ON Semiconductor MC14516B Technical data

MC14516B
Binary Up/Down Counter
The MC14516B synchronous up/down binary counter is constructed with MOS P–channel and N–channel enhancement mode devices in a monolithic structure.
This counter can be preset by applying the desired value, in binary, to the Preset inputs (P0, P1, P2, P3) and then bringing the Preset Enable (PE) high. The direction of counting is controlled by applying a high (for up counting) or a low (for down counting) to the UP/DOWN input. The state of the counter changes on the positive transition of the clock input.
Cascading can be accomplished by connecting the Carry Out Carry In of the next stage while clocking each counter in parallel. The outputs (Q0, Q1, Q2, Q3) can be reset to a low state by applying a high to the reset (R) pin.
This CMOS counter finds primary use in up/down and difference counting. Other applications include: (1) Frequency synthesizer applications where low power dissipation and/or high noise immunity is desired, (2) Analog–to–digital and digital–to–analog conversions, and (3) Magnitude and sign generation.
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Internally Synchronous for High Speed
Logic Edge–Clocked Design — Count Occurs on Positive Going
Edge of Clock
Single Pin Reset
Asynchronous Preset Enable Operation
Capable of Driving Two Low–Power TTL Loads or One Low–Power
Schottky Load Over the Rated Temperature Range
to the
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MARKING
DIAGRAMS
16
PDIP–16
P SUFFIX
CASE 648
SOIC–16
D SUFFIX
CASE 751B
SOEIAJ–16
F SUFFIX
CASE 966
A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week
MC14516BCP
AWLYYWW
1
16
AWLYWW
1
16
MC14516B
1
14516B
ALYW
MAXIMUM RATINGS (Voltages Referenced to V
Symbol Parameter Value Unit
V
DD
Vin, V
Iin, I
P
T
T
stg
T
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/C From 65C To 125C
Semiconductor Components Industries, LLC, 2000
August, 2000 – Rev. 4
DC Supply Voltage Range –0.5 to +18.0 V Input or Output Voltage Range
out
out
D
A
L
(DC or Transient)
Input or Output Current
(DC or Transient) per Pin
Power Dissipation,
per Package (Note 3.) Ambient Temperature Range –55 to +125 °C Storage Temperature Range –65 to +150 °C Lead Temperature
(8–Second Soldering)
) (Note 2.)
SS
–0.5 to VDD + 0.5 V
±10 mA
500 mW
260 °C
1 Publication Order Number:
ORDERING INFORMATION
Device Package Shipping
MC14516BCP PDIP–16 2000/Box MC14516BD SOIC–16 48/Rail MC14516BDR2 SOIC–16 2500/Tape & Reel MC14516BF SOEIAJ–16 See Note 1. MC14516BFEL SOEIAJ–16 See Note 1.
1. For ordering information on the EIAJ version of the SOIC packages, please contact your local ON Semiconductor representative.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid ap­plications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, V range V
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either V puts must be left open.
and V
in
(Vin or V
SS
should be constrained to the
out
) VDD.
out
or VDD). Unused out-
SS
MC14516B/D
PE
Q3
CARRY IN
Q0
CARRY OUT
V
MC14516B
PIN ASSIGNMENT
1
2
P3
3
P0
4
6
7
8
SS
BLOCK DIAGRAM
16
15
14
13
125
11
10
9
V
C
Q2
P2
P1
Q1
U/D
R
DD
1
5
9
10
15
4
12
13
3
PE
CARRY IN
RESET
UP/DOWN
CLOCK
P0
P1
P2
P3
VDD = PIN 16
VSS = PIN 8
Q0
Q1
Q2
Q3
CARRY
OUT
6
11
14
2
7
TRUTH TABLE
Preset
Carry In Up/Down
1 X 0 0 X No Count 0 1 0 0 Count Up 0 0 0 0 Count Down X X 1 0 X Preset X X X 1 X Reset
X = Don’t Care NOTE: When counting up, the Carry Out
when Q0 through Q3 are high and Carry In Carry Out
is low only when Q0 through Q3 and Carry In are low.
