ON Semiconductor MJD112, MJD117 Service Manual

MJD112 (NPN) MJD117 (PNP)
Preferred Device
Complementary Darlington Power Transistors
DPAK For Surface Mount Applications
Designed for general purpose power and switching such as output or driver stages in applications such as switching regulators, converters, and power amplifiers.
Features
Lead Formed for Surface Mount Applications in Plastic Sleeves
(No Suffix)
Straight Lead Version in Plastic Sleeves (“−1” Suffix)
Electrically Similar to Popular TIP31 and TIP32 Series
Pb−Free Packages are Available
MAXIMUM RATINGS
Rating Symbol Max Unit
Collector−Emitter Voltage V Collector−Base Voltage V Emitter−Base Voltage V Collector Current − Continuous
− Peak Base Current I Total Power Dissipation @ TC = 25°C
Derate above 25°C
Total Power Dissipation (Note1)
@ TA = 25°C Derate above 25°C
Operating and Storage Junction
Temperature Range
CEO
P
P
TJ, T
CB EB
I
C
B
D
D
stg
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Case Thermal Resistance, Junction−to−Ambient
(Note 1)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. These ratings are applicable when surface mounted on the minimum pad sizes recommended.
R
q
JC
R
q
JA
100 Vdc 100 Vdc
5 Vdc 2
4
50 mAdc 20
0.16
1.75
0.014
−65 to + 150 °C
6.25 °C/W
71.4 °C/W
Adc
W
W/°C
W
W/°C
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SILICON
POWER TRANSISTORS
2 AMPERES
100 VOLTS, 20 WATTS
MARKING
DIAGRAMS
4
YWW
2
1
3
DPAK
CASE 369C
4
1
2
3
DPAK−3
CASE 369D
Y = Year WW = Work Week x = 2 or 7 G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.
Preferred devices are recommended choices for future use and best overall value.
J11xG
YWW
J11xG
© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 7
1 Publication Order Number:
MJD112/D
MJD112 (NPN) MJD117 (PNP)
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ELECTRICAL CHARACTERISTICS (T
= 25_C unless otherwise noted)
C
Characteristic
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (Note 2)
ООООООООООООООООООО
(IC = 30 mAdc, IB = 0)
Collector Cutoff Current
(VCE = 50 Vdc, IB = 0)
ООООООООООООООООООО
Collector Cutoff Current
(VCB = 100 Vdc, IE = 0)
Emitter Cutoff Current
ООООООООООООООООООО
(VBE = 5 Vdc, IC = 0)
Collector−Cutoff Current
(VCB = 80 Vdc, IE = 0)
ООООООООООООООООООО
Emitter−Cutoff Current
(VBE = 5 Vdc, IC = 0)
ON CHARACTERISTICS
DC Current Gain
ООООООООООООООООООО
(IC = 0.5 Adc, VCE = 3 Vdc) (IC = 2 Adc, VCE = 3 Vdc)
ООООООООООООООООООО
(IC = 4 Adc, VCE = 3 Vdc)
Collector−Emitter Saturation Voltage
ООООООООООООООООООО
(IC = 2 Adc, IB = 8 mAdc) (IC = 4 Adc, IB = 40 mAdc)
ООООООООООООООООООО
Base−Emitter Saturation Voltage
(IC = 4 Adc, IB = 40 mAdc)
Symbol
V
CEO(sus)
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I
CEO
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I
CBO
I
EBO
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I
CBO
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I
EBO
h
FE
ÎÎÎ
ÎÎÎ
V
CE(sat)
ÎÎÎ
ÎÎÎ
V
BE(sat)
Min
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100
ÎÎ
ÎÎ
ÎÎ
ÎÎ
500
1000
ÎÎ
200
ÎÎ
ÎÎ
Max
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20
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20
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2
10
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2
Î
12,000
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2 3
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4
Unit
Vdc
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mAdc
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mAdc
mAdc
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mAdc
ÎÎ
mAdc
ÎÎ
ÎÎ
Vdc
ÎÎ
ÎÎ
Vdc
Base−Emitter On Voltage
ООООООООООООООООООО
(IC = 2 Adc, VCE = 3 Vdc)
V
BE(on)
ÎÎÎ
DYNAMIC CHARACTERISTICS
Current−Gain − Bandwidth Product
(IC = 0.75 Adc, VCE = 10 Vdc, f = 1 MHz)
ООООООООООООООООООО
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 0.1 MHz) MJD117
ООООООООООООООООООО
MJD112
f
T
ÎÎÎ
C
ob
ÎÎÎ
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
*These ratings are applicable when surface mounted on the minimum pad sizes recommended.
