ON Semiconductor NCP1654 User Manual

Power Factor Controller for Compact and Robust, Continuous Conduction Mode Pre-Converters
The NCP1654 is a controller for Continuous Conduction Mode (CCM) Power Factor Correction stepup preconverters. It controls the power switch conduction time (PWM) in a fixed frequency mode and in dependence on the instantaneous coil current.
Housed in a SO8 package, the circuit minimizes the number of external components and drastically simplifies the PFC implementation. It also integrates high safety protection features that make the NCP1654 a driver for robust and compact PFC stages like an effective input power runaway clamping circuitry.
Features
IEC6100032 Compliant
Average Current Continuous Conduction Mode
Fast Transient Response
Very Few External Components
Very Low Startup Currents (< 75 mA)
Very Low Shutdown Currents (< 400 mA)
Low Operating Consumption
±1.5 A Totem Pole Gate Drive
Accurate Fully Integrated 65/133/200 kHz Oscillator
Latching PWM for cyclebycycle DutyCycle Control
Internally Trimmed Internal Reference
Undervoltage Lockout with Hysteresis
SoftStart for Smoothly Startup Operation
Shutdown Function
Pin to Pin Compatible with Industry Standard
This is a PbFree Device
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8
1
SO−8
D SUFFIX
CASE 751
MARKING DIAGRAM
8
54Bxx ALYW
G
1
xx = 65, 133 or 200 A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package
PIN CONNECTIONS
Ground
BrownOut
V
CS
M
1
2
3
4
(Top View)
Driver
8
V
7
CC
Feedback
6
V
5
control
Safety Features
Inrush Currents Detection
Overvoltage Protection
Undervoltage Detection for Open Loop Detection or Shutdown
BrownOut Detection
SoftStart
Accurate Overcurrent Limitation
Overpower Limitation
Typical Applications
Flat TVs, PC Desktops
AC Adapters
White Goods, other Offline SMPS
© Semiconductor Components Industries, LLC, 2016
March, 2021 Rev. 6
1 Publication Order Number:
ORDERING INFORMATION
Device Package Shipping
NCP1654BD65R2G 2500 /
NCP1654BD133R2G 2500 /
NCP1654BD200R2G 2500 /
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
SO−8
(PbFree)
SO−8
(PbFree)
SO−8
(PbFree)
Tape & Reel
Tape & Reel
Tape & Reel
NCP1654/D
NCP1654
MAXIMUM RATINGS TABLE
Symbol Pin Rating Value Unit
DRV 8 Output Drive Capability Source
Output Drive Capability Sink
V
CC
7 Power Supply Voltage, VCC pin, continuous voltage 0.3, +20 V
7 Transient Power Supply Voltage, duration < 10 ms, IVCC < 10 mA +25 V
Vin 2, 3, 4, 5, 6 Input Voltage 0.3, +10 V
Power Dissipation and Thermal Characteristics D suffix, Plastic Package, Case 751
PD(SO)
R
q
JA
T
T
Jmax
T
Smax
T
Lmax
(SO)
J
Maximum Power Dissipation @ TA = 70°C Thermal Resistance JunctiontoAir
Operating Junction Temperature Range −40 to +125 °C
Maximum Junction T
emperature
Storage Temperature Range −65 to +150 °C
Lead Temperature (Soldering, 10 s) 300 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) 2000 V per JEDEC standard JESD22, Method A114E Machine Model (MM) 200 V (except pin#7 which complies 150 V) per JEDEC standard JESD22, Method A115A.