Enable
Reset Clock Action
signal is normally high and is low only
is lo w. When counting down,
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MC14516B
V
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
DD
Characteristic Symbol
Output Voltage “0” Level
V
= VDD or 0
in
“1” Level
V
= 0 or V
in
DD
Input Voltage “0” Level
= 4.5 or 0.5 Vdc)
(V
O
(V
= 9.0 or 1.0 Vdc)
O
(V
= 13.5 or 1.5 Vdc)
O
“1” Level
= 0.5 or 4.5 Vdc)
(V
O
(V
= 1.0 or 9.0 Vdc)
O
(V
= 1.5 or 13.5 Vdc)
O
Output Drive Current
(V
= 2.5 Vdc) Source
OH
= 4.6 Vdc)
(V
OH
(V
= 9.5 Vdc)
OH
(V
= 13.5 Vdc)
OH
(VOL = 0.4 Vdc) Sink (V
= 0.5 Vdc)
OL
(V
= 1.5 Vdc)
OL
Input Current I Input Capacitance
(V
= 0)
in
Quiescent Current
(Per Package)
Total Supply Current
(5.) (6.)
(Dynamic plus Quiescent, Per Package) (C
= 50 pF on all outputs, all
L
Vdc
V
OL
5.0 10 15
V
OH
5.0 10 15
V
IL
5.0 10 15
V
IH
5.0 10 15
I
OH
5.0
5.0 10 15
I
OL
5.0 10 15
in
C
in
I
DD
15 ± 0.1 ±0.00001 ± 0.1 ± 1.0 µAdc — 5.0 7.5 pF
5.0 10 15
I
T
5.0 10 15
Min Max Min Typ
— — —
4.95
9.95
14.95
— — —
3.5
7.0 11
– 3.0
– 0.64
– 1.6 – 4.2
0.64
1.6
4.2
— — —
)
SS
– 55C 25C 125C
(4.)
Max Min Max
0.05
0.05
0.05 —
— —
1.5
3.0
4.0
— — —
— — — —
— — —
5.0 10 20
— — —
4.95
9.95
14.95
— — —
3.5
7.0 11
– 2.4
– 0.51
– 1.3 – 3.4
0.51
1.3
3.4
— — —
0 0 0
5.0 10 15
2.25
4.50
6.75
2.75
5.50
8.25
– 4.2 – 0.88 – 2.25
– 8.8
0.88
2.25
8.8
0.005
0.010
0.015
IT = (0.58 µA/kHz) f + I IT = (1.20 µA/kHz) f + I IT = (1.70 µA/kHz) f + I
0.05
0.05
0.05 —
— —
1.5
3.0
4.0
— — —
— — — —
— — —
5.0 10 20
DD DD DD
— — —
4.95
9.95
14.95
— — —
3.5
7.0 11
– 1.7
– 0.36
– 0.9 – 2.4
0.36
0.9
2.4
— — —
0.05
0.05
0.05
buffers switching)
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
5. The formulas given are for the typical characteristics only at 25C.
6. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: I
is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
T
— — —
1.5
3.0
4.0
— — —
— — — —
— — —
150 300 600
Unit
Vdc
Vdc
Vdc
Vdc
mAdc
mAdc
µAdc
µAdc
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MC14516B
PLH PHL
()
L
PLH,PHL
()
L
SWITCHING CHARACTERISTICS
(7.)
(C
= 50 pF, T
L
= 25C)
A
All Types
100
50 40
315 130 100
315 130 100
180
80 60
315 130 100
550 225 150
190 100
80
200 100
75
3.0
6.0
8.0
(8.)
