1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices suchas insulation barriers, insulation papersshields are properly installed.
3.After servicing, make the following leakage current checksto prevent the customer from being exposed to shock hazards.
4.Whenconducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
5.When wiring units (with cables, flexible cables or lead wires) are supplied as repair partsandonly one wire or some of thewires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
6.When conducting repairs and servicing,do not twist the Fasten connectors but plug them straight in or unplug them straight out.
1.1.1.Leakage Current Cold Check
1.Unplugthe AC cordandconnect a jumper between the two prongs on the plug.
2.Measure the resistance value, with an ohmmeter,between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposedmetallic part has a return path to the chassis, the reading should be 100 Mohm and over.Whenthe exposed metal does not have a return path to the chassis,the reading must be .
1.1.2.Leakage Current Hot Check (SeeFigure 1.)
1.Plug the AC cord directly into theAC outlet. Do not use an isolation transformer for this check.
2.Connect a 1.5kohm, 10watts resistor, in parallel with a
0.15μF capacitors, between each exposed metallicpart onthe set and agood earth ground such as a water pipe, as shown in Figure 1.
3.Use an AC voltmeter,with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4.Checkeach exposed metallic part, and measure the voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6.The potential at any point should not exceed0.75 volts RMS.A leakage current tester (Simpson Model 229 orequivalent) may be used to make the hot checks, leakagecurrent must not exceed 1/2 milliamp. In case a measurement is outside of the limitsspecified, there is apossibility of a shock hazard, and the equipment should berepaired and rechecked before it is returnedto the customer.
Figure 1
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2Warning
2.1.Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity.Suchcomponents commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devicesare integrated circuits and some field-effect transistors andsemiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on yourbody by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,which should be removed for potential shock reasons prior toapplying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostaticcharge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Mostreplacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power isapplied to thechassisor circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham lessmotion such as the brushing together of your clothes fabric or the lifting ofyour foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).
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2.2.About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in itsuggest the use of Pb free solder as well, althoughPb solder maybe used.
PCBs manufactured using lead free solder will have the PbF within a leaf SymbolPbF stamped onthe back of PCB.
Caution
•Pb free solder has a higher melting point thanstandard solder. Typically the meltingpoint is 50 ~ 70 °F (30~40 °C) higher. Pleaseuse a high temperature soldering iron and set it to 700 ± 20 °F (370± 10 °C).
•Pb free solder will tendto splashwhen heated toohigh (about 1100°F or 600 °C).If you must use Pb solder, please completely remove all of thePb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
•After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (seefigure below)
Suggested Pb free solder
There are several kinds of Pb freesolder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However,Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
's manufacture due toenvironmental conservation issues. For service and repair work, we'd
Panel SystemLCD panel (LED backlight)Screen size58 inch class (57.5 inches measured diagonally)W × H × Diagonal50.0 inch × 28.4 inch× 57.5 inch (1,270 mm× 721 mm× 1,461 mm)
Number of pixels1,920 × 1,080Speaker Output20 W [10 W + 10 W] ( 10 % THD )Channel Capability (Digital/Analog)VHF/ UHF: 2 - 69, CATV: 1 - 135Operating ConditionsTemperature:32 °F - 95°F (0°C - 35°C)
Humidity:20 % - 80 % RH (non-condensing)
Connection Terminals
VIDEO INRCA PIN (VIDEO, AUDIO-L, AUDIO-R)
COMPONENT INRCA PIN (Y, PB, PR, AUDIO-L, AUDIO-R)
HDMI IN 1/2/3 TYPE A Connector (supports [HDAVI Control 5] function)
USB 1/2USB 2.0 Type A connectorDC 5V, Max. 500mA
DIGITAL AUDIO OUTPCM / Dolby Digital, Fiber Optic
OTHERSETHERNET (10BASE-T/100BASE-TX)Dimensions (W× H × D)
Including pedestal 51.1 inch × 32.2 inch× 13.2 inch (1,296 mm× 818 mm× 333 mm)
TV Set only51.1 inch × 30.0 inch× 2.0 inch (1,296 mm × 762 mm× 49 mm)Mass
Including pedestal66.2 lb. (30.0 kg) NET
TV Set only56.3 lb. (25.5 kg) NET
Q Wireless LAN
Standard Compliance and
Frequency Range*
SecurityWPA2-PSK (TKIP/AES)
1
*
The frequency and channel differ depending on the country.
