ON 2N7002L, 2V7002L Schematic [ru]

2N7002L, 2V7002L
Small Signal MOSFET
60 V, 115 mA, N−Channel SOT−23
Features
Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable (2V7002L)
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating Symbol Value Unit
DrainSource Voltage V
DrainGate Voltage (RGS = 1.0 MW)
Drain Current
Continuous T
Continuous T
Pulsed (Note 2)
GateSource Voltage
Continuous
Nonrepetitive (t
= 25°C (Note 1)
C
= 100°C (Note 1)
C
50 ms)
p
V
V
DSS
DGR
I I
I
DM
V
GSM
D D
GS
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR−5 Board
(Note 3) T Derate above 25°C
Thermal Resistance, JunctiontoAmbient
Total Device Dissipation
(Note 4) Alumina Substrate, T Derate above 25°C
Thermal Resistance, JunctiontoAmbient
Junction and Storage Temperature TJ, T
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. The Power Dissipation of the package may result in a lower continuous drain current.
2. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%.
3. FR5 = 1.0 x 0.75 x 0.062 in.
4. Alumina = 0.4 x 0.3 x 0.025 in 99.5% alumina.
= 25°C
A
= 25°C
A
P
D
R
q
JA
P
D
R
q
JA
stg
60 Vdc
60 Vdc
±115
±75
±800
±20 ±40
225
1.8
556
300
2.4
417
55 to +150
mAdc
Vdc Vpk
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
http://onsemi.com
R
MAX
(BR)DSS
60 V
1
SOT23 CASE 318 STYLE 21
702 = Device Code M = Date Code* G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
DS(on)
7.5 W @ 10 V, 500 mA
NChannel
3
1
2
3
2
1
ID MAXV
115 mA
MARKING DIAGRAM
702 MG
G
ORDERING INFORMATION
Device Package Shipping
2N7002LT1G
2N7002LT3G 10,000 Tape & Reel
2V7002LT1G
2V7002LT3G 10,000 Tape & Reel
2N7002LT1H* 3000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
*Not for new design.
SOT23
(PbFree)
SOT23
(PbFree)
3000 Tape & Reel
3000 Tape & Reel
© Semiconductor Components Industries, LLC, 2013
April, 2013 Rev. 7
1 Publication Order Number:
2N7002L/D
2N7002L, 2V7002L
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted)
A
Characteristic
OFF CHARACTERISTICS
DrainSource Breakdown Voltage
= 0, ID = 10 mAdc)
(V
GS
Zero Gate Voltage Drain Current TJ = 25°C
(VGS = 0, VDS = 60 Vdc) TJ = 125°C
GateBody Leakage Current, Forward
(V
= 20 Vdc)
GS
GateBody Leakage Current, Reverse
(V
= 20 Vdc)
GS
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
= VGS, ID = 250 mAdc)
(V
DS
OnState Drain Current
(V
2.0 V
DS
, VGS = 10 Vdc)
DS(on)
Static DrainSource OnState Voltage
(V
= 10 Vdc, ID = 500 mAdc)
GS
(VGS = 5.0 Vdc, ID = 50 mAdc)
Static DrainSource OnState Resistance
(V
= 10 V, ID = 500 mAdc) TC = 25°C
GS
TC = 125°C
(VGS = 5.0 Vdc, ID = 50 mAdc) TC = 25°C
TC = 125°C
Forward Transconductance
(V
2.0 V
DS
, ID = 200 mAdc)
DS(on)
DYNAMIC CHARACTERISTICS
Input Capacitance
= 25 Vdc, VGS = 0, f = 1.0 MHz)
(V
DS
Output Capacitance
(V
= 25 Vdc, VGS = 0, f = 1.0 MHz)
DS
Reverse Transfer Capacitance
(V
= 25 Vdc, VGS = 0, f = 1.0 MHz)
DS
SWITCHING CHARACTERISTICS (Note 5)
TurnOn Delay Time
TurnOff Delay Time t
(VDD = 25 Vdc, ID ^ 500 mAdc,
= 25 W, RL = 50 W, V
R
G
gen
= 10 V)
BODYDRAIN DIODE RATINGS
Diode Forward On−Voltage
= 11.5 mAdc, VGS = 0 V)
(I
S
Source Current Continuous
(Body Diode)
Source Current Pulsed I
5. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%.
Symbol Min Typ Max Unit
V
(BR)DSS
I
DSS
I
GSSF
I
GSSR
V
GS(th)
I
D(on)
V
DS(on)
r
DS(on)
g
C
C
C
t
d(on)
d(off)
V
I
SM
FS
iss
oss
rss
SD
S
60 Vdc
1.0
500
mAdc
100 nAdc
100 nAdc
1.0 2.5 Vdc
500 mA
Vdc
3.75
0.375
Ohms
7.5
13.5
7.5
13.5
80 mS
50 pF
25 pF
5.0 pF
20 ns
40 ns
1.5 Vdc
11 5 mAdc
800 mAdc
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