Panasonic KX-TG7511HGB, KX-TGA750FXB Service manual

ORDER NO. KM41006158CE

Telephone Equipment

Model No. KX-TG7511HGB

KX-TGA750FXB

Digital Cordless Phone

B: Black Version (for Hungary)

KX-TG7511HGB/KX-TGA750FXB

TABLE OF CONTENTS

PAGE PAGE

1 Safety Precautions----------------------------------------------- 4

1.1. For Service Technicians --------------------------------- 4

2 Warning-------------------------------------------------------------- 4

2.1. Battery Caution--------------------------------------------- 4

2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4

2.3. Discarding of P.C. Board--------------------------------- 5

3 Specifications ----------------------------------------------------- 6 4 Technical Descriptions----------------------------------------- 7

4.1. Block Diagram (Base Unit)------------------------------ 7

4.2. Circuit Operation (Base Unit)--------------------------- 8

4.3. Block Diagram (Handset)-------------------------------11

4.4. Circuit Operation (Handset)----------------------------12

4.5. Circuit Operation (Charger Unit)----------------------13

4.6. Signal Route -----------------------------------------------14

5 Location of Controls and Components ------------------16 6 Installation Instructions---------------------------------------16 7 Operating Instructions-----------------------------------------16

7.1. For Service Hint-------------------------------------------16

8 Service Mode -----------------------------------------------------17

8.1. Engineering Mode----------------------------------------17

8.2. Copying Phonebook Items when Repairing -------21

8.3. How to Clear User Setting------------------------------23

9 Troubleshooting Guide----------------------------------------24

9.1. Troubleshooting Flowchart -----------------------------24

9.2. Troubleshooting by Symptom (Base Unit and Charger Unit) ----------------------------------------------36

9.3. Troubleshooting by Symptom (Handset) -----------40

10 Disassembly and Assembly Instructions ---------------44

10.1. Disassembly Instructions-------------------------------44

10.2. How to Replace the Handset LCD -------------------47

11 Measurements and Adjustments---------------------------48

11.1. Equipment Required -------------------------------------48

11.2. The Setting Method of JIG (Base Unit) -------------48

11.3. Adjustment Standard (Base Unit)---------------------50

11.4. Adjustment Standard (Charger Unit)-----------------51

11.5. The Setting Method of JIG (Handset) ---------------52

11.6. Adjustment Standard (Handset) ----------------------54

11.7. Things to Do after Replacing IC or X'tal ------------55

11.8. RF Specification-------------------------------------------57

11.9. How to Check the Handset Speaker or Receiver ----------------------------------------------------58

11.10. Frequency Table (MHz) ---------------------------------58

12 Miscellaneous ----------------------------------------------------59

12.1. How to Replace the Flat Package IC ----------------59

12.2. How to Replace the Shield Case---------------------61

12.3. Terminal Guide of the ICs, Transistors, Diodes and Electrolytic Capacitors-----------------------------63

13 Schematic Diagram ---------------------------------------------64

13.1. For Schematic Diagram---------------------------------64

13.2. Schematic Diagram (Base Unit) ----------------------66

13.3. Schematic Diagram (Handset) ------------------------68

13.4. Schematic Diagram (Charger Unit) ------------------70

14 Printed Circuit Board-------------------------------------------71

14.1. Circuit Board (Base Unit_Main)-----------------------71

14.2. Circuit Board (Handset)---------------------------------73

14.3. Circuit Board (Charger Unit) ---------------------------75

15 Exploded View and Replacement Parts List -----------76

15.1. Cabinet and Electrical Parts (Base Unit) -----------76

KX-TG7511HGB/KX-TGA750FXB

15.2. Cabinet and Electrical Parts (Handset)------------- 77

15.3. Cabinet and Electrical Parts (Charger Unit) ------- 78

15.4. Accessories------------------------------------------------ 79

15.5. Replacement Part List ---------------------------------- 80

KX-TG7511HGB/KX-TGA750FXB

1 Safety Precautions

1.1. For Service Technicians

• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires, injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.

2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.

3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on worktable.

4. Do not grasp IC or LSI pins with bare fingers.

2Warning

2.1. Battery Caution

1. Danger of explosion if battery is incorrectly replaced.

2. Replace only with the same or equivalent type recommended by the manufacturer.

3. Dispose of used batteries according to the manufacture’s Instructions.

2.2. About Lead Free Solder (Pbf: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead. We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), Silver (Ag), and Copper (Cu). This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder.

