OKI MSM6794 Datasheet

E2B0046-27-Y2
¡ Semiconductor MSM6794
¡ Semiconductor
This version: Nov. 1997
Previous version: Mar. 1996
MSM6794
DOT MATRIX LCD DRIVER WITH 128-CHANNEL RAM
GENERAL DESCRIPTION
The MSM6794 is a dot matrix graphic liquid crystal display LSI device to display bit maps. It drives an LCD panel for dot matrix graphic display under the control of a 4- or 8-bit microcomputer. All necessary functions for driving a bit map type LCD are built in on one chip. Therefore,by using the MSM6794, a bit map type dot matrix graphic liquid crystal display system can be implemented with a small number of chips. Since 1-bit data of the display RAM corresponds to the light-on/off of 1-dot of the LCD panel (bit map system), a flexible display, including kanji display, is possible. One chip comprises a graphic display system of a maximum of 128¥48 dots. This display can be expanded by using multiple chips. The MSM6794 uses CMOS process. Since it is an internal RAM type, the MSM 6794 features low power consumption, and is suited to display for battery-driven portable equipment.
FEATURES
• Segment outputs : Maximum of 128
• Common outputs : Maximum of 48
• Display duty : 1/33, 1/41, 1/44, 1/48
• Bit map type internal RAM : 6,144 bits (128¥48 bits)
• Display data I/F : 8-bit parallel/serial switchable
• Standby function by program
• LCD drive bias resistor (externally connected)
• Built-in voltage multiplier circuit
• LOGIC voltage : 2.7 to 5.5V
• LCD driving voltage : VBI 5 to 12V (positive voltage)
• Low current consumption : Maximum of 10mA (in standby mode)
• Number of pads : 224
1/34
¡ Semiconductor MSM6794
BLOCK DIAGRAM
COM48
SEG1
SEG128 COM1
LCD drive power supply V1, V3, V4, V6
V VC1 VC2 VS1 VS2
DT
to V
V
DD1
DD4
V
to V
SS1
SS3
IN
DF
LCDCK
FLM
M/S
RESET
CO
OSC1 OSC2 OSC3
TEST1 TEST2
multiplier
SI
Voltage
circuit
Segment driver
Level shifter
Data latch
2 2
RAM
128 × 48 bit
display memory
X decoder
5
X address
counter
8
Timing
generator
MPX
Clock
frequency
divider
circuit
BUSY
driver
Common
6
6
MPX
Y decoder
Memory
/output
2
8
input
buffer
6
8-, 6-bit conversion circuit
X address
5
register
Y address
6
register
Control register
7
7
Address
register
MPX MPX
8-bit Serial register
LCD drive power supply V1, V2, V5, V6
Common
counter
Decoder
Y address
counter
8
8
SO
P/S
I/O control
SHT CS WR RD RS
Input/output buffer
DB7 to DB0
2/34
¡ Semiconductor MSM6794
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Condition Rating Unit Applicable Pins
Supply voltage
Bias voltage Voltage multiplication reference voltage Input voltage Power dissipation Storage temperature
*2 *3
–0.3 to +7
–0.3 to +14
–0.3 to +7
–0.3 to +4.6
–0.3 to V
*1
–55 to +150
DD
+0.3
V
DD
V
BI
V
IN
V
I
P
D
T
STG
Ta=25˚C,
V
DD1-4–VSS1-3
Ta=25˚C,V1–V6
V
IN–VSS1-3
VIN–V
SS1-3
Ta=25˚C
— —
V
V
V
V
mW
˚C
V
DD1-4
V1, V6
V
IN, VSS1-3
All Inputs
— —
, V
SS1-3
Ta : ambient temperature *1 Power dissipation depends on the heat radiation in a device attach condition. Set junction
temperature to 150˚C or lower. *2 Ta = 25˚C; when doubler is used. *3 Ta = 25˚C; when tripler is used.
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Condition Range Unit Applicable Pins
Supply voltage Bias voltage Voltage multiplicatipon reference voltage Operating frequency Operating temperature
1
2.7 to 5.5 5 to 12
1 to V
DD
1 to 4 270 to 500 –25 to +85
V V
V
kHz
˚C
V
DD
V
BI
V
IN
f
op
T
op
V
DD1-4–VSS1-3
V1–V6
VIN–V
SS1-3
See Note 1 on p.6
2
V
DD1-4, VSS1-3
V1, V6
V
, V
IN
SS1-3
OSC1
1 For bias potential, V1 has the highest potential and V6 has the lowest potential. Use V6 at the
same potential as V
SS1
to V
SS3
.
