NL37WZ16
Triple Buffer
The NL37WZ16 is a high performance buffer with inputs operating
from a 1.65 to 5.5 V supply.
The NL37WZ16 can be used as a line receiver which will receive
slow input signals.
Features
• Designed for 1.65 V to 5.5 V V
Operation
CC
• Over Voltage Tolerant Inputs and Outputs
• LVTTL Compatible − Interface Capability with 5 V TTL Logic
CC
= 3 V
with V
• LVCMOS Compatible
• 24 mA Balanced Output Sink and Source Capability
• Near Zero Static Supply Current Substantially Reduces System
Power Requirements
• Current Drive Capability is 24 mA at the Outputs
• Chip Complexity: FET = 94
• Pb−Free Package is Available
IN A1
OUT Y3
IN A2
GND
1
2
3
45
Figure 1. Pinout (Top View)
8
7
6
V
CC
OUT Y1
IN A3
OUT Y2
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MARKING
DIAGRAM
8
1
US8
US SUFFIX
CASE 493
LR = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
8
LR M G
G
1
PIN ASSIGNMENT
1
IN A1
OUT Y3
2
3IN A2
GND
4
OUT Y2
5
IN A3
6
OUT Y1
7
8V
CC
IN A1
IN A2
IN A3
1
1
1
Figure 2. Logic Symbol
© Semiconductor Components Industries, LLC, 2008
July, 2008 − Rev. 5
OUT Y1
OUT Y2
OUT Y3
FUNCTION TABLE
A Input Y Output
L
H
L
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
1 Publication Order Number:
NL37WZ16/D
NL37WZ16
MAXIMUM RATINGS
Symbol Parameter Value Unit
V
CC
V
I
V
O
I
IK
I
OK
I
O
I
CC
I
GND
T
STG
T
L
T
J
q
JA
P
D
MSL Moisture Sensitivity Level 1
F
R
V
ESD
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
absolute maximum rating must be observed.
1. I
O
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
3. Tested to EIA/JESD22−A114−A.
4. Tested to EIA/JESD22−A115−A.
5. Tested to JESD22−C101−A.
DC Supply Voltage *0.5 to )7.0 V
DC Input Voltage *0.5 ≤ V
DC Output Voltage Output in Z or LOW State (Note 1) *0.5 ≤ V
≤ )7.0 V
I
≤ 7.0 V
O
DC Input Diode Current VI < GND *50 mA
DC Output Diode Current VO < GND *50 mA
DC Output Sink Current $50 mA
DC Supply Current per Supply Pin $100 mA
DC Ground Current per Ground Pin $100 mA
Storage Temperature Range *65 to )150
Lead Temperature, 1 mm from Case for 10 Seconds 260
Junction Temperature under Bias )150
Thermal Resistance (Note 2) 333
Power Dissipation in Still Air at 85_C
200 mW
_C
_C
_C
_C/W
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
ESD Withstand Voltage Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
> 2000
> 200
N/A
V
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
CC
V
I
V
O
T
A
Dt/DV
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
Supply Voltage Operating
Data Retention Only
1.65
1.5
5.5
5.5
Input Voltage (Note 6) 0 5.5 V
Output Voltage (HIGH or LOW State) 0 5.5 V
Operating Free−Air Temperature *40 )85
Input Transition Rise or Fall Rate VCC = 2.5 V $0.2 V
V
= 3.0 V $0.3 V
CC
VCC = 5.0 V $0.5 V
0
0
0
20
10
5
V
_C
ns/V
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2
NL37WZ16
DC ELECTRICAL CHARACTERISTICS
V
CC
Symbol Parameter Condition (V) Min Typ Max Min Max Unit
V
IH
V
IL
V
OH
High−Level Input
Voltage
Low−Level Input
Voltage
High−Level Output
Voltage
V
= VIH or V
IN
IL
1.65 to 5.5 0.7 V
1.65 to 5.5 0.3
IOH = −100 mA
1.65 to 5.5 VCC − 0.1 V
