Cover.

TH-37PG9W / TH-42PG9W

6.2. Removal of the HA-Board

1. Remove the 4 screws(D) and then remove the HA Terminal Block.

2. Remove the 4 screws(E).

3. Remove the 2 screws(F) and then remove the HA-Board.

6.3. Removal of the Slot Block

1. Disconnect the couplers (J1, J2, J3, J4, J5, J6, J7, J8, J10, J15).

2. Remove the 4 screws and then remove the Slot Block.

TH-37PG9W / TH-42PG9W

6.4. Removal of the J-Board

1. Remove the Slot Block. (Reference to Removal of the Slot Block)

2. The slot block is turned inside out.

3. Remove the 6 screws and then remove the Slot cover.

4. Remove the 6 screws, release the coupler(J14) from HXBoard and then remove the J-Board.

6.5. Removal of the HX-Board

1. Remove the Slot Block. (Reference to Removal of the Slot Block)

2. Remove the J-Board. (Reference to Removal of the J-Board)

3. Remove the 2 screws and then remove the Slot Case.

4. Remove the 4 Hexagonal-Head screws and the 1 screw and then remove the HX-Board.

TH-37PG9W / TH-42PG9W

6.6. Removal of the DA-Board

1. Disconnect the couplers(DA1, DA3, DA5, DA6).

2. Remove the Flexible Cable from the coupler(DA2).

3. Remove the 4 screws and then remove the DA-Board.

Note:

A re-setup of the destination is performed by MS mode after DA-Board exchange.

6.8. Removal of the D-Board

1. Remove the Slot Block. (Reference to Removal of the Slot Block)

2. Disconnect the couplers(D5, D20, D25)

3. Remove the Flexible Cable from the couplers (D3, D31, D32).

4. Remove the 4 screws and then remove the D-Board.

6.7. Removal of the P-Board

1. Disconnect the couplers(P2, P5, P9, P10, P11, P12, P23, P25)

2. Remove the 6 screws and then remove the P-Board.

6.9. Removal of the Speaker (L, R)

6.9.1. Removal of the Speaker (L)

1. Disconnect the coupler (J8).

2. Remove the 2 screws (

3. Remove the 4 screws (

) and then remove the Plate.

) and then remove the Speaker (L).

TH-37PG9W / TH-42PG9W

6.9.2. Removal of the Speaker (R)

1. Disconnect the coupler (J7).

2. Remove the 2 screws (

3. Remove the 4 screws (

) and then remove the Plate.

) and then remove the Speaker (R).

6.10. Removal of the SU-Board and the SD-Board

1. Remove the each 2 screws.

2. Remove the Flexible Cable from the couplers(SU1, SU2,

SU3).

3. Remove the Flexible Cable from the couplers(SD1, SD2,

SD3).

4. Disconnect the couplers(SU45, SD46).

5. Slide the SU-Board and the SD-Board to the left, remove the SU-Board and the SD-Board from the couplers(SC41, SC42).

6.11. Removal of the SC-Board

1. Slide the SU-Board and the SD-Board to the left. (Reference to Removal of the SU-Board and the SD-Board)

2. Disconnect the couplers(SC2, SC20, SC23).

3. Remove the 6 screws and then remove the SC-Board.

TH-37PG9W / TH-42PG9W

6.12. Removal of the SS-Board

1. Disconnect the couplers(SS11, SS12, SS23, SS34).

2. Remove the Flexible Cable from the couplers(SS41, SS42, SS43, SS44)

3. Remove the 6 screws and then remove the SS-Board.

6.13. Removal of the C1, C2-Board

1. Remove the Slot Block. (Reference to Removal of the Slot Block)

2. Remove the each 6 screws and then remove the Stand Blocks.

6.13.1. Removal of the C1-Board

1. Disconnect the couplers(C11, C12).

2. Remove the 6 screws and then remove the Flexible Cable from the couplers(CB1, CB2, CB3).

3. Remove the 3 screws and then remove the C1-Board.

6.13.2. Removal of the C2-Board

1. Disconnect the coupler(C21, C22).

2. Remove the 8 screws and then remove the Flexible Cable from the couplers(CB4, CB5 CB6, CB7).

3. Remove the 4 screws and then remove the C2-Board.

TH-37PG9W / TH-42PG9W

6.14. Removal of the S-Board

1. Disconnect the coupler(SS34).

2. Remove the 2 screws(A) and then remove the S-Board Block.

3. Disconnect the coupler(S1).

4. Remove the 2 screw(B) and then remove the S-Board.

6.15. Removal of the GK-Board

1. Remove the 2 screws(C) and then remove the Plate(A).

2. Remove the 2 screws(D).

3. Disconnect the coupler(GK3) and then remove the GKBoard.

6.16. Removal of the K-Board

1. Remove the 2 screws.

2. Disconnect the coupler(K1) and then remove the K-Board.

TH-37PG9W / TH-42PG9W

6.17. Removal of the Control Panel, the Power SW and the Door

1. Remove the S-Board Block.

(Remove to the Removal of the S-Board)

2. Remove the K-Board.

(Remove to the Removal of the K-Board)

3. Remove the GK-Board.

(Remove to the Removal of the GK-Board)

4. Remove the 5 screws(E) and then remove the Plate(B).

5. Remove the 2 screws(F) and then remove the Control

Panel.

