Panasonic SCHTB-500-PP, SUHTB-500-PP Service manual

PSG1006004CE

Home Theater Audio System

Model No. SU-HTB500PP

SC-HTB500PP

Product Color: (K)...Black Type

Note: Please refer to the original service manual for:

O Wireless Subwoofer Unit SB-WA500PP-K, Order No. PSG1006031CE

TABLE OF CONTENTS

PAG E PAG E

1 Safety Precautions ----------------------------------------------- 3

1.1. General Guidelines---------------------------------------- 3

1.2. Before Repair and Adjustment ------------------------- 4

1.3. Caution For Fuse Replacement------------------------ 4

1.4. Protection Circuitry ----------------------------------------4

1.5. Safety Part Information -----------------------------------5

1.6. Safety Installation Instructions -------------------------6

2Warning--------------------------------------------------------------7

2.1. Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices ----------7

2.2. Service caution based on Legal restrictions---------8

3 Service Navigation------------------------------------------------9

3.1. Service Information ----------------------------------------9

4 Specifications ---------------------------------------------------- 10 5 Location of Controls and Components------------------ 11

5.1. Main Unit Key Button Operations -------------------- 11

5.2. Remote Control Key Buttons Operation ------------ 12

5.3. Audio Information ---------------------------------------- 12

6 Self diagnostic and special mode setting -------------- 13

6.1. Automatically Displayed Error Codes --------------- 13

6.2. Service Mode---------------------------------------------- 14

7 Service Fixture & Tools --------------------------------------- 18 8 Disassembly and Assembly Instructions---------------19

8.1. Disassembly flow chart ---------------------------------20

8.2. Main Parts Location Diagram ------------------------- 20

8.3. Disassembly of Back Cabinet Assembly ----------21

8.4. Disassembly of Wireless Adapter P.C.B. ---------- 26

8.5. Disassembly of Front Speaker L (SP1) ------------ 28

8.6. Disassembly of Front Speaker R (SP2) ----------- 29

8.7. Disassembly of Main Chassis Assembly ---------- 30

8.8. Disassembly of LED P.C.B. and Panel Tact Switch P.C.B. --------------------------------------------- 33

8.9. Disassembly of AC Inlet P.C.B. ---------------------- 35

8.10. Disassembly of Main P.C.B. -------------------------- 37

8.11. Disassembly of SMPS P.C.B. ------------------------40

8.12. Replacement of Switch Regulator IC (IC5701)

----------------------------------------------------------------43

8.13. Replacement of Rectifier Diode (D5802) ---------- 45

8.14. Disassembly of HDMI P.C.B. ------------------------- 47

9 Service Position ------------------------------------------------- 50

9.1. Checking and Repairing of Main P.C.B. (Side A) -------------------------------------------------------------50

9.2. Checking and Repairing of Main P.C.B. (Side B) -------------------------------------------------------------51

9.3. Checking and Repairing of Wireless Adapter P.C.B. ------------------------------------------------------- 52

9.4. Checking and Repairing of SMPS P.C.B. --------- 53

9.5. Checking and Repairing of HDMI P.C.B. (Side A) ------------------------------------------------------------55

9.6. Checking and Repairing of HDMI P.C.B. (Side B) ------------------------------------------------------------56

10 Voltage Measurement & Waveform Chart--------------- 57

10.1. HDMI P.C.B. (1/5) --------------------------------------- 57

10.2. HDMI P.C.B. (2/5) --------------------------------------- 58

10.3. HDMI P.C.B. (3/5) --------------------------------------- 59

10.4. HDMI P.C.B. (4/5) --------------------------------------- 60

10.5. HDMI P.C.B. (5/5) --------------------------------------- 61

10.6. MAIN P.C.B. (1/2) ----------------------------------------62

10.7. MAIN P.C.B. (2/2) ----------------------------------------63

10.8. LED P.C.B. ------------------------------------------------- 63

10.9. SMPS P.C.B. ----------------------------------------------64

10.10. WIRELESS ADAPTER P.C.B. ------------------------ 64

10.11. Waveform Chart (1/2) ----------------------------------- 65

10.12. Waveform Chart (2/2) ----------------------------------- 66

11 Illustration of IC’s, Transistors and Diodes ------------67 12 Overall Simplified Block -------------------------------------- 68 13 Block Diagram --------------------------------------------------- 69