RB & RC VARIED TO OBTAIN DESIRED CURRENT LEVELS D1, MUST BE FAST RECOVERY TYPE, e.g.:
V
CC
−30 V
4
1N5825 USED ABOVE IB 100 mA MSD6100 USED BELOW IB 100 mA
V
2
APPROX
+8 V
0
V
1
51
APPROX
−12 V
tr, tf 10 ns DUTY CYCLE = 1%
25 ms
FOR td AND tr, D1 IS DISCONNECTED AND V2 = 0
FOR NPN TEST CIRCUIT REVERSE ALL POLARITIES.
R
D
B
1
+ 4 V
8 k
TUT
60
R
C
SCOPE
2
1
0.8
t, TIME (s)μ
0.6
0.4
0.2
0.04 0.2 40.1
PNP NPN
0.06 IC, COLLECTOR CURRENT (AMP)
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2.8
Vdc
ÎÎ
MHz
25
ÎÎ
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ÎÎ
pF
ÎÎ
VCC = 30 V
t
s
IC/IB = 250
0.4 2
200
Î
100
0.6 1
t
f
td @ V
ÎÎ
IB1 = I
B2
TJ = 25°C
t
= 0 V
BE(off)
r
Figure 1. Switching Times Test Circuit Figure 2. Switching Times
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2
1
ACTIVE−REGION SAFE−OPERATING AREA
0.7
0.5
0.3
0.2
0.1
0.07
0.05
r(t), EFFECTIVE TRANSIENT
0.03
0.02
THERMAL RESISTANCE (NORMALIZED)
0.01
0.01
10
7 5
3 2
1
0.7
0.5
0.3
0.2
0.1
, COLLECTOR CURRENT (AMP)
C
I
2
MJD112 (NPN) MJD117 (PNP)
D = 0.5
0.2
0.1
0.05
0.01
SINGLE PULSE
0.02 0.03 0.05 0.1 0.2 0.3 0.5 1 2 3 5 10 20 30 50 100 200 300 500 t, TIME OR PULSE WIDTH (ms)
R
= r(t) R
q
JC(t)
R
q
JC
D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t T
J(pk)
q
= 6.25°C/W
− TC = P
(pk) qJC(t)
JC
1
Figure 3. Thermal Response
TAT
C
25
2.5
100ms
500ms
1ms
BONDING WIRE LIMITED THERMAL LIMIT SECOND BREAKDOWN LIMIT
TJ = 150°C CURVES APPLY BELOW RATED V
5203
10730
VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)
5ms
dc
CEO
50 70 200
100
1.5
0.5
, POWER DISSIPATION (WATTS)
D
P
20
2
15
10
1
5
0
0
25
SURFACE
MOUNT
50 75 100 125 15
P
(pk)
t
1
DUTY CYCLE, D = t1/t
T
TA
T, TEMPERATURE (°C)
C
t
2
2
1000
Figure 4. Maximum Rated Forward Biased
Safe Operating Area
There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate I limits of the transistor that must be observed for reliable
C
− V
CE
operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate.
The data of Figures 5 and 6 is based on T
= 150_C; T
J(pk)
is variable depending on conditions. Second breakdown pulse limits are valid for duty cycles to 10% provided T
< 150_C. T
J(pk)
may be calculated from the data in
J(pk)
Figure 4. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown.
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Figure 5. Power Derating
200
100
70
C, CAPACITANCE (pF)
50
30
20
10
0.04
C
ib
PNP NPN
0.1 2 6 20
VR, REVERSE VOLTAGE (VOLTS)
1 4 10 40
0.60.40.20.06
C
TC = 25°C
C
ob
Figure 6. Capacitance
3
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