Max
200 100
80
630 260 200
630 260 200
360 160 120
630 360 200
1100
450 300
— — —
— — —
1.5
3.0
4.0
Characteristic Symbol V
Output Rise and Fall Time
t
, t
TLH
t
TLH
t
TLH
= (1.5 ns/pF) CL + 25 ns
THL
, t
= (0.75 ns/pF) CL + 12.5 ns
THL
, t
= (0.55 ns/pF) CL + 9.5 ns
THL
Propagation Delay Time
Clock to Q
, t
t
PLH
t
PLH
t
PLH
= (1.7 ns/pF) CL + 230 ns
PHL
, t
= (0.66 ns/pF) CL + 97 ns
PHL
, t
= (0.5 ns/pF) CL + 75 ns
PHL
Clock to Carry Out
t
, t
PLH
t
PLH
t
PLH
= (1.7 ns/pF) CL + 230 ns
PHL
, t
= (0.66 ns/pF) CL + 97 ns
PHL
, t
= (0.5 ns/pF) CL + 75 ns
PHL
Carry In to Carry Out
t
, t
PLH
t
PLH
t
PLH
= (1.7 ns/pF) CL + 230 ns
PHL
, t
= (0.66 ns/pF) CL + 97 ns
PHL
, t
= (0.5 ns/pF) CL + 75 ns
PHL
Preset or Reset to Q
, t
t
PLH
t
PLH
t
PLH
= (1.7 ns/pF) CL + 230 ns
PHL
, t
= (0.66 ns/pF) CL + 97 ns
PHL
, t
= (0.5 ns/pF) CL + 75 ns
PHL
Preset or Reset to Carry Out
t
, t
PLH
t
PLH
t
PLH
= (1.7 ns/pF) CL + 465 ns
PHL
, t
= (0.66 ns/pF) CL + 192 ns
PHL
, t
= (0.5 ns/pF) CL + 125 ns
PHL
Reset Pulse Width t
Clock Pulse Width t
Clock Pulse Frequency f
t
t
t
PLH
t
t
PLH
t
t
PLH
t
t
PLH
t
t
PLH
t
TLH
THL
PHL
PHL
PHL
PHL
PHL
WH
DD
Min Typ
,
5.0 10 15
— — —
,
5.0 10 15
— — —
,
5.0 10 15
— — —
,
5.0 10 15
— — —
,
5.0 10 15
— — —
,
5.0 10 15
w
5.0 10 15
5.0 10 15
cl
5.0 10 15
— — —
380 200 160
350 170 140
— — —
7. The formulas given are for the typical characteristics only at 25C.
8. Data labelled “Typ” is not to be used for design purposes but is intended as an Indication of the IC’s potential performance.
Unit
ns
ns
ns
ns
ns
ns
ns
ns
MHz
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MC14516B
SWITCHING CHARACTERISTICS
(9.)
(C
= 50 pF, T
L
= 25C) (continued)
A
All Types
Characteristic Symbol V
Preset or Reset Removal Time
The Preset or Reset signal must be low prior to a positive–going transition of the clock.
Clock Rise and Fall Time t
Setup Time
to Clock
Carry In
Hold Time
Clock to Carry In
Setup Time
Up/Down to Clock
Hold Time
Clock to Up/Down
Setup Time
Pn to PE
Hold Time
PE to Pn
Preset Enable Pulse Width t
t
rem
TLH
t
THL
t
t
t
WH
DD
5.0 10 15
,
5.0 10 15
su
5.0 10 15
t
h
5.0 10 15
su
5.0 10 15
t
h
5.0 10 15
su
5.0 10 15
t
h
5.0 10 15
5.0 10 15
Min Typ
650 230 180
— — —
260 120 100
0 20 20
500 200 150
– 70 – 10
0
– 40 – 30 – 25
480 420 420
200 100
80
(10.)
325 115
90 —
— —
130
60 50
– 60 – 20
0
250 100
75
– 160
– 60 – 40
– 120
– 70 – 50
240 210 210
100
50 40
Max
— —
15
5 4
— — —
— — —
— — —
— — —
— — —
— — —
— — —
9. The formulas given are for the typical characteristics only at 25C.
10.Data labelled “Typ” is not to be used for design purposes but is intended as an Indication of the IC’s potential performance.