13.1. SYSTEM CONTROL BLOCK DIAGRAM ---------- 69

13.2. HDMI BLOCK DIAGRAM ------------------------------ 70

13.3. AUDIO (1/2) BLOCK DIAGRAM --------------------- 71

13.4. AUDIO (2/2) BLOCK DIAGRAM --------------------- 72

13.5. IC TERMINAL CHART (HDMI/AUDIO) ------------ 73

13.6. POWER SUPPLY (1/2) BLOCK DIAGRAM------- 74

13.7. POWER SUPPLY (2/2) BLOCK DIAGRAM------- 75

14 Wiring Connection Diagram -------------------------------- 77 15 Schematic Diagram Notes ----------------------------------- 79 16 Schematic Diagram -------------------------------------------- 81

16.1. HDMI CIRCUIT (1/6)------------------------------------ 81

16.2. HDMI CIRCUIT (2/6)------------------------------------ 82

16.3. HDMI CIRCUIT (3/6)------------------------------------ 83

16.4. HDMI CIRCUIT (4/6)------------------------------------ 84

16.5. HDMI CIRCUIT (5/6)------------------------------------ 85

16.6. HDMI CIRCUIT (6/6)------------------------------------ 86

16.7. MAIN CIRCUIT (1/4) ------------------------------------ 87

16.8. MAIN CIRCUIT (2/4) ------------------------------------ 88

16.9. MAIN CIRCUIT (3/4) ------------------------------------ 89

16.10. MAIN CIRCUIT (4/4) ------------------------------------ 90

16.11. LED CIRCUIT, PANEL TACT SWITCH CIRCUIT, AC INLET CIRCUIT ----------------------- 91

16.12. SMPS CIRCUIT (1/2) ----------------------------------- 92

16.13. SMPS CIRCUIT (2/2) ----------------------------------- 93

16.14. WIRELESS ADAPTER CIRCUIT -------------------- 94

17 Printed Circuit Board------------------------------------------ 95

17.1. HDMI P.C.B. (SIDE A) --------------------------------- 95

17.2. HDMI P.C.B. (SIDE B) --------------------------------- 96

17.3. MAIN P.C.B. (SIDE A) ---------------------------------- 97

17.4. MAIN P.C.B. (SIDE B) ---------------------------------- 98

17.5. LED P.C.B., PANEL TACT SWITCH P.C.B.------- 99

17.6. AC INLET P.C.B., SMPS P.C.B., WIRELESS ADAPTER P.C.B. ---------------------------------------100

18 Terminal Function of IC’s ----------------------------------- 101

18.1. IC604 (RFKWMHTB500P) IC MICRO PROCESSOR -------------------------------------------101

18.2. IC2002 (RFKWMHTB10PB) IC MICRO PROCESSOR -------------------------------------------102

19 Exploded View and Replacement Parts List---------- 103

19.1. Exploded View and Mechanical replacement Parts List--------------------------------------------------103

19.2. Electrical Replacement Parts List ------------------107

1 Safety Precautions

1.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, ensure that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, check for leakage current checks to prevent from being exposed to shock hazards.

1.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Using an ohmmeter measure the resistance value, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MΩ and 5.2Ω. When the exposed metal does not have a return path to the chassis,

the reading must be

1.1.2. Leakage Current Hot Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15μF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. should the measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and re-checked before it is returned to the customer.

1.2. Before Repair and Adjustment

Disconnect AC power, discharge unit AC Capacitors for: (C5700, C5701, C5702, C5703, C5704, C5706, C5708) through a 10Ω, 1W resistor to ground.

DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices. After repairs are completed, restore power gradually using a variac, to avoid overcurrent.

