KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page Page
1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4
1.1. Suggested PbF Solder
1.2. How to Recognize that Pb Free Solder is Used
2 FOR SERVICE TECHNICIANS
3 CAUTION
4 OPERATING INSTRUCTIONS
4.1. Battery
4.2. Location of Controls
4.3. Displays
4.4. Settings
4.5. Troubleshooting
5 DISASSEMBLY INSTRUCTIONS
5.1. Base Unit
5.2. Handset
5.3. Charger Unit
6 HOW TO REPLACE THE HANDSET LCD
7 TROUBLESHOOTING GUIDE
7.1. Check Power
7.2. Check Battery Charge
7.3. Check Link
7.4. Check the RF part
7.5. Check Handset Transmission
7.6. Check Handset Reception
7.7. Check Caller ID
8 ADJUSTMENT AND TEST MODE
8.1. Test Mode Flow Chart for Base Unit
8.2. Test Mode Flow Chart for Handset
8.3. X501 (Base Unit), X201 (Handset) Check
8.4. Adjust Battery Low Detector Voltage (Handset)
13.8. 2.4GHz Mod/Demod Circuit (Base Unit RF Part)
14 BLOCK DIAGRAM (HANDSET_MAIN)
15 BLOCK DIAGRAM (HANDSET_RF PART)
16 CIRCUIT OPERATION (HANDSET)
16.1. Construction
16.2. Power Supply Circuit
16.3. Charge Circuit
16.4. Ringer and Handset SP-Phone
16.5. Sending Signal
16.6. Reception Signal
16.7. 2.4GHz Mod/Demod Circuit (Handset RF Part)
17 CIRCUIT OPERATION (CHARGER UNIT)
18 SIGNAL ROUTE
19 CPU DATA (BASE UNIT)
19.1. IC501
20 CPU DATA (HANDSET)
20.1. IC201
21 EXPLANATION OF IC TERMINALS (RF PART)
21.1. IC901
22 HOW TO REPLACE A FLAT PACKAGE IC
22.1. PREPARATION
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KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
22.2. FLAT PACKAGE IC REMOVAL PROCEDURE 73
22.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
22.4. BRIDGE MODIFICATION PROCEDURE
23 CABINET AND ELECTRICAL PARTS (BASE UNIT)
23.1. KX-TG2820LAB
23.2. KX-TG2822LAB
24 CABINET AND ELECTRICAL PARTS (HANDSET)
25 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
26 ACCESSORIES AND PACKING MATERIALS
26.1. KX-TG2820LAB
26.2. KX-TG2822LAB
27 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
27.1. Base Unit
27.2. Handset
27.3. Charger Unit
28 REPLACEMENT PARTS LIST
28.1. Base Unit
28.2. Handset
28.3. Charger Unit
28.4. Accessories and Packing Materials
28.5. Fixtures and Tools
29 FOR SCHEMATIC DIAGRAM
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29.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT_MAIN))
29.2. Handset (SCHEMATIC DIAGRAM (HANDSET_MAIN))
29.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
30 SCHEMATIC DIAGRAM (BASE UNIT_MAIN)
31 SCHEMATIC DIAGRAM (BASE UNIT_RF PART)
32 SCHEMATIC DIAGRAM (HANDSET_MAIN)
33 SCHEMATIC DIAGRAM (HANDSET_RF PART)
34 SCHEMATIC DIAGRAM (CHARGER UNIT)
35 CIRCUIT BOARD (BASE UNIT_MAIN)
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35.1. Component View
35.2. Flow Solder Side View
36 CIRCUIT BOARD (BASE UNIT_RF PART)
37 CIRCUIT BOARD (HANDSET_MAIN)
37.1. Component View
37.2. Flow Solder Side View
38 CIRCUIT BOARD (HANDSET_RF PART)
39 CIRCUIT BOARD (CHARGER UNIT)
39.1. Component View
39.2. Flow Solder Side View
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KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
• PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
• •
temperature control and adjust it to 700°F ± 20° F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
•
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
• •
•
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
• •
and be sure that any remaining is melted prior to applying the Pb solder.
•
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
• •
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
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KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
1.2. How to Recognize that Pb Free Solder is Used
(Example: Handset P.C.B.)
Marked
VBATT
R376
R352
C353
L351
R377
R351
JTAG
R243
R231
TX
C209
RX
R207
R206
VSSVSS
C241
R209
R205
R241
5
R226
C244
C226
C243
C377
C303
C304
C315
R315
C316
R317
R314
C314
C317
R312
R318
C208
R334
C336
C305
C333
R333
C307
R228
C231
C306
R208
C222
R222
D231
IC221
R232
Q231
C221
R223
D223
C223
CHG2
1
L352
C313
C311
C312
Q362
R242
C242
Q363
R362
R361R363
R354
C354
D313
D312
R368
R367
R366
R364
IC241
D361
Q361
Q243
R230
CHG1
C206
R340
100
Q221
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C340
TEST
R224
C224
RA201
75
C202
Q251Q252 Q253
RA251
R251 R252
IC201
TXO
C212C215C201
R225
C219
C214
RESET
C225
X201
R201
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251
MOE
R258 R261
R257
R256
C205
50
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C246
1
C204
R204
R203
RSSI
R234
R249
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IC249
L211
L326
L327
D326
D327
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
C371
IC371
C372
SP_PHONE
RECEIVER
C361
1
R331
R332
C332
L332
C211
C373
Q331
CN331
D373
C384
IC373
Q373
C334
C381
R324
C322
IC381
L334
D324
D323
L373
C335
C321
R325
R323
L331
C382
1
C383
PbF
IC374
C227
R227
CA274
C273
R273
R272
C272
CA271
ANT
SHIELD
PQUP11285Z
FL901
IC901
A
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
3 CAUTION
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacturer´s Instructions.
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KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
4 OPERATING INSTRUCTIONS
4.1. Battery
4.1.1. Battery Installation
4.1.2. Battery Charge
4.1.3. Recharging the Battery
Note for service:
The battery strength may not be indicated correctly if the battery is disconnected and connected again, even after it is fully
charged. In that case, by recharging the battery as mentioned above, you will get a correct indication of the battery strength.
4.1.4. Battery Strength
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4.1.5. Battery Replacement
KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
4.1.6. Battery Performance
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KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
4.2. Location of Controls
4.2.1. Base Unit
4.2.2. Handset
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4.2.3. Charger Unit (KX-TG2822LA only)
KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
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KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
4.3. Displays
4.3.1. Display Items
4.3.2. Troubleshooting (Handset LCD)
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4.4. Settings
4.4.1. Connections
KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
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KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
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4.4.2. Guide to Handset Programming
KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
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KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
4.4.3. Direct Commands
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KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
4.5. Troubleshooting
If the handset display shows error messages, see “Troubleshooting (Handset LCD) (P.10)” for the Cause & Solution.
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KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
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KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
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KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
5 DISASSEMBLY INSTRUCTIONS
5.1. Base Unit
Shown in Fig.-To Remove -Remove -
1Cabinet CoverScrews (2.6 × 12).....(A) × 4
Main P. C. BoardScrews (2.6 × 8).......(B) × 2
Tapes and Solders
Main P. C. Board
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5.2. Handset
KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB
Shown in Fig.-To Remove -Remove -
2Cabinet CoverScrews (2 × 10).............(C) × 2
3Follow the procedure.
4Main P. C. BoardTape and Solders
Screws (2 × 10).............(D) × 3
Charge Terminals
Main P. C. Board
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KX-TG282 0LAB / KX-TG2822L AB / KX-TGA243L AB / KX-TGA2 46LAB