Panasonic TH-37PG9U, TH-42PG9U Service manual

ORDER NO. MTNC060474CE

D10 Canada: B07

Progressive Wide Hospitality Plasma Display

TH-37PG9U TH-42PG9U

GP9D Chassis

Specifications

Power Source 120 VAC, 50/60Hz Power Consumption

Maximum 265 W (37 inch) 290 W (42 inch) Stand-bycondition Save OFF 0.6 W, Save ON 0.4 W (37 inch) Save OFF 0.6 W, Save ON 0.4 W (42 inch) Power off condition 0.1 W (37 inch) 0.1 W (42 inch)

Plasma Displaypanel Drive method:AC type 37-inch, Drive method:AC type 42-inch,

16:9 aspect ratio (37 inch) 16:9 aspect ratio (42 inch)

Contrast Ratio 10000:1

Screen size 32.2” (818 mm) (W) × 18.1” (461 mm) (H) × 37” (939 mm) (diagonal) (37 inch)

36.2” (920 mm) (W) × 20.4” (518 mm) (H) × 42” (1,056 mm) (diagonal) (42 inch)

(No. of pixels) 408,960 (852 (W) × 480(H))

[2,556 × 480 dots]

Operating condition

Temperature 32 °F - 104 °F (0 °C - 40 °C) Humidit

Applicablesignals

Scanning format 525 (480) / 60i 60p, 625 (575)/50i 50p, 750 (720)/60p 50p, 1125 (1080) / 60i 50i 24p 25p

PC signals VG

Connection terminals

PC (HIGH-DENSITYMini-D-SUB 15PIN) R,G,B/0.7 Vp-p (75-ohm)

20% - 80%

30p 24sF.... SMPTE274M, 1250 (1080) / 50i

SVGA, XGA, SXGA, UXGA..... (compressed)

Horizontal scanning frequency 15 - 110 kHz Vertical scanning frequency 48 - 120 Hz

Component

HD,VD/1.0-5.0 Vp-p (high impedance)

:1.0 Vp-p (75-ohm: include sync)

CB:0.7 Vp-p (75-ohm)

CR:0.7 Vp-p (75-ohm)

TH-37PG9U / TH-42PG9U

UDIO IN (M3 JACK) 0.5 Vrms (high impedance)

SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE

Accessories Supplied

Fixing bands (TMME203 or TMME187) × 2

Dimensions (W×H×D) 36.1” (916 mm) × 25.4” (644 mm) × 4.3” (109 mm) 40.2” (1,020 mm) ×27.8” (705 mm) × 4.3” (109 mm)

(exclusive of protruding portion) (37 inch) (exclusive of protruding portion) (42 inch)

Mass (weight) approx. 57.3 lbs (37 inch) approx. 66.1 lbs (42 inch) Sound

Speaker (8Ω） 20W〔10W+10W〕（10％THD）

Notes:

· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

CONTENTS

Page Page

1 Applicable signals 4 2 Safety Precautions

2.1. General Guidelines

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 4 About lead free solder (PbF) 5 PCB Structure sheet of GP9D chassis 6 Service Hint 7 Disassembly