• Current consumption at AC 120 V, at 60 Hz in NO SIGNAL mode, at volume minimum, SEL: HDMI/D-IN should be ~200 mA.

1.3. Caution For Fuse Replacement

1.4. Protection Circuitry

The protection circuitry may have operated if either of the following conditions are noticed:

• No sound is heard when the power is turned on.

• Sound stops during a performance. The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are "shorted", or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used. If this occurs, follow the procedure outlines below:

1. Turn off the power.

2. Determine the cause of the problem and correct it.

3. Turn on the power once again after one minute. Note: When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.

1.5. Safety Part Information

Safety Parts List:

There are special components used in this equipment which are important for safety. These parts are marked by in the Schematic Diagrams & Replacement Parts List. It is essential that these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards. Do not modify the original design without permission of manufacturer.

Safety Ref. No. Part No. Part Name & Description Remarks

2 REXX1104 1P RED/BLACK WIRE (AC INLET-SMPS)

17 RGNX1156-K1 SPEC LABEL

A2 RFAX1027 AC CORD/W FERRITE CORE

A3 RQTX1179-2Y O/I BOOK (En/Cf)

PCB1 REPX0840D HDMI P.C.B. (RTL)

PCB2 REPX0839KA MAIN P.C.B. (RTL)

PCB5 REPX0841BA SMPS P.C.B. (RTL)

PCB6 REPX0841BA AC INLET P.C.B. (RTL)

DZ5701 ERZV10V511CS ZNR

L5701 ELF15N007A FILTER

L5702 ELF19H010A FILTER

T5703 ETS28BH1E5AC TRANSFORMER

T5751 ETS19AB2A6AG SUB TRANSFORMER

PC5720 B3PBA0000402 PHOTO COUPLER

PC5799 B3PBA0000402 PHOTO COUPLER

RY5701 K6B1AEA00003 RELAY

F1 K5D252APA008 FUSE

FP700 K5H302100004 FUSE PROTECTOR

TH5702 D4CAA5R10001 THERMISTOR

P5701 K2ABYA000001 AC INLET

C5700 F1BAF2220023 2200pF

C5701 F0CAF104A105 0.1uF

C5702 F0CAF104A105 0.1uF

C5703 F0CAF104A105 0.1uF

C5704 F1BAF1020020 1000pF

C5706 F1BAF1020020 1000pF

C5708 F1BAF1020020 1000pF

1.6. Safety Installation Instructions

2Warning

2.1. Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as aluminium foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can generate electrical charge to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize body motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient

to damage an ES device).

2.2. Service caution based on Legal restrictions

2.2.1. General description about Lead Free Solder (PbF)

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that of the normal solder.

Definition of PCB Lead Free Solder being used

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder. (See right figure)

Service caution for repair work using Lead Free Solder (PbF)

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used. (Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.

• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.

• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees C (662±86°F).

Recommended Lead Free Solder (Service Parts Route.)

• The following 3 types of lead free solder are available through the service parts route. RFKZ03D01K-----------(0.3mm 100g Reel) RFKZ06D01K-----------(0.6mm 100g Reel) RFKZ10D01K-----------(1.0mm 100g Reel)

Note

* Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

3 Service Navigation

3.1. Service Information

This service manual contains technical information which will allow service perssonnel’s to understand and service this model. Please place orders using the parts list and not the drawing reference numbers.

If the circuit is changed or modified, this information will be followed by supplement service manual to be filed with original service manual.

• Micro-processor :

1. The following components are supplied as an assembled part.

• Micro-processor IC, IC604 (RFKWMHTB500P).

• Micro-processor IC, IC2002 (RFKWMHTB10PB).