2
802.11b/g/n CH1 ~ CH11 only use for United States and Canada.
*
1,*2
IEEE 802.11a/n:
5.15 GHz - 5.35 GHz, 5.47 GHz - 5.85 GHz
IEEE 802.11b/g/n:
2.400 GHz - 2.4835 GHz
WAP-PSK (TKIP/AES)WEP (64bit/128bit)
Note
Design and Specificationsare subject to change without notice. Mass and Dimensions shown are approximate.
7
5Technical Descriptions
5.1.Specification of KEY for DTCP-IP, WMDRM and Widevine
5.1.1. General information:
1.NAND Flash (IC8900) for spare parts has the seed of KEY for each DTCP-IP for DLNA, WMDRM for Netflix and Widevine for CinemaNow.
2.The final KEY data will be generated by Main IC (IC8000) when SELF CHECK wasdoneandare storedin both Main IC (IC8000) and NAND Flash (IC8900).
5.1.2.Replacement of ICs:
When Main IC is replaced, NAND Flash should be also replaced with new one the same time.WhenNAND Flash is replaced, Main IC is not necessary to be replaced the same time.After the replacement of IC, SELF CHECK should be done to generate the final KEY data.How to SELF CHECK: While pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote control for more than3 seconds.TV will be forced to the factory shipment setting after this SELF CHECK.
8
6Service Mode
6.1.How to enter into Service Mode
6.1.1.Purpose
After exchange parts, check and adjust the contents of adjustment mode.
While pressing [VOLUME ( - )] button of the main unit, press [INFO] button of the remote control three times within 2 seconds.
6.1.2.Key command
[1] button...Main items Selection in forward direction [2] button...Main items Selection in reverse direction [3] button...Sub items Selection in forward direction [4] button...Sub items Selection in reverse direction [VOL] button...Value of sub items change in forward direction ( + ), in reverse direction ( - )
6.1.3.How toexit
Switch off the power with the [POWER] button on the main unit or the [POWER] button onthe remote control.
6.1.4.Contents of adjustment mode
•Value is shown as a hexadecimal number.
•Preset value differs depending on models.
•After entering the adjustment mode, take note of the value in each item before starting adjustment.
SOS History (Number of LED blinking) indication.From left side; Last SOS, before Last, three occurrence before, 2nd occurrenceafter shipment, 1st occurrence after shipment.This indication except 2nd and 1st occurrence after shipment will be cleared by [Self-check indication and forced to factory shipment setting].
6.2.3.POWER ON TIME/COUNT
Note : To display TIME/COUNT menu, highlight position, then press MUTE for 3sec.Time : Cumulative power on time, indicated hour : minute by decimalCount : Number of ON times bydecimalNote : Thisindication will not beclearedby eitherof the self-checks or any other command.
6.2.4.Exit
Disconnect the AC cord from wall outlet orpress the [POWER] button on the main unit for 3seconds to turn off and thenturn onautomatically.
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6.3.Hotel mode
1. Purpose
Restrict a function for hotels.
2. Access command to the Hotel mode setup menu
Inorder to display the Hotel mode setup menu:While pressing [VOLUME (-)] button of the main unit, press [INPUT] button of the remotecontrol three timeswithin 2 seconds.
Then, the Hotel mode setup menu is displayed.
3.To exit the Hotel modesetup menuSwitch off the power withthe [POWER] button on the main unit or the[POWER] button on the remote control.
4.Explain the Hotel mode setup menu
ItemFunction
ModeSelect hotel mode On/Off
InputSelectinput signal modes.
