ON Semiconductor MC100LVE210, MC100E210 Technical data

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MC100LVE210, MC100E210
Low Voltage Dual 1:4, 1:5 Differential Fanout Buffer
ECL/PECL Compatible
For applications which require a single–ended input, the V
BB
reference voltage is supplied. For single–ended input applications the VBB reference should be connected to the unused CLK input of a differential pair and bypassed to ground via a 0.01µf capacitor. The input signal is then driven into the selected CLK input.
T o ensure that the tight skew specification is met it is necessary that both sides of the differential output are identically terminated, even if only one side is being used. In most applications all nine differential pairs will be used and therefore terminated. In the case where fewer than nine pairs are used it is necessary to terminate at least the output pairs adjacent to the output pair being used in order to maintain minimum skew. Failure to follow this guideline will result in small degradations of propagation delay (on the order of 10–20ps) of the outputs being used, while not catastrophic to most designs this will result in an increase in skew. Note that the package corners isolate outputs from one another such that the guideline expressed above holds only for outputs on the same side of the package.
The MC100LVE210, as with most ECL devices, can be operated from a positive VCC supply in PECL mode. This allows the L VE210 to be used for high performance clock distribution in +3.3V systems. Designers can take advantage of the LVE210’s performance to distribute low skew clocks across the backplane or the board. In a PECL environment series or Thevenin line terminations are typically used as they require no additional power supplies, if parallel termination is desired a terminating voltage of VCC–2.0V will need to be provided. For more information on using PECL, designers should refer to Application Note AN1406/D.
Dual Differential Fanout Buf fers
200ps Part–to–Part Skew
50ps Typical Output–to–Output Skew
Low Voltage ECL/PECL Compatible
28–lead PLCC Packaging
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PLCC PACKAGE
FN SUFFIX
CASE 776
MARKING DIAGRAM*
MC100L VE210
AWLYYWW
MC100E210FN
AWLYYWW
*For additional information, see Application Note AND8002/D
ORDERING INFORMATION
Device Package Shipping
MC100L VE210FN PLCC 37 Units / Rail MC100L VE210FNR2 PLCC 500 Tape & Reel
MC100E210FN PLCC 37 Units / Rail MC100E210FNR2 PLCC 500 Tape & Reel
A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week
A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week
Semiconductor Components Industries, LLC, 1999
February , 2000 – Rev. 2
1 Publication Order Number:
MC100L VE210/D
MC100LVE210, MC100E210
V
EE
V
BB
CLKa
V
CC
CLKa
CLKb CLKb
Qa0 Qa0 Qa1 V
25 24 23 22 21 20 19
26
27
28
1
2
3
4
Pinout: 28–Lead PLCC
(Top View)
567891011
Qb4 Qb3 Qb2Qb4 V
Qa1 Qa2 Qa2
CCO
Qb3 Qb2
CCO
CLKa CLKa
Qa3
18
Qa3
17
Qb0
16
15
V
CCO
14
Qb0
13
Qb1
12
Qb1
LOGIC SYMBOL
PIN NAMES
Pins
CLKa, CLKb Qa0:3, Qb0:4 V
BB
Qa0 Qa0
Qa1 Qa1
Qa2 Qa2
Qa3 Qa3
Function
Differential Input Pairs Differential Outputs VBB Output
CLKb CLKb
V
BB
Qb0 Qb0
Qb1 Qb1
Qb2 Qb2
Qb3 Qb3
Qb4 Qb4
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2
MC100LVE210, MC100E210
MC100LVE210 ECL DC CHARACTERISTICS
–40°C 0°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
V
OH
V
OL
V
IH
V
IL
V
BB
V
EE
I
IH
I
EE
MC100L VE210 PECL DC CHARACTERISTICS
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
V
OH
V
OL
V
IH
V
IL
V
BB
V
CC
I
IH
I
EE
1. These values are for VCC = 3.3V. Level Specifications will vary 1:1 with VCC.
MC100LVE210 AC CHARACTERISTICS (VEE = VEE (min) to VEE (max); VCC = V
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit Condition
t
PLH
t
PHL
t
skew
V
PP
V
CMR
tr/t
1. The differential propagation delay is defined as the delay from the crossing points of the dif ferential input signals to the crossing point of the
2. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal.