4 Specifications

Q GENERAL Power consumption: Main unit : 27 W

Digital transmitter : 1.2 W

Power consumption in standby mode: Main unit : Approx. 0.1 W Power supply: AC 120 V, 60 Hz Dimensions (W x H x D):

Main unit : (Without wall mount bracket) 1029 mm x 108 mm x 58 mm (10 1/2” x 4 1/4” x 2 9/32”) (With wall mount bracket) 1029 mm x 108 mm x 80 mm (10 1/2” x 4 1/4” x 3 5/32”) Digital transmitter : 43.5 mm x 37.3 mm x 8.2 mm (1 23/32” x 1 15/32” x 5/16”)

Mass:

Main unit : (Without wall mount bracket) Approx. 2.8 kg (6.2 lbs) (With wall mount bracket) Approx. 2.9 kg (6.4 lbs) Digital transmitter : Approx. 0.0095 kg (0.0209 lbs)

Operating temperature range: 0°C to +40°C (+32°F to +104°F) Operating humidity range: 20% to 80% RH (no condensation)

Q AMPLIFIER SECTION RMS Output Power

Front ch: 60 W per channel (4 Ω), 1 kHz, 10% THD Total RMS Dolby Digital mode power: 240 W

FTC Output Power

Front ch: 25 W per channel (4 Ω), 120 Hz to 20 kHz, 1% THD Total FTC Dolby Digital mode power: 87 W

Q SPEAKER SECTION FRONT SPEAKERS (BUILT-IN)

Type: 1 way 1 speaker system (Bass Reflex) Full range: 6.5 cm (2 1/2”) Cone type x 2 Output sound pressure: 78 dB/W(1m) Frequency range: 35 Hz to 180 Hz (-16dB)

40 Hz to 160 Hz (-10dB)

Q TERMINAL SECTION HDMI This unit supports “HDAVI Control 5” function. HDMI input

Input Connector: Type A (19 pin)

HDMI AV output

Output Connector: Type A (19 pin)

Digital Audio Input (TV only)

Optical digital input: Optical terminal Sampling frequency: 32 kHz, 44.1 kHz, 48 kHz Audio Format: LPCM, Dolby Digital

IR Blaster

Terminal 1: 3.5 mm (1/8”) jack

Q WIRELESS SECTION Wireless module

Frequency range: 2.4 GHz to 2.4835 GHz Number of channels: 3

Note:

1. Specifications are subject to change without notice.

2. Total harmonic distortion is measured by the digital spectrum analyzer.

5 Location of Controls and Components

5.1. Main Unit Key Button Operations

5.2. Remote Control Key Buttons Operation

5.3. Audio Information

6 Self diagnostic and special mode setting

This unit is equipped with features of self-diagnostic & special mode setting for checking the functions & reliability. Special Note : Checking of the reliability (ageing) & changer operation must be carry out to ensure good working condi-

tion in unit.

6.1. Automatically Displayed Error Codes

This model does not have a display unit hence error code (when a fault condition occurs) is represented by the LED status indicators. Refer to Fig 6.1

Here is the description of the LED status indicators: LED 1 Audio source Indicator (TV, BD/DVD) LED 2 Clear-mode Dialog indicator (Clear-Mode) LED 3 Sound Effect Indicator (Sound-Effect) LED 4 Dolby Virtual Sound Indicator (DVS) LED 5 Audio Format Indicator (DD/DTS)

Fig 6.1

6.1.1. Error Code Display Details by LED Blinking Indicators

This section describes the LED status indicators by its blinking to represent the error codes.

Caution: The LED blinking process will stop only when the unit is power-off completely.

Error Code LED 1 (TV/BD/

DVD)

OVERLOAD (F61) X XXX *

F76

* XXXX

F70 DSP

X XXX*2

F70 DAP

X XXX*3

F70 HDMI

X XXX*4

U701

*2 XXXX

U703

*3 XXXX

U704

*4 XXXX

“X” means LED off. “*” means LED blink (RED) 1 time, then off. “*2” means LED blink (RED) 2 times, then off.