2 RC oscillation and external input clock frequency (when frequency dividing ratio is 1).
For divided frequency operation, clock frequency after dividing must be within this range.
3/34
¡ Semiconductor MSM6794
ELECTRICAL CHARACTERISTICS
DC Characteristics (1)
(V
=2.7 to 4.5V, VBI=5 to 12V, Ta=–25 to +85˚C)
DD
Parameter Symbol Condition Min. Typ. Max. Unit. Applicable Pin
"H" input voltage 1 "H" input voltage 2 "H" input voltage 3 "L" input voltage 1 "L" input voltage 2 "L" input voltage 3
DD
DD
DD
— — — — — —
V
V
DD
V
0.2V
0.2V
0.2V
DD
DD
V
IH1
V
IH2
V
IH3
V
IL1
V
IL2
V
IL3
— — — — — —
0.8V
0.8V
0.8V 0 0 0
DD
DD
DD
V V V V V
Unit.
DB0-7, LCDCK, FLM, DF
Other input pins
DB0-7, LCDCK, FLM, DF
Other input pins
Input pins excluding
"H" input current 1
I
IH1
V
I=VDD
5
µA
DB0-7
FLM and DF
"H" input current 2
I
IH2
VI=V
DD
–5
5
DB0-7, LCDCK, FLM, DF
µA
Input pins excluding
"L" input current I
I
IL1
VI=0V
–5
µA
DB0-7
FLM and DF "L" input current 2 OFF leakage current "H" output voltage 1 "H" output voltage 2 "L" output voltage 1 "L" output voltage 2 Multiplied voltage 1 Doubler output Multiplied voltage 2 Tripler output COM output resistance SEG output resistance
I
IL2
I
off
V
OH1
V
OH2
V
OL1
V
OL2
V
DB
V
TR
R
C
R
S
V
V
I=VDD
I
=–1.0mA
O
=–1.0mA
I
O
=1.0mA
I
O
=1.0mA
I
O
=–500µA
I
O
=350kHz
f
osc
=–500µA
I
O
=350kHz
f
osc
I
=±50µA
O
=±20µA
I
O
=0V
I
or 0V
–5
–5
0.9V
0.9V — —
V
IN
–0.5
V
IN
–1.0
×2
×3
DD
DD
— — — —
— —
0.1V
0.1V
10
20
5
5
DD
DD
DB0-7, LCDCK, FLM, DF
µA µA
CO, LCDCK, FLM, DF, SO
V V V V
DB0 to DB7
CO, LCDCK, FLM, DF, SO
DB0 to DB7
V
V
k
k
COM1 to COM48
SEG1 to SEG128
During display
Supply Current 1
I
DD1
External clock
= 350kHz
f
osc
450
µA
During display
Supply Current 2
I
DD2
Internal
oscillation
= 350kHz
f
osc
360
700
µA
OSC1
OSC1
, LCDCK,
, LCDCK,
SO
VS2
VS2
V
DD
V
DD
Supply Current 3
Oscillation frequency
I
f
DDS
OSC
During standby
R
=18k
f
=56pF
C
f
See Note 3 on p.6
292
350
10
437
µA
kHz
V
DD
OSC1, OSC2, OSC3
4/34
¡ Semiconductor MSM6794
DC Characteristics (2)
=4.5 to 5.5V, VBI=5 to 12V, Ta=–25 to +85˚C)
(V
DD
Parameter Symbol Condition Min. Typ. Max. Unit Applicable Pin
"H" input voltage 1 "H" input voltage 2 "H" input voltage 3 "L" input voltage 1 "L" input voltage 2 "L" input voltage 3
"H" input current 1
"H" input current 2
"L" input current I
"L" input current 2
OFF leakage current
"H" output voltage 1 "H" output voltage 2 "L" output voltage 1 "L" output voltage 2
Multiplied voltage 1 Doubler output
Multiplied voltage 2 Tripler output
V
IH1
V
IH2
V
IH3
V
IL1
V
IL2
V
IL3
I
IH1
I
IH2
I
IL1
I
IL2
I
off
V
OH1
V
OH2
V
OL1
V
OL2
V
DB
V
TR
0.8V — 0.8V — 0.8V — 0 0.2V — 0 0.2V — 0 0.2V
—VDDV OSC1
DD
—VDDV
DD
—VDDV Other input pins
DD
DD
DD
DD
DB0-7, LCDCK, FLM, DF
V OSC1 V
DB0-7, LCDCK, FLM, DF
V Other input pins
Input pins excluding
VI=V
DD
—— 5µA