3. The within–device skew is defined as the worst case difference between any two similar delay paths within a single device.
4. VPP(min) is defined as the minimum input differential voltage which will cause no increase in the propagation delay . The VPP(min) is AC limited
5. V
Output HIGH Voltage –1.085 –1.005 –0.880 –1.025 –0.955 –0.880 –1.025 –0.955 –0.880 –1.025 –0.955 –0.880 V Output LOW Voltage –1.830 –1.695 –1.555 –1.810 –1.705 –1.620 –1.810 –1.705 –1.620 –1.810 –1.705 –1.620 V Input HIGH Voltage –1.165 –0.880 –1.165 –0.880 –1.165 –0.880 –1.165 –0.880 V Input LOW Voltage –1.810 –1.475 –1.810 –1.475 –1.810 –1.475 –1.810 –1.475 V Output Reference
Voltage Power Supply Voltage –3.0 –3.8 –3.0 –3.8 –3.0 –3.8 –3.0 –3.8 V Input HIGH Current 150 150 150 150 µA Power Supply Current 55 55 55 65 mA
Output HIGH Voltage12.215 2.295 2.42 2.275 2.345 2.420 2.275 2.345 2.420 2.275 2.345 2.420 V Output LOW Voltage11.47 1.605 1.745 1.490 1.595 1.680 1.490 1.595 1.680 1.490 1.595 1.680 V Input HIGH Voltage Input LOW Voltage Output Reference
1
Voltage Power Supply Voltage 3.0 3.8 3.0 3.8 3.0 3.8 3.0 3.8 V Input HIGH Current 150 150 150 150 µA Power Supply Current 55 55 55 65 mA
Propagation Delay to Output
IN (differential) IN (single–ended)
Within–Device SkewQa Qb
Part–to–Part Skew (Diff) Minimum Input Swing 500 500 500 500 mV Note 4 Common Mode Range –1.5 –0.4 –1.5 –0.4 –1.5 –0.4 –1.5 –0.4 V Note 5 Output Rise/Fall Time 200 600 200 600 200 600 200 600 ps 20%–80%
f
Qa Qa,Qb Qb
–1.38 –1.26 –1.38 –1.26 –1.38 –1.26 –1.38 –1.26 V
–40°C 0°C 25°C 85°C
1
2.135 2.420 2.135 2.420 2.135 2.420 2.135 2.420 V
1
1.490 1.825 1.490 1.825 1.490 1.825 1.490 1.825 V
1.92 2.04 1.92 2.04 1.92 2.04 1.92 2.04 V
= GND)
CCO
–40°C 0°C 25°C 85°C
475 400
675 700
505075
200
475 400
75
675 700
503075
200
500 450
50
700 750
503075
200
500 450
503075
50
ps 700 750
ps Note 3
50
200
differential output signals.
for the LVE210 as a differential input as low as 50 mV will still produce full ECL levels at the output.
is defined as the range within which the VIH level may vary, with the device still meeting the propagation delay specification. The V
CMR
level must be such that the peak to peak voltage is less than 1.0 V and greater than or equal to VPP(min).
Note 1 Note 2
IL
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MC100LVE210, MC100E210
MC100E210 ECL DC CHARACTERISTICS
–40°C 0°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
V
OH
V
OL
V
IH
V
IL
V
BB
V
EE
I
IH
I
EE
MC100E210 PECL DC CHARACTERISTICS
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
V
OH
V
OL
V
IH
V
IL
V
BB
V
CC
I
IH
I
EE
1. These values are for VCC = 5.0V. Level Specifications will vary 1:1 with VCC.
MC100E210 AC CHARACTERISTICS (VEE = VEE (min) to VEE (max); VCC = V
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit Condition
t
PLH
t
PHL
t
skew
V
PP
V
CMR
tr/t
1. The differential propagation delay is defined as the delay from the crossing points of the dif ferential input signals to the crossing point of the
2. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal.
3. The within–device skew is defined as the worst case difference between any two similar delay paths within a single device.