LED 2

(CLEAR-

MODE)

LED 3 (SOUNDEFFECT)

LED 4 (DVS) LED 5 (DD/

DTS)

Speaker protection, D-AMP IC or Fan abnormality. Check for faulty parts and replace with new parts if necessary. DC Power/Voltage Supply abnormality. Check for faulty parts and replace with new parts if necessary. DSP - Main Micro-p IC communication failure/ abnormality. Check for faulty parts and replace with new parts if necessary. DAP - Main Micro- P IC communication failure / abnormality. Check for faulty parts and replace with new parts if necessary. HDMI to Main Micro-P IC communication error. Check for faulty parts and replace with new parts if necessary. Connected devices error (HDCP non-compliance). Check for faulty parts and replace with new parts if necessary. HDMI connectionabnormality (cable damage, HDCP non-complianceetc). Check for faulty parts and replace with new parts if necessary. HDMI image format incompatibility. Check for faulty parts and replace with new parts if neces-

sary. “*3” means LED blink (RED) 3 times, then off. “*4” means LED blink (RED) 4 times, then off.

Table 6-1

Cause and Problem

6.2. Service Mode

This mode can be used during servicing. Here are the procedures to enter into service mode:

Step 1 : Power-up the main unit. Step 2 : Press & hold [VOL+] button, [VOL-] button and [POWER] button on main unit.

This unit is equipped with service mode function for:

Step 1 : Checking the region/model and generation no. Step 2 : Checking the Main micro-p & HDMI micro-p firmware version.

Legend: “O” means LED ON “X” means LED OFF

6.2.1. Checking of Main Micro-p Firmware version

Here are the procedures to check the region/model, generation no. and main firmware version:

Step 1 : Power-up the main unit. Step 2 : Enter into service mode. (Refer to Section 6.2 for the procedures). Step 3 : Press [VOL+] to check for the region/model & generation no. (Refer to table 6-2 for information on the LED indication). Step 4 : Press [VOL+] to check for the main micro-p firmware version no. (Refer to table 6-2 for information on the LED indication).

Key Operation LED 1 (TV/BD/DVD) LED 2 (CLEAR-

Press [VOL+] button on main unit for one time Press [VOL+] button on main unit for two times

Generation Bit No. Model Bit No. Region Bit 1 Region bit 0 O

Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

MODE)

LED 3 (SOUND-

EFFECT)

LED 4 (DVS) LED 5 (DD/DTS)

Table 6-2

6.2.1.1. Generation Bit No.

The generation bit no. is used for indication of the Model Year. (Refer to table 6-3 for more information).

Generation Bit Number Model By Year

(TV/BD/DVD) LED

X 0 2010 O 1 2011

Table 6-3

6.2.1.2. Model Bit No.

The model bit no. is to indicate the software for the specific model. (base on chip-select detection). (Refer to table 6-4 for more information)

Model Bit Number Model No.

CLEAR-MODE LED

X 0 HTB500 O 1 HTB10/50

Table 6-4

(Green)

6.2.1.3. Region Bit No.

The region bit no. is to indicate the destination for model. (Refer to table 6-5 for more information).

Region Bit 1 Region Bit 0 Main Software

SOUND EFFECT DVS By Destination

X X 0 : Japan X O 1 : US O X 2 : Europe/Asia

Table 6-5

6.2.1.4. Firmware version Bit No. (Bit 0~4)

It is to indicate the firmware version no. (Bit 0 ~4). (Refer to table 6-6 for more information).

Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Version No DVS DPLII DOLBY DTS PCM/AAC

XXXXX 00 XXXXO 01 XXXOX 02 XXXOO 03 XXOXX 04 XXOXO 05 XXOOX 06 XXOOO 07 XOXXX 08 XOXXO 09 XOXOX 10 XOXOO 11 XOOXX 12 XOOXO 13 XOOOX 14 XOOOO 15 OXXXX 16 OXXXO 17 OXXOX 18 OXXOO 19 OXOXX 20 OXOXO 21 OXOOX 22 OXOOO 23 OOX X X 24 OOX XO 25 OOX OX 26 OOX OO 27 OOOX X 28 OOOX O 29 OOOOX 30 OOOOO 31

Table 6-6

6.2.2. Checking of HDMI Micro-p Firmware version

Here are the procedures for checking the HDMI micro-p firmware version no:

Step 1 : Enter into service mode. (Refer to Section 6.2 for the procedures) Step 2 : Press [VOL-] to check the region no. (Refer to table 6-7 for information). Step 3 : Press [VOL-] to check the HDMI micro-p firmware version no. (Refer to table 6-7 for information).

