Panasonic TC-L50E60 Schematic

ORDER NO.MTNC130212CE

Ver.1

B32 Canada: B61

50 inch Class 1080p LCD HDTV

Model No. TC-L50E60

LA41 Chassis

TABLE OF CONTENTS

PAG E PAGE

1 Safety Precautions -----------------------------------------------3

1.1. General Guidelines ----------------------------------------3

2 Warning --------------------------------------------------------------4

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices ----------4

2.2. About lead free solder (PbF) ----------------------------5

3 Service Navigation------------------------------------------------6

3.1. PCB Layout --------------------------------------------------6

4 Specifications ------------------------------------------------------7 5 Technical Descriptions------------------------------------------8

5.1. Specification of KEY for DTCP-IP, WMDRM and Widevine------------------------------------------------8

6 Service Mode -------------------------------------------------------9

6.1. How to enter into Service Mode ------------------------9

6.2. SRV-TOOL------------------------------------------------- 10

6.3. Hotel mode------------------------------------------------- 11

6.4. Data Copy by USB Memory --------------------------- 12

7 Troubleshooting Guide---------------------------------------- 15

7.1. Check of the IIC bus lines ------------------------------ 15

7.2. Power LED Blinking timing chart --------------------- 16

7.3. LCD Panel test mode ----------------------------------- 16

8 Disassembly and Assembly Instructions --------------- 17

8.1. Disassembly Flow Chart for the Unit ---------------- 17

8.2. Disassembly Procedure for the Unit----------------- 18

9 Measurements and Adjustments -------------------------- 26

9.1. Voltage chart of P-board-------------------------------- 26

9.2. Voltage chart of A-board------------------------------- 26

10 Block Diagram --------------------------------------------------- 27

10.1. Main Block Diagram ------------------------------------- 27

10.2. Block (1/2) Diagram ------------------------------------- 28

10.3. Block (2/2) Diagram ------------------------------------- 29

11 Wiring Connection Diagram--------------------------------- 31

11.1. Caution statement.--------------------------------------- 31

11.2. Dressing Wire --------------------------------------------- 31

1 Safety Precautions

1.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

4. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.

5. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

6. When conducting repairs and servicing, do not twist the Fasten connectors but plug them straight in or unplug them straight out.

1.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be 100 Mohm and over. When the exposed metal does not have a return path to the chassis, the reading must be .

1.1.2. Leakage Current Hot Check (See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kohm, 10 watts resistor, in parallel with a

0.15μF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

Figure 1

2 Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

's manufacture due to environmental conservation issues. For service and repair work, we'd

3 Service Navigation

3.1. PCB Layout

Board Name Function A-Board Main K-Board IR/LED/AI P-Board Power GK-Board SW

4 Specifications

Power Source AC 110-127 V, 60 Hz Power Consumption

Rated Power 96 W Standby Power 0.2 W

Display Panel

Panel System LCD panel (LED backlight) Screen size 50 inch class (49.5 inches measured diagonally) W × H × Diagonal 43.1 inch × 24.2 inch × 49.5 inch (1,096 mm × 616 mm × 1,257 mm)

Number of pixels 1,920 × 1,080 Speaker Output 20 W [10 W + 10 W] ( 10 % THD ) Channel Capability (Digital/Analog) VHF/ UHF: 2 - 69, CATV: 1 - 135 Operating Conditions Temperature: 32 °F - 95 °F (0 °C - 35°C)

Humidity: 20 % - 80 % RH (non-condensing)

Connection Terminals

VIDEO IN RCA PIN (VIDEO, AUDIO-L, AUDIO-R)

COMPONENT IN RCA PIN (Y, PB, PR, AUDIO-L, AUDIO-R)

HDMI IN 1/2/3 TYPE A Connector (supports [HDAVI Control 5] function)

USB 1/2 USB 2.0 Type A connector DC 5V, Max. 500mA

DIGITAL AUDIO OUT PCM / Dolby Digital, Fiber Optic

OTHERS ETHERNET (10BASE-T/100BASE-TX) Dimensions (W × H × D)