7.1. Removal of the Back Cover

7.2. Removal of the Slot Block

7.3. Removal of the J-Board

7.4. Removal of the HX-Board

7.5. Removal of the DA-Board

7.6. Removal of the P-Board

7.7. Removal of the D-Board

7.8. Removal of the SU-Board and the SD-Board

7.9. Removal of the SC-Board

7.10. Removal of the SS-Board

7.11. Removal of the C1, C2-Board

7.12. Removal of the S-Board

7.13. Removal of the GK-Board

7.14. Removal of the K-Board

7.15. Removal of the Escutcheon

7.16. Removal of the Plasma Panel

8 Location of Lead Wiring

8.1. Location of Lead Wiring (1)

8.2. Location of Lead wiring (2)

8.3. Location of Lead wiring (3)

8.4. Location of Lead Wiring (4)

9 Adjustment Procedure

9.1. Driver Set-up

9.2. Initialization Pulse Adjust

10 10 10 11 11 11 12 12 12 12 13 13 14 14 14 15

18 19 20 21

22 23

6 7 8 9

9.3. P.C.B. (Printed Circuit Board) exchange

9.4. Adjustment Volume Location

9.5. Test Point Location

10 Service mode

10.1. CAT (computer Aided Test) mode

10.2. IIC mode structure (following items value is sample data.)

11 Adjustment

11.1. RGB white balance adjustment

11.2. HD white balance adjustment

11.3. Power control adjustment

12 Trouble shooting guide

12.1. Self Check

12.2. No Power

12.3. No Picture

12.4. Local screen failure

13 Option Setting 14 Conduct Views

14.1. P-Board (37inch)

14.2. P-Board (42inch)

14.3. HX-Board

14.4. GK, K and S-Board

14.5. J-Board

14.6. DA-Board

14.7. D-Board

14.8. C1-Board (37inch)

14.9. C1-Board (42inch)

14.10. C2-Board (37inch)

14.11. C2-Board (42inch)

14.12. SC-Board

14.13. SU-Board (37inch)

14.14. SU-Board (42inch)

14.15. SD-Board (37inch)

23 24 25

30 32 34

35 37 37 38

39 41

41 44 47 48 49 51 53 55 56 57 58 59 62 63 64

14.16. SD-Board (42inch) 65

14.17. SS-Board

15 Block and Schematic Diagram

15.1. Schematic Diagram Notes

15.2. Main Block Diagram

15.3. P-Board Block Diagram (37inch)

15.4. P-Board (1 of 6) Schematic Diagram (37inch)

15.5. P-Board (2 of 6) Schematic Diagram (37inch)

15.6. P-Board (3 of 6) Schematic Diagram (37inch)

15.7. P-Board (4 of 6) Schematic Diagram (37inch)

15.8. P-Board (5 of 6) Schematic Diagram (37inch)

15.9. P-Board (6 of 6) Schematic Diagram (37inch)

15.10. P-Board Block Diagram (42inch)

15.11. P-Board (1 of 6) Schematic Diagram (42inch)

15.12. P-Board (2 of 6) Schematic Diagram (42inch)

15.13. P-Board (3 of 6) Schematic Diagram (42inch)

15.14. P-Board (4 of 6) Schematic Diagram (42inch)

15.15. P-Board (5 of 6) Schematic Diagram (42inch)

15.16. P-Board (6 of 6) Schematic Diagram (42inch)

15.17. HX-Board Block and Schematic Diagram

15.18. GK and K-Board Block and Schematic Diagram

15.19. J-Board (1 of 2) Block Diagram

15.20. J-Board (2 of 2) Block Diagram

15.21. J-Board (1 of 5) Schematic Diagram

15.22. J-Board (2 of 5) Schematic Diagram

15.23. J-Board (3 of 5) Schematic Diagram

15.24. J-Board (4 of 5) Schematic Diagram

15.25. J-Board (5 of 5) Schematic Diagram

15.26. DA-Board (1 of 2) Block Diagram

15.27. DA-Board (2 of 2) Block Diagram

15.28. DA-Board (1 of 6) Schematic Diagram

15.29. DA-Board (2 of 6) Schematic Diagram

15.30. DA-Board (3 of 6) Schematic Diagram

15.31. DA-Board (4 of 6) Schematic Diagram

15.32. DA-Board (5 of 6) Schematic Diagram

69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99

100

15.33. DA-Board (6 of 6) Schematic Diagram

15.34. D-Board Block Diagram

15.35. D-Board (1 of 6) Schematic Diagram

15.36. D-Board (2 of 6) Schematic Diagram

15.37. D-Board (3 of 6) Schematic Diagram

15.38. D-Board (4 of 6) Schematic Diagram

15.39. D-Board (5 of 6) Schematic Diagram

15.40. D-Board (6 of 6) Schematic Diagram

15.41. C1 and C2-Board Block Diagram

15.42. C1-Board (1 of 2) Schematic Diagram (37inch)

15.43. C1-Board (2 of 2) Schematic Diagram (37inch)

15.44. C1-Board (1 of 2) Schematic Diagram (42inch)

15.45. C1-Board (2 of 2) Schematic Diagram (42inch)

15.46. C2-Board (1 of 2) Schematic Diagram (37inch)

15.47. C2-Board (2 of 2) Schematic Diagram (37inch)