Caution

• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).

• Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the opposite side (See the figure below).

KX-TG7511HGB/KX-TGA750FXB

2.2.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper (Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

2.3. Discarding of P.C. Board

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

KX-TG7511HGB/KX-TGA750FXB

3 Specifications

Note:

• Design and specifications are subject to change without notice.

Note for Service:

• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.

• Analog telephone connection: Telephone Line

• Optional headset: KX-TCA94EX

4 Technical Descriptions

4.1. Block Diagram (Base Unit)

KX-TG7511HGB/KX-TGA750FXB

T1 AN

X R

Burst Encoding

Speech Encoding

ANT1

801 D

V R D A

-P

Burst Decoding

Speech Decoding

T2 AN

A P

F R

X T

PLL

MOD/DEMOD

DSP

ADPCM

Codec Filter

IC801

787374

BMC

ANT2

L E S P

z H M

10.3

A T

X T

KX-TG7511 BLOCK DIAGRAM (BASE UNIT)

Pump

Charge

IC7

BBIC

A/D

D/A

Analog

Audio

Off-Hook Line Voltage

Q3,Q4,Q5

Hook Switch

Bridge

Rect D3

2 L

o TEL_LINE

End

Front

HOOK

211924

Interface

Bell/Caller ID

CPU

BELL

SCL

SDA

IC401

EEPROM

Charge

Detector

2.5V

CHARGE

CONTACT

Limit

Resistor

P C D

To AC Adaptor

3.0 V

IC2

M C D

2.4 V

2.4V

IC3

Reg.

1.8 V

1.8V

Reg.

KX-TG7511HGB/KX-TGA750FXB

4.2. Circuit Operation (Base Unit)

4.2.1. Outline

Base Unit consists of the following ICs as shown in Block Diagram (Base Unit) (P.7).

• DECT BBIC (Base Band IC): IC7

- Handling all the audio, signal and data processing needed in a DECT base unit

- Controlling the DECT specific physical layer and radio section (Burst Module Controller section)

- ADPCM code filter for speech encoding and speech decoding (DSP section)

- Echo-cancellation and Echo-suppression (DSP section)

- Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)

- DTMF receiver (DSP section)

- Clock Generation for RF Module

- ADC, DAC, timer, and power control circuitry

- PLL Oscillator

-Detector

- Compress/Expander

- First Mixer

- All interfaces (ex: RF Power Amp, EEPROM, LED, Analog Front End, etc.)

• RF Power Amp.: IC801

- Amplifier for transmission and reception

• EEPROM: IC401

- Temporary operating parameters (for RF, etc.)

• Additionally,

- Power Supply Circuit (+3.0 V, +2.4 V, +1.8 V output)

- Crystal Circuit (10.368 MHz)

- Charge Circuit

- Telephone Line Interface Circuit

KX-TG7511HGB/KX-TGA750FXB

4.2.2. Power Supply Circuit

The power is supplied to the DECT BBIC, RF Module, EEPROM and Charge Contact from AC Adaptor (+6.5 V) as shown in Fig.101. The power supply is as follows;

• DECT BBIC (IC7): DC Jack (+6.5 V) → IC2 → IC7 DC Jack (+6.5 V) → IC2 → Q9 → IC7 DC Jack (+6.5 V) → IC2 → Q8 → IC7

• RF Power Amp. (IC801): DC Jack (+6.5 V) → IC2 → IC801 (Power AMP)

• EEPROM (IC401): DC Jack (+6.5 V) → IC2 → IC7→ IC401

• Charge Contact (TP16): DC Jack (+6.5 V) → R56 → R55 → D22→ TP16

<Fig.101>

KX-TG7511HGB/KX-TGA750FXB

4.2.3. Telephone Line Interface

• Bell signal detection

• Clip signal detection

• ON/OFF hook circuit

Bell & Clip (: Calling Line Identification Presentation: Caller ID) signal detection:

In the standby mode, Q3 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the L1T (A) and L1R (B) leads (when the telephone rings), the AC ring voltage is transferred as follows;

•B → L2 → C4 → R6 → R33 → IC7 Pin 21 (CID INp)

•A → L1 → C3 → R4 → R35 → IC7 Pin 20 (CID INn)

ON/OFF hook circuit:

In the standby mode, Q3 is open, and connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-hook condition. When IC7 detects a ring signal or press the TALK Key onto the handset, Q4 turns on and then Q3 turns on, thus providing an off-hook condition (DC current flows through the circuit) and the following signal flow makes the loop current.

