ON Semiconductor MC34064, MC33064, NCV33064 Technical data

MC34064, MC33064, NCV33064

Undervoltage Sensing Circuit

The MC34064 is an undervoltage sensing circuit specifically designed for use as a reset controller in microprocessor−based systems. It offers the designer an economical solution for low voltage detection with a single external resistor. The MC34064 features a trimmed−in−package bandgap reference, and a comparator with precise thresholds and built-in hysteresis to prevent erratic reset operation. The open collector reset output is capable of sinking in excess of 10 mA, and operation is guaranteed down to 1.0 V input with low standby current. The MC devices are packaged in 3−pin TO-92, micro size TSOP−5, 8−pin SOIC−8 and Micro8 surface mount packages. The NCV device is packaged in SOIC−8 and TO−92.

Applications include direct monitoring of the 5.0 V MPU/logic power supply used in appliance, automotive, consumer and industrial equipment.

Features

• Trimmed−In−Package Temperature Compensated Reference

• Comparator Threshold of 4.6 V at 25°C

• Precise Comparator Thresholds Guaranteed Over Temperature

• Comparator Hysteresis Prevents Erratic Reset

• Reset Output Capable of Sinking in Excess of 10 mA

• Internal Clamp Diode for Discharging Delay Capacitor

• Guaranteed Reset Operation with 1.0 V Input

• Low Standby Current

• Economical TO−92, TSOP−5, SOIC−8 and Micro8 Surface Mount

Packages

• NCV Prefix for Automotive and Other Applications Requiring Site

and Control Changes

• Pb−Free Packages are Available

Input

2 (2)

Reset

1 (1)

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Pin 1. Reset

PIN CONNECTIONS

Reset

Input

N.C.

Ground

(Top View)

TO−92

P SUFFIX

CASE 29

2. Input

3. Ground

SOIC−8

D SUFFIX

CASE 751

Micro8 DM SUFFIX CASE 846A

TSOP−5

SN SUFFIX

CASE 483

2. Input

3. Ground

4. NC

5. NC

N.C.

1.2 V

ref

3 (4)

GND

Pin numbers adjacent to terminals are for the 3−pin TO−92 package. Pin numbers in parenthesis are for the 8−lead packages.

This device contains 21 active transistors.

Figure 1. Representative Block Diagram

 Semiconductor Components Industries, LLC, 2005

February, 2005 − Rev. 12

ORDERING INFORMATION

See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.

DEVICE MARKING INFORMATION

Sink Only Positive True Logic

1 Publication Order Number:

See general marking information in the device marking section on page 7 of this data sheet.

MC34064/D

MC34064, MC33064, NCV33064

MAXIMUM RATINGS

Rating Symbol Value Unit

Power Input Supply Voltage V Reset Output Voltage V Reset Output Sink Current (Note 2) I

Clamp Diode Forward Current, Pin 1 to 2 (Note 2) I

in O

Sink

Power Dissipation and Thermal Characteristics

P Suffix, Plastic Package

Maximum Power Dissipation @ T

= 25°C

Thermal Resistance, Junction−to−Air

D Suffix, Plastic Package

Maximum Power Dissipation @ T

= 25°C

Thermal Resistance, Junction−to−Air

DM Suffix, Plastic Package

Maximum Power Dissipation @ T

= 25°C

Thermal Resistance, Junction−to−Air Operating Junction Temperature T Operating Ambient Temperature



MC34064 MC33064 NCV33064

Storage Temperature Range T

stg

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously . If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.

1. ESD data available upon request.

−1.0 to 10 V 10 V

Internally

Limited

100 mA

625 200

520 240

°C/W

+150 °C

°C

0 to +70

−40 to +85

−40 to +125

−65 to +150 °C

ELECTRICAL CHARACTERISTICS (For typical values T

= 25°C, for min/max values TA is the operating ambient temperature range

that applies [Notes 3 and 4] unless otherwise noted.)