15.48. C2-Board (1 of 2) Schematic Diagram (42inch)

15.49. C2-Board (2 of 2) Schematic Diagram (42inch)

15.50. SC, SU and SD-Board Block Diagram

15.51. SC-Board (1 of 2) Schematic Diagram

15.52. SC-Board (2 of 2) Schematic Diagram

15.53. SU-Board Schematic Diagram (37inch)

15.54. SU-Board Schematic Diagram (42inch)

15.55. SD-Board Schematic Diagram (37inch)

15.56. SD-Board Schematic Diagram (42inch)

15.57. SS and S-Board Block Diagram

15.58. SS and S-Board Schematic Diagram

16 Parts Location

16.1. Exploded View

16.2. Accessories Box

16.3. Cable relation

17 Mechanica l Replacement Parts List 18 Replacement Parts List

18.1. Relpacement Parts List Notes

18.2. TH-37PG9U Electrical Replacement Parts List

18.3. TH-42PG9U Electrical Replacement Parts List

TH-37PG9U / TH-42PG9U

101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126

127

127 128 129

130 131

131 132 152

TH-37PG9U / TH-42PG9U

1 Applicable signals

TH-37PG9U / TH-42PG9U

2 Safety Precautions

2.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

2.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screw heads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MΩ and 5.2MΩ.

When the exposed metal does not have a return path to

the chassis, the reading must be

Figure 1

2.1.2. Leakage Current Hot Check (See

Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

TH-37PG9U / TH-42PG9U

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

TH-37PG9U / TH-42PG9U

4 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

Caution

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb

solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

stamped on the back of PCB.

TH-37PG9U / TH-42PG9U

5 PCB Structure sheet of GP9D chassis

Board Name Function Remarks

DA Digital Signal Processor, Micon 1

D Format Converter, Plasma AI Processor

Sub-Field Processor

J Slot Interface (Audio/Video/Sync input Switch),

SYNC processor, Sound processor, SS Sustain drive 1 SC Scan drive 1 SU Scan out (Upper) 1 SD Scan out (Lower) 1 C1 Data Drive (Right) C2 Data Drive (Left) SP Speaker

S Power switch K Remote receiver, LED_G,R

GK Key switch

P Power supply 1

HX PC / RS-232C_Input terminal

Remarks

1: Recommend PCB´s for initial service for GP9D chassis.

6 Service Hint

Note:

· The remote control transmitter is not included with this set.

· Execute by the following remote control transmitter when repairing.

product number : EUR7636070R

TH-37PG9U / TH-42PG9U

Note:

· Extension cable kit Slot Board is supplied as service fixtures and tools.

(Parts No. TZSC0704)

TH-37PG9U / TH-42PG9U

7 Disassembly

· To disassemble P.C.B., wait for 1 minute after power was off for discharge from electrolysis capacitors.

and marks indicate screw positions.

7.1. Removal of the Back Cover

7.1.1. TH-37PG9U

1. Remove the screws (×6 ,×6 , ×14 ,×8 ) and then remove the Back Cover.

7.2. Removal of the Slot Block

1. Disconnect the couplers (J1, J2, J3, J4, J5, J6, J7, J8, J10, J15).

2. Remove the 4 screws and then remove the Slot Block.

7.3. Removal of the J-Board

7.1.2. TH-42PG9U

1. Remove the screws (×6 ,×6 , ×14 ,×8 ) and then remove the Back Cover.

1. Remove the Slot Block. (Reference to Removal of the Slot Block)

2. The slot block is turned inside out.

3. Remove the 6 screws and then remove the Slot cover.

4. Remove the 6 screws, release the coupler(J14) from HXBoard and then remove the J-Board.

7.4. Removal of the HX-Board

TH-37PG9U / TH-42PG9U

7.5. Removal of the DA-Board

1. Remove the Slot Block. (Reference to Removal of the Slot Block)

2. Remove the J-Board. (Reference to Removal of the J-Board)

3. Remove the 2 screws and then remove the Slot Case.

4. Remove the 4 Hexagonal-Head screws and the 1 screw and then remove the HX-Board.

1. Disconnect the couplers(DA1, DA3, DA5, DA6).

2. Remove the Flexible Cable from the coupler(DA2).

3. Remove the 4 screws and then remove the DA-Board.

Note:

A re-setup of the destination is performed by MS mode after DA-Board exchange.