•B → L2 →D3 → Q3 → Q5 → R21 → R22 → D3 → L1 →A [OFF HOOK]

4.2.4. Transmitter/Receiver

• Audio Circuits and DTMF tone signal circuits. Base Unit and Handset mainly consist of RF Module and DECT BBIC. Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency.

Signal Path:

*Refer to Signal Route (P.14).

4.2.4.1. Transmitter Block

The voice signal input from the TEL LINE interface goes to RF Power Amp. (IC801) through DECT BBIC (IC7) as shown in Block Diagram (Base Unit) (P.7) The voice signal passes through the analog part of IC7 where it is amplified and converted to a digital audio stream signal. The burst switch controller processes this stream performing encryption and scrambling, adding the various other fields to produce the GAP (Generic Access Profile) standard DECT frame, assigning to a time slot and channel etc. In IC7, the carrier frequency is changing, and frequency modulated RF signal is generated.In IC801,RF signal is amplified, and radiated from antenna. Handset detects the voice signal or data signal in the circuit same as the following explanation of

Receiver Block.

4.2.4.2. Receiver Block

The signal of 1900 MHz band (1881.792 MHz ~ 1897.344 MHz) which is input from antenna is input to IC7 as shown in Block Diagram (Base Unit) (P.7).

In IC7, the signal of 1900 MHz band is downconverted to 864 kHz signal and demodulated, as GAP (Generic Access Profile) standard DECT frames. It passes through the decoding section burst switch controller where it separates out the frame information and performs de-encryption and de-scrambling as required. It then goes to the DSP section where it is turned back

into analog audio. This is amplified by the analog front end, and goes to the TEL LINE Interface.

4.2.5. Pulse Dialling

During pulse dialling the hookswitch (Q3, Q4) is used to generate the pulses using the HOOK control signal, which is set high during pulses. To force the line impedance low during the “pause” intervals between dial pulses, the PULSE_DIAL signal turns on Q2.

4.3. Block Diagram (Handset)

Q4, Q9, R7

ANT1

KX-TG7511HGB/KX-TGA750FXB

RXon

RXn

Burst

Decoding

Speech

Decoding

DA801

VDD-PADRY

RXp

TXp

Burst

Encoding

ADPCM

Speech

Encoding

RF PA

TXn

PLL

MOD/DEMOD

Filter

Codec

IC801

367

Pon

737480

BMC

DSP

PSEL

TXon

XTAL

10.368

MHz

BATTERY

ON SWITCH

KEYPAD

ROWS

COLUMNS

48, 49, 50, 51

22, 23, 24, 25, 26

Pump

Charge

IC1

BBIC

43 42

CP2.5V CP4.0V

KX-TGA750 BLOCK DIAGRAM (HANDSET)

SPEAKER

D/A

A/D

RECEIVER

MIC

Analog

End

Front

CHARGE

CHARGE_CTRL

CHARGE

CIRCUIT

Q4, Q9, R7

CHARGE(+)

CHARGE

CONTACTS

SCL

SDA

IC3

EEPROM

CHARGE(-)

BATT+

CPU

VBAT

BATTERY

TERMINAL

1.8 V

R45

BATT-

LDO_CTRL

1.8 V

RESET

635455

CSB

SDA

SCL

LCD

KEY LED

BELL LED

CP4.0V

WHITE LED

on LCD unit

KX-TG7511HGB/KX-TGA750FXB

4.4. Circuit Operation (Handset)

4.4.1. Outline

Handset consists of the following ICs as shown in Block Diagram (Handset) (P.11).

• DECT BBIC (Base Band IC): IC1

- All data signals (forming/analyzing ACK or CMD signal)

- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)

- PLL Oscillator

-Detector

- Compress/Expander

- Reception

• RF Power Amp: IC801

- Amplifier for transmission

• EEPROM: IC3

- Temporary operating parameters (for RF, etc.)

4.4.2. Power Supply Circuit/Reset Circuit

Circuit Operation:

When power on the Handset, the voltage is as follows; BATTERY(2.2 V ~ 2.6 V: BATT+) → F1 → Q2 (1.8 V), IC1-43pin (2.5V) The Reset signal generates IC1 (61 pin) and 1.8 V.