2. This device contains Latchup Protection and exceeds ±100 mA per JEDEC Standard JESD78.
1.5 +1.5
450 178
mW
°C/W
150 °C
A
TYPICAL ELECTRICAL CHARACTERISTICS TABLE (V
= 15 V, TJ from 40°C to +125°C, unless otherwise specified) (Note 3)
CC
Symbol Rating Min Typ Max Unit
GATE DRIVE SECTION
R
OH
R
OL
T
r
T
f
Source Resistance @ I
Sink Resistance @ I
= 100 mA 9.0 20 W
source
= 100 mA 6.6 18 W
sink
Gate Drive Voltage Rise Time from 1.5 V to 13.5 V (C
Gate Drive Voltage Fall Time from 13.5 V to 1.5 V (C
= 2.2 nF) 60 ns
L
= 2.2 nF) 40 ns
L
REGULATION BLOCK
V
REF
I
EA
G
EA
IBpin6 Pin 6 Bias Current @ VFB = V
V
control
V
control(max)
V
control(min)
DV
control
V
L / V
OUT
H
L / V
OUT
I
BOOST
Voltage Reference 2.425 2.5 2.575 V
Error Amplifier Current Capability ±28 mA
Error Amplifier Gain 100 200 300 mS
REF
500 500 nA
Pin5 Voltage Maximum Control Voltage @ V Minimum Control Voltage @ V
REF
REF
DV
Ratio (V
Ratio (V
control
= V
control(max)
Low Detect Thresold / V
OUT
Low Detect Hysteresis / V
OUT
Pin 5 Source Current when (V
V
= 2 V
FB
= 3 V
FB
control(min)
) 94 95 96 %
REF
) 0.5 %
REF
Low Detect) is activated 190 228 260 mA
OUT
2.7
3.6
0.6
3.0
3.3
CURRENT SENSE BLOCK
V
I
S(OCP)
S
Current Sense Pin Offset Voltage, (ICS = 100 mA) 10 mV
Overcurrent Protection Threshold 185 200 215 mA
POWER LIMITATION BLOCK
I
x V
CS
I
CS(OPL1)
I
CS(OPL2)
Overpower Limitation Threshold 200 mVA
BO
Overpower Current Threshold (VBO = 0.9 V, VM = 3 V) Overpower Current Threshold (VBO = 2.67 V, VM = 3 V)
186
62
222
75
308 110
PWM BLOCK
Dcycle Duty Cycle Range 097 %
V
mA
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2
NCP1654
TYPICAL ELECTRICAL CHARACTERISTICS TABLE (V
= 15 V, TJ from 40°C to +125°C, unless otherwise specified) (Note 3)
CC
Symbol UnitMaxTypMinRating
OSCILLATOR / RAMP GENERATOR BLOCK
fsw Switching Frequency
65 kHz 133 kHz 200 kHz
58 120 180
65 133 200
146 220
kHz
72
BROWNOUT DETECTION BLOCK
V
V
BOH
BOL
I
IB
BrownOut Voltage Threshold (rising) 1.22 1.30 1.38 V
BrownOut Voltage Threshold (falling) 0.65 0.7 0.75 V
Pin 4 Input Bias Current @ VBO = 1 V 500 500 nA
CURRENT MODULATION BLOCK
I
M1
I
M2
Multiplier Output Current (V Multiplier Output Current (V
(@ 0 125°C)
control
control
= V
= V
control(max)
control(max)
, VBO = 0.9 V, I
, VBO = 0.9 V, I
(@ 40 125°C)
I
M3
I
M4
Multiplier Output Current (V Multiplier Output Current (V
control control
= V = V
control(min) control(min)
+ 0.2 V, VBO = 0.9 V, I + 0.2 V, VBO = 0.9 V, I
CS
= 25 mA)
CS
= 75 mA)
CS CS
= 25 mA = 75 mA
1.5
1.5
1.9
4.7
4.7
28.1
84.4
8.8
9.8
mA
OVERVOLTAGE PROTECTION
V
OVP
T
/ V
OVP
Ratio (Overvoltage Threshold / V
REF
Propagation Delay (VFB – 107% V
) 103 105 107 %
REF
) to Drive Low 500 ns
REF
UNDERVOLTAGE PROTECTION / SHUTDOWN
V
UVP(on)/VREF
V
UVP(off)/VREF
V
UVP(H)
T
UVP
UVP Activate Threshold Ratio (TJ = 0°C to +105°C) 4 8 12 %
UVP Deactivate Threshold Ratio (TJ = 0°C to +105°C) 6 12 18 %
UVP Lockout Hysteresis 4 %
Propagation Delay (VFB < 8% V
) to Drive Low 500 ns
REF
THERMAL SHUTDOWN
T
SD
H
SD
Thermal Shutdown Threshold 150 °C
Thermal Shutdown Hysteresis 30 °C
VCC UNDERVOLTAGE LOCKOUT SECTION
V
CC(on)
V
CC(off)
V
CC(H)
StartUp Threshold (Undervoltage Lockout Threshold, VCC rising) 9.6 10.5 11.4 V
Disable Voltage after Turn−On (Undervoltage Lockout Threshold, VCC falling) 8.25 9.0 9.75 V
Undervoltage Lockout Hysteresis 1.0 1.5 V
DEVICE CONSUMPTION
Power Supply Current:
I
STUP
I
CC1
I
CC2
I
STDN
StartUp (@ VCC = 9.4 V) Operating (@ VCC = 15 V, no load, no switching) Operating (@ VCC = 15 V, no load, switching) Shutdown Mode (@ VCC = 15 V and V
FB
= 0 V)
3.7
4.7
300
75
5.0
6.0
400
mA mA mA
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. The above specification gives the targeted values of the parameters. The final specification will be available once the complete circuit characterization has been performed.