7.6. Removal of the P-Board

1. Disconnect the couplers(P2, P5, P9, P10, P11, P12, P23, P25)

2. Remove the 6 screws and then remove the P-Board.

TH-37PG9U / TH-42PG9U

7.7. Removal of the D-Board

1. Remove the Slot Block. (Reference to Removal of the Slot Block)

2. Disconnect the couplers(D5, D20, D25)

3. Remove the Flexible Cable from the couplers (D3, D31, D32).

4. Remove the 4 screws and then remove the D-Board.

7.9. Removal of the SC-Board

1. Slide the SU-Board and the SD-Board to the left. (Reference to Removal of the SU-Board and the SD-Board)

2. Disconnect the couplers(SC2, SC20, SC23).

3. Remove the 6 screws and then remove the SC-Board.

7.8. Removal of the SU-Board and the SD-Board

1. Remove the each 2 screws.

2. Remove the Flexible Cable from the couplers(SU1, SU2,

SU3).

3. Remove the Flexible Cable from the couplers(SD1, SD2,

SD3).

7.10. Removal of the SS-Board

1. Disconnect the couplers(SS11, SS12, SS23, SS34).

2. Remove the Flexible Cable from the couplers(SS41, SS42, SS43, SS44)

3. Remove the 6 screws and then remove the SS-Board.

4. Disconnect the couplers(SU45, SD46).

5. Slide the SU-Board and the SD-Board to the left, remove the SU-Board and the SD-Board from the couplers(SC41, SC42).

7.11. Removal of the C1, C2-Board

1. Remove the Slot Block. (Reference to Removal of the Slot Block)

2. Remove the each 6 screws and then remove the Stand Blocks.

TH-37PG9U / TH-42PG9U

7.11.2. Removal of the C2-Board

1. Disconnect the coupler(C21, C22).

2. Remove the 8 screws and then remove the Flexible Cable from the couplers(CB4, CB5 CB6, CB7).

3. Remove the 4 screws and then remove the C2-Board.

7.12. Removal of the S-Board

7.11.1. Removal of the C1-Board

1. Disconnect the couplers(C11, C12).

2. Remove the 6 screws and then remove the Flexible Cable from the couplers(CB1, CB2, CB3).

3. Remove the 3 screws and then remove the C1-Board.

1. Disconnect the coupler(SS34).

2. Remove the 2 screws(A) and then remove the S-Board Block.

3. Disconnect the coupler(S1).

4. Remove the 2 screw(B) and then remove the S-Board.

TH-37PG9U / TH-42PG9U

7.13. Removal of the GK-Board

1. Remove the 2 screws(C) and then remove the Plate(A).

2. Remove the 2 screws(D).

3. Disconnect the coupler(GK3) and then remove the GKBoard.

7.14. Removal of the K-Board

1. Remove the 2 screws(E).

2. Disconnect the coupler(K1) and then remove the K-Board.

3. Lift up the bottom of the Plasma Panel in the direction of the arrow1 and pull the Plasma Panel in the direction of the arrow2 and then remove the Plasma Panel.

4. Remove the S-Board Block. (Remove to the Removal of the S-Board)

5. Remove the K-Board. (Remove to the Removal of the K-Board)

6. Remove the GK-Board. (Remove to the Removal of the GK-Board)

7. Remove the 5 screws(E) and then remove the Plate(B).

8. Remove the 2 screws(F) and then remove the Control Panel.

7.15. Removal of the Escutcheon

1. Disconnect the couplers(J2, J7, J8, J15, SS34).

2. Remove the 10 screws.

9. Remove the 1 screw(G) and then remove the Spring.

10. Remove the 3 hooks and then remove the Door.

11. Remove the 4 hooks and then remove the Power SW.

12. Remove the each screws and then remove the Glass Fixed Plate (L, R, Upper, Lower).

· TH-42PG9U

Removed number of screws:

each 6 screws (L, R) 5 screws (Upper) 8 screws (Lower)

· TH-37PG9U

Removed number of screws:

each 6 screws (L, R) 5 screws (Upper) 6 screws (Lower)