4.4.3. Charge Circuit

Circuit Operation:

When charging the handset on the Base Unit, the charge current is as follows; DC+(6.5 V) → R56 → R55 → D22 → CHARGE+(Base) → CHARGE+(Handset) → Q4 → D7→ F1 → BATTERY+... Battery... BATTERY- → R45 → GND → CHARGE-(Handset)→ CHARGE-(Base) → GND → DC-(GND) In this way, the BBIC on Handset detects the fact that the battery is charged. The charge current is controlled by switching Q9 of Handset.

Refer to Fig.101 in Power Supply Circuit (P.9).

4.4.4. Battery Low/Power Down Detector

Circuit Operation:

“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery. The detected voltage is as follows;

• Battery Low

Battery voltage: V(Batt) 2.25 V ± 50 mV

The BBIC detects this level and " " starts flashing.

• Power Down

Battery voltage: V(Batt) 2.0 V ± 50 mV

The BBIC detects this level and power down.

4.4.5. Speakerphone

The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.

4.5. Circuit Operation (Charger Unit)

4.5.1. Power Supply Circuit

The power supply is as shown.

KX-TG7511HGB/KX-TGA750FXB

4.6. Signal Route

KX-TG7511HGB/KX-TGA750FXB

5 Location of Controls and Components

Refer to the Operating Instructions.

Note:

You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

6 Installation Instructions

Refer to the Operating Instructions.

Note:

You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

7 Operating Instructions

Refer to the Operating Instructions.

Note:

You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

7.1. For Service Hint

8 Service Mode

8.1. Engineering Mode

8.1.1. Base Unit

KX-TG7511HGB/KX-TGA750FXB

Frequently Used Items (Base Unit)

ex.)

Items Address Default Data New Data Remarks

C-ID (FSK) sensitivity 05 4B 00 01 (6 dB up) 02 (12 dB up) When hex changes from “00” to “01” or “02”,

C-ID (DTMF) sensitivity 05 80 50 60 (6 dB up) 70 (12 dB up) When hex changes from “50” to “60” or “70”,

SMS (FSK) receiving sensitivity SMS (FSK) sending level 04 9B/04 9A 00/04 19/20 (6 dB

Frequency 00 08/00 07 02/70 - - Use these items in a READ-ONLY mode to ID 00 02~00 06 Given value - -

Bell length 02 1D 32 (5sec) (*3) 1E (3 sec) 14 (2 sec) This is time until bell stops ringing.

PULSE Dial speed (10PPS -> 20PPS)

04 D6 00 01 (6 dB up) 02 (12 dB up) When hex changes from “00” to “01”or “02”,

32/40 (12 dB

up)

01 F8 21 (33msec)

(*3)

01 F9 43 (67msec)

(*3)

02 0C 47 (870msec)

(*3)

up)

18 (20msec) - This is pulse make time. (Unit:1 ms)

1A (30msec) - This is pulse break time. (Unit:1 ms)

2C (440msec) - This is inter-digit time in pulse mode.

gain increases by 6 dB or 12 dB.

gain increases by 6 dB or 12 dB. When hex changes from “00 0B” to “00 16”or “00 2C”, gain increases by 6 dB or 12 dB.

confirm the contents. Careless rewriting may cause serious damage to the computer system.

(Unit: 100 ms)

(Unit:10 ms)

Note:

(*1) Refer to Registering a Handset to a Base Unit in the Operating Instructions. (*2) When you enter the address or New Data, please refer to the table below.

Desired Number (hex) Input Keys Desired Number (hex) Input Keys

00 A[R] + 0 11 B[R] + 1

.. C[R] + 2 .. D[R] + 3 .. E[R] + 4

99 F[R] + 5

(*3)

Bell length 32(hex) = 50(dec) → 50 × 100 msec = 5000 msec (5 sec) PULSE Dial speed (10PPS -> 20PPS)

21(hex) = 33(dec) → 33 × 1msec = 33msec 43(hex) = 67(dec) → 67 × 1msec = 67msec 47(hex) = 71(dec) → 71 × 10msec = 710msec

8.1.2. Handset

KX-TG7511HGB/KX-TGA750FXB

Frequently Used Items (Handset)

ex.)

