BAT54XV2T1
Schottky Barrier Diodes
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
Features
• Extremely Fast Switching Speed
• Low Forward Voltage − 0.35 V (Typ) @ I
• Pb−Free Package is Available
= 10 mA
F
http://onsemi.com
30 VOLT
SILICON HOT−CARRIER
DETECTOR AND SWITCHING
DIODES
MAXIMUM RATINGS (T
Rating
Reverse Voltage V
= 125°C unless otherwise noted)
J
Symbol Value Unit
R
30 V
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR−5 Board,
(Note 1) T
Thermal Resistance,
Junction and Storage Temperature TJ, T
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 Minimum Pad.
= 25°C
A
Derate above 25°C
Junction−to−Ambient
P
D
R
JA
stg
200
1.57
635 °C/W
−55 to 125 °C
mW
mW/°C
1
CATHODE
2
1
2
ANODE
SOD−523
CASE 502
PLASTIC
MARKING DIAGRAM
JVM G
1
JV = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
G
ORDERING INFORMATION
Device Package Shipping
BAT54XV2T1 SOD−523 3000 / Tape & Reel
BAT54XV2T1G SOD−523
(Pb−Free)
BAT54XV2T5G SOD−523
(Pb−Free)
3000 / Tape & Reel
8000 / Tape & Reel
†
© Semiconductor Components Industries, LLC, 2009
September, 2009 − Rev. 5
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
1 Publication Order Number:
BAT54XV2T1/D
BAT54XV2T1
ELECTRICAL CHARACTERISTICS (T
Characteristic
Reverse Breakdown Voltage
= 10 A)
(I
R
= 25°C unless otherwise noted)
A
Symbol Min Typ Max Unit
V
Total Capacitance
(V
= 1.0 V, f = 1.0 MHz)
R
Reverse Leakage
(V
= 25 V)
R
Forward Voltage
(I
= 0.1 mA)
F
Forward Voltage
(I
= 1.0 mA)
F
Forward Voltage
(I
= 10 mA)
F
Forward Voltage
(I
= 30 mA)
F
Forward Voltage
(IF = 100 mA)
Reverse Recovery Time
(I
= IR = 10 mA, I
F
= 1.0 mA) Figure 1
R(REC)
Forward Current (DC) I
Repetitive Peak Forward Current I
Non−Repetitive Peak Forward Current
(t < 1.0 s)
(BR)R
C
I
R
V
V
V
V
V
t
rr
F
FRM
I
FSM
30 − − V
T
F
F
F
F
F
− 7.6 10 pF
− 0.5 2.0
A
− 0.22 0.24 V
− 0.29 0.32 V
− 0.35 0.40 V
− 0.41 0.5 V
− 0.52 0.8 V
− − 5.0 ns
− − 200 mA
− − 300 mA
− − 600 mA
+10 V
50 Output
Generator
820
Pulse
2 k
0.1 F
100 H
I
0.1 F
F
t
t
p
r
10%
t
I
F
DUT
50 Input
Sampling
Oscilloscope
V
R
90%
INPUT SIGNAL
I
R
(I
Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so I
Notes: 3. t
» t
p
rr
is equal to 10 mA.
R(peak)
Figure 1. Recovery Time Equivalent Test Circuit
t
rr
= 1 mA
i
R(REC)
OUTPUT PULSE
= IR = 10 mA; measured
F
at i
R(REC)
= 1 mA)
t
http://onsemi.com
2
BAT54XV2T1
100
10
1.0
, FORWARD CURRENT (mA)
F
I
0.1
0.0 0.1
150°C
125°C
85°C
VF, FORWARD VOLTAGE (VOLTS)
Figure 2. Forward Voltage
25°C
0.2 0.3 0.4
−40°C
−55°C
14
12
10
8
0.5
0.6
1000
TA = 150°C
100
10
1.0
0.1
, REVERSE CURRENT (A)
R
I
0.01
0
5101520
, REVERSE VOLTAGE (VOLTS)
V
R
TA = 125°C
TA = 85°C
TA = 25°C
25
30
Figure 3. Leakage Current
6
4
, TOTAL CAPACITANCE (pF)
T
2
C
0
0
51015 30
V
, REVERSE VOLTAGE (VOLTS)
R
2520
Figure 4. Total Capacitance
http://onsemi.com
3
BAT54XV2T1
PACKAGE DIMENSIONS
SOD−523
CASE 502−01
ISSUE D
12
2X
b
0.08 (0.003) X Y
c
−X−
D
−Y−
E
M
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
DIM MIN NOM MAX
H 1.50 1.60 1.70
MILLIMETERS
A 0.50 0.60 0.70
b 0.25 0.30 0.35
c 0.07 0.14 0.20
D 1.10 1.20 1.30
E 0.70 0.80 0.90
E
L 0.15 0.20 0.25
INCHES
MIN NOM MAX
0.020 0.024 0.028
0.010 0.012 0.014
0.0028 0.0055 0.0079
0.043 0.047 0.051
0.028 0.032 0.035
0.059 0.063 0.067
0.006 0.008 0.010
A
L
H
E
−T−
SEATING
PLANE
SOLDERING FOOTPRINT*
1.40
0.0547
0.40
0.0157
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.0157
SCALE 10:1
0.40
mm
ǒ
inches
Ǔ
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
BAT54XV2T1/D
4
Loading...