DB0-7
FLM and DF
VI=V
DD
–5 5 µA
DB0-7, LCDCK, FLM, DF
Input pins excluding
V
=0V –5 µA
I
DB0-7
FLM and DF
V
=0V –5 5 µA
I
VI=V
/0V –5 5 µASO
DD
IO=–1.5mA 0.9V IO=–1.5mA 0.9V
IO=1.5mA 0.1V IO=1.5mA 0.1V
I
=–500µA
O
f
=350kHz
osc
I
=–500µA
O
f
=350kHz
osc
V
–0.5
V
–1.0
IN
IN
V CO, LCDCK, FLM, DF, SO
DD
V DB0 to DB7
DD
DD
DD
×2
V VS2
×3
V VS2
DB0-7, LCDCK, FLM, DF
V CO, LCDCK, FLM, DF, SO V DB0 to DB7
, LCDCK,
, LCDCK,
COM output resistance
SEG output resistance
Supply Current 1
Supply Current 2
Supply Current 3
Oscillation frequency
I
I
I
f
R
C
R
S
DD1
DD2
DDS
OSC
See Note 3 on p.6
I
=±50µA——10kΩCOM1 to COM48
O
I
=±20µA——20kΩSEG1 to SEG128
O
During display
External clock
f
= 350kHz
osc
450 µA V
During display Internal oscillation f
=350kHz
osc
During standby
R
=22k
f
C
=56pF
f
360 700 µA V
——10µA V
292 350 437 kHz OSC1, OSC2, OSC3
DD
DD
DD
5/34
¡ Semiconductor MSM6794
g
g
Notes: 1. Voltage multiplication reference voltage is = VDD maximum when the multiplied
voltage is 12V or less. The voltage multiplication reference voltage is 4V maximum when the multiplied voltage is 12V or more (tripler output). Condition: f
= 350kHz
osc
Voltage multiplier circuit configuration: connect as in the following diagram.
<Usin
V
IN
VC1
VC2
VS1
VS2
tripler>
Voltage multiplication reference voltage
Doubler output
4.7µF
4.7µF
+
+
<Usin
Voltage multiplication reference voltage
Tripler output
4.7µF
4.7µF
4.7µF
+
+
+
2. If the multiplied voltage output and bias power supply are directly connected, the voltage multiplier circuit operation may malfunction due to bias power supply noise. A countermeasure for noise is necessary, such as inserting a series resistor to prevent noise from entering multiplied voltage output (VS1, VS2).
+
4.7µF
VS1
V
IN
VC1
VC2
VS1
VS2
doubler>
100
Tripler output
+
VS2
4.7µF
3. RC oscillation circuit configuration: connect as in the following diagram.
R
= 18k ± 2 % (V
OSC1
C
f
R
f
OSC2
f
= 22k ± 2 % (V
R
f
C
= 56pF ± 5 %
f
OSC3
= 2.7 to 4.5V)
DD
= 4.5 to 5.5V)
DD
6/34
¡ Semiconductor MSM6794
AC Characteristics
Parallel interface (1)
Parameter Symbol Condition Min Max Unit
RD "H" level width RD "L" level width WR "H" level width WR "L" level width WR-RD "H" level width CS, RS setup time CS, RS hold time
Write data setup time Write data hold time Read data output delay time Read data hold time External clock "H" level width External clock "L" level width RESET pulse width
External clock rise time, fall time
Parallel interface (2)
Parameter Symbol Condition Min Max Unit
RD "H" level width RD "L" level width WR "H" level width WR "L" level width WR-RD "H" level width CS, RS setup time CS, RS hold time
Write data setup time Write data hold time Read data output delay time Read data hold time External clock "H" level width External clock "L" level width RESET pulse width External clock rise time, fall time tr, t