Set the input, when each time power is switched on.Selection:
-,RF,HDMI1,HDMI2,HDMI3,AV
•Off: give priority to a last memory.
ChannelSelect channelwhen input signal is RF.
Set the channel, each time power is switchedon.Selection:Any channel number or [-].[-] means the channel when turns off.
VolumeAdjust the volume when each time power is
switched on.Range: 0 to 100
Vol. MaxAdjust maximum volume.
Range: 0 to 100
OSD CtrlRestrict the OSD.
Selection:Off/Pattern1
•Off: No restriction
•Pattern1: restriction
FP CtrlSelectfront keyconditions.
Selection: Off/Pattern1/All
•Off: altogethervalid.
•Pattern1: only input key is valid.
•All: altogetherinvalid.
Pow CtrlSelect POWER-On/Off condition when AC
power cord is disconnected and thenconnected. Off: The same condition when AC power cord is disconnected. On: Forced power ON condition.
11
6.4.Data Copy by USB Memory
Note:
SD card can not be used for Data Copy.
6.4.1.Purpose
(a) Board replacement (Copy the datawhen exchanging A-board):
Whenexchanging A-board, the data in original A-board can be copied to USB Memory and then copy to new A-board.
(b) Hotel (Copy the datawhen installing a number of unitsin hotel or any facility):
When installing a number of units in hotelor any facility, the data in master TV can be copied to USB Memory and then copy to other TVs.
6.4.2.Preparation
Make pwd file as startup file for (a) or (b) in a empty USB Memory.
1.Insert a empty USB Memory to your PC.
2.Right-click a blank area in a USB Memory window, point to New, and then click text document. Anew file is created by default(New TextDocument.txt).
3.Right-click the new text document that you just created and select rename, and then changethe name and extension of thefile to the following file name for (a) or (b) and press ENTER.
File name:
(a) For Board replacement : boardreplace.pwd(b) For Hotel : hotel.pwd
Note:
Please makeonly one file to prevent the operation error.
No any other file should not be in USB Memory.
12
6.4.3.Data copy from TV set to USB Memory
1. Turn on the TV set.
2. Insert USB Memory with a startup file (pwd file) to USB terminal.
On-screen Display will be appeared according to the startup file automatically.
3. Input a following password for (a) or (b) by using remote control.
(a) For Board replacement : 2770
(b) For Hotel:4850Data will be copied from TV set to USB Memory.It takes around 2 to 6 minutes maximum for copying.
4.After the completion of copying to USB Memory, remove USB Memory from TV set.
5.Turn off the TV set.
Note:
Following new folder will be created in USB Memory for data from TV set.
(a) For Boardreplacement : user_setup(b) For Hotel : hotel
13
6.4.4.Data copy from USB Memory to TV set
1. Turn on the TV set.
2. Insert USB Memory with Data to USB terminal.
On-screen Display will be appeared according to the Data folder automatically.
3. Input a following password for (a) or (b) by using remote control.
(a) For Board replacement : 2771(b) For Hotel : 4851
Data will be copied from USB Memoryto TV set.
4.After thecompletion of copying toUSB Memory, remove USB Memory from TV set.
(a) For Board replacement : Data will bedeleted after copying (Limited one copy).(b) For Hotel : Data will not be deleted and can be used for other TVs.
5.Turn off theTV set.
Note:
1.Depending onthe failure of boards, function of Data copy for board replacement does not work.
2.This function can be effective among the same model numbers.
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7Troubleshooting Guide
Use the self-check function to test the unit.
1. Checking the IIC bus lines
2. Power LED Blinking timing
7.1.Check of the IIC bus lines
7.1.1.How toaccess
7.1.1.1.Self-check indication only:
Produce TV reception screen, and while pressing [VOLUME ( - )] button onthe main unit, press [OK] button on theremote control
for more than 3 seconds.
7.1.1.2.Self-check indication and forced to factory shipment setting:
Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote
control for more than3 seconds.