Characteristics Symbol Min Typ Max Unit

COMPARATOR

Threshold Voltage

High State Output (Vin Increasing) Low State Output (V Hysteresis

Decreasing)

4.5

0.01

4.61

4.59

0.02

RESET OUTPUT

Output Sink Saturation

(Vin = 4.0 V, I (V

= 4.0 V, I

= 1.0 V, I

= 8.0 mA)

Sink

= 2.0 mA)

Sink

= 0.1 mA)

Sink

Output Sink Current (Vin, Reset = 4.0 V) I Output Off-State Leakage (Vin, Reset = 5.0 V) I Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 10 mA) V

Sink

−

0.46

0.15

−

10 27 60 mA

− 0.02 0.5 A

0.6 0.9 1.2 V

TOTAL DEVICE

Operating Input Voltage Range V Quiescent Input Current (Vin = 5.0 V) I

1.0 to 6.5 − − V

− 390 500 A

2. Maximum package power dissipation limits must be observed.

3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.

4. T

=0°C for MC34064 T

low

−40°C for MC33064 +85°C for MC33064

= +70°C for MC34064

high

−40°C for NCV33064 +125°C for NCV33064

5. NCV prefix is for automotive and other applications requiring site and change control.

4.7

0.05

1.0

0.4

0.1

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MC34064, MC33064, NCV33064

8.0

RL = 10 k to V T

= 25°C

6.0

4.0

, OUTPUT VOLTAGE (V)

2.0

0 2.0 4.0 6.0 8.0 10

Vin, INPUT VOLTAGE (V)

Figure 2. Reset Output Voltage versus

Input Voltage

4.630

4.620

4.610

4.600

4.590

, THRESHOLD VOLTAGE (V)

4.580

RL = 10 k to V

Upper Threshold

High State Output

Lower Threshold

Low State Output

5.0

4.0

RL = 10 k to V T

= 25°C

3.0

2.0

, OUTPUT VOLTAGE (V)

1.0

4.560 4.580 4.600 4.620 4.640 V

, INPUT VOLTAGE (V)

Figure 3. Reset Output Voltage versus

Input Voltage

1.0

= +25°C

0.8

0.6

0.4

, INPUT CURRENT (mA)

0.2

= +25°C

+85°C

−40°C

+85°C

−40°C

4.570

−55 −25 0 25 50 75 100 125

, AMBIENT TEMPERATURE (°C)

Figure 4. Comparator Threshold Voltage

versus Temperature

2.0

1.5

Vin = 4.0 V

= 85°C

= 25°C

= −40°C

1.0

, OUTPUT SATURATION (V)

0.5

010203040

, SINK CURRENT (mA)

Sink

Figure 6. Reset

Output Saturation versus

Sink Current

0 2.0 4.0 6.0 8.0 10

, INPUT VOLTAGE (V)

Figure 5. Input Current versus Input Voltage

90%

5.0 V −

4.0 V −

10%

5.0V

4.0V

Reset

REF

10k

Reset

200 ns/DIV

Vin = 5.0 V to 4.0 V RL = 10 k T

Figure 7. Reset Delay Time

= 25°C

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MC34064, MC33064, NCV33064

Vin = 0 V T

= 25°C

, FORWARD CURRENT (mA)

0 0.4 0.8 1.2 1.6

, FORWARD VOLTAGE (V)

F

Figure 8. Clamp Diode Forward Current versus Voltage

Power

Supply

−

Power

Supply

−

2 (2)

1.2 V

1 (1)

−

ref

3 (4)

Reset

Microprocessor

Circuit

DLY

A time delayed reset can be accomplished with the addition of C power supply rise times (<500 ns) it is recommended that the RC V

th(MPU)

. For systems with extremely fast

DLY

time constant be greater than 5.0 s.

DLY

is the microprocessor reset input threshold.