6.18. Removal of the Front Glass

1. Disconnect the couplers(J2, J7, J8, J15, SS34).

2. Remove the 10 screws.

3. Pull the bottom of the Plasma Panel forward (arrow1).

4. Slide the Plasma Panel and then remove the Plasma Panel (arrow2).

6. Remove the 1 screw(G) and then remove the Spring.

7. Remove the 3 hooks and then remove the Door.

8. Remove the 4 hooks and then remove the Power SW.

5. Remove the 5 screws (E) and then remove the Plate (B).

6. Remove the each screws and then remove the Glass Fixed Plate (A, B, C, D).

7. Remove the Front Glass.

TH-37PG9W / TH-42PG9W

· TH-42PG9W

Removed number of screws: 25

· TH-37PG9W

Removed number of screws: 23

6.19. Removal of the Escutcheon

1. Disconnect the couplers(J2, J7, J8, J15, SS34).

2. Remove the 10 screws.

3. Lift up the bottom of the Plasma Panel in the direction of the arrow1 and pull the Plasma Panel in the direction of the arrow2 and then remove the Plasma Panel.

Note: when Front Glass is exchanged

· Each Front Glass Sponge must be stuck along the edge of Fixed Angle.

Note

· The sponges are parts which cannot be recycled. Please use the new article when you exchange the

Front Glass.

4. Remove the S-Board Block. (Remove to the Removal of the S-Board)

5. Remove the K-Board. (Remove to the Removal of the K-Board)

6. Remove the GK-Board. (Remove to the Removal of the GK-Board)

7. Remove the 5 screws(E) and then remove the Plate(B).

8. Remove the 2 screws(F) and then remove the Control Panel.

TH-37PG9W / TH-42PG9W

9. Remove the 1 screw(G) and then remove the Spring.

10. Remove the 3 hooks and then remove the Door.

11. Remove the 4 hooks and then remove the Power SW.

12. Remove the each screws and then remove the Glass Fixed Plate (A, B, C, D).

· TH-42PG9W

Removed number of screws: 25

Note: when Front Glass is removed

· Each Front Glass Sponge must be stuck along the edge of Fixed Angle.

Note

· The sponges are parts which cannot be recycled. Please use the new article when you exchange the Front Glass.

13. Remove the each 1 screw and then remove the Plate(L, R).

14. Remove the each 4 screws and then remove the Speaker (L, R).

· TH-37PG9W

Removed number of screws: 23

15. Remove the Escutcheon.

TH-37PG9W / TH-42PG9W

6.20. Removal of the Plasma Panel

· The C1,C2 module is connected with the plasma panel

for the repair.

1. Remove the each 6 screws and then remove the Stand Blocks.

2. Disconnect the couplers(J1, J2, J3, J4, J5, J6, J7, J8, J10, J15).

3. Remove the 4 screws and then remove the Slot Block.

6. Disconnect the couplers(P2, P9, P11, P12, P23, P25).

7. Remove the 6 screws and then remove the P-Board.

8. Disconnect the coupler(D20).

9. Remove the Flexible Cable from the couplers(C11, C21).

10. Remove the 4 screws and then remove the D-Board.

4. Remove the Flexible Cable from the couplers(DA2).

5. Remove the 4 screws and then remove the D-Board Block.

11. Remove the SU-Board and the SD-Board. (Reference to Removal of the SU-Board and the SD-Board)

12. Remove the 6 screws and then remove the SC-Board.

TH-37PG9W / TH-42PG9W

13. Disconnect the couplers(SS23, SS34).

14. Remove the Flexible Cable from the couplers(SS41, SS42, SS43, SS44).

15. Remove the 6 screws and then remove the SS-Board.

16. Remove the Flexible Cable from the couplers(C12, C22).

17. Remove the 3 screws and then remove the C1-Board.

20. Remove the 6 Spacers and Spacer Rings from the Plasma Panel.

Caution

· Please confirm the installation place of Spacer and Spacer Ring when you exchange the Plasma Panel, and install Spacer and Spacer Ring in an original installation place after exchanging the Plasma Panel.

21. Lift up the bottom of the Plasma Panel in the direction of the arrow1 and pull the Plasma Panel in the direction of the arrow2 and then remove the Plasma Panel.

18. Remove the 3 screws(H) and then remove the AC Inlet Block.

19. Remove the 2 screws(J) and then remove the plate(C).

TH-37PG9W / TH-42PG9W

7 Location of Lead Wiring

7.1. Location of Lead Wiring (1)

The lead wiring is dressed as shown in figure.