Key Operation LED 1 (TV/BD/DVD) LED 2 (CLEAR-

Press [VOL-] button on main unit Press [VOL-] button on main unit

Generation Bit No. Model Bit No. Region Bit 1 Region bit 0 O

Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

MODE)

LED 3 (SOUND-

EFFECT)

LED 4 (DVS) LED 5 (DD/DTS)

Table 6-7

6.2.2.1. Generation Bit No.

The generation bit no. is used for indication of the Model Year. (Refer to table 6-8 for more information).

Generation Bit Number Model By Year

(TV/BD/DVD) LED

X 0 2010 O 1 2011

Table 6-8

6.2.2.2. Model Bit No.

The model bit no. is to indicate the software for the specific model. (base on chip-select detection). (Refer to table 6-9 for more information)

Model Bit Number Model No.

CLEAR-MODE LED

X 0 HTB500 O 1 HTB10/50

Table 6-9

(Green)

6.2.2.3. Region Bit No.

The region bit no. is to indicate the destination for model. (Refer to table 6-10 for more information).

Region Bit 1 Region Bit 0 HDMI Software

SOUND EFFECT DVS By last 2 digit

XX Invalid XO For Japan O X For Others OO Invalid

Table 6-10

6.2.2.4. Firmware version Bit No. (Bit 0~4)

It is to indicate the firmware version no. (Bit 0 ~4). (Refer to table 6-9 for more information).

Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Version No DVS DPLII DOLBY DTS PCM/AAC

Table 6-11

6.2.3. Cold start

Here are the procedures to do a reset for the main unit.

Step 1 : Power-up the main unit. Step 2 : Press & hold [POWER] button on main unit for 4s or more.

All LED will light-up and blink for 2 times (at frequency of 4Hz)

7 Service Fixture & Tools

Prepare service tools before proccess service position.

Ref. No. Service Tools Remarks

SFT1 Main P.C.B. (CN700) - SMPS P.C.B. (H2016) REXX1103 (10P Cable Wire)

8 Disassembly and Assembly Instructions

Caution Note:

• This section describes the disassembly and/or assembly procedures for all major printed circuit boards & main components for the unit. (You may refer to the section of “Main components and P.C.B Locations” as described in the service manual)

• Before carrying out the disassembly process, please ensure all the safety precautions & procedures are followed.

• During the disassembly and/or assembly process, please handle with care as there may be chassis components with sharp edges.

• Avoid touching heatsinks due to its high temperature after prolong use. (See caution as described below)

• During disassembly and assembly, please ensure proper service tools, equipments or jigs is being used.

• During replacement of component parts, please refer to the section of “Replacement Parts List” as described in the service manual.

• Select items from the following indexes when disassembly or replacement are required.

• Disassembly of Back Cabinet Assembly

• Disassembly of Wireless Adapter P.C.B.

• Disassembly of Front Speaker L (SP1)

• Disassembly of Front Speaker R (SP2)

• Disassembly of Main Chassis Assembly

• Disassembly of LED P.C.B. and Panel Tact Switch P.C.B.

• Disassembly of AC Inlet P.C.B.

• Disassembly of Main P.C.B.

• Disassembly of SMPS P.C.B.

• Replacement of Switch Regulator IC (IC5701)

• Replacement of Rectifier Diode (D5802)

• Disassembly of HDMI P.C.B.

8.1. Disassembly flow chart

The following chart is the procedure for disassembling the casing and inside parts for internal inspection when carrying out the servicing. To assemble the unit, reverse the steps shown in the chart below.

8.2. Main Parts Location Diagram

8.3. Disassembly of Back Cabinet Assembly

Step 1 : Remove 2 screws. Step 2 : Remove the TV Stand Cover as arrow shown.

Step 3 : Remove 4 Screw Covers.