DLY

= RC

DLY

1 −

th(MPU)

Figure 9. Low Voltage Microprocessor Reset

TEST DATA

(mV)

V

(mV)

1.2V

ref

3 (4)

1 (1)

Reset

Microprocessor

Circuit

−

4.6 R

≈

V

th(lower)

Where:R

+ 0.02

≈ 340 R

x 10

≤ 150 

≥ 1.5 , ≤ 10 k

−6

51 40 81 71

112 100 164 190 327 276 480

3.4

6.8

6.8 10 10 16 16 34 34 51 51

R ()

0 10 20 20 30 30 47 47

100 100 150 150

(k)

1.5

4.7

1.5

2.7

1.5

2.7

1.5

2.7

1.5

2.7

1.5

Comparator hysteresis can be increased with the addition of resistor R simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold (Figure 4). An increase of the lower threshold V

4.59V. The equations are accurate to ±10% with R

will be observed due to Iin which is typically 340 A at

th(lower)

less than 150  and RL between 1.5 k and 10 k

. The hysteresis equation has been

Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis

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MC34064, MC33064, NCV33064

Power Supply

−

Vin = 11.5

to 14.5V

− 2 (2)

1 (1)

−

1.2V

ref

3 (4)

2 (2)

1.2V

1.0k

1 (1)

−

ref

3 (4)

Figure 11. Voltage Monitor Figure 12. Solar Powered Battery Charger

25H

4.7k

470

2 (2)

1.2V

MPSW51A

470

1N5819

1.2k

1N756

330

68022

Line Regulation Vin = 11.5 V to 14.5 V, IO = 50 mA 35 mV

1 (1)

−

ref

Load Regulation Vin = 12.6 V, IO = 0 mA to 50 mA 12 mV Output Ripple Vin = 12.6 V, IO = 50 mA 60 mVpp Efficiency Vin = 12.6 V, IO = 50 mA 77%

= 5.0 V

IO = 50 mA

Test Conditions Results

Solar Cells

3 (4)

Figure 13. Low Power Switching Regulator

MTP3055EL

4.6V

270

2 (2)

1 (1)

−

1.2V

ref

3 (4)

Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L MOSFET.

Figure 14. MOSFET Low Voltage Gate Drive Protection

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MC34064, MC33064, NCV33064

ORDERING INFORMATION

Device Operating Temperature Range Package Shipping

MC34064D−005 SOIC−8 98 Units / Rail MC34064D−005G SOIC−8

MC34064D−5R2 SOIC−8 2500 Units/ Tape & Reel MC34064D−5R2G SOIC−8

MC34064DM−5R2 Micro8 4000 Units / Tape & Reel MC34064DM−5R2G Micro8

MC34064P−005 MC34064P−005G

MC34064P−5RA TO−92 2000 Units / Tape & Reel MC34064P−5RAG TO−92

MC34064P−5RP TO−92 2000 Units / Ammo Pack MC34064P−5RPG TO−92

MC34064P−5RM TO−92 2000 Units / Ammo Pack MC34064SN−5T1 TSOP−5 3000 Units / Tape & Reel MC33064D−005 SOIC−8 98 Units / Rail MC33064D−005G SOIC−8

MC33064D−5R2 SOIC−8 2500 Units / Tape & Reel MC33064D−5R2G SOIC−8

MC33064DM−5R2 Micro8 4000 Units / Tape & Reel MC33064DM−5R2G

MC33064P−005 MC33064P−005G TO−92

MC33064P−5RA TO−92 2000 Units / Tape & Reel MC33064P−5RAG TO−92

MC33064P−5RP TO−92 2000 Units / Ammo Pack MC33064P−5RPG TO−92

NCV33064D−5R2* SOIC−8 2500 Units / Tape & Reel NCV33064D−5R2G* SOIC−8

NCV33064P−5RA* NCV33064P−5RP* TO−92 2000 Units / Ammo Pack NCV33064DM−5R2* Micro8 4000 Units / Tape & Reel

*NCV33064: T

control.

= −40°C, T

low

= +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change

high

TA = 0°C to +70°C

TJ = −40°C to +85°C

TA = −40°C to +125°C

(Pb−Free)

TO−92 2000 Units / Bag TO−92

(Pb−Free)

Micro8

(Pb−Free)

TO−92 2000 Units / Bag

(Pb−Free)

TO−92 2000 Units / Tape & Reel

98 Units / Rail

2500 Units/ Tape & Reel

4000 Units / Tape & Reel

2000 Units / Bag

2000 Units / Tape & Reel

2000 Units / Ammo Pack

98 Units / Rail

2500 Units / Tape & Reel

4000 Units / Tape & Reel

2000 Units / Bag

2000 Units / Tape & Reel

2000 Units / Ammo Pack

2500 Units / Tape & Reel

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MC34064, MC33064, NCV33064

MARKING DIAGRAMS

TSOP−5

SN SUFFIX

CASE 483

SDYYW

123

SOIC−8

D SUFFIX

CASE 751

3x064

ALYW5

Micro8 DM SUFFIX CASE 846A

Ly50

AYW

SDY = Device Code x = 3 or 4 y = I or C A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W= Work Week

*This marking diagram also applies to NCV33064P.