7.2. Location of Lead wiring (2)

The lead wiring is dressed as shown in figure.

TH-37PG9W / TH-42PG9W

7.3. Location of Lead wiring (3)

The lead wiring is dressed as shown in figure.

7.4. Location of Lead Wiring (4)

The lead wiring is dressed as shown in figure.

TH-37PG9W / TH-42PG9W

8 Adjustment Procedure

8.1. Driver Set-up

8.1.1. Item / Preparation

1. Input a white signal to plasma video input.

2. Set the picture controls as follows. Picture menu: Standard Picture: +25 Aspect: Full

Caution

1. First perform Vsus adjustment.

2. Confirmation of Vscn voltage should be performed after

confirmation of Vad adjustment. When Vad=-90V, Voltage of Vscn is 35V ±4V.

8.1.2. Adjustments

Adjust driver section voltages referring the panel data on the panel data label.

Check or adjust the following voltages with the multimeter.

Name Test Point Voltage Volume Remarks

Vsus TPVSUS

(SS) Ve TPVE (SS) Ve ± 1V VR6000 (SS) * Vset TPVSET

(SC) Vad TPVAD (SC) -90V ± 1V VR6600

Vscn TPVSCN

(SC) Vda TPVDA (SS) 70V ± 1V Fixed Vdat P12-1, 5 (P) 70.2V ± 0.1V R665 (P) PFC C446 (+)(-) 396V ± 0.5V R443 (P)

*See the Panel label.

Vsus ± 1V R628 (P) *

232V ± 7V Fixed

(SC)

Vad+125V ±4VFixed

8.2. Initialization Pulse Adjust

1. Input the White signal to plasma video input.

2. Set the picture controls as follows. Picture menu: Standard Picture: +25 Aspect: Full

3. Connect Oscilloscope to TPSC1 (T2) and adjust VR6602 for 170±5µ Sec.

Test point Volume Level

T2 TPSC1 (SC) VR6602 (SC) 170 ± 5µ Sec.

TH-37PG9W / TH-42PG9W

8.3. P.C.B. (Printed Circuit Board) exchange

8.3.1. Caution

1. To remove P.C.B., wait 1 minute after power was off for discharge from electrolysis capacitors.

8.3.2. Quick adjustment after P.C.B. exchange

Adjust the following voltages with the multimeter.

P.C.B. Name Test Point Voltage Volume Remarks

P Board Vsus TPVSUS (SS) Vsus ± 1V R628 (P) *

Vdat P12-1, 5 (P) 70.2V ± 0.1V R665 (P)

PFC C446 (+) (-) (P) 396V ± 0.5V R443 (P) SC Board Vad TPVAD (SC) -90V ± 1V VR6600 (SC) SS Board Ve TPVE (SS) Ve ± 2V VR6000 (SS) * D, J, DA Board White balance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals DA Board Set Market Select Number to correct destination by MS mode. (See chap. 9.1.4)

*See the Panel label.

Caution:

Absolutely do not reduce Vsus below Ve not to damage the P.C.B.

TH-37PG9W / TH-42PG9W

8.4. Adjustment Volume Location

8.4.1. TH-37PG9W

8.4.2. TH-42PG9W

8.5. Test Point Location

8.5.1. TH-37PG9W

TH-37PG9W / TH-42PG9W

8.5.2. TH-42PG9W

TH-37PG9W / TH-42PG9W

9 Service mode

9.1. CAT (computer Aided Test) mode

To exit the CAT mode, access the ID mode and switch off the main power.

9.1.1. IIC mode

Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

Subject and item are mentioned on “IIC mode structure”.

To exit the IIC mode, press the R button on the remote control.

TH-37PG9W / TH-42PG9W

9.1.2. CD mode

Select the CD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 5 seconds.

Micom software version (IC9702), this version can be upgrade by

1. replace of new version IC

2. Loading the new version software from loader tool, TZSC07036. Memory data change

To exit the CD mode, press the R button on the remote control.

9.1.3. SD mode

Select the SD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

To exit the SD mode, press the R button on the remote control.

TH-37PG9W / TH-42PG9W

9.1.4. MS mode

Select the MS mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 5 seconds.

To exit the MS mode, press the R button on the remote control.

Caution:

Market Select should be set after exchange of DA-Board.

Destination number

Number Destination Number Destination

0 Japan 14 Thailand (Hotel) 1 North America 15 -2 Europe 16 Mexico 3 Others 17 Mexico (Hotel) 4 Britain 18 China 5 Taiwan 19 China (Hotel) 6 Thailand 20 -7 -- 21 -8 Japan (Hotel) 22 --

9 North America (Hotel) 23 -10 Europe (Hotel) 24 -11 Others (Hotel) 25 -12 Britain (Hotel) 26 --

Number Destination

Default setting

1 North America

9.1.5. ID mode

Select the ID mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 5 seconds.

To exit the ID mode, press the R button on the remote control.

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