Panasonic KX-TS3MXB, KX-TS3MXF, KX-TS3MXR, KX-TS3MXW, KX-TS3MXP Service Manual
ORDER NO. KM40103772C3
Telephone Equipment
KX-TS3MXB
KX-TS3MXF
KX-TS3MXP
KX-TS3MXR
KX-TS3MXW
Integrated Telephone System
Black Version
Skeleton Blue Version
Skeleton Pink Version
Red Version
White Version
(for Asia, Middle Near East and Other areas)
© 2001 Kyushu Matsushita Electric Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW
CONTENTS
Page Page
1 LOCATION OF CONTROLS 3
2 CONNECTION
3 OPERATIONS
3.1. Making Calls
3.2. Answering Calls
4 SPECIAL FEATURES
4.1. For Call Waiting Service Users
4.2. Temporary Tone Dialing (For Rotary or Pulse Service
Users)
5 DISASSEMBLY INSTRUCTIONS
6 HOW TO REPLACE FLAT PACKAGE IC
6.1. Preparation
6.2. Procedure
6.3. Modification Procedure of Bridge
7 CPU DATA
8 TERMINAL GUIDE OF IC’S TRANSISTORS AND DIODES
9 IC BLOCK DIAGRAM
10 OPTION JUMPER TABLE
10.1. Dialing Mode SW
10.2. Flash Key
11 BLOCK DIAGRAM (IC2)
12 CIRCUIT OPERATIONS
12.1. Telephone Line Interface and Pulse Dial Circuit
10
10
10
10
10
11
11
4
5
5
5
5
5
5
6
7
7
7
7
8
9
12.2. Tone Dial Circuit
12.3. Ringer Circuit
12.4. Power Circuit and Redial Back-up Circuit
12.5. Sending Circuit (Tx)
12.6. Receiving Circuit (Rx)
13 TROUBLE SHOOTING GUIDE
13.1. Service Hints
13.2. Pulse Dialing Problems
13.3. Problems With the Handset
13.4. Tone Dialing Problems
13.5. Problems With Ringer
13.6. How to Check the IC1 (Scanning to the key)
14 CABINET AND ELECTRICAL PARTS LOCATION
15 ACCESSORY AND PACKING MATERIALS
16 REPLACEMENT PARTS LIST
16.1. Base Unit
16.2. ACCESSORIES AND PACKING MATERIALS
17 FOR SCHEMATIC DIAGRAM (SCHEMATIC DIAGRAM)
18 CIRCUIT BOARD AND WIRING CONNECTION DIAGRAM
18.1. Component View
18.2. Flow Solder Side View
19 SCHEMATIC DIAGRAM
11
12
12
12
12
13
13
13
14
14
15
15
16
17
18
18
19
20
21
21
22
23
2
1 LOCATION OF CONTROLS
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW
3
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW
2 CONNECTION
4
3 OPERATIONS
3.1. Making Calls
3.1.1. To redial the last number dialed
3.2. Answering Calls
4 SPECIAL FEATURES
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW
4.1. For Call Waiting Service Users
4.2. Temporary Tone Dialing (For Rotary or Pulse Service Users)
5
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW
5 DISASSEMBLY INSTRUCTIONS
Ref. No. Procedure Shown in Fig —. To remove —. Remove —.
1 1 1 Lower Cabinet Screws (2.6 × 10) . . . . . . . . . ....(A)×5
2 1~2 2 Printed Circuit Board Remove the P.C.Board
6
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW
6 HOW TO REPLACE FLAT PACKAGE IC
6.1. Preparation
• • SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-19RMA
•
• Soldering iron
Recommended power consumption will be between 30 W to 40 W.
Temperature of Copper Rod 662 ±50°F (350 ± 10°C)
(An expert may handle between 60 ~ 80 W iron, but beginner might damage foil by overheating.)
•
• Flux
HI115 Specific gravity 0.863
(Original flux will be replaced daily.)
6.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two marked 2 pins.
*Most important matter is accurate setting of IC to the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as sliding the soldering iron.
6.3. Modification Procedure of Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering iron as shown in below figure.
7
KX-TS3MXB / KX-TS3MXF / KX-TS3MXP / KX-TS3MXR / KX-TS3MXW
7 CPU DATA
8
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