Unit
ns
µs
ns
ns
ns
ns
ns
ns
ns
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5
MC14516B
V
DD
PULSE
GENERATOR
RESET
500 pF
I
D
0.01 µF CERAMIC
PE
CARRY IN R UP/DOWN
CLOCK
P0 P1 P2
P3
Q0
Q1
Q2
Q3
CARRY
OUT
10%
20 ns
V
DD
V
SS
20 ns
C
L
C
L
C
L
C
L
C
L
CLOCK
50%
90%
VARIABLE
WIDTH
Figure 1. Power Dissipation Test Circuit and Waveform
LOGIC DIAGRAM
Q2
P04Q0
6
P1 12
Q1
11
9
P2 13
14
2
P33Q3
PRESET ENABLE
CLOCK
CARRY OUT
CARRY IN
UP/DOWN
1
15
P
PE
Q
7
C
T
Q
P
PE
C
TQQ
P
PE
C
TQQ
P
PE
C
TQQ
5
10
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MC14516B
TOGGLE FLIP–FLOP
PARALLEL IN
CARRY IN
UP/DOWN
CLOCK
PRESET ENABLE
Q
OR CARRY OUT
0
RESET
OR
50%
FLIP–FLOP FUNCTIONAL TRUTH TABLE
Preset
P
PE
Q
C
Q
T
t
su
50%
50%
t
w(H)
CARRY OUT
90%
10%
t
THL
t
w
t
h
t
w(H)
ONLY
t
PLH
t
rem
t
rem
Enable
1 X X Parallel In 0 0 Q 0 1 Q 0 X Q
X = Don’t Care
1
f
Clock T Q
cl
t
TLH
90%
10%
t
PHL
t
PLH
n+1
n n n
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
V
OH
V
OL
V
DD
V
SS
Figure 2. Switching Time Waveforms
PIN DESCRIPTIONS
INPUTS
P0, P1, P2, P3, Preset Inputs (Pins 4, 12, 13, 3) Data
on these inputs is loaded into the counter when PE is taken high.
Carry In
, (Pin 5) — This active–low input is used when
Cascading stages. Carry In is usually connected to Carry Out of the previous stage. While high, Clock is inhibited.
Clock, (Pin 15) Binary data is incremented or
decremented, depending on the direction of count, on the positive transition of this input.
OUTPUTS
Q0, Q1, Q2, Q3, Binary outputs (Pins 6, 11, 14, 2)
Binary data is present on these outputs with Q0 corresponding to the least significant bit.
Carry Out, (Pin 7) — Used when cascading stages, Carry
Out is usually connected to Carry In of the next stage. This synchronous output is active low and may also be used to indicate terminal count.
CONTROLS
PE, Preset Enable, (Pin 1) Asynchronously loads data
on the Preset Inputs. This pin is active high and inhibits the clock when high.
R, Reset, (Pin 9) Asynchronously resets the Q out–
puts to a low state. This pin is active high and inhibits the clock when high.
Up/Down, (Pin 10) Controls the direction of count,
high for up count, low for down count.
SUPPLY PINS
VSS, Negative Supply Voltage, (Pin 8) This pin is
usually connected to ground.
V
, Positive Supply Voltage, (Pin 16) — This pin is
DD
connected to a positive supply voltage ranging from 3.0 volts to 18.0 volts.
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7
PRESET ENABLE
0 = COUNT
1 = PRESET
1 = UP
0 = DOWN
MC14516B
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
Q0 Q1 Q2 Q3
PE
C
C
in
CLOCK
L.S.D.
MC14516B
out
U/D R
P0 P1 P2 P3
P0 P1 P2 P3 P4 P5 P6 P7
Q0 Q1 Q2 Q3
PE
C
in
CLOCK
M.S.D.