4. VPP(min) is defined as the minimum input differential voltage which will cause no increase in the propagation delay . The VPP(min) is AC limited
5. V
Output HIGH Voltage –1.085 –1.005 –0.880 –1.025 –0.955 –0.880 –1.025 –0.955 –0.880 –1.025 –0.955 –0.880 V Output LOW Voltage –1.830 –1.695 –1.555 –1.810 –1.705 –1.620 –1.810 –1.705 –1.620 –1.810 –1.705 –1.620 V Input HIGH Voltage –1.165 –0.880 –1.165 –0.880 –1.165 –0.880 –1.165 –0.880 V Input LOW Voltage –1.810 –1.475 –1.810 –1.475 –1.810 –1.475 –1.810 –1.475 V Output Reference
Voltage Power Supply Voltage –5.25 –4.2 –5.25 –4.2 –5.25 –4.2 –5.25 –4.2 V Input HIGH Current 150 150 150 150 µA Power Supply Current 55 55 55 65 mA
Output HIGH Voltage13.915 3.995 4.12 3.975 4.045 4.12 3.975 4.045 4.12 3.975 4.045 4.12 V Output LOW Voltage13.170 3.305 3.445 3.19 3.295 3.38 3.19 3.295 3.38 3.19 3.295 3.38 V Input HIGH Voltage Input LOW Voltage Output Reference
1
Voltage Power Supply Voltage 4.75 5.25 4.75 5.25 4.75 5.25 4.75 5.25 V Input HIGH Current 150 150 150 150 µA Power Supply Current 55 55 55 65 mA
Propagation Delay to Output
IN (differential) IN (single–ended)
Within–Device SkewQa Qb
Part–to–Part Skew (Diff) Minimum Input Swing 500 500 500 500 mV Note 4 Common Mode Range –1.5 –0.4 –1.5 –0.4 –1.5 –0.4 –1.5 –0.4 V Note 5 Output Rise/Fall Time 200 600 200 600 200 600 200 600 ps 20%–80%
f
Qa Qa,Qb Qb
–1.38 –1.26 –1.38 –1.26 –1.38 –1.26 –1.38 –1.26 V
–40°C 0°C 25°C 85°C
1
3.835 4.12 3.835 4.12 3.835 4.12 3.835 4.12 V
1
3.190 3.525 3.190 3.525 3.190 3.525 3.190 3.525 V
3.62 3.74 3.62 3.74 3.62 3.74 3.62 3.74 V
= GND)
CCO
–40°C 0°C 25°C 85°C
475 400
675 700
505075
200
475 400
75
675 700
503075
200
500 450
50
700 750
503075
200
500 450
503075
50
ps 700 750
ps Note 3
50
200
differential output signals.
for the E210 as a differential input as low as 50 mV will still produce full ECL levels at the output.
is defined as the range within which the VIH level may vary, with the device still meeting the propagation delay specification. The V
CMR
level must be such that the peak to peak voltage is less than 1.0 V and greater than or equal to VPP(min).
Note 1 Note 2
IL
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4
MC100LVE210, MC100E210
P ACKAGE DIMENSIONS
PLCC PACKAGE
FN SUFFIX
CASE 776–02
ISSUE D
-L-
C
0.010 (0.250)
28 1
Z
G
G1
TL
-N-
–M
Y BRK
0.007 (0.180)
B
0.007 (0.180)
U
TL
–M
TL
SNSM
SNSM
–M
D
Z
-M-
D
W
V
X
G1
0.010 (0.250)
TL
–M
SNSS
VIEW D-D
0.007 (0.180)
A
0.007 (0.180)
R
E
0.004 (0.100)
SEATING
-T-
J
PLANE
VIEW S
SNSS
TL
TL
–M
–M
SNSM
SNSM
0.007 (0.180)
H
TL
–M
SNSM
K1
K
0.007 (0.180)
F
TL
–M
SNSM
VIEW S
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
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INCHES MILLIMETERS
MIN MINMAX MAX
DIM
0.485
0.485
0.165
0.090
0.013
0.050 BSC
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042 — 2°
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032
0.456
0.456
0.048
0.048
0.056
0.020 10°
0.430
— —
A B C E F G H J K R U V W X Y
Z G1 K1
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
10.42
1.02
— 2°
1.27 BSC
12.57
12.57
4.57
2.79
0.48
0.81
11.58
11.58
1.21
1.21
1.42
0.50 10°
10.92
— —
5
Notes
MC100LVE210, MC100E210
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6
Notes
MC100LVE210, MC100E210
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7
MC100LVE210, MC100E210
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MC100L VE210/D
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