Including pedestal 44.2 inch × 28.0 inch × 10.9 inch (1,121 mm × 710 mm × 275 mm)

TV Set only 44.2 inch × 25.8 inch × 2.0 inch (1,121 mm × 655 mm × 49 mm) Mass

Including pedestal 45.2 lb. (20.5 kg) NET

TV Set only 38.6 lb. (17.5 kg) NET

Q Wireless LAN

Standard Compliance and

Frequency Range*

Security WPA2-PSK (TKIP/AES)

The frequency and channel differ depending on the country.

802.11b/g/n CH1 ~ CH11 only use for United States and Canada.

1,*2

IEEE 802.11a/n:

5.15 GHz - 5.35 GHz, 5.47 GHz - 5.85 GHz

IEEE 802.11b/g/n:

2.400 GHz - 2.4835 GHz

WAP-PSK (TKIP/AES) WEP (64bit/128bit)

Note

Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.

5 Technical Descriptions

5.1. Specification of KEY for DTCP-IP, WMDRM and Widevine

5.1.1. General information:

1. NAND Flash (IC8900) for spare parts has the seed of KEY for each DTCP-IP for DLNA, WMDRM for Netflix and Widevine for CinemaNow.

2. The final KEY data will be generated by Main IC (IC8000) when SELF CHECK was done and are stored in both Main IC (IC8000) and NAND Flash (IC8900).

5.1.2. Replacement of ICs:

When Main IC is replaced, NAND Flash should be also replaced with new one the same time. When NAND Flash is replaced, Main IC is not necessary to be replaced the same time. After the replacement of IC, SELF CHECK should be done to generate the final KEY data. How to SELF CHECK: While pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote control for more than 3 seconds. TV will be forced to the factory shipment setting after this SELF CHECK.

6 Service Mode

6.1. How to enter into Service Mode

6.1.1. Purpose

After exchange parts, check and adjust the contents of adjustment mode.

While pressing [VOLUME ( - )] button of the main unit, press [INFO] button of the remote control three times within 2 seconds.

6.1.2. Key command

[1] button...Main items Selection in forward direction [2] button...Main items Selection in reverse direction [3] button...Sub items Selection in forward direction [4] button...Sub items Selection in reverse direction [VOL] button...Value of sub items change in forward direction ( + ), in reverse direction ( - )

6.1.3. How to exit

Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.

6.1.4. Contents of adjustment mode

• Value is shown as a hexadecimal number.

• Preset value differs depending on models.

• After entering the adjustment mode, take note of the value in each item before starting adjustment.

Main item Sub item Sample Data Remark

ADJUST CONTRAST 000

COLOR 3A TINT 00 SUB-BRT 800 BACKLGT FFF B-Y-G 40 R-Y-A 00 V COM 000

WB-ADJ R-GAIN 80

G-GAIN 6F B-GAIN 79 R-CENT 80 G-CENT 80 B-CENT 80

OPTION Boot ROM Factory Preset.

STBY-SET 00 EMERGENCY ON CLK MODE 01 CLOCK FFF EDID-CLK HIGH

SRV-TOOL 00 See next.

6.2. SRV-TOOL

6.2.1. How to access

1. Select [SRV-TOOL] in Service Mode.

2. Press [OK] button on the remote control.

6.2.2. Display of SOS History

SOS History (Number of LED blinking) indication. From left side; Last SOS, before Last, three occurrence before, 2nd occurrence after shipment, 1st occurrence after shipment. This indication except 2nd and 1st occurrence after shipment will be cleared by [Self-check indication and forced to factory shipment setting].

6.2.3. POWER ON TIME/COUNT

Note : To display TIME/COUNT menu, highlight position, then press MUTE for 3 sec. Time : Cumulative power on time, indicated hour : minute by decimal Count : Number of ON times by decimal Note : This indication will not be cleared by either of the self-checks or any other command.

