Panasonic TC-32LX700 Service manual

32” DIAGONAL LCD TV
A
V
A
A
A
A
LH65 Chassis
Specifications
PowerSource PowerConsumption
Average use 138 W Maximum Current 1.5 A Standby condition 0.1W Aspect Ratio 16 : 9
isible screen size (W × H × Diagonal) (No. of pixels)
Sound
Speake Audio Output 20 W [ (7.5 W + 2.5 W) × 2] ( 10 % THD ) Headphones M3 (3.5mm) Jack × 1
Channel Capability - VHF/UHF: 2 - 69, CATV: 1 - 135 ATSC/NTSC(Digital/Analog) Operating Conditions Temperature: 32 °F - 95 °F (0 °C - 35 °C)
Connection Terminals
INPUT 1-2 VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
INPUT 3 VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
COMPONENTVIDEO INPUT
HDMI 1-2 AUDIO IN TYPE A Connector×2
C 110-127 V, 60 Hz
31.5” DIAGONAL (80.0 cm DIAGONAL)
27.5” × 15.4” × 31.5” (698 mm × 392 mm × 800 mm) 1,049,088 (1,366 (W) × 768(H)) [4,098 × 768 dots]
2way4 speakers
Humidity: 20 % - 80 % RH (non-condensing)
S-VIDEO: Mini DIN 4-pin Y: 1.0 V [p-p] (75 ohm) C: 0.286 V [p-p] (75 ohm)
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
UDIO L-R: RCA PIN Type × 2 0.5 V [rms] Y: 1.0 V [p-p] (including synchronization) PB,PR: ± 0.35 V [p-p]
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
ORDER NO.MTNC070101CE
B05 Canada: B07
© 2007 Matsushita Electric Industrial Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
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TC-32LX700
Card slot SD CARD slot × 1 OUTPUT VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
DIGITAL AUDIO OUT PCM/DolbyDigital, FiberOptic
FEATURES 3D Y/C Digital Comb Filter, CLOSED CAPTION, V-Chip
HDMI (HDAVI Control 2) Vesa compatible Photo Viewer
Dimensions (W × H × D)
Including TV stand 32.9 ” × 23.3 ” × 9.8 ” (836 mm × 592 mm × 248 mm) TV Set only 32.9 ” × 21.3 ” × 4.2 ” (836 mm × 540 mm × 106.8 mm)
Weight 40.0 lb. (18.0kg) NET
Note:
Design and Specifications are subject change without notice. Weight and Dimensions shown are approximate.
CONTENTS
Page Page
1 Applicable signals 4 2 Safety Precautions
2.1. General Guidelines
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 4 About lead free solder (PbF) 5 Chassis Board Layout 6 Disassembly for Servise
6.1. Pedestal assy
6.2. Rear cover
6.3. VESA metal
6.4. AC cord
6.5. Tuner cover
6.6. Power button bracket
6.7. Control panel assy
6.8. G-Board and GS-Board
6.9. Side AV bracket
6.10. AP-Board
6.11. P-Board
6.12. DT-Board
6.13. A-Board and DT-Board metal
6.14. Chassis
6.15. LCD MTG (bottom)
6.16. Speaker assy
6.17. Squawker speaker
6.18. V-Board
6.19. LCD panel
7 Caution statement
7.1. Caution statement.
8 Location of Lead Wiring
8.1. Lead of Wiring (1)
8.2. Lead of Wiring (2)
9 EMI Processing
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5
6 7 8 9
9 9 9
9 10 10 10 10 11 11 11 11 12 12 12 13 13 13 14
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16
16 17
9.1. EMI (1)
9.2. EMI (2)
10 Self-c heck Function
10.1. Check of the IIC bus lines
10.2. Power LED Blinking timing chart
10.3. No Power
11 Service Mode
11.1. How to enter into Service Mode
11.2. SRV-TOOL
12 Adjustment
12.1. Voltage chart of AP-board
12.2. Voltage chart of P-board
12.3. Voltage chart of A-board
12.4. Picture level adjyustment (RF)
13 Hotel mode 14 Conductor Views
14.1. P-Board
14.2. AP-Board
14.3. A-Board
14.4. DT-Board
14.5. G, GS and V-Board
15 Sche matic and Block Diagr am
15.1. Schematic Diagram Notes
15.2. Block Diagram (1 of 2)
15.3. Block Diagram (2 of 2)
15.4. Interconnection Schematic Diagram
15.5. G, GS, P and V-Board Schematic Diagram
15.6. AP-Board (1 of 2) Schematic Diagram
15.7. AP-Board (2 of 2) Schematic Diagram
15.8. A-Board (1 of 13) Schematic Diagram
15.9. A-Board (2 of 13) Schematic Diagram
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18 19
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20 21 22
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23 24
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25 25 25 25
26 27
27 28 30 33 34
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35 36 37 38 39 40 41 42 43
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15.10. A-Board (3 of 13) Schematic Diagram 44
15.11. A-Board (4 of 13) Schematic Diagram
15.12. A-Board (5 of 13) Schematic Diagram
15.13. A-Board (6 of 13) Schematic Diagram
15.14. A-Board (7 of 13) Schematic Diagram
15.15. A-Board (8 of 13) Schematic Diagram
15.16. A-Board (9 of 13) Schematic Diagram
15.17. A-Board (10 of 13) Schematic Diagram
15.18. A-Board (11 of 13) Schematic Diagram
45 46 47 48 49 50 51 52
15.19. A-Board (12 of 13) Schematic Diagram
15.20. A-Board (13 of 13) Schematic Diagram
15.21. DT-Board Schematic Diagram
16 Explo ded View and Replacement Parts List
16.1. Exploded View
16.2. Replacement Parts List Notes
16.3. Mechanical Replacement Parts List
16.4. Electrical Replacement Parts List
TC-32LX700
53 54 55
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57 58 59 60
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TC-32LX700
1 Applicable signals
* Mark: Applicable input signal for Component (Y, PB,PR) and HDMI
horizontal frequency (kHz) vertical frequency (kHz) COMPONENT HDMI 525 (480) / 60i 15.73 59.94 * * 525 (480) /60p 31.47 59.94 * * 750 (720) /60p 45.00 59.94 * * 1,125 (1,080) /60i 33.75 59.94 * * 1,125 (1,080)/60p 67.43 59.94 * 1,125 (1,080)/60p 67.50 60.00 *
Note:
·
· Signals other than those shown above may not be displayed properly.