IOH = −4 mA 1.65 1.4 1.50 1.55
IOH = −8 mA 2.3 1.9 2.1 1.9
IOH = −12 mA 2.7 2.2 2.4 2.2
IOH = −16 mA 3.0 2.4 2.7 2.4
IOH = −24 mA 3.0 2.3 2.5 2.3
IOH = −32 mA 4.5 3.8 4.0 3.8
V
OL
Low−Level Output
Voltage
V
= VIH or V
IN
IL
IOL = 100 mA
IOL = 4 mA 1.65 0.24 0.24
1.65 to 5.5 0.1 0.1
IOL = 8 mA 2.3 0.20 0.3 0.3
IOL = 12 mA 2.7 0.22 0.4 0.4
IOL = 16 mA 3.0 0.28 0.4 0.4
IOL = 24 mA 3.0 0.38 0.55 0.55
IOL = 32 mA 4.5 0.42 0.55 0.55
I
I
I
IN
OFF
CC
Input Leakage Current VIN = VCC or GND 0 to 5.5 $0.1 $1.0
Power Off−Output
Leakage Current
Quiescent Supply
V
= 5.5 V 0 1 10
OUT
VIN = VCC or GND 5.5 1 10
Current
TA = 25°C *40°C ≤ TA ≤ 85°C
CC
0.7 V
CC
VCC − 0.1
CC
V
CC
0.3 V
CC
V
V
V
V
mA
mA
mA
AC ELECTRICAL CHARACTERISTICS t
Symbol
t
PLH
t
PHL
Parameter
Propagation Delay
(Figure 3 and 4)
= tF = 2.5 ns; CL = 50 pF; RL = 500 W
R
Condition
RL = 1 MW, C
RL = 1 MW, C
RL = 1 MW, C
RL = 500 W, C
RL = 1 MW, C
RL = 500 W, C
= 15 pF
L
= 15 pF
L
= 15 pF
L
= 50 pF
L
= 15 pF
L
= 50 pF
L
VCC (V)
1.8 $ 0.15
2.5 $ 0.2
3.3 $ 0.3
5.0 $ 0.5
Min
1.8
1.0
0.8
1.2
0.5
0.8
TA = 25°C
Typ
6.0
3.0
2.3
3.0
1..8
2.4
*40°C ≤ TA ≤ 85°C
Max
7.9
5.2
3.6
4.6
2.9
3.8
Min
1.8
1.0
0.8
1.2
0.5
0.8
Max
8.8
5.8
4.0
5.1
3.2
4.2
Unit
ns
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Unit
C
IN
C
PD
7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
power consumption; P
Input Capacitance VCC = 5.5 V, VI = 0 V or V
CC
Power Dissipation Capacitance (Note 7) 10 MHz, VCC = 3.3 V, VI = 0 V or V
10 MHz, VCC = 5.5 V, VI = 0 V or V
= CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic
)
= CPD V
D
2
fin ) ICC VCC.
CC
CC(OPR
CC
CC
7.0 pF
9
pF
11
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3
NL37WZ16
V
V
A
50%
CC
GND
t
PLH
Y
50% V
CC
t
PHL
PULSE
GENERATOR
R
CC
DUT
T
C
R
L
L
t
= tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
R
Figure 3. Switching Waveforms
RT = Z
of pulse generator (typically 50 W)
OUT
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
PROPAGATION DELAYS
Device Order Number Package Type Tape and Reel Size
NL37WZ16US US8 178 mm, 3000 Units / Tape & Reel
NL37WZ16USG US8
178 mm, 3000 Units / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
†
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4
−T−
SEATING
PLANE
A
58
P
D
G
K
0.10 (0.004) XY
M
41
−X−
LB
T
−Y−
C
0.50
0.0197
NL37WZ16
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493−02
ISSUE B
J
DETAIL E
R
S
U
H
T0.10 (0.004)
N
V
F
DETAIL E
SOLDERING FOOTPRINT*
3.8
0.15
1.8
0.07
NOTES:
R 0.10 TYP
M
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
MILLIMETERS
DIMAMIN MAX MIN MAX
1.90 2.10 0.075 0.083
B 2.20 2.40 0.087 0.094
C 0.60 0.90 0.024 0.035
D 0.17 0.25 0.007 0.010
F 0.20 0.35 0.008 0.014
G 0.50 BSC 0.020 BSC
H 0.40 REF 0.016 REF
J 0.10 0.18 0.004 0.007
K 0.00 0.10 0.000 0.004
L 3.00 3.20 0.118 0.126
M 0 6 0 6
____
N 5 10 5 10
____
P 0.23 0.34 0.010 0.013
R 0.23 0.33 0.009 0.013
S 0.37 0.47 0.015 0.019
U 0.60 0.80 0.024 0.031
V 0.12 BSC
INCHES
0.005 BSC
0.30
0.012
1.0
0.0394
mm
ǒ
SCALE 8:1
inches
Ǔ
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NL37WZ16/D
5
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