I
V
cs
NOTE:
IM+
4 ǒV
control
* V
BO
control(min)
Ǔ
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3
NCP1654
DETAILED PIN DESCRIPTIONS
Pin Symbol Name Function
1 GND Ground
2 V
in
3 CS Current Sense
4 V
5 V
6 V
7 V
BO
control
FB
CC
8 DRV Drive Output The high current capability of the totem pole gate drive (±1.5 A) makes it suitable to effectively
Multiplier
Voltage
This pin provides a voltage VM for the PFC duty cycle modulation. The input impedance of the PFC circuits is proportional to the resistor RM externally connected to this pin. The device operates in average current mode if an external capacitor CM is connected to the pin. Otherwise, it operates in peak current mode.
This pin sources a current ICS which is proportional to the inductor current IL. The sense
Input
current I modulation. When ICS goes above 200 mA, OCP is activated and the Drive Output is disabled.
is for overcurrent protection (OCP), overpower limitation (OPL) and PFC duty cycle
CS
BrownOut / In Connect a resistor network among the rectified input voltage, BO pin, and ground. And connect
a capacitor between BO pin and ground. BO pin detects a voltage signal proportional to the average input voltage.
When VBO goes below V (brownout), turns off the output driver and keeps it in low state until VBO exceeds V
, the circuit that detects too low input voltage conditions
BOL
BOH
This signal which is proportional to the RMS input voltage Vac is also for overpower limitation (OPL) and PFC duty cycle modulation.
Control Voltage /
SoftStart
FeedBack /
Shutdown
The voltage of this pin V external type2 compensation components to limit the V to achieve near unity power factor.
The device provides no output when V increases slowly (softstart).
directly controls the input impedance. This pin is connected to
control
control
< V
control(min)
bandwidth typically below 20 Hz
control
. When it starts operation, the power
This pin receives a feedback signal VFB that is proportional to the PFC circuits output voltage. This information is used for both the output regulation, the overvoltage protection (OVP), and output undervoltage protection (UVP) to protect the system from damage at feedback abnormal situation.
When VFB goes above 105% V When VFB goes below 8% V
Supply Voltage This pin is the positive supply of the IC. The circuit typically starts to operate when V
exceeds 10.5 V and turns off when VCC goes below 9 V. After start−up, the operating range is
, OVP is activated and the Drive Output is disabled.
REF
, the device enters a lowconsumption shutdown mode.
REF
CC
9 V up to 20 V.
drive high gate charge power MOSFET.
.