TO−92

P SUFFIX

CASE 29

MC3x0

64P−5

ALYWW

123

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MC34064, MC33064, NCV33064

PACKAGE DIMENSIONS

P SUFFIX

PLASTIC PACKAGE

CASE 29−1 1

(TO−92)

ISSUE AL

SEATING PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.

MILLIMETERSINCHES

H V

SECTION X−X

DIM MIN MAX MIN MAX

A 0.175 0.205 4.45 5.20 B 0.170 0.210 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 G 0.045 0.055 1.15 1.39 H 0.095 0.105 2.42 2.66 J 0.015 0.020 0.39 0.50 K 0.500 −−− 12.70 −−− L 0.250 −−− 6.35 −−− N 0.080 0.105 2.04 2.66 P −−− 0.100 −−− 2.54 R 0.115 −−− 2.93 −−− V 0.135 −−− 3.43 −−−

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MC34064, MC33064, NCV33064

PACKAGE DIMENSIONS

SN SUFFIX

PLASTIC PACKAGE

CASE 483−02

ISSUE C

0.05 (0.002)

123

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.

DIM MIN MAX MIN MAX

A 2.90 3.10 0.1142 0.1220 B 1.30 1.70 0.0512 0.0669 C 0.90 1.10 0.0354 0.0433 D 0.25 0.50 0.0098 0.0197 G 0.85 1.05 0.0335 0.0413 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.55 0.0493 0.0610 M 0 10 0 10

___ _

S 2.50 3.00 0.0985 0.1181

INCHESMILLIMETERS

SOLDERING FOOTPRINT

1.9

0.95

0.037

0.074

1.0

0.039

0.7

0.028

SCALE 10:1

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2.4

0.094



inches



MC34064, MC33064, NCV33064

PACKAGE DIMENSIONS

D SUFFIX

PLASTIC PACKAGE

CASE 751−07

(SOIC−8 NB)

ISSUE AE

−Y−

−Z−

−X− A

0.25 (0.010)

SEATING PLANE

0.10 (0.004)

0.25 (0.010) Z

SXS

X 45



NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.

6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07.

MILLIMETERS

DIMAMIN MAX MIN MAX

4.80 5.00 0.189 0.197

B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020

G 1.27 BSC 0.050 BSC

H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050

M 0 8 0 8



N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244

INCHES

SOLDERING FOOTPRINT*

1.52

0.060

7.0

0.275

0.6

0.024

4.0

0.155

1.270

0.050

SCALE 6:1



inches



*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

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SEATING PLANE

−T−

0.038 (0.0015)

PIN 1 ID

MC34064, MC33064, NCV33064

PACKAGE DIMENSIONS

DM SUFFIX

PLASTIC PACKAGE

CASE 846A−02

(Micro8)

ISSUE F

−A−

−B−

8 PL

0.08 (0.003) A

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.

DIM MIN MAX MIN MAX

A 2.90 3.10 0.114 0.122 B 2.90 3.10 0.114 0.122 C −−− 1.10 −−− 0.043 D 0.25 0.40 0.010 0.016 G 0.65 BSC 0.026 BSC H 0.05 0.15 0.002 0.006 J 0.13 0.23 0.005 0.009 K 4.75 5.05 0.187 0.199 L 0.40 0.70 0.016 0.028

INCHESMILLIMETERS

SOLDERING FOOTPRINT*

1.04

0.041

3.20

0.126

0.65

0.0256

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

0.38

0.015

4.24

0.167

SCALE 8:1

5.28

0.208



inches



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MC34064, MC33064, NCV33064

Micro8 is a trademark of International Rectifier.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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MC34064/D

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