Step 4 : Remove 3 screws. Step 5 : Remove 18 screws.

Step 6 : Lift up and flip over the Back Cabinet Assembly as arrow shown. Caution : Do not exert too much force as it may damage the wiring within.

8.3.1. Wire Dressing for assembling

Step 1 : Ensure Front Speaker L (SP1) wire is properly dressed into the Front Panel Assembly ribs. Step 2 : Ensure Front Speaker L (SP1) wire is properly dressed into the Front Panel Assembly gap and rib.

Step 3 : Ensure Front Speaker R (SP2) wire is properly dressed into the Front Panel Assembly rib and gap. Step 4 : Ensure Front Speaker R (SP2) wire is properly dressed into the Front Panel Assembly ribs.

Step 5 : Ensure Front Speaker R (SP2) wire is properly dressed into the Front Panel Assembly ribs. Step 6 : Ensure Front Speaker R (SP2) wire is properly dressed into the Front Panel Assembly gap.

Step 7 : Ensure 2P Wire (Wireless-Main) is properly dressed into the Front Panel Assembly rib. Step 8 : Ensure 2P Wire (Wireless-Main) is properly dressed into the Front Panel Assembly gab.

Step 9 : Ensure 2P Wire (Wireless-Main) is properly dressed into the Front Panel Assembly ribs. Step 10 : Ensure 2P Wire (Wireless-Main) is properly dressed into the Front Panel Assembly gaps. Step 11 : Paste 2 pieces of himelons over the wires.

Step 12 : Ensure 4P Wire Blue Socket must be dressed facing toward right direction as shown. Step 13 : Ensure 4P Wire White Socket must be dressed facing toward left direction as shown. Step 14 : Ensure Front Speaker L (SP1) wire is properly dressed into the Front Panel Assembly rib. Step 15 : Ensure Front Speaker R (SP2) wire is properly dressed into the Front Panel Assembly between rib and wall of Main Chas-

sis.

8.4. Disassembly of Wireless Adapter P.C.B.

• Refer to “Disassembly of Back Cabinet Assembly”.

Step 1 : Remove 2 screws. Step 2 : Detach 14P FFC of connector (CN101) on Tx Card Chassis Unit. Step 3 : Disconnect the 4P Wire White Socket.

Step 4 : Flip over the Tx Card Chassis Unit as arrow shown. Step 5 : Remove 1 screw. Step 6 : Release the catches. Step 7 : Remove the Wireless Adapter P.C.B. as arrow shown. Caution : During assembling, ensure the Wireless Adapter P.C.B. is properly seated onto the locators.

Caution 1 : During assembling, ensure the 14P FFC must be dressed flatly onto the Front Cabinet Assembly. Caution 2 : During assembling, ensure to paste the himelon over the 14P FFC onto wall of the Front Cabinet Assembly. Caution 3 : During assembling, ensure to paste the himelon over the 14P FFC onto the Front Cabinet Assembly. Caution 4 : During assembling, ensure to paste the himelon over ferrite core onto the Front Cabinet Assembly.

8.5. Disassembly of Front Speaker L (SP1)

• Refer to “Disassembly of Back Cabinet Assembly”.

Step 1 : Detach the Red (+) and Black (-) speaker wires. Step 2 : Remove 4 screws.

Step 3 : Remove the Front Speaker L (SP1).

8.6. Disassembly of Front Speaker R (SP2)

• Refer to “Disassembly of Back Cabinet Assembly”.

Step 1 : Detach the Red (+) and Black (-) speaker wires. Step 2 : Remove 4 screws.

Step 3 : Remove the Front Speaker R (SP2).

8.7. Disassembly of Main Chassis Assembly

• Refer to “Disassembly of Back Cabinet Assembly”.

Step 1 : Disconnect the 4P Wire Blue Socket and 4P Wire White Socket.

Caution 1 : During assembling, ensure 4P Wire White Socket must be dressed facing toward left direction as shown. Caution 2 : During assembling, ensure 4P Wire Blue Socket must be dressed facing toward right direction as shown.

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