The MSM6794 is a dot matrix graphic liquid crystal display LSI device to display bit maps.
It drives an LCD panel for dot matrix graphic display under the control of a 4- or 8-bit
microcomputer.
All necessary functions for driving a bit map type LCD are built in on one chip. Therefore,by
using the MSM6794, a bit map type dot matrix graphic liquid crystal display system can be
implemented with a small number of chips.
Since 1-bit data of the display RAM corresponds to the light-on/off of 1-dot of the LCD panel (bit
map system), a flexible display, including kanji display, is possible. One chip comprises a graphic
display system of a maximum of 128¥48 dots. This display can be expanded by using multiple
chips.
The MSM6794 uses CMOS process. Since it is an internal RAM type, the MSM 6794 features low
power consumption, and is suited to display for battery-driven portable equipment.
FEATURES
• Segment outputs: Maximum of 128
• Common outputs: Maximum of 48
• Display duty: 1/33, 1/41, 1/44, 1/48
• Bit map type internal RAM: 6,144 bits (128¥48 bits)
• Display data I/F: 8-bit parallel/serial switchable
• Standby function by program
• LCD drive bias resistor (externally connected)
• Built-in voltage multiplier circuit
• LOGIC voltage: 2.7 to 5.5V
• LCD driving voltage: VBI 5 to 12V (positive voltage)
• Low current consumption: Maximum of 10mA (in standby mode)
• Number of pads: 224
1/34
¡ SemiconductorMSM6794
BLOCK DIAGRAM
COM48
SEG1
SEG128COM1
LCD drive power supply
V1, V3, V4, V6
V
VC1
VC2
VS1
VS2
DT
to V
V
DD1
DD4
V
to V
SS1
SS3
IN
DF
LCDCK
FLM
M/S
RESET
CO
OSC1
OSC2
OSC3
TEST1
TEST2
multiplier
SI
Voltage
circuit
Segment driver
Level shifter
Data latch
22
RAM
128 × 48 bit
display memory
X decoder
5
X address
counter
8
Timing
generator
MPX
Clock
frequency
divider
circuit
BUSY
driver
Common
6
6
MPX
Y decoder
Memory
/output
2
8
input
buffer
6
8-, 6-bit conversion circuit
X address
5
register
Y address
6
register
Control
register
7
7
Address
register
MPXMPX
8-bit Serial register
LCD drive power supply
V1, V2, V5, V6
Common
counter
Decoder
Y address
counter
8
8
SO
P/S
I/O control
SHT CS WR RD RS
Input/output buffer
DB7 to DB0
2/34
¡ SemiconductorMSM6794
ABSOLUTE MAXIMUM RATINGS
ParameterSymbolConditionRatingUnitApplicable Pins
Supply voltage
Bias voltage
Voltage multiplication
reference voltage
Input voltage
Power dissipation
Storage temperature
*2
*3
–0.3 to +7
–0.3 to +14
–0.3 to +7
–0.3 to +4.6
–0.3 to V
*1
–55 to +150
DD
+0.3
V
DD
V
BI
V
IN
V
I
P
D
T
STG
Ta=25˚C,
V
DD1-4–VSS1-3
Ta=25˚C,V1–V6
V
IN–VSS1-3
VIN–V
SS1-3
Ta=25˚C
—
—
V
V
V
V
mW
˚C
V
DD1-4
V1, V6
V
IN, VSS1-3
All Inputs
—
—
, V
SS1-3
Ta : ambient temperature
*1 Power dissipation depends on the heat radiation in a device attach condition. Set junction
temperature to 150˚C or lower.
*2 Ta = 25˚C; when doubler is used.
*3 Ta = 25˚C; when tripler is used.
RECOMMENDED OPERATING CONDITIONS
ParameterSymbolConditionRangeUnitApplicable Pins
Supply voltage
Bias voltage
Voltage multiplicatipon
reference voltage
Operating frequency
Operating temperature
1
2.7 to 5.5
5 to 12
1 to V
DD
1 to 4
270 to 500
–25 to +85
V
V
V
kHz
˚C
V
DD
V
BI
V
IN
f
op
T
op
V
DD1-4–VSS1-3
V1–V6
VIN–V
SS1-3
See Note 1 on p.6
2
—
V
DD1-4, VSS1-3
V1, V6
V
, V
IN
SS1-3
OSC1
—
1 For bias potential, V1 has the highest potential and V6 has the lowest potential. Use V6 at the
same potential as V
SS1
to V
SS3
.
