Design and spec ifi cations are e ach subj ect to change w ithout notic e. Ask f actory for t he cur rent technical speci fi cations before purchase and/or use.
Should a sa fet y concern ar ise reg arding th is product, please be sure to c ontac t us immediately.
Feb. 2008
Page 2
■ Circuit Confi guration (No Polarity)
2 mode Noise Filters
43
12
43
12
■ Ratings
Part Number
EXC24CP121U
EXC24CP221U
EXC24CB221U
EXC24CB102U
Part Number
EXC24CN601X
Impedance (Open mode)
(액) at 100 MHzTolerance(%)
120
2203500.4
2201000.7
1000501.5
Impedance (Common mode)
(액) at 100 MHzTolerance(%)
600±2552000.9
■ Impedance Characteristics (Typical)
EXC24CP121U
●
500
400
300
200
Impedance(액)
100
0
EXC24CB221U
●
500
400
300
200
Impedance(액)
100
0
110100100010000
Open mode
110100100010000
Normal mode
Open mode
Common mode
Frequency(MHz)
Normal mode
Common mode
Frequency(MHz)
Rated Voltage
(V DC)
±255
Rated Voltage
(V DC)
EXC24CP221U
●
500
400
300
200
Impedance(액)
100
0
110100100010000
EXC24CB102U
●
1200
1000
800
600
400
Impedance(액)
200
0
110100100010000
Rated Current
(mA DC)
5000.3
Rated Current
(mA DC)
Normal mode
Open mode
Common mode
Frequency(MHz)
Open mode
Frequency(MHz)
Normal mode
Common mode
DC Re sis tance
(액) max.
DC Re sis tance
(액) max.
Measurement Circuit
●
(A)Open Mode(B)Common Mode(C)Normal Mode
Z
Design and spec ifi cations are e ach subj ect to change w ithout notic e. Ask f actory for t he cur rent technical speci fi c ations before purchase and/or use.
Should a sa fet y concern ar ise reg arding th is product, please be sure to c ontac t us immediately.
Z
Z
Feb. 2008
Page 3
(A)Open Mode
(C)Differential Mode
(B)Common Mode
Z
Z
Z
■ Impedance Characteristics (Typical)
2 mode Noise Filters
EXC24CN601X
●
1600
1400
1200
1000
800
600
Impedance(액)
400
200
–
110100100010000
Differential mode
Open mode
Common mode
Frequency(MHz)
Measurement Circuit
●
■ Packaging Methods (Taping)
● Standard Quantity
Part NumberKind of TapingPitch (P1)Quantity
EXC24CP
EXC24CB
EXC24CN
Embossed Carrier Taping
●
t1
Sprocket holeCompartment
t2
Chip component
첸첸첸
첸첸첸
첸첸첸
U
U
X
Embossed Carrier Taping4 mm5000 pcs./reel
Pressed Carrier Taping2 mm10000 pcs./reel
Pressed Carrier Taping
●
φD0
A
B
P1P2P0
FE
W
Ta pe running direction
Sprocket hole
B
A
t2
Chip component
P0 P2
P1
Tape running direction
Compartment
φD0
E
F
W
●
Embossed Carrier Dimensions (mm)
Pressed Carrier Dimensions (mm)
Standard Reel Dimensions (mm)
Design and spec ifi cations are e ach subj ect to change w ithout notic e. Ask f actory for t he cur rent technical speci fi c ations before purchase and/or use.
Should a sa fet y concern ar ise reg arding th is product, please be sure to c ontac t us immediately.
Recommendations and precautions are described below.
Recommended soldering conditions for refl ow
●
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Peak
2 mode Noise Filters
Dimension (mm)
A1.50 to 1.90
B1.10
C0.50
D0.50 to 0.70
E0.40
F0.30
For soldering (Example : Sn- 37Pb)
Temp eratureTime
Preheating140 °C to 160 °C60 s to 120 s
Main heatingAbove 200 °C30 s to 40 s
Peak235 ± 10 °Cmax. 10 s
Preheating
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Temp eratureTime
Temperature
Heating
Preheating150 °C to 170 °C60 s to 120 s
Main heatingAbove 230 °C30 s to 40 s
Peakmax. 260 °Cmax. 10 s
Time
<Repair with hand soldering>
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
●
each electrode for 3 seconds or less.
Never touch this product with the tip of a soldering iron.
●
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog.
1. When possible, do not mount 2 mode Noise Filters (hereafter called the fi lters) by fl ow soldering. It is highly
possible that fl ow soldering may cause bridges between the electrodes.
2. Use rosin-based fl ux or halogen-free fl ux.
3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
4. Do not apply shock to the fi lters or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies
may be chipped, affecting their performance. Excessive me chanical stress may damage the fi lters. Handle
with care.
5. Store the fi lters in a lo ca tion with a temperature ranging from −5 °C to +40 °C and a relative humidity of 40 % to 60 %,
where there are no rapid changes in temperature or humidity.
6. Use the fi lters within half a year after the date of the outgoing inspection indicated on the packages.
Design and spec ifi cations are e ach subj ect to change w ithout notic e. Ask f actory for t he cur rent technical speci fi c ations before purchase and/or use.
Should a sa fet y concern ar ise reg arding th is product, please be sure to c ontac t us immediately.
Jul. 2008
Page 5
Safety Precautions (Common precautions for EMI Filters, ESD Suppressors, Fuses, and MR Sensors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifi cations described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant dam age, such as damage to
vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
Systems equipped with a protection circuit and a protection device
✽
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault
✽
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general elec tron ic equipment
(e.g. AV equipment, home electric appliances, offi ce equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl
4. Electric Static Discharge (ESD) Environment (except ESD Suppressors)
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or infl ammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
, H2S, NH3, SO2, or NO
2
2
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al
at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the out go ing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifi cations. The performance of Thermal Cut offs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl
, H2S, NH3, SO2, or NO
2
2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Jan. 2008
– EL113 –
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