TH-37PG9U / TH-42PG9U

7.16. Removal of the Plasma Panel

1. Remove the each 6 screws and then remove the Stand Blocks.

2. Disconnect the couplers(J1, J2, J3, J4, J5, J6, J7, J8, J10, J15).

3. Remove the 4 screws and then remove the Slot Block.

13. Remove the each 1 screw and then remove the Plate(L, R).

14. Remove the each 4 screws and then remove the Speaker (L/R).

4. Remove the Flexible Cable from the couplers(DA2).

5. Remove the 4 screws and then remove the D-Board Block.

TH-37PG9U / TH-42PG9U

6. Disconnect the couplers(P2, P9, P11, P12, P23, P25).

7. Remove the 6 screws and then remove the P-Board.

8. Disconnect the coupler(D20).

9. Remove the Flexible Cable from the couplers(D31, D32).

10. Remove the 4 screws and then remove the D-Board.

15. Remove the 6 screws and then remove the SS-Board.

16. Remove the 6 screws and then remove the Flexible Cable from the couplers(CB1, CB2, CB3, C12).

17. Remove the 3 screws and then remove the C1-Board.

11. Remove the SU-Board and the SD-Board. (Reference to Removal of the SU-Board and the SD-Board)

12. Remove the 6 screws and then remove the SC-Board.

13. Disconnect the couplers(SS23, SS34).

14. Remove the Flexible Cable from the couplers(SS41, SS42, SS43, SS44).

18. Remove the 8 screws and then remove the Flexible Cable from the couplers(CB4, CB5, CB6, CB7).

19. Remove the 4 screws and then remove the C2-Board.

20. Remove the 3 screws(H) and then remove the AC Inlet Block.

21. Remove the 2 screws(J) and then remove the plate(C).

22. Lift up the bottom of the Plasma Panel in the direction of the arrow1 and pull the Plasma Panel in the direction of the arrow2 and then remove the Plasma Panel.

TH-37PG9U / TH-42PG9U

8 Location of Lead Wiring

8.1. Location of Lead Wiring (1)

The lead wiring is dressed as shown in figure.

8.2. Location of Lead wiring (2)

The lead wiring is dressed as shown in figure.

TH-37PG9U / TH-42PG9U

8.3. Location of Lead wiring (3)

The lead wiring is dressed as shown in figure.

8.4. Location of Lead Wiring (4)

The lead wiring is dressed as shown in figure.

TH-37PG9U / TH-42PG9U

9 Adjustment Procedure

9.1. Driver Set-up

9.1.1. Item / Preparation

1. Input a white signal to plasma video input.

2. Set the picture controls as follows. Picture menu: Vivid Picture: +30 Aspect: Full

Caution

1. First perform Vsus adjustment.

2. Confirmation of Vscn voltage should be performed after

confirmation of Vad adjustment. When Vad=-90V, Voltage of Vscn is 30V ±3V.

9.1.2. Adjustments

Adjust driver section voltages referring the panel data on the panel data label.

Name Test Point Voltage Volume Remarks

Vsus TPVSUS

(SS) Ve TPVE (SS) Ve ± 2V VR6000 (SS) * Vset TPVSET

(SC) Vad TPVAD (SC) -90V ± 1V VR6600

Vscn TPVSCN

(SC) Vda TPVDA (SS) 70V ± 1V Fixed Vdat P12-1, 5 (P) 70.2V ± 0.1V R665 (P) PFC C446 (+)(-) 396V ± 0.5V R443 (P) Vlow C555 (+)(-) 73.0V ± 0.1V R661 (P) Vda load

Csus TPVSUS

(SS)

*See the Panel label.

Vsus ± 2V R628 (P) *

232V ± 7V Fixed

(SC)

Vad+125V ±4VFixed

current:

0.4A

165V ± 0.5V R671 (P) Vsus load

current:

1.25A

9.2. Initialization Pulse Adjust

1. Input the White signal to plasma video input.

2. Set the picture controls as follows. Picture menu: Vivid Picture: +25 Aspect: Full

3. Connect Oscilloscope to TPSC1 (T2) and adjust VR6602 for 170±10µ Sec.

Test point Volume Level

T2 TPSC1 (SC) VR6602 (SC) 170 ± 10µ Sec.

TH-37PG9U / TH-42PG9U

9.3. P.C.B. (Printed Circuit Board) exchange

9.3.1. Caution

1. To remove P.C.B., wait 1 minute after power was off for discharge from electrolysis capacitors.

9.3.2. Quick adjustment after P.C.B. exchange

P.C.B. Name Test Point Voltage Volume Remarks

P Board Vsus TPVSUS (SS) Vsus ± 2V R628 (P) *

Vdat P12-1, 5 (P) 70.2V ± 0.1V R665 (P) PFC C446 (+) (-) (P) 396V ± 0.5V R443 (P) Vlow C555 (+) (-) (P) 73.0V ± 0.1V R661 (P) Vda load current: 0.4A Csus TPVSUS (SS) 165V ± 0.5V R671 (P) Vsus load current:

SC Board Vad TPVAD (SC) -90V ± 1V VR6600 (SC) SS Board Ve TPVE (SS) Ve ± 2V VR6000 (SS) * D, J, DA Board White balance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals DA Board Set Market Select Number to correct destination by MS mode. (See chap. 10.1.4)

*See the Panel label.