7.1.2.Exit
Disconnect the AC cordfrom wall outlet or pressthe [POWER] button on themain unit for 3 seconds to turn off and then turn on
1. Subject
Information of LED Flashing timing chart.
2. Contents
When an abnormality has occurred theunit, the protection circuit operates and reset to the stand by mode. At this time, thedefective block can be identified bythe number ofblinks of the Power LED on the front panel of the unit.
Blinking TimesContentsCheck point
1BACK LIGHT SOSLCD PANEL
7SUB 3.3VSENSE SOSA-Board9SOUND SOSA-Board
13EMERGENCY SOSA-Board
P-Board
Speaker
7.3.LCD Panel test mode
Purpose:
To find thepossible failure point where inLCD Panel or Printed Circuit Board when the abnormal picture is displayed.
How toEnter:
While pressing [VOLUME ( - )] button of the main unit, press [OPTION] button of the remote control three times within 2 seconds.
How toExit:
Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.
How to confirm:
If the abnormal picture is displayed, go into LCD Panel test mode to display the several test patterns.And then, judge bythe following method.Still abnormal picture is displayed: The cause must be in LCD Panel.Normal picture is displayed: The cause must be in A board.
Remarks:
The test pattern is created by the circuit in LCD Panel.In LCD Panel test mode, this test pattern is displayed unaffected by signal processing for RF or input signal.If the normal pictureis displayed, LCD Panel must be okayand the cause of failure must be in A board.
16
8Disassembly and Assembly Instructions
8.1.Disassembly Flow Chart for the Unit
This is a disassembly chart.
When assembling, perform this chart conversely.
17
8.2.Disassembly Procedure for the Unit
8.2.1.Pedestal
1. Lay down the unit so that the rear cover faces upward.
2. Remove the 4 screws.
3.Remove the pedestal.
8.2.2.WiFi Dongle
1.Remove the 1 screw.
2.Remove the WiFi Dongle.
8.2.3.Back Cover
1. Remove the 20 screws (A).
2. Remove the 7 screws (B).
3.Remove the 4 screws (C).
4.Remove the 3 screws (D).
5.Remove the Back Cover.
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8.2.4.P-Board
1. Remove the 4 screws.
2. Disconnect the connectors (P2 and P4).
3. Remove the P-Board.
4. Remove the CH Mount Boss and Ground Spring.
5. Disconnect the connectors (A02, A10, A12 ,A15, A16 and
A20).
6. Remove the A-Board.
8.2.6.K-Board
1.Disconnect the connector (K10).
2.Remove the 1 lockingtab.
3.Remove the K-Board.
8.2.5.A-Board
1.Remove the 3 screws.
2.Remove the 2 locking tabs.
3.Removethe Side AV bracket.
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8.2.7.GK-Board
1. Disconnect the connector (GK4).
2. Remove the 1 screw.
8.2.8.Speaker Unit L/R
1. Remove the 2 Speaker Unit L/R.
8.2.9.Rear Panel BTM Assy
1.Remove the 7 screws.
2.Remove the Rear Panel BTM Assy.
8.2.10.Rear Panel Top L/R Assy
1.Remove the 2 screws.
2.Remove the Rear Panel L/R Assy.
3.Remove the Rear Panel Top Assy.
3.Remove the 5 locking tabs.
4.Remove the GK-Board and the Key Button Bracket.
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8.2.11.WiFi Cable
1. Remove the 1 screw.
2. Remove the WiFi Cable.
8.2.12.Rear Panel Metal Bot L/R
1.Remove the 8 screws.
2.Remove the Rear Panel Metal Bot L/R.
8.2.13.Rear Panel Metal Top/L/R
1. Remove the 3 screws.
2. Remove the Rear Panel Metal Top/L/R.
8.2.14.Bottom Metal and LCD Panel
1.Remove the 4 screws.
2.Remove the Bottom Metal and LCD Panel.
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8.2.15.Felt, Sponge, and so on
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