6.2.4. Exit

Disconnect the AC cord from wall outlet or press the [POWER] button on the main unit for 3 seconds to turn off and then turn on automatically.

6.3. Hotel mode

1. Purpose Restrict a function for hotels.

2. Access command to the Hotel mode setup menu In order to display the Hotel mode setup menu: While pressing [VOLUME (-)] button of the main unit, press [INPUT] button of the remote control three times within 2 seconds.

Then, the Hotel mode setup menu is displayed.

3. To exit the Hotel mode setup menu Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.

4. Explain the Hotel mode setup menu

Item Function Mode Select hotel mode On/Off Input Select input signal modes.

Set the input, when each time power is switched on. Selection:

-,RF,HDMI1,HDMI2,HDMI3,AV

• Off: give priority to a last memory.

Channel Select channel when input signal is RF.

Set the channel, each time power is switched on. Selection: Any channel number or [-]. [-] means the channel when turns off.

Volume Adjust the volume when each time power is

switched on. Range: 0 to 100

Vol. Max Adjust maximum volume.

Range: 0 to 100

OSD Ctrl Restrict the OSD.

Selection: Off/Pattern1

• Off: No restriction

• Pattern1: restriction

FP Ctrl Select front key conditions.

Selection: Off/Pattern1/All

• Off: altogether valid.

• Pattern1: only input key is valid.

• All: altogether invalid.

Pow Ctrl Select POWER-On/Off condition when AC

power cord is disconnected and then connected. Off: The same condition when AC power cord is disconnected. On: Forced power ON condition.

6.4. Data Copy by USB Memory

Note:

SD card can not be used for Data Copy.

6.4.1. Purpose

(a) Board replacement (Copy the data when exchanging A-board):

When exchanging A-board, the data in original A-board can be copied to USB Memory and then copy to new A-board.

(b) Hotel (Copy the data when installing a number of units in hotel or any facility):

When installing a number of units in hotel or any facility, the data in master TV can be copied to USB Memory and then copy to other TVs.

6.4.2. Preparation

Make pwd file as startup file for (a) or (b) in a empty USB Memory.

1. Insert a empty USB Memory to your PC.

2. Right-click a blank area in a USB Memory window, point to New, and then click text document. A new file is created by default (New Text Document.txt).

3. Right-click the new text document that you just created and select rename, and then change the name and extension of the file to the following file name for (a) or (b) and press ENTER.

File name:

(a) For Board replacement : boardreplace.pwd (b) For Hotel : hotel.pwd

Note:

Please make only one file to prevent the operation error.

No any other file should not be in USB Memory.

6.4.3. Data copy from TV set to USB Memory

1. Turn on the TV set.

2. Insert USB Memory with a startup file (pwd file) to USB terminal. On-screen Display will be appeared according to the startup file automatically.

3. Input a following password for (a) or (b) by using remote control.

(a) For Board replacement : 2770

(b) For Hotel : 4850 Data will be copied from TV set to USB Memory. It takes around 2 to 6 minutes maximum for copying.

4. After the completion of copying to USB Memory, remove USB Memory from TV set.

5. Turn off the TV set.

Note:

Following new folder will be created in USB Memory for data from TV set.

(a) For Board replacement : user_setup (b) For Hotel : hotel

6.4.4. Data copy from USB Memory to TV set

1. Turn on the TV set.

2. Insert USB Memory with Data to USB terminal. On-screen Display will be appeared according to the Data folder automatically.

3. Input a following password for (a) or (b) by using remote control.

(a) For Board replacement : 2771 (b) For Hotel : 4851

Data will be copied from USB Memory to TV set.

4. After the completion of copying to USB Memory, remove USB Memory from TV set.

(a) For Board replacement : Data will be deleted after copying (Limited one copy). (b) For Hotel : Data will not be deleted and can be used for other TVs.

5. Turn off the TV set.

Note:

1. Depending on the failure of boards, function of Data copy for board replacement does not work.

2. This function can be effective among the same model numbers.

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