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AC
Input
EMI
Filter
NCP1654
V
in
I
IN
+
in
L
C
filter
R
SENSE
I
L
I
L
+
C
bulk
Output
Voltage
(V
OUT
)
R
boU
R
R
Vcontrol
C
P
R
boL
fbU
fbL
C
+
OVP
-
105% Vref
UVP
-
+
8% Vref with 4% Vref Vdd
Hysteresis
Soft Start
OPL
Vdd
200 mA
BO
UVLO
Undervoltage
LockOut
S
FB
6
Q
R
Reference
Block
Vref
-
Vref
+
Vout Low Detect
OTA
-
+
±28 mA
+
UVP BO
95% Vref
5
R
Z
Vcontrol(min)
C
Z
Thermal
Off
Bias Block
Iref Vdd
Output Buffer
Vcc
7
8
DRV
1
GND
Shutdown
BO
BO
4
-
BO
+
VboH / VboL VboH = 1.3 V, VboL = 0.7 V
Vdd
OL
OVP
Vref
Vramp
-
+
Vdd
Current Mirror
Ics
Ics
Vbo
Fault
Vdd
Q
PWM
R
Latch
RS
Iref
+
-
Vref/10% Vref
Ics
R
CS
CS
3
Ics*Vbo > 200 mVA
OPL
Division
OL
Ics > 200 mA
+
C1
S1
65/133/200 kHz
Oscillator
Im = (Ics*Vbo) / (4*(Vcontrol Vcontrol(min))
Vm
R
2
M
C
M
OCP
Figure 1. Functional Block Diagram
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NCP1654
TYPICAL CHARACTERISTICS
10
8
6
, GATE DRIVE
OL
4
& R
RESISTANCE (W)
OH
R
2
0
32
30
28
(A)
26
EA_source
I
24
2.60
(V)
REF
V
2.55
2.50
2.45
2.40
Figure 3. Reference Voltage vs. Temperature
R
OH
R
OL
10075 12550250−25−50
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 2. Gate Drive Resistance vs.
Temperature
20
22
24
(A)
26
EA_sink
I
28
1251007550250−25−50
22
20
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
10075 12550250−25−50
Figure 4. Source Current Capability of the
Error Amplifier vs. Temperature
300
250
(mS)
200
EA
G
150
100
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
1251007550250−25−50 10075 12550250−25−50
30
32
150
100
50
0
pin6 (nA)
B
I
50
100
150
Figure 5. Sink Current Capability of the Error
Amplifier vs. Temperature
Figure 6. Error Amplifier Gain vs. Temperature Figure 7. Feedback Pin Current vs.
Temperature (@V
fb
= V
REF
10075 12550250−25−50
)
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NCP1654
TYPICAL CHARACTERISTICS
4.0
3.9
3.8
(V)
3.7
3.6
CONTROL(max )
V
3.5
3.4
3.3
95.1
95.0
94.9
94.8
(%)
REF
94.7
/ V
94.6
outL
V
94.5
94.4
94.3
Figure 10. Ratio (V
215
3.3
3.2
3.1
(V)
3.0
CONTROL
2.9
DV
2.8
10075 12550250−25−50
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 8. V
Maximum Voltage vs.
control
Temperature
1007550 125250−25−50
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Low Detect Threshold /
OUT
) vs. Temperature
V
REF
2.7
260
250
240
230
(mA)
220
Boost
I
210
200
190
306
50
Figure 9. V
0−25
Maximum Swing (DV
control
vs. Temperature
Figure 11. Pin 5 Source Current when (V
Low Detect) is Activated vs. Temperature
10075 1255025
CONTROL
10075 12550250−25−50
OUT
)
210
205
(mA)
200
S(OCP)
I
195
190
185
50 0−25 10075 1255025−50
0−25
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
10075 1255025
Figure 12. OverCurrent Protection Threshold
vs. Temperature
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286
266
(mA)
246
CS(OPL1)
I
226
206
186
Figure 13. OverPower Current Threshold
= 0.9 V & Vm = 3 V) vs. Temperature
(@V
BO
7
NCP1654
TYPICAL CHARACTERISTICS
110
100
90
(mA)
80
CS(OPL2)
I
70
60
72
70
68
66
(kHz)
64
SW
f
62
100
99
98
97
96
MAXIMUM DUTY CYCLE (%)
140
138
136
134
(kHz)
132
SW
f
130
95
Figure 15. Maximum Duty Cycle vs.
Temperature
1251007550250−25−50
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 14. Over−Power Current Threshold
= 2.67 V & Vm = 3 V) vs. Temperature
(@V
BO
1251007550250−25−50
60
58
TJ, JUNCTION TEMPERATURE (°C)
Figure 16. Switching Frequency vs.
Temperature (65 kHz Version)
210
205
200
195
(kHz)
SW
f
190
185
180
TJ, JUNCTION TEMPERATURE (°C)
Figure 18. Switching Frequency vs.
Temperature (200 kHz Version)
128
10075 12550250−25−50
126
10075 12550250−25−50
TJ, JUNCTION TEMPERATURE (°C)
Figure 17. Switching Frequency vs.
Temperature (133 kHz Version)
10075 12550250−25−50
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