Caution:

Absolutely do not reduce Vsus below Ve not to damage the P.C.B.

1.25A

TH-37PG9U / TH-42PG9U

9.4. Adjustment Volume Location

9.4.1. TH-37PG9U

9.4.2. TH-42PG9U

9.5. Test Point Location

9.5.1. TH-37PG9U

TH-37PG9U / TH-42PG9U

9.5.2. TH-42PG9U

TH-37PG9U / TH-42PG9U

10 Service mode

10.1. CAT (computer Aided Test) mode

To exit the CAT mode, access the ID mode and switch off the main power.

10.1.1. IIC mode

Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

Subject and item are mentioned on “IIC mode structure”.

To exit the IIC mode, press the R button on the remote control.

TH-37PG9U / TH-42PG9U

10.1.2. CD mode

Select the CD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 5 seconds.

Micom software version (IC9702), this version can be upgrade by

1. replace of new version IC

2. Loading the new version software from loader tool, TZSC07036.

Memory data change

To exit the CD mode, press the R button on the remote control.

10.1.3. SD mode

Select the SD mode by Up/Down button on the remote control at the front page of CAT mode and then press the Action button on the remote control.

To exit the SD mode, press the R button on the remote control.

TH-37PG9U / TH-42PG9U

10.1.4. MS mode

Select the MS mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 5 seconds.

To exit the MS mode, press the R button on the remote control.

Caution:

Market Select should be set after exchange of DA-Board.

Destination number

Number Destination Number Destination

0 Japan 14 Thailand (Hotel) 1 North America 15 -2 Europe 16 Mexico 3 Others 17 Mexico (Hotel) 4 Britain 18 China 5 Taiwan 19 China (Hotel) 6 Thailand 20 -7 -- 21 -8 Japan (Hotel) 22 --

9 North America (Hotel) 23 -10 Europe (Hotel) 24 -11 Others (Hotel) 25 -12 Britain (Hotel) 26 --

Number Destination

Default setting

1 North America

10.1.5. ID mode

Select the ID mode by Up/Down button on the remote control at the front page of CAT mode and then press the Mute button on the remote control more than 5 seconds.

To exit the ID mode, press the R button on the remote control.

10.2. IIC mode structure (following items value is sample data.)

TH-37PG9U / TH-42PG9U

11 Adjustment

11.1. RGB white balance adjustment

Instrument Name Connection Remarks

· RGB VGA W/B pattern

· Color analyzer

(Minolta CA-100 or equivalent)

Procedure Remarks

· Ensure aging is adequate.

· Make sure the front panel to be used on the final set is fitted.

· Make sure a color signal is not being shown before adjustment.

· Put the color analyzer where there is little color variation.

1. Set COMPONET/RGB-IN SELECT to RGB.

2. Select the IIC mode “PANEL W/B Adj.” item.

3. Check that the color temperature is “COOL (High)”.

4. Output a white balance pattern.

5. Touch the signal receiver of color analyzer to the highlight window’s center.

6. Fix G drive at E0h and adjust B drive and R drive so x, y become the “Color temperature High” in the below table.

7. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

8. Set color temperature to “NORMAL (Medium)”.

9. Fix G drive at E0h and adjust B drive and R drive so the highlight window’s x, y becomes the “Color temperature Medium” in the below table.

10. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

11. Set color temperature to “WARM(Low)”.

12. Set G drive to E0h and adjust B drive and R drive so the highlight window’s x, y become the “Color temperature Low” shown in the below table.

13. Increase R/G/B together so the maximum drive value in R/G/B becomes FCh.

14. Copy the R drive, G drive and B drive data in NTSC, PAL DVI region.

PC input Panel surface

User setting: Normal (Picture menu: Standard)

Picture Menu: Standard Picture: 25 Aspect: Full Position and size: Normal

· Highlight section Signal amplitude 75%

· Cutoff standard G: 80h

· Drive standard G: E0h

Adjustment target Hi-light: x ± 0.003 y ± 0.003 Hi-light is target of the number at drive adjustment in the hi-light windows. Therefore, it is not target of the hi-light number at after adjustment white balance.

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