MC14516B
U/D R
P0 P1 P2 P3
out
TERMINAL COUNT INDICATOR
C
+V
DD
+V
DD
THUMBWHEEL SWITCHES
(OPEN FOR 0")
RESISTORS = 10 k
+V
CLOCK
RESET
DD
OPEN = COUNT
NOTE: The Least Significant Digit (L.S.D.) counts from a preset value once Preset Enable (PE) goes low. The Most Significant
Digit (M.S.D.) is disabled while C up mode), C
goes low for one complete clock cycle, thus allowing the next counter to decrement/increment one count.
out
is high. When the count of the L.S.D. reaches 0 (count down mode) or reaches 15 (count
in
(See Timing Diagram) The L.S.D. now counts through another cycle (15 clock pulses) and the above cycle is repeated.
Figure 3. Presettable Cascaded 8–Bit Up/Down Counter
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8
CLOCK
UP/DOWN
CARRY IN
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CARRY OUT
9
CARRY OUT
RESET
(MSD)
PE
P7
P6
P5
P4
P3
P2
P1
P0
(MSD)
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
(LSD)
TIMING DIAGRAM FOR THE PRESETTABLE CASCADED 8–BIT UP/DOWN COUNTER
MC14516B
COUNT
13 14 15 16 17 18 18 17 16 15 14 1319 251 252 253 254 255 0 1 2 2 13 012
PRESET ENABLE
UP COUNT DOWN COUNT UP COUNT
PRESET ENABLE
DOWN
COUNT
UP COUNT
RESET
MC14516B
f
out
CLOCK (f
+V
DD
)
in
RESET
OPEN = COUNT
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
Q0 Q1 Q2 Q3
PE
C
in
CLOCK
L.S.D.
MC14516B
U/D R
P0 P1 P2 P3
P0 P1 P2 P3
+V
DD
THUMBWHEEL SWITCHES
(OPEN FOR 0")
C
out
Q0 Q1 Q2 Q3
PE
C
in
CLOCK
M.S.D.
MC14516B
U/D R
P0 P1 P2 P3
P4 P5 P6 P7
+V
DD
RESISTORS = 10 k
f
in
=
f
out
n
BUFFER
C
out
NOTE: The programmable frequency divider can be set by applying the desired divide ratio, in binary, to the preset inputs. For example,
the maximum divide ratio of 255 may be obtained by applying a 1111 1111 to the preset inputs P0 to P7. For this divide operation, both counters should be configured in the count down mode. The divide ratio of zero is an undefined state and should be avoided.
Figure 4. Programmable Cascaded Frequency Divider
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10
–T–
–A–
916
B
18
F
C
S
–T–
H
G
D
16 PL
0.25 (0.010) T
K
M
–A–
16 9
–B–
18
G
K
C
SEATING
PLANE
D
16 PL
0.25 (0.010) A
M
S
B
T
S
MC14516B
PACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
L
SEATING PLANE
J
M
A
SOIC–16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
8 PLP
M
0.25 (0.010) B
M
S
X 45
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC
M
F
J
H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
MILLIMETERSINCHES
INCHESMILLIMETERS

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11
16 9
1
Z
D
e
b
0.13 (0.005)
M
8
H
E
E
A
A
1
0.10 (0.004)
MC14516B
PACKAGE DIMENSIONS
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
L
E
M
L
DETAIL P
VIEW P
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
Q
1
c
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
DIM MIN MAX MIN MAX
--- 2.05 --- 0.081
A
A
0.05 0.20 0.002 0.008
1
0.35 0.50 0.014 0.020
b
0.18 0.27 0.007 0.011
c
9.90 10.50 0.390 0.413
D
5.10 5.45 0.201 0.215
E
1.27 BSC 0.050 BSC
e
H
7.40 8.20 0.291 0.323
E
0.50 0.85 0.020 0.033
L L
1.10 1.50 0.043 0.059
E
0
M
Q
0.70 0.90 0.028 0.035
1
--- 0.78 --- 0.031
Z
INCHES
10
10
0
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