Items Address Default Data New Data Possible Adjusted

Value MAX (hex)

Sending level 03 17 Adjusted value Given value FF D0 (*2)

Receiving level 03 18 Adjusted value Given value FF D0 (*3)

Battery Low 00 09 70 - - -

Frequency 00 08/00 07 02/70 - - -

ID 00 02~00 06 Given value - - -

Possible Adjusted

Value MIN (hex)

Note:

(*1) When you enter the address or New Data, please refer to the table below.

Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys

00 A[R] + 0 11 B[R] + 1

.. C[R] + 2 .. D[R] + 3 .. E[R] + 4

99 F[R] + 5

(*2) When adding “01” (hex) to default value, sending level increases by 0.25 dB. ex.)

Item Default Data New Data

E7 EB E3

Sending level -2dBm -1dBm -3dBm

(*3) When reducing “01” (hex) from default value, receiving level increases by 0.25 dB. ex.)

Remarks

(*4)

Item Default Data New Data

E7 EB E3

Receiving level -22dBm -21dBm -23dBm

(*4) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the

handset.

KX-TG7511HGB/KX-TGA750FXB

8.2. Copying Phonebook Items when Repairing

You can copy the handset phonebook to another (compatible Panasonic) handset. This will help to save the original phonebook data which the customer has registered. Available models: KX-TG7511 Refer to the following procedures.

Note:

• BS=Base Unit, HS=Handset

• If the max number of handsets are already registered to the base unit, a new handset cannot be registered.

• To register the handset, refer to Registering a Handset to a Base Unit in the Operating Instructions.

• To cancel the handset, refer to Deregistering a Handset in the Operating Instructions.

• To copy the handset phonebook, refer to Copying Phonebook Entries in the Operating Instructions.

KX-TG7511HGB/KX-TGA750FXB

Note:

• BS=Base Unit, HS=Handset

• If the max number of handsets are already registered to the base unit, a new handset cannot be registered.

• To register the handset, refer to Registering a Handset to a Base Unit in the Operating Instructions.

• To cancel the handset, refer to Deregistering a Handset in the Operating Instructions.

• To copy the handset phonebook, refer to Copying Phonebook Entries in the Operating Instructions.

KX-TG7511HGB/KX-TGA750FXB

8.3. How to Clear User Setting

Units are reset to the Factory settings by this operation (Erase stored Phone numbers, Caller list and etc.)

Note:

• Some menus are not reset. Refer to Operating Instructions (P.16).

• The reset menus differ depending on the following operations.

• This operation should not be performed for a usual repair.

8.3.1. Resetting both base unit and handset

Both the base unit and the registered handset which you did the following steps to are reset. Other registered handsets will not be reset.

Note:

(*1) Refer to Registering a Handset to a Base Unit in the Operating Instructions.

8.3.2. Resetting only handset

The only handset is reset by doing the following steps to .

Note: (*2)

• The handset registration to the base unit is cancelled.

• If the handset needs to be registered to the base unit, refer to Registering a Handset to a Base Unit in the Operating Instructions.

• If users do not bring the base unit with them, the registration procedure has to be done by users themselves.

KX-TG7511HGB/KX-TGA750FXB

9 Troubleshooting Guide

9.1. Troubleshooting Flowchart

Flow Chart

Cross Reference:

Check Power (P.25) Bell Reception (P.35) Check Battery Charge (P.26) Check Link (P.27) Check the RF part (P.31) Check Handset Transmission (P.34) Check Handset Reception (P.34) Signal Route (P.14) Check Caller ID (P.34)

9.1.1. Check Power

9.1.1.1. Base Unit

Is the AC Adaptor inserted into AC outlet? (*1)

KX-TG7511HGB/KX-TGA750FXB

Cross Reference:

Power Supply Circuit (P.9)

9.1.1.2. Handset

Note:

(*1) Refer to Specifications (P.6) for part number and supply voltage of AC Adaptor.

Cross Reference:

Power Supply Circuit/Reset Circuit (P.12)

KX-TG7511HGB/KX-TGA750FXB

9.1.2. Check Battery Charge

9.1.2.1. Base Unit

Cross Reference:

Charge Circuit (P.12)

9.1.2.2. Handset

Cross Reference:

Check Power (P.25)

Charge Circuit (P.12)

9.1.2.3. Charger Unit

Cross Reference:

Charge Circuit (P.12)

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