· ·
·
· The above signals are reformatted for optimal viewing on your display.
· ·
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TC-32LX700
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between
7.3 Mohm and 9.0 Mohm.
When the exposed metal does not have a return path to
the chassis, the reading must be
Figure 1
.
2.1.2. Leakage Current Hot Check (See Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kohm, 10 watts resistor, in parallel with a
0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the ACplugintheACoutlet and repeat eachof the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.
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TC-32LX700
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such asthe brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).
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TC-32LX700
4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
· ·
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
· ·
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
· ·
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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TC-32LX700
5 Chassis Board Layout
8
6 Disassembly for Service
TC-32LX700
6.1. Pedestal assy
1. Lay down the unit so that the rear cover faces upward.
2. Remove the 4 screws.
3. Remove the pedestal assy.
6.3. VESA metal
1. Remove the 4 screws.
2. Remove the VESA metal.
6.4. AC cord
1. Take out the groove of the AC cord from the slot of the tuner cover.
2. Disconnect the connecter (P1) of AC cord.
6.2. Rear cover
1. Remove the 18 screws.
2. Remove the rear cover.
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TC-32LX700
6.5. Tuner cover
6.7. Control panel assy
1. Remove the 2 screws.
2. Remove the tuner cover.
6.6. Power button bracket
1. Remove the 2 screws.
2. Remove the power button bracket.
1. Disconnect the connecter (AP6).
2. Remove the 2 screws.
3. Remove the control panel assy.
6.8. G-Board and GS-Board
1. Remove the screw.
2. Disconnect the connecter (GS8)
3. Remove the GS-Board
4. Remove the 2 screws.
5. Disconnect the connecter (G4).
6. Remove the G-Board.
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6.9. Side AV bracket
TC-32LX700
6.11. P-Board
1. Remove the 2 screws (A).
2. Remove the screw (B).
3. Remove the side AV bracket.
6.10. AP-Board
1. Remove the 3 screws.
2. Disconnect the connecters (A3/A4/CN3).
3. Remove the AP-Board.
1. Remove the 6 screws.
2. Disconnect the connecters (P3/P5/P6).
3. Remove the P-Board.
6.12. DT-Board
1. Remove the 4 screws.
2. Remove the DT-Board.
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TC-32LX700
6.13. A-Board and DT-Board metal
6.15. LCD MTG (bottom)
1. Remove the 10 screws.
2. Disconnect the connecter (A2/A5/A6/A9).
3. Remove the 2 screws.
4. Remove the A-Board and DT-Board metal.
6.14. Chassis
1. Remove the 4 screws (F).
2. Remove the 6 screws (G)
3. Remove the LCD MTG (bottom).
1. Remove the 2 screws (C).
2. Remove the 2 screws (D).
3. Remove the 2 screws (E).
4. Remove the chassis.
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6.16. Speaker assy
TC-32LX700
6.17. Squawker speaker
1. Remove the 4 screws.
2. Remove the speaker assy.
1. Remove the 4 screws.
2. Remove the squawker speaker.
6.18. V-Board
1. Remove the 2 screws.
2. Remove the V-Board.
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TC-32LX700
6.19. LCD panel
1. Remove the 2 screws.
2. Remove the LCD L/R MTG (A).
3. Remove the 2 screws.
4. Remove the LCD L/R MTG (B).
5. Remove the LCD panel.
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7 Caution statement
7.1. Caution statement.
Caution:
Please confirm that all flexible cables are assembled correctly. Also make sure that they are locked in the connectors. Verify by giving the flexible cables a very slight pull.
TC-32LX700
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TC-32LX700
8 Location of Lead Wiring
8.1. Lead of Wiring (1)
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8.2. Lead of Wiring (2)
TC-32LX700
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TC-32LX700
9 EMI Processing
9.1. EMI (1)
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9.2. EMI (2)
TC-32LX700
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TC-32LX700
10 Self-check Function
Use the self-check function to test the unit.
1. Checking the IIC bus lines
2. Power LED Blinking timing
10.1. Check of the IIC bus lines
10.1.1. How to access
Self-check indication only: Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [OK] button on the remote control
for more than 3 seconds. Self-check indication and forced to factory shipment setting: Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote
control for more than 3 seconds.
10.1.2. Exit
Disconnect the AC cord from wall outlet.
10.1.3. Screen display
10.1.4. Check Point
Confirm the following parts if NG was displayed.
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10.2. Power LED Blinking timing chart
1. Subject Information of LED Flashing timing chart.
2. Contents When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.
TC-32LX700
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TC-32LX700
10.3. No Power
First check point
There are following 2 states of No Power indication by power LED.
1. No lit
2. Red is lit then turns red blinking a few seconds later. (See 10.2.)
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