t
WRH
t
WRL
t
WWH
t
WWL
t
WWRH
t
AS
t
AH
t
DSW
t
DHW
t
DDR
t
DHR
t
WCH
t
WCL
t
WRE
t
, t
r
f
t
WRH
t
WRL
t
WWH
t
WWL
t
WWRH
t
AS
t
AH
t
DSW
t
DHW
t
DDR
t
DHR
t
WCH
t
WCL
t
WRE
f
(V
=2.7 to 4.5V, VBI=5 to 12V, Ta=–25 to +85˚C)
DD
200 ns — 200 ns — 200 ns — 200 ns — 200 ns —50—ns —10—ns —50—ns —20—ns
CL=50pF 170 ns
—20—ns — 200 ns — 200 ns — 2.0 µs — 100 ns
(V
=4.5 to 5.5V, VBI=5 to 12V, Ta=–25 to +85˚C)
DD
150 ns — 150 ns — 150 ns — 150 ns — 150 ns —50—ns —10—ns —50—ns —20—ns
CL=50pF 130 ns
—20—ns — 150 ns — 150 ns — 2.0 µs — 20 ns
7/34
¡ Semiconductor MSM6794
Parallel Interface Timing Diagram
V
IH
CS
RS
WR
RD
V
IL
V
IH
V
IL
t
AS
V
IH
V
IL
V
IH
V
IL
t
WRH
t
t
WWL
DSW
t
DHW
t
AH
t
WWH
t
WWRH
t
AS
t
WRL
t
DDR
t
AH
t
DHR
DB0-DB7
RESET
OSC1
V
IH
V
IL
t
WRE
V
IL
t
r
V
IH
V
IL
t
f
t
WCL
V
OH
V
OL
t
WCH
V
IH
V
OH
, V
0.8V
=
0.9V
=
= 0.2V
DD
IL
DD
, V
= 0.1V
DD
OL
DD
8/34
¡ Semiconductor MSM6794
Serial interface (1)
=2.7 to 4.5V, VBI=5 to 12V, Ta=–25 to +85˚C)
(V
DD
Parameter Symbol Condition Min Max Unit
CS, RS setup time CS, RS hold time
S1 setup time S1 hold time
SHT "H" pulse width SHT "L" pulse width SHT clock cycle time
SO ON delay time SO output delay time SO OFF delay time BUSY delay time
WR setup time WR "L" pulse width
RESET pulse width
t
SAS
t
SAH
t
IS
t
IH
t
WSHH
t
WSHL
t
SYS
t
ON
t
DS
t
OFF
t
BUSY
t
SHS
t
WWL
t
WRE
—60—ns —15—ns — 100 ns —15—ns — 100 ns — 100 ns
400 ns CL=50pF 200 ns CL=50pF 0 200 ns
50 ns CL=50pF 200 ns
100 ns
120 ns
2.0 µs
External clock rise time, fall time tr, t
Serial interface (2)
Parameter Symbol Condition Min Max Unit
CS, RS setup time CS, RS hold time
S1 setup time S1 hold time
SHT "H" pulse width SHT "L" pulse width SHT clock cycle time
SO ON delay time SO output delay time SO OFF delay time BUSY delay time
WR setup time WR "L" pulse width
RESET pulse width
f
t
SAS
t
SAH
t
IS
t
IH
t
WSHH
t
WSHL
t
SYS
t
ON
t
DS
t
OFF
t
BUSY
t
SHS
t
WWL
t
WRE
100 ns
=4.5 to 5.5V, VBI=5 to 12V, Ta=–25 to +85˚C)
(V
DD
—50—ns —10—ns —50—ns —10—ns —80—ns —80—ns
200 ns CL=50pF 100 ns CL=50pF 0 100 ns
20 ns CL=50pF 100 ns
—50—ns
—80—ns
2.0 µs
External clock rise time, fall time tr, t
f
20 ns
9/34
¡ Semiconductor MSM6794
Serial Interface Timing Diagram
V
CS
RS
SI
SHT
WR
IH
V
IL
V
IH
V
IL
V
IH
V
IL
t
SAS
V
IH
V
IL
V
IH
V
IL
50%
t
ON
t
WSHL
t
t
IS
IH
t
WSHH
t
SYS
t
DS
t
SAH
t
SHS
t
WWLtBUSYtOFF
SO
RESET
OSC1
V
V
V
V
V
“Z”
OH
OL
t
WRE
IL
t
r
IH
IL
t
f
= 0.8VDD, VIL = 0.2V
V
IH
VOH = 0.9VDD, VOL = 0.1V
DD
DD
“Z”
10/34
¡ Semiconductor MSM6794
Serial Interface Input/Output Timing
Input timing
CS
RS
SHT
SI
WR
Output timing
RS
SO
CS
SHT
WR
D7 D6 D5 D4
BUSY BUSY
D7 D6 D5 D4
D3
D2 D1 D0
D3
D2 D1 D0
For SO output, 8 bits after input of the WR pulse are valid.
11/34
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