2 RC oscillation and external input clock frequency (when frequency dividing ratio is 1).
For divided frequency operation, clock frequency after dividing must be within this range.
"H" input voltage 1
"H" input voltage 2
"H" input voltage 3
"L" input voltage 1
"L" input voltage 2
"L" input voltage 3
DD
DD
DD
—
—
—
—
—
—
V
V
DD
V
0.2V
0.2V
0.2V
DD
DD
V
IH1
V
IH2
V
IH3
V
IL1
V
IL2
V
IL3
—
—
—
—
—
—
0.8V
0.8V
0.8V
0
0
0
DD
DD
DD
V
V
V
V
V
Unit.
DB0-7, LCDCK, FLM, DF
Other input pins
DB0-7, LCDCK, FLM, DF
Other input pins
Input pins excluding
"H" input current 1
I
IH1
V
I=VDD
—
—
5
µA
DB0-7
FLM and DF
"H" input current 2
I
IH2
VI=V
DD
–5
—
5
DB0-7, LCDCK, FLM, DF
µA
Input pins excluding
"L" input current I
I
IL1
VI=0V
–5
—
—
µA
DB0-7
FLM and DF
"L" input current 2
OFF leakage
current
"H" output voltage 1
"H" output voltage 2
"L" output voltage 1
"L" output voltage 2
Multiplied voltage 1
Doubler output
Multiplied voltage 2
Tripler output
COM output
resistance
SEG output
resistance
I
IL2
I
off
V
OH1
V
OH2
V
OL1
V
OL2
V
DB
V
TR
R
C
R
S
V
V
I=VDD
I
=–1.0mA
O
=–1.0mA
I
O
=1.0mA
I
O
=1.0mA
I
O
=–500µA
I
O
=350kHz
f
osc
=–500µA
I
O
=350kHz
f
osc
I
=±50µA
O
=±20µA
I
O
=0V
I
or 0V
–5
–5
0.9V
0.9V
—
—
V
IN
–0.5
V
IN
–1.0
—
—
×2
×3
DD
DD
—
—
—
—
—
—
—
—
—
—
—
—
0.1V
0.1V
—
—
10
20
5
5
DD
DD
DB0-7, LCDCK, FLM, DF
µA
µA
CO, LCDCK, FLM, DF, SO
V
V
V
V
DB0 to DB7
CO, LCDCK, FLM, DF, SO
DB0 to DB7
V
V
kΩ
kΩ
COM1 to COM48
SEG1 to SEG128
During display
Supply Current 1
I
DD1
External clock
= 350kHz
f
osc
—
—
450
µA
During display
Supply Current 2
I
DD2
Internal
oscillation
= 350kHz
f
osc
—
360
700
µA
OSC1
OSC1
, LCDCK,
, LCDCK,
SO
VS2
VS2
V
DD
V
DD
Supply Current 3
Oscillation
frequency
I
f
DDS
OSC
During standby
R
=18kΩ
f
=56pF
C
f
See Note 3 on p.6
—
292
—
350
10
437
µA
kHz
V
DD
OSC1, OSC2, OSC3
4/34
¡ SemiconductorMSM6794
DC Characteristics (2)
=4.5 to 5.5V, VBI=5 to 12V, Ta=–25 to +85˚C)
(V
DD
ParameterSymbol ConditionMin. Typ. Max. Unit Applicable Pin
"H" input voltage 1
"H" input voltage 2
"H" input voltage 3
"L" input voltage 1
"L" input voltage 2
"L" input voltage 3
"H" input current 1
"H" input current 2
"L" input current I
"L" input current 2
OFF leakage
current
"H" output voltage 1
"H" output voltage 2
"L" output voltage 1
"L" output voltage 2
Multiplied voltage 1
Doubler output
Multiplied voltage 2
Tripler output
V
IH1
V
IH2
V
IH3
V
IL1
V
IL2
V
IL3
I
IH1
I
IH2
I
IL1
I
IL2
I
off
V
OH1
V
OH2
V
OL1
V
OL2
V
DB
V
TR
—0.8V
—0.8V
—0.8V
—0—0.2V
—0—0.2V
—0—0.2V
—VDDVOSC1
DD
—VDDV
DD
—VDDVOther input pins
DD
DD
DD
DD
DB0-7, LCDCK, FLM, DF
VOSC1
V
DB0-7, LCDCK, FLM, DF
VOther input pins
Input pins excluding
VI=V
DD
—— 5µA
DB0-7
FLM and DF
VI=V
DD
–5—5µA
DB0-7, LCDCK, FLM, DF
Input pins excluding
V
=0V–5——µA
I
DB0-7
FLM and DF
V
=0V–5—5µA
I
VI=V
/0V–5—5µASO
DD
IO=–1.5mA0.9V
IO=–1.5mA0.9V
IO=1.5mA——0.1V
IO=1.5mA——0.1V
I
=–500µA
O
f
=350kHz
osc
I
=–500µA
O
f
=350kHz
osc
V
–0.5
V
–1.0
IN
IN
——VCO, LCDCK, FLM, DF, SO
DD
——VDB0 to DB7
DD
DD
DD
×2
——VVS2
×3
——VVS2
DB0-7, LCDCK, FLM, DF
VCO, LCDCK, FLM, DF, SO
VDB0 to DB7
, LCDCK,
, LCDCK,
COM output
resistance
SEG output
resistance
Supply Current 1
Supply Current 2
Supply Current 3
Oscillation
frequency
I
I
I
f
R
C
R
S
DD1
DD2
DDS
OSC
See Note 3 on p.6
I
=±50µA——10kΩCOM1 to COM48
O
I
=±20µA——20kΩSEG1 to SEG128
O
During display
External clock
f
= 350kHz
osc
——450µAV
During display
Internal
oscillation
f
=350kHz
osc
During standby
R
=22kΩ
f
C
=56pF
f
—360700µAV
——10µAV
292350437kHzOSC1, OSC2, OSC3
DD
DD
DD
5/34
¡ SemiconductorMSM6794
g
g
Notes: 1. Voltage multiplication reference voltage is = VDD maximum when the multiplied
voltage is 12V or less.
The voltage multiplication reference voltage is 4V maximum when the multiplied
voltage is 12V or more (tripler output).
Condition: f
= 350kHz
osc
Voltage multiplier circuit configuration: connect as in the following diagram.
<Usin
V
IN
VC1
VC2
VS1
VS2
tripler>
Voltage multiplication
reference voltage
Doubler output
4.7µF
4.7µF
+
+
<Usin
Voltage multiplication
reference voltage
Tripler output
4.7µF
4.7µF
4.7µF
+
+
+
2. If the multiplied voltage output and bias power supply are directly connected, the
voltage multiplier circuit operation may malfunction due to bias power supply noise.
A countermeasure for noise is necessary, such as inserting a series resistor to prevent
noise from entering multiplied voltage output (VS1, VS2).
+
4.7µF
VS1
V
IN
VC1
VC2
VS1
VS2
doubler>
100Ω
Tripler output
+
VS2
4.7µF
3. RC oscillation circuit configuration: connect as in the following diagram.
R
= 18kΩ ± 2 % (V
OSC1
C
f
R
f
OSC2
f
= 22kΩ ± 2 % (V
R
f
C
= 56pF ± 5 %
f
OSC3
= 2.7 to 4.5V)
DD
= 4.5 to 5.5V)
DD
6/34
¡ SemiconductorMSM6794
AC Characteristics
Parallel interface (1)
ParameterSymbol ConditionMinMaxUnit
RD "H" level width
RD "L" level width
WR "H" level width
WR "L" level width
WR-RD "H" level width
CS, RS setup time
CS, RS hold time
Write data setup time
Write data hold time
Read data output delay time
Read data hold time
External clock "H" level width
External clock "L" level width
RESET pulse width
External clock rise time, fall time
Parallel interface (2)
ParameterSymbol ConditionMinMaxUnit
RD "H" level width
RD "L" level width
WR "H" level width
WR "L" level width
WR-RD "H" level width
CS, RS setup time
CS, RS hold time
Write data setup time
Write data hold time
Read data output delay time
Read data hold time
External clock "H" level width
External clock "L" level width
RESET pulse width